EP2047201B1 - Dispositif a ecoulement de chaleur - Google Patents
Dispositif a ecoulement de chaleur Download PDFInfo
- Publication number
- EP2047201B1 EP2047201B1 EP07823290.7A EP07823290A EP2047201B1 EP 2047201 B1 EP2047201 B1 EP 2047201B1 EP 07823290 A EP07823290 A EP 07823290A EP 2047201 B1 EP2047201 B1 EP 2047201B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- equipment
- item
- cold
- cold part
- thermal conditions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007788 liquid Substances 0.000 claims description 27
- 239000000446 fuel Substances 0.000 claims description 14
- 238000013021 overheating Methods 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 230000015556 catabolic process Effects 0.000 claims description 2
- 238000006731 degradation reaction Methods 0.000 claims description 2
- 239000007791 liquid phase Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 37
- 239000007787 solid Substances 0.000 description 9
- 230000008018 melting Effects 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 230000008016 vaporization Effects 0.000 description 5
- 238000009834 vaporization Methods 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000007257 malfunction Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
- F28F2013/008—Variable conductance materials; Thermal switches
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/10—Safety or protection arrangements; Arrangements for preventing malfunction for preventing overheating, e.g. heat shields
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2270/00—Thermal insulation; Thermal decoupling
Definitions
- the element comprises for example in this case at least one component of which a change of state in said thermal conditions causes said loss of contact.
- the equipment 301 generating heat and the cold part 302 acting as a cold source are located respectively in the upper part and the lower part of an enclosure 305.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Hydrogen, Water And Hydrids (AREA)
- Thermal Insulation (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0653016A FR2904103B1 (fr) | 2006-07-18 | 2006-07-18 | Dispositif a ecoulement de chaleur |
PCT/FR2007/001223 WO2008009812A1 (fr) | 2006-07-18 | 2007-07-17 | Dispositif a ecoulement de chaleur |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2047201A1 EP2047201A1 (fr) | 2009-04-15 |
EP2047201B1 true EP2047201B1 (fr) | 2021-09-01 |
Family
ID=37691806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP07823290.7A Active EP2047201B1 (fr) | 2006-07-18 | 2007-07-17 | Dispositif a ecoulement de chaleur |
Country Status (9)
Country | Link |
---|---|
US (2) | US20100012311A1 (ja) |
EP (1) | EP2047201B1 (ja) |
JP (1) | JP2009543998A (ja) |
CN (1) | CN101490497B (ja) |
BR (1) | BRPI0713191A2 (ja) |
CA (1) | CA2657778C (ja) |
FR (1) | FR2904103B1 (ja) |
RU (1) | RU2460955C2 (ja) |
WO (1) | WO2008009812A1 (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9610093B2 (en) | 2010-08-06 | 2017-04-04 | Kci Licensing, Inc. | Microblister skin grafting |
US8617181B2 (en) | 2010-08-06 | 2013-12-31 | MoMelan Technologies, Inc. | Methods for preparing a skin graft |
US8978234B2 (en) | 2011-12-07 | 2015-03-17 | MoMelan Technologies, Inc. | Methods of manufacturing devices for generating skin grafts |
US9597111B2 (en) | 2010-08-06 | 2017-03-21 | Kci Licensing, Inc. | Methods for applying a skin graft |
US8562626B2 (en) | 2010-08-06 | 2013-10-22 | MoMelan Technologies, Inc. | Devices for harvesting a skin graft |
US9173674B2 (en) | 2010-08-06 | 2015-11-03 | MoMelan Technologies, Inc. | Devices for harvesting a skin graft |
US8926631B2 (en) | 2010-08-06 | 2015-01-06 | MoMelan Technologies, Inc. | Methods for preparing a skin graft without culturing or use of biologics |
FR2977121B1 (fr) * | 2011-06-22 | 2014-04-25 | Commissariat Energie Atomique | Systeme de gestion thermique a materiau a volume variable |
CN105636532B (zh) | 2013-03-14 | 2019-06-21 | 凯希特许有限公司 | 用于采集皮肤移植片的吸收性基底 |
EP3626188B1 (en) | 2013-12-31 | 2021-08-18 | 3M Innovative Properties Company | Sensor systems for skin graft harvesting |
