EP2158597A1 - Monolithisches induktives bauelement, verfahren zum herstellen des bauelements und verwendung des bauelements - Google Patents
Monolithisches induktives bauelement, verfahren zum herstellen des bauelements und verwendung des bauelementsInfo
- Publication number
- EP2158597A1 EP2158597A1 EP08761143A EP08761143A EP2158597A1 EP 2158597 A1 EP2158597 A1 EP 2158597A1 EP 08761143 A EP08761143 A EP 08761143A EP 08761143 A EP08761143 A EP 08761143A EP 2158597 A1 EP2158597 A1 EP 2158597A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- green
- ferritic
- component
- ceramic
- film composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001939 inductive effect Effects 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000919 ceramic Substances 0.000 claims abstract description 42
- 239000011162 core material Substances 0.000 claims abstract description 40
- 239000002131 composite material Substances 0.000 claims abstract description 23
- 238000004804 winding Methods 0.000 claims abstract description 13
- 229910010293 ceramic material Inorganic materials 0.000 claims description 15
- 238000000465 moulding Methods 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 6
- 230000008901 benefit Effects 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 230000006698 induction Effects 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 11
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 238000002360 preparation method Methods 0.000 abstract 1
- 229910000859 α-Fe Inorganic materials 0.000 description 22
- 239000000463 material Substances 0.000 description 13
- 230000035699 permeability Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 238000005245 sintering Methods 0.000 description 7
- 239000011888 foil Substances 0.000 description 5
- 230000010354 integration Effects 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HPYIMVBXZPJVBV-UHFFFAOYSA-N barium(2+);iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Ba+2] HPYIMVBXZPJVBV-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000009700 powder processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/043—Printed circuit coils by thick film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49163—Manufacturing circuit on or in base with sintering of base
Definitions
- the invention relates to a monolithic inductive component.
- a method for producing the component and a use of the component are specified.
- a ceramic multilayer body offers the advantage that electrical components, for example printed conductors, resistances, capacitances and inductances, can be integrated into its volume.
- Known manufacturing processes include HTCC (High Temperature Cofired Ceramics) and LTCC (Low Temperature Cofired Ceramics) technology.
- unsintered ceramic green sheets are punched and screen printed using metal filled, electrically conductive pastes and provided with vias and planar conductive structures and then sintered together in the stack. This results in thermally resilient, hermetically sealed, planar multi-layer substrates.
- These multilayer substrates can act as circuit carriers of other components.
- the advantage of LTCC technology is that a sealing firing temperature is so low that relatively low temperature melting and highly electrically conductive metals such as silver or copper can be used to integrate the devices.
- a monolithic inductive component comprising at least one multilayer ceramic body with integrated winding and at least one magnetic core with ferritic core material, wherein the magnetic core is formed by a molded part.
- a method for producing the monolithic component is also specified with the following method steps: a) providing a green body with a green film composite for forming the ceramic multilayer body with the integrated winding and a molded body with the ferritic core material, b) heat treating the green body, wherein from the green film composite of the ceramic multilayer body with integrated winding and from the molding of the magnetic core with the ferritic core material is formed.
- the green body is a green foil composite.
- the shaped body is a green body with free-formed ferritic core material. Green foil composite and moldings together form one
- the molded body with the ferritic ceramic material may be an already densified ferrite core.
- the shaped body itself is a green body. This means that in the heat treatment, a compression of the ferritic ceramic material takes place.
- Under green body is generally a ceramic body with not yet compacted ceramic material.
- the green body may have organic additives such as binder and dispersant. But the green body can also only a squeeze of the ferritic core material or output stages of the ferritic Core material exist. From the output stages, the ferritic ceramic material is formed during the heat treatment.
- the green film composite and the molded body are combined in a common heat treatment step (Cofiring) to monolithic, so one-piece inductive component.
- the ceramic multilayer body has dielectric ceramic material.
- the film composite can have openings into which the molded part protrudes.
- such an opening is surrounded by a winding introduced in the film composite with the aid of an electrically conductive paste.
- the molding can be one-piece. Preferably that is
- Molded part two or more parts. It consists of at least two parts. Thereby, an efficient control of the magnetic flux by means of the core can be achieved.
- the air gap may be formed by a thin ceramic layer of the ceramic multilayer body with low permittivity.
