EP2084728A2 - Emitter für röntgenröhren und erwärmungsverfahren dafür - Google Patents
Emitter für röntgenröhren und erwärmungsverfahren dafürInfo
- Publication number
- EP2084728A2 EP2084728A2 EP07805460A EP07805460A EP2084728A2 EP 2084728 A2 EP2084728 A2 EP 2084728A2 EP 07805460 A EP07805460 A EP 07805460A EP 07805460 A EP07805460 A EP 07805460A EP 2084728 A2 EP2084728 A2 EP 2084728A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- emitter
- heating device
- emitting section
- heating
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J35/00—X-ray tubes
- H01J35/02—Details
- H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
- H01J35/06—Cathodes
- H01J35/064—Details of the emitter, e.g. material or structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2201/00—Electrodes common to discharge tubes
- H01J2201/28—Heaters for thermionic cathodes
- H01J2201/2803—Characterised by the shape or size
Definitions
- the present invention relates to the field of fast high-current electron sources for X-ray tubes.
- the present invention relates to an emitter for X- ray tubes, further, a heating device for the emitter, a setup consisting of the emitter and the heating device and a heating method to heat the emitter.
- the first of the two types is a thermionic emitter with balancing thermal conduction legs.
- the second type is explained later on. Both types have in common that they are directly heated thin flat emitters and that both emitter designs use slits to create an electric current path.
- the advantage of the emitters of the aforesaid types is that the entire electrical path can be realized with thin wires and narrow slits, resulting in a small device which is optimal for medical X-ray tubes.
- the disadvantage however may also based on the structuring: The electrical field may penetrates into the slit and the potential lines therefore bend into the slit region. If an electron is emitted from the surface perpendicular to the optical axis but within the region of deformed potential, its tangential velocity component may increases which causes stronger optical aberration of the source resulting in enlarged focal spots. An improvement of these known electron sources is essential.
- an emitter for X-ray tubes comprising a flat foil with an emitting section and at least two electrically conductive fixing sections wherein the emitting section is unstructured.
- the term 'unstructured' means that the emitting section has no slits and shows therefore a solid and plain surface. Due to the unstructured emitting section the electrical field is less disturbed as in slit structured emitting sections as known from the art. Surprisingly, eliminating the slit structure reduces the achievable spot size significantly. The emitter leads to smaller focal spot sizes than achievable with common electron sources without losing the necessary fast response times for medical examinations.
- the foil has a uniformly thickness in a range between 50 ⁇ m and 300 ⁇ m, preferably, in a range between lOO ⁇ m and 200 ⁇ m.
- the foil consists of tungsten or a tungsten alloy.
- the emitting section has a rectangular shape, particularly, a quadratically shape.
- the fixing sections have a spring structure. Due to the fact that one major problem of an unstructured flat emitter is the thermal expansion, the spring structure of the fixing sections may compensate this expansion. This compensation could lead to a significantly reduced deformation of the emitting area and thus to a further increased optical quality of the emitter.
- each fixing section is connected with a corner of the emitting section.
- This arrangement of the fixing sections allows to apply a mechanical pretension in a way, that the elongation of the emitting area during its hot phase is compensated.
- the spring structure of each fixing section must be designed following the boundary condition that this pretension causes no plastic deformation.
- this structure may forms a heat barrier between further terminals located at both ends of the emitter (heat sink) and a hot part of the emitter which leads to the necessary well-defined emitting area.
- the direction of the resilience of each fixing section is in-line with one diagonal of the shape of the emitting section to compensate the thermal expansion of the emitting section in all plane directions. This leads to a still better compensation of the elongation of the emitting section/emitting area.
- the present invention also relates to a heating device to heat the emitter, comprising a flat structured heating section and at least two fixing sections.
- the heating section is preferably subdivided by a plurality of slits into a plurality of thermal regions.
- the slits have a spiral shape.
- the present invention includes a setup comprising the emitter and a heating device.
- Another object of the invention is a heating method of the aforesaid setup.
- the method preferably comprises an electron bombardment onto the emitting section of the emitter and to apply an electrical current I R onto at least two fixing sections of the heating device. Additionally the method comprises to apply an electrical current into the at least two fixing sections of the emitter.