US10463392B2 (en) | 2013-12-31 | 2019-11-05 | Kci Licensing, Inc. | Fluid-assisted skin graft harvesting |
WO2016164890A1 (en) | 2015-04-09 | 2016-10-13 | Kci Licensing, Inc. | Soft-tack, porous substrates for harvesting skin grafts |
WO2017079439A1 (en) | 2015-11-03 | 2017-05-11 | Kci Licensing, Inc. | Device for creating an epidermal graft sheet |
US10866036B1 (en) | 2020-05-18 | 2020-12-15 | Envertic Thermal Systems, Llc | Thermal switch |
US11493551B2 (en) | 2020-06-22 | 2022-11-08 | Advantest Test Solutions, Inc. | Integrated test cell using active thermal interposer (ATI) with parallel socket actuation |
US11549981B2 (en) | 2020-10-01 | 2023-01-10 | Advantest Test Solutions, Inc. | Thermal solution for massively parallel testing |
US11821913B2 (en) | 2020-11-02 | 2023-11-21 | Advantest Test Solutions, Inc. | Shielded socket and carrier for high-volume test of semiconductor devices |
US11808812B2 (en) | 2020-11-02 | 2023-11-07 | Advantest Test Solutions, Inc. | Passive carrier-based device delivery for slot-based high-volume semiconductor test system |
US20220155364A1 (en) | 2020-11-19 | 2022-05-19 | Advantest Test Solutions, Inc. | Wafer scale active thermal interposer for device testing |
US11567119B2 (en) | 2020-12-04 | 2023-01-31 | Advantest Test Solutions, Inc. | Testing system including active thermal interposer device |
US11573262B2 (en) | 2020-12-31 | 2023-02-07 | Advantest Test Solutions, Inc. | Multi-input multi-zone thermal control for device testing |
US11587640B2 (en) | 2021-03-08 | 2023-02-21 | Advantest Test Solutions, Inc. | Carrier based high volume system level testing of devices with pop structures |
US11656273B1 (en) | 2021-11-05 | 2023-05-23 | Advantest Test Solutions, Inc. | High current device testing apparatus and systems |
US11835549B2 (en) | 2022-01-26 | 2023-12-05 | Advantest Test Solutions, Inc. | Thermal array with gimbal features and enhanced thermal performance |
Family Cites Families (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3391728A (en) * | 1964-07-03 | 1968-07-09 | Trw Inc | Thermal valve |
US3463224A (en) * | 1966-10-24 | 1969-08-26 | Trw Inc | Thermal heat switch |
US3399717A (en) * | 1966-12-27 | 1968-09-03 | Trw Inc | Thermal switch |
US3519067A (en) * | 1967-12-28 | 1970-07-07 | Honeywell Inc | Variable thermal conductance devices |
GB1356115A (en) * | 1970-10-27 | 1974-06-12 | Lucas Industries Ltd | Fuel supply arrangements for internal combustion engines |
US4212346A (en) * | 1977-09-19 | 1980-07-15 | Rockwell International Corporation | Variable heat transfer device |
US4281708A (en) * | 1979-05-30 | 1981-08-04 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Automatic thermal switch |
US4384610A (en) * | 1981-10-19 | 1983-05-24 | Mcdonnell Douglas Corporation | Simple thermal joint |
US4402358A (en) * | 1982-10-15 | 1983-09-06 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Heat pipe thermal switch |
US4742867A (en) * | 1986-12-01 | 1988-05-10 | Cape Cod Research, Inc. | Method and apparatuses for heat transfer |
JPS63161388A (ja) | 1986-12-23 | 1988-07-05 | Ishikawajima Harima Heavy Ind Co Ltd | ヒ−トパイプ |
JPH01110245A (ja) * | 1987-10-23 | 1989-04-26 | Iwatani Internatl Corp | 極低温試験装置 |
US6435454B1 (en) * | 1987-12-14 | 2002-08-20 | Northrop Grumman Corporation | Heat pipe cooling of aircraft skins for infrared radiation matching |
JPH0645177Y2 (ja) | 1988-07-11 | 1994-11-16 | 三菱重工業株式会社 | ヒートパイプ |
JPH0528721Y2 (ja) * | 1989-09-06 | 1993-07-23 | ||
US5188909A (en) * | 1991-09-12 | 1993-02-23 | Eveready Battery Co., Inc. | Electrochemical cell with circuit disconnect device |
AT399951B (de) * | 1991-11-05 | 1995-08-25 | Grabner Werner | Verfahren und vorrichtung zur begrenzung der temperatur |
US5216580A (en) * | 1992-01-14 | 1993-06-01 | Sun Microsystems, Inc. | Optimized integral heat pipe and electronic circuit module arrangement |
US5379601A (en) * | 1993-09-15 | 1995-01-10 | International Business Machines Corporation | Temperature actuated switch for cryo-coolers |
JP3324107B2 (ja) * | 1996-03-29 | 2002-09-17 | 株式会社トヨトミ | ポット式石油燃焼器の燃料管構造 |