- the above-described opening of the film composite is designed as a blind hole, which is filled by paste ⁇ or powder processing with segments of the ferritic molding.
- the functions of magnetic permeability and electrical insulation are realized in their respective spatial regions of the device by respectively tailored specific ceramics, whereby a high efficiency of the design and the requirement and Application of the component result.
- different dielectric and ferritic ceramic materials can be used.
- hexa-ferrite ceramics in particular barium-hexa-ferrite ceramics, can preferably be used. These have a permeability between about 10 and 30.
- a second class of ceramics may be used when frequencies in the middle range of about 10 to about 30 MHz are required.
- CuNiZn ferrite materials can be used.
- the permeability of ferritic ceramics used for devices for use in this medium frequency range has permeability values of about 150 to about 500.
- ceramics used in the relatively low frequency range between about 1 to about 3 MHz.
- MnZn ferrite materials can be used.
- ceramics used in this class have permeability values between about 500 and 1000.
- the invention can be used in HTCC technology. However, it is particularly advantageous to select the ceramic materials in such a way that compression takes place at a relatively low temperature and thus the LTCC technology can be used.
- green sheets and / or a ferritic ceramic material with glass are therefore used.
- a glass content in a green film or in the ferritic ceramic material ensures a compression at lower temperatures.
- the sintering process produces a glass ceramic with ceramic phase and glass phase.
- the ferritic ceramic material and / or the dielectric ceramic material comprise glass.
- the molding can be prefabricated. This means that the molded part is manufactured before being brought into contact with the green film composite. The molding produced during the Caribbean documents with the green film composite.
- the green-foil composite is brought together with an envelope so that a cavity with a cavity opening is formed between the envelope and the green-foil composite, and the cavity is filled with the still-formable ferritic core material through the cavity opening.
- the cavity is filled, for example, with the oxidic starting material in the form of a bulk material. It is also conceivable filling the cavity with a slurry containing the ferritic core material or the starting material of the core material.
- the shaped body has a ferritic slip or free-flowing ferritic green powder.
- the molding is removed before removal
- the envelope is preferably elastically deformable. This means that from the outside pressure on the filled in the cavity, such as powdery ferritic
- Core material can be exercised, so that a stable, self-supporting ferrite form is formed.
- a sheath made of a silicone is used for this purpose.
- Other elastically deformable wrapping materials are also conceivable.
- the coating may remain for heat treatment in combination with the molding and the green sheet composite.
- the sheath preferably consists of an organic material which is oxidized during heat treatment and removed via the gas phase.
- the covering it is also conceivable, in particular, for the covering to be removed after the molding has been formed and before the heat treatment. This can be done in the wrapping Cavity have a non-stick film, which simplifies a separation of the molding and sheath.
- the method can be carried out in terms of benefit. It can be made in parallel to a variety of components.
- the design of the inductive component is arbitrary.
- the inductive component preferably has at least one coil and / or at least one transformer.
- the device is used in power electronics, for example for current or voltage transformation or as a low-pass filter.
- the device is a circuit element of an electronic ballast (ECG) for a discharge lamp.
- ECG electronic ballast
- the invention provides the following particular advantages:
- the device achieves a high temperature compatibility. It is thus suitable for installation in the vicinity of heat sources, e.g. Lamps and motors suitable.
- heat sources e.g. Lamps and motors suitable.
- Low sintering ferrite material e.g. special MnZn ferrite, enables cost-effective production in use in a single sintering process together with the ceramic multilayer body (board).
- ferrite By targeted use of the ferrite alone on the inductive component, a cost-effective integration with other circuit components is achieved. There are no full-surface ferrites as in a simple, continuous film technology required. - With the invention, a ferrite volume can be minimized. The minimized ferrite volume minimizes thermal stresses between the different materials. This leads to a high stability and safer process management.
- the ferrite moldings can be made separately or directly on the multilayer body in molds by injection of green powder, by injection molding or similar methods. It is therefore not necessary to handle small pieces of film.
- a height of the ferrite core is subject to fewer restrictions than in the structure of ceramic
- the functions of the magnetic permeability and the electrical insulation are realized in their respective space regions by tailor-made specific ceramics, so that high efficiency of the design and high performance of the component result.
- Figures 1 and 2 each show a monolithic inductive component in a lateral cross-section.
- FIG. 3 indicates a method for producing a monolithic inductive component.