- a practicable indirect heating method may be given by a heat flux generation by accelerating electrons that are emitted from a directly heated emitter behind the indirectly heated nonstructured emitter (IHFE).
- IHFE indirectly heated nonstructured emitter
- Fig. 1 a shows a common directly heated first emitter with a rectangular emitting surface.
- Fig. 1 b shows a common second emitter with a round emitting surface.
- Fig. 2 shows a cross-section of a slit within the emitter with its electrical field and a part of the anode.
- Fig. 3 shows a focal spot example for a structured directly heated flat emitter (DHFE) of the state of the art.
- Fig. 4 shows a focal spot example for an unstructured indirectly heated flat emitter (IHFE).
- Fig. 5 shows a schematic setup of the indirectly heated emitter according to the invention with a heating device and a part of a cathode cup.
- Fig. 6 shows the assembly of Fig. 5 without the emitter and the cathode cup.
- Fig. 7 shows an emitter with symmetrically arranged fixing sections.
- Fig. 8 shows another emitter according to the invention with four fixing sections on a mounting device.
- Fig. 9 shows a temperature distribution of the emitter surface shown in
- FIG. 8 heated by a heating device like shown in Fig. 5 and Fig. 6.
- Fig. 10 shows a temperature distribution of the emitter surface more detailed.
- Fig. 11 shows a temperature distribution of the emitter surface with a combination of indirect heating via electron bombardment and direct heating by applying an electrical current to the fixing sections at the corners of the emitting section.
- Fig. 12 shows another temperature distribution as shown in Fig. 11.
- Fig. 13 shows a temperature and electron emitting distribution of a directly heated heating device.
- Fig. 14 shows a temperature distribution resulting from the heating device shown in Fig. 13.
- Fig. 15 shows a graph of a transient thermal dynamic of an emitter, whose temperature distribution is shown in Fig. 11
- Fig. 16 shows a schematic emitting control setup with an indirectly heated emitter according to the invention.
- FIG. Ia A directly heated thin flat emitter 1 with a rectangular emitting surface 2, as known from the art, is shown in Fig. Ia).
- the emitter design uses slits 3.
- Even the emitter 4 of Fig. Ib) with a round emitting surface 5 uses slits 6 and is directly heated.
- the flat emitting surface 5 is subdivided by the slits into spiral conductor sections 7.
- Fig. Ib) shows formed legs 8, as Fig. Ia), which here are angled 90° for installation and simultaneously serve as support elements via a heating current and the cathode high voltage are applied.
- Fig. 2 shows an example of a structured directly heated flat emitter
- a slit structure 10 of an emitter 9 as e.g. shown in Fig. Ia) and Fig. Ib) to the tracks of the electrons (arrows 11) from negative to positive potential are shown in Fig. 2:
- the electrons get higher tangential energy components (arrow 12) in relation to an optical axis 14 of the shown setup 13 due to the deformed electrical potential (shown as lines 15) and the emitting surfaces 16 that are not perpendicular to the optical axis 14.
- Fig. 2 it is schematically illustrated how a slit 18 between wires 17 influence the electrical field and the tracks of the emitted electrons.
- the electrical field penetrates into the slit 18 and the potential lines 15 therefore bend into the slit region 10. If an electron (path 19) is emitted from the surface 20 which is perpendicular to the optical axes 14 but within the region of deformed potential, its tangential velocity component increases. This causes stronger optical aberration of the source resulting in enlarged focal spots.
- a directly heated flat emitter with 20 slits of 40 ⁇ m width in length direction of the emitter and, according to the invention, an unstructured indirectly heated flat emitter (IHFE) in Fig. 4.
- Both emitter types have an emission section of 3.7mm x 6.8mm.
- the gray scale presenting the concentration of emission reaches from 0% emission (white) to 100% emission(black) on an area with a width 21 and a length 22.
- the white cross 23 presents the optical axis of a focal spot 24.
- the arrow 25 presents 15% emission.
- the strongest influence is given for the length dimension with a size reduction of more than 50%. Hence, eliminating the slit structure significantly reduces the achievable spot size.
- Fig. 5 shows a setup 29, comprising the indirectly heated emitter 26, according to the invention, a heating device 27 and a part 28 of a cathode cup.