RU2110902C1 (ru) * | 1996-11-13 | 1998-05-10 | Российский Федеральный Ядерный Центр - Всероссийский Научно-Исследовательский Институт Экспериментальной Физики | Способ охлаждения электрорадиоэлементов |
US6047766A (en) | 1998-08-03 | 2000-04-11 | Hewlett-Packard Company | Multi-mode heat transfer using a thermal heat pipe valve |
RU2161384C1 (ru) * | 1999-05-13 | 2000-12-27 | Фонд Сертификации "Энергия" | Устройство для температурной стабилизации электронного оборудования |
US6940716B1 (en) * | 2000-07-13 | 2005-09-06 | Intel Corporation | Method and apparatus for dissipating heat from an electronic device |
RU2183310C1 (ru) * | 2000-10-31 | 2002-06-10 | Центр КОРТЭС | Устройство термостабилизации |
DE10123473A1 (de) * | 2001-05-15 | 2002-11-21 | Volkswagen Ag | Vorrichtung zur Wärmeeinbringung in eine Flüssigkeit |
JP4273680B2 (ja) * | 2001-06-14 | 2009-06-03 | パナソニック株式会社 | 液化ガス気化装置 |
US20030196787A1 (en) * | 2002-04-19 | 2003-10-23 | Mahoney William G. | Passive thermal regulator for temperature sensitive components |
RU2212358C1 (ru) * | 2002-12-18 | 2003-09-20 | Макаров Игорь Альбертович | Летательный аппарат |
US6768781B1 (en) * | 2003-03-31 | 2004-07-27 | The Boeing Company | Methods and apparatuses for removing thermal energy from a nuclear reactor |
JP4131196B2 (ja) * | 2003-05-21 | 2008-08-13 | 株式会社ノーリツ | 燃焼装置 |
US6864571B2 (en) | 2003-07-07 | 2005-03-08 | Gelcore Llc | Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking |
DE10342425A1 (de) * | 2003-09-13 | 2005-01-05 | Daimlerchrysler Ag | Steuerbare Wärmeisolationsschicht |
TWI229789B (en) | 2003-12-29 | 2005-03-21 | Li Mei Feng | Cooling method and device of micro heat pipe with pressure difference flow shunt |
DE10361653B4 (de) | 2003-12-30 | 2008-08-07 | Airbus Deutschland Gmbh | Kühleinrichtung zum Abführen von Wärme von einer im Innenraum eines Flugzeuges angeordneten Wärmequelle |
JP4407509B2 (ja) | 2004-01-20 | 2010-02-03 | 三菱マテリアル株式会社 | 絶縁伝熱構造体及びパワーモジュール用基板 |
US20060037589A1 (en) * | 2004-08-17 | 2006-02-23 | Ramesh Gupta | Heat pipe for heating of gasoline for on-board octane segregation |
US7268292B2 (en) * | 2004-09-20 | 2007-09-11 | International Business Machines Corporation | Multi-dimensional compliant thermal cap for an electronic device |
US20060141308A1 (en) * | 2004-12-23 | 2006-06-29 | Becerra Juan J | Apparatus and method for variable conductance temperature control |
JP4410183B2 (ja) * | 2005-01-27 | 2010-02-03 | 愛三工業株式会社 | 燃料供給装置 |
US7755899B2 (en) * | 2006-01-18 | 2010-07-13 | ÅAC Microtec AB | Miniaturized high conductivity thermal/electrical switch |
FR2904102B1 (fr) | 2006-07-18 | 2015-03-27 | Airbus France | Dispositif a ecoulement de chaleur |
-
2006
- 2006-07-18 FR FR0653016A patent/FR2904103B1/fr not_active Expired - Fee Related
-
2007
- 2007-07-17 BR BRPI0713191-7A patent/BRPI0713191A2/pt not_active Application Discontinuation
- 2007-07-17 CA CA2657778A patent/CA2657778C/en not_active Expired - Fee Related
- 2007-07-17 WO PCT/FR2007/001223 patent/WO2008009812A1/fr active Application Filing
- 2007-07-17 EP EP07823290.7A patent/EP2047201B1/fr active Active
- 2007-07-17 RU RU2009105501/06A patent/RU2460955C2/ru not_active IP Right Cessation
- 2007-07-17 US US12/373,988 patent/US20100012311A1/en not_active Abandoned
- 2007-07-17 JP JP2009520012A patent/JP2009543998A/ja active Pending
- 2007-07-17 CN CN200780027095.4A patent/CN101490497B/zh active Active
-
2012
- 2012-12-17 US US13/716,951 patent/US9310145B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US9310145B2 (en) | 2016-04-12 |
CN101490497A (zh) | 2009-07-22 |
US20100012311A1 (en) | 2010-01-21 |
RU2009105501A (ru) | 2010-08-27 |
CN101490497B (zh) | 2014-07-23 |
EP2047201A1 (fr) | 2009-04-15 |
JP2009543998A (ja) | 2009-12-10 |
US20130098594A1 (en) | 2013-04-25 |
BRPI0713191A2 (pt) | 2012-03-20 |
CA2657778A1 (en) | 2008-01-24 |
WO2008009812A1 (fr) | 2008-01-24 |
CA2657778C (en) | 2015-11-24 |
FR2904103B1 (fr) | 2015-05-15 |
RU2460955C2 (ru) | 2012-09-10 |
FR2904103A1 (fr) | 2008-01-25 |
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BE435650A (ja) |
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