- LTCC technology is used to produce a monolithic multilayer ceramic body with integrated inductive component.
- the inductive component is a transformer.
- the ceramic green sheets used have glass contents, so that sintering can be carried out at a relatively low temperature (below 900 ° C.).
- the unsintered ferrite mass is then connected to the green film composite for co-sintering (cofiring).
- FIGS. 1 to 3 each show a planar transformer or a planar coil in a section perpendicular to the circuit carrier with corresponding functional materials and components.
- the component consists of a ceramic
- current-carrying windings are embedded between the layers.
- the transformer is realized by two coils that have no electrically conductive connection with each other, but by the magnetic field (inductively) are coupled together.
- the core with the ferritic material consists of two parts 7 and 8 (FIGS. 1 and 2). According to an alternative embodiment, the core is in one piece.
- the core consists only of a single part 7 ( Figure 3).
- the legs of the core are arranged in both embodiments in the openings 2, 3 and 4 of the ceramic multilayer body. For the production of the molding with the ferritic ceramic material different molding processes are used.
- the ferrite core can be constructed from individual layers and then mechanically processed ( Figure 2).
- casting of a ceramic slip or plastic deformation of a precisely sized ferrite mass is employed. This can e.g. also directly on the circuit carrier, as shown in Figure 3, done.
- the green film composite is brought together with a sheath 9, 10, which has a sheath opening 91. Through the sheath opening ferrite mass is filled in as a slip or powder. After drying or pressure / heat treatment, the envelope for later
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Soft Magnetic Materials (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007028239A DE102007028239A1 (de) | 2007-06-20 | 2007-06-20 | Monolithisches induktives Bauelement, Verfahren zum Herstellen des Bauelements und Verwendung des Bauelements |
| PCT/EP2008/057675 WO2008155344A1 (de) | 2007-06-20 | 2008-06-18 | Monolithisches induktives bauelement, verfahren zum herstellen des bauelements und verwendung des bauelements |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP2158597A1 true EP2158597A1 (de) | 2010-03-03 |
| EP2158597B1 EP2158597B1 (de) | 2012-08-15 |
| EP2158597B8 EP2158597B8 (de) | 2012-09-26 |
Family
ID=39722492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP08761143A Not-in-force EP2158597B8 (de) | 2007-06-20 | 2008-06-18 | Monolithisches induktives bauelement, verfahren zum herstellen des bauelements und verwendung des bauelements |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8695208B2 (de) |
| EP (1) | EP2158597B8 (de) |
| KR (1) | KR101511058B1 (de) |
| CN (1) | CN101681714B (de) |
| DE (1) | DE102007028239A1 (de) |
| WO (1) | WO2008155344A1 (de) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5398676B2 (ja) * | 2009-09-24 | 2014-01-29 | 日本碍子株式会社 | コイル埋設型インダクタおよびその製造方法 |
| CN101789311A (zh) * | 2010-02-11 | 2010-07-28 | 深圳顺络电子股份有限公司 | 一种ltcc低温共烧陶瓷平面变压器 |
| CN101777413A (zh) * | 2010-02-11 | 2010-07-14 | 深圳顺络电子股份有限公司 | 一种ltcc低温共烧陶瓷功率电感器 |
| DE102011112826B4 (de) | 2011-05-23 | 2020-06-18 | Micro-Epsilon Messtechnik Gmbh & Co. Kg | Sensor und Verfahren zur Herstellung des Sensors |
| CN102683789B (zh) * | 2012-04-28 | 2015-11-18 | 深圳光启创新技术有限公司 | 一种谐振子及制备方法 |