- Fig. 6 shows the assembly of Fig. 5 without the emitter and the cathode cup.
- the emitter 26 of the setup 29 comprises a non-structured well-defined electron emitting section 30 and fixing sections 31, 32, 33, 34 that keeps the plane surface in position and avoids deformations.
- the heating device 27 with an inhomogeneous temperature distribution, a cold center and an increasing temperature to the edges, in combination with a direct heating of the fixing sections of the emitter leads to an homogeneous temperature and hence electron emission distribution.
- the heating device 27 with the combination of an electron emitting part and the real filament that injects electrons into the electron optic.
- the electrons that are emitted from the heating device 27 are accelerated towards the filament of the emitter 26 by applying an electrical voltage between these parts with the heating device 27 on negative potential with respect to the optical emitter (filament).
- the electrons impinge onto the filament's backside their kinetic energy is transformed into heat and the filament temperature rises. Additionally, energy is transferred to the filament by radiation. This principle setup is shown in Fig. 5 and Fig. 16.
- the heating device 27 is directly heated by electrical current and therefore needs a high electrical resistance which is e. g. realized by a meander structured foil.
- a blocking frame 36 is implemented around and on the heating device's backside (Fig. 6). This frame 36 is on the same electrical potential than the heating device 27 itself.
- the emitting area 37 of the heating device 27 is slightly smaller than the filament's emission area 30 to reduce the amount of electrons that are ejected through the slit between filament and cathode cup 28 into the high voltage region.
- the dimensions are e. g. an emitter of 7mmx7mm in size and a heating device of 6.5mm x 6.5mm in size.
- the foils thickness of both parts, heating device and emitter, is in the range of 100-200 ⁇ m making fast thermal responses achievable.
- the cathode cup 28 and the emitter 26 are on the same electrical potential.
- Fig. 7 shows an emitter 26, as shown in Fig. 5 with symmetrically arranged fixing sections 31 to 34 .
- One major problem of such a flat unstructured emitter 26 may be its thermal expansion. This expansion could lead to a deformation of the emitting section 30 which would drastically reduce the optical quality of the electron source.
- a spring structure of the fixing sections 31 to 34 is realized at the ends of the emitting section 30 of the IHFE like exemplarily shown in Fig. 5 with a fixing at all corners of the emitting section 30 and a 'double meander' structure on both ends. This arrangement allows to apply a mechanical pretension in a way, that the elongation of the emitting section 30 during its hot phase is compensated.
- this pretension is realized by elongation in the range of 80-120 ⁇ m.
- the spring must be designed following the boundary condition that this pretension causes no plastic deformation.
- this structure forms a heat barrier between the terminals at both ends (heat sink) and the hot part which leads to the necessary well-defined emitting section 30.
- Fig. 8 shows another emitter 40 according to the invention with four fixing sections 41 to 44 mounted on a mounting device 45 and a rectangular emitting section 46.
- the principle emitter design as shown in Fig. 7 only compensates the elongation in one direction.
- the expansion in the perpendicular direction leads to additional mechanical stress within the spring structure that is not compensated.
- the resulting reset force may lead to a deformation of the thin foil.
- a different design is presented in Fig. 8.
- This more complex structure, with four terminals as fixing sections 41 to 44 to fix the emitter 40 compensates the elongation in all plane directions.
- the surrounding slit 47 between the mounting device 45 and the emitter 40 is necessary to avoid electrical field deformation at the edges.
- the small slit 47 between surrounding and emitter has no significant influence on the optical properties due to its negligible small area in comparison to the entire emitting section 46.
- Fig. 9 to Fig. 12 and Fig. 14 show temperature distributions of the emitter surface shown in Fig. 8, heated by a heating device shown in Fig. 5 and Fig. 6.
- Fig. 11 shows a temperature distribution of the emitter surface with a combination of indirect heating via electron bombardment and direct heating by applying an electrical current to the fixing sections at the corners of the emitting section.
- Fig. 12 shows another temperature distribution as shown in Fig. 11.
- Fig. 13 shows a temperature and electron emitting distribution of a directly heated heating device.