| FR3009884B1 (fr) * | 2013-08-26 | 2016-12-09 | Centre Nat De La Rech Scient (C N R S) | Procede de fabrication d'un composant electromagnetique monolithique et composant magnetique monolithique associe |
| DE102016223039A1 (de) * | 2016-11-22 | 2018-05-24 | Audi Ag | Abschirmeinrichtung für eine am Unterboden eines Kraftfahrzeugs angeordnete Induktionsspule und damit ausgestattetes Kraftfahrzeug |
| CN108155888A (zh) * | 2018-01-05 | 2018-06-12 | 北京航天微电科技有限公司 | 一种用于抑制电源电磁干扰的ltcc大功率emi滤波器 |
| CN108807439B (zh) * | 2018-05-25 | 2020-09-25 | 复旦大学 | 一种基于高温共烧陶瓷的线阵图像传感器封装方法 |
| US11398334B2 (en) | 2018-07-30 | 2022-07-26 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier comprising embedded inductor with an inlay |
| CN117238607B (zh) * | 2023-10-30 | 2025-04-29 | 北半球技术(苏州)有限公司 | 一种电感器及其制造方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69119557T2 (de) * | 1990-11-30 | 1996-10-17 | Intermetallics Co Ltd | Verfahren und Apparat zur Dauermagnet-Herstellung durch Formieren eines grünen und gesinterten Kompakts |
| US5087804A (en) * | 1990-12-28 | 1992-02-11 | Metcal, Inc. | Self-regulating heater with integral induction coil and method of manufacture thereof |
| US5349743A (en) | 1991-05-02 | 1994-09-27 | At&T Bell Laboratories | Method of making a multilayer monolithic magnet component |
| JPH0555044A (ja) * | 1991-08-23 | 1993-03-05 | Matsushita Electric Ind Co Ltd | インダクタンス部品およびその製造方法 |
| JP3099500B2 (ja) * | 1992-01-31 | 2000-10-16 | 株式会社村田製作所 | 複合積層トランス及びその製造方法 |
| JP3132786B2 (ja) * | 1992-08-19 | 2001-02-05 | 太陽誘電株式会社 | 積層チップインダクタおよびその製造方法 |
| JP3158757B2 (ja) * | 1993-01-13 | 2001-04-23 | 株式会社村田製作所 | チップ型コモンモードチョークコイル及びその製造方法 |
| TW265450B (en) * | 1994-06-30 | 1995-12-11 | At & T Corp | Devices using metallized magnetic substrates |
| US5945902A (en) * | 1997-09-22 | 1999-08-31 | Zefv Lipkes | Core and coil structure and method of making the same |
| JPH11171645A (ja) * | 1997-12-09 | 1999-06-29 | Hitachi Metals Ltd | 電子部品 |
| CN1141722C (zh) * | 1998-08-10 | 2004-03-10 | 广东肇庆风华电子工程开发有限公司 | 高性能低温烧结多层片式电感器制作工艺 |
| JP3449350B2 (ja) * | 2000-11-09 | 2003-09-22 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法及び積層セラミック電子部品 |
| JP3685720B2 (ja) * | 2001-02-16 | 2005-08-24 | 三洋電機株式会社 | 積層型複合デバイス及びその製造方法 |
| EP1367611A4 (de) * | 2001-03-08 | 2010-01-13 | Panasonic Corp | Induktivitätsbauelement und verfahren zu seiner herstellung |
| JP2004200227A (ja) * | 2002-12-16 | 2004-07-15 | Alps Electric Co Ltd | プリントインダクタ |
| JP5204403B2 (ja) * | 2003-09-04 | 2013-06-05 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | フェライト高分子コアを有する端数巻き変圧器 |
-
2007
- 2007-06-20 DE DE102007028239A patent/DE102007028239A1/de not_active Ceased
-
2008
- 2008-06-18 WO PCT/EP2008/057675 patent/WO2008155344A1/de not_active Ceased
- 2008-06-18 EP EP08761143A patent/EP2158597B8/de not_active Not-in-force
- 2008-06-18 KR KR1020107001342A patent/KR101511058B1/ko not_active Expired - Fee Related
- 2008-06-18 US US12/602,799 patent/US8695208B2/en not_active Expired - Fee Related
- 2008-06-18 CN CN200880021235.1A patent/CN101681714B/zh not_active Expired - Fee Related
Non-Patent Citations (1)
| Title |
|---|
| See references of WO2008155344A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101511058B1 (ko) | 2015-04-10 |
| EP2158597B1 (de) | 2012-08-15 |
| US8695208B2 (en) | 2014-04-15 |
| CN101681714B (zh) | 2012-08-22 |
| CN101681714A (zh) | 2010-03-24 |
| WO2008155344A1 (de) | 2008-12-24 |
| US20100171582A1 (en) | 2010-07-08 |
| DE102007028239A1 (de) | 2009-01-02 |
| EP2158597B8 (de) | 2012-09-26 |
| KR20100042627A (ko) | 2010-04-26 |
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