- Fig. 14 shows a temperature distribution resulting from the heating device shown in Fig. 13. The temperature distribution of the 7mmx7mm emitter, when heated by a
- 6.5mmx6.5mm heater with a homogenous temperature is generally shown in Fig. 9 and in more detail in Fig. 10.
- the heating device 50 comprises a flat structured heating section 51 and two fixing sections 52, 53.
- the inhomogeneous temperature distribution of the heater can be realized e. g. by a double helix structure with an increasing width of the wires towards the center. This can be optimized but not completely eliminated as there is still the influence of the heat sink given by the terminals of the emitter.
- the pretension spring structure by itself has a relative high electrical resistance compared to the emitting area. Hence, by applying an electrical current to the terminals, the springs are heated up and the temperature difference ⁇ T decreases. In principle this is shown in Fig. 11 and Fig. 12.
- the higher thermal gradient in the spring is not problematic because the gradient acts in the direction of the structure and is therefore compensated by the pretension.
- a disadvantage, but with an insignificant influence on the quality of the entire electron source, is given by the small hot sections of the springs that also emit electrons. Regarding the emitter area size in comparison to these sections, this effect is negligible.
- Fig. 15 shows the transient thermal dynamic of an emitter of lOO ⁇ m in thickness as described in Fig. 11 with a boosted heating-up section (I), the controlled steady- state mode (II) and the passive cooling-down section (III).
- Fig. 16 shows a schematic emitting control setup with an indirectly heated emitter 51 according to the invention.
- the principle electrical circuit shown in Fig. 16 describes the electron source control. It is a tube power controlled setup with the tube current I E , the high voltage HV, the current between a heating device 52 and the emitter 51 I EH and the acceleration voltage between heating device and emitter 51 V H as input values.
- the actuating variables are the heating current I H and V H - Also shown is an anode 53.
- the invention generally includes a setup of an electron source for X-ray- tubes comprising a non-structured indirectly-heated or directly/indirectly heated flat emitter section with fast response regarding to the emitting current.
- This setup leads to smaller focal spot sizes than achievable with common electron sources without losing the necessary fast response times for medical examinations.
- a heating device with an inhomogeneous temperature distribution, a cold center and an increasing temperature to the edges, in combination with a direct heating of the fixture part of the emitter leads to an homogeneous temperature and hence electron emitting distribution.
- One way to realize an indirect heating of a non-structured foil is given by a combination of an electron emitting part and the real filament that injects electrons into the electron optic.
Landscapes
- Solid Thermionic Cathode (AREA)
- X-Ray Techniques (AREA)
- Control Of Resistance Heating (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07805460A EP2084728A2 (de) | 2006-10-17 | 2007-10-10 | Emitter für röntgenröhren und erwärmungsverfahren dafür |
EP11176652.3A EP2407997B1 (de) | 2006-10-17 | 2007-10-10 | Emitter für Röntgenröhren und entsprechendes Heizverfahren |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06122431 | 2006-10-17 | ||
EP07805460A EP2084728A2 (de) | 2006-10-17 | 2007-10-10 | Emitter für röntgenröhren und erwärmungsverfahren dafür |
PCT/IB2007/054124 WO2008047269A2 (en) | 2006-10-17 | 2007-10-10 | Emitter for x-ray tubes and heating method therefore |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11176652.3A Division EP2407997B1 (de) | 2006-10-17 | 2007-10-10 | Emitter für Röntgenröhren und entsprechendes Heizverfahren |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2084728A2 true EP2084728A2 (de) | 2009-08-05 |
Family
ID=39047858
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11176652.3A Not-in-force EP2407997B1 (de) | 2006-10-17 | 2007-10-10 | Emitter für Röntgenröhren und entsprechendes Heizverfahren |
EP07805460A Withdrawn EP2084728A2 (de) | 2006-10-17 | 2007-10-10 | Emitter für röntgenröhren und erwärmungsverfahren dafür |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11176652.3A Not-in-force EP2407997B1 (de) | 2006-10-17 | 2007-10-10 | Emitter für Röntgenröhren und entsprechendes Heizverfahren |
Country Status (4)
Country | Link |
---|---|
US (1) | US8000449B2 (de) |
EP (2) | EP2407997B1 (de) |
CN (1) | CN101529549B (de) |
WO (1) | WO2008047269A2 (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
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GB0525593D0 (en) | 2005-12-16 | 2006-01-25 | Cxr Ltd | X-ray tomography inspection systems |
US8243876B2 (en) | 2003-04-25 | 2012-08-14 | Rapiscan Systems, Inc. | X-ray scanners |
GB0812864D0 (en) | 2008-07-15 | 2008-08-20 | Cxr Ltd | Coolign anode |
US9208988B2 (en) | 2005-10-25 | 2015-12-08 | Rapiscan Systems, Inc. | Graphite backscattered electron shield for use in an X-ray tube |
US10483077B2 (en) | 2003-04-25 | 2019-11-19 | Rapiscan Systems, Inc. | X-ray sources having reduced electron scattering |
US9046465B2 (en) | 2011-02-24 | 2015-06-02 | Rapiscan Systems, Inc. | Optimization of the source firing pattern for X-ray scanning systems |
US20100176708A1 (en) * | 2007-06-01 | 2010-07-15 | Koninklijke Philips Electronics N.V. | X-ray emitting foil with temporary fixing bars and preparing method therefore |
US7924983B2 (en) | 2008-06-30 | 2011-04-12 | Varian Medical Systems, Inc. | Thermionic emitter designed to control electron beam current profile in two dimensions |
DE102009005454B4 (de) | 2009-01-21 | 2011-02-17 | Siemens Aktiengesellschaft | Thermionische Emissionsvorrichtung |
GB0901338D0 (en) * | 2009-01-28 | 2009-03-11 | Cxr Ltd | X-Ray tube electron sources |
DE102010020151A1 (de) * | 2010-05-11 | 2011-11-17 | Siemens Aktiengesellschaft | Thermionischer Flachemitter und zugehöriges Verfahren zum Betrieb einer Röntgenröhre |
US9466455B2 (en) * | 2011-06-16 | 2016-10-11 | Varian Medical Systems, Inc. | Electron emitters for x-ray tubes |
WO2014041639A1 (ja) * | 2012-09-12 | 2014-03-20 | 株式会社島津製作所 | X線管装置およびx線管装置の使用方法 |
US9251987B2 (en) | 2012-09-14 | 2016-02-02 | General Electric Company | Emission surface for an X-ray device |
CN106206223B (zh) | 2013-10-29 | 2019-06-14 | 万睿视影像有限公司 | 发射特点可调节以及磁性操控和聚焦的具有平面发射器的x射线管 |
US9711320B2 (en) | 2014-04-29 | 2017-07-18 | General Electric Company | Emitter devices for use in X-ray tubes |
DE102014211688A1 (de) | 2014-06-18 | 2015-12-24 | Siemens Aktiengesellschaft | Flachemitter |
DE102015215690A1 (de) * | 2015-08-18 | 2017-03-09 | Siemens Healthcare Gmbh | Emitteranordnung |
US9953797B2 (en) | 2015-09-28 | 2018-04-24 | General Electric Company | Flexible flat emitter for X-ray tubes |
US10249469B2 (en) * | 2016-03-30 | 2019-04-02 | General Electric Company | Fabrication methods and modal stiffining for non-flat single/multi-piece emitter |
JP6744116B2 (ja) * | 2016-04-01 | 2020-08-19 | キヤノン電子管デバイス株式会社 | エミッター及びx線管 |
US10636608B2 (en) * | 2017-06-05 | 2020-04-28 | General Electric Company | Flat emitters with stress compensation features |
KR101966794B1 (ko) * | 2017-07-12 | 2019-08-27 | (주)선재하이테크 | 전자 집속 개선용 엑스선관 |
EP3518266A1 (de) | 2018-01-30 | 2019-07-31 | Siemens Healthcare GmbH | Thermionische emissionsvorrichtung |
US10998160B2 (en) * | 2018-08-21 | 2021-05-04 | General Electric Company | Cathode emitter to emitter attachment system and method |
CN109300750B (zh) * | 2018-08-30 | 2020-10-23 | 中国科学院微电子研究所 | 一种场发射阴极电子源、阵列及电子发射方法 |
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DE336781C (de) | 1919-07-16 | 1921-05-18 | Siemens & Halske Akt Ges | Gluehkathode fuer Roentgenroehren |
DE738936C (de) * | 1931-08-20 | 1944-04-19 | Aeg | Gluehkathode, insbesondere fuer Roentgenroehren, Braunsche Roehren |
GB524240A (en) * | 1939-01-25 | 1940-08-01 | Werner Ehrenberg | Improvements in or relating to cathodes for electron discharge devices |
NL250741A (de) * | 1959-07-16 | |||
DE2727907A1 (de) * | 1977-06-21 | 1979-01-18 | Siemens Ag | Roentgenroehren-gluehkathode |
JPS5568056A (en) * | 1978-11-17 | 1980-05-22 | Hitachi Ltd | X-ray tube |
DE3222511C2 (de) * | 1982-06-16 | 1985-08-29 | Feinfocus Röntgensysteme GmbH, 3050 Wunstorf | Feinfokus-Röntgenröhre |
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FR2633775B1 (fr) * | 1988-07-01 | 1995-11-17 | Gen Electric Cgr | Tube radiogene a cathode plane et a chauffage indirect |
US5042058A (en) * | 1989-03-22 | 1991-08-20 | University Of California | Ultrashort time-resolved x-ray source |
DE19510048C2 (de) * | 1995-03-20 | 1998-05-14 | Siemens Ag | Röntgenröhre |
WO1996039709A1 (en) | 1995-06-05 | 1996-12-12 | Ceradyne, Inc. | Directly heated dispenser cathode and method of manufacture therefor |
US5907595A (en) * | 1997-08-18 | 1999-05-25 | General Electric Company | Emitter-cup cathode for high-emission x-ray tube |
DE19828158C1 (de) * | 1998-06-24 | 1999-11-25 | Siemens Ag | Indirekt geheizte Kathode, insbesondere für Röntgenröhren |
DE19911081A1 (de) | 1999-03-12 | 2000-09-21 | Siemens Ag | Röntgenröhre mit konzentrischem Mehrfoken-Rundstrahlemitter |
DE10016125A1 (de) * | 1999-04-29 | 2000-11-02 | Siemens Ag | Lebensdaueroptimierter Emitter |
US6456691B2 (en) * | 2000-03-06 | 2002-09-24 | Rigaku Corporation | X-ray generator |
DE10012203C1 (de) | 2000-03-13 | 2001-07-26 | Siemens Ag | Thermionischer Flachemitter |
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JP4584470B2 (ja) * | 2001-02-01 | 2010-11-24 | 浜松ホトニクス株式会社 | X線発生装置 |
US6480568B1 (en) * | 2001-06-19 | 2002-11-12 | Photoelectron Corporation | Optically driven therapeutic radiation source |
DE10135995C2 (de) * | 2001-07-24 | 2003-10-30 | Siemens Ag | Direktgeheizter thermionischer Flachemitter |
US6785359B2 (en) * | 2002-07-30 | 2004-08-31 | Ge Medical Systems Global Technology Company, Llc | Cathode for high emission x-ray tube |
US7320733B2 (en) | 2003-05-09 | 2008-01-22 | Sukegawa Electric Co., Ltd. | Electron bombardment heating apparatus and temperature controlling apparatus and control method thereof |
-
2007
- 2007-10-10 EP EP11176652.3A patent/EP2407997B1/de not_active Not-in-force
- 2007-10-10 CN CN200780038682.3A patent/CN101529549B/zh active Active
- 2007-10-10 WO PCT/IB2007/054124 patent/WO2008047269A2/en active Application Filing
- 2007-10-10 US US12/445,751 patent/US8000449B2/en active Active
- 2007-10-10 EP EP07805460A patent/EP2084728A2/de not_active Withdrawn
Non-Patent Citations (1)
Title |
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See references of WO2008047269A2 * |
Also Published As
Publication number | Publication date |
---|---|
CN101529549A (zh) | 2009-09-09 |
EP2407997B1 (de) | 2014-03-05 |
US8000449B2 (en) | 2011-08-16 |
WO2008047269A3 (en) | 2008-08-14 |
EP2407997A1 (de) | 2012-01-18 |
US20100316192A1 (en) | 2010-12-16 |
WO2008047269A2 (en) | 2008-04-24 |
CN101529549B (zh) | 2014-09-03 |
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