FR2904103A1 - Dispositif a ecoulement de chaleur - Google Patents
Dispositif a ecoulement de chaleur Download PDFInfo
- Publication number
- FR2904103A1 FR2904103A1 FR0653016A FR0653016A FR2904103A1 FR 2904103 A1 FR2904103 A1 FR 2904103A1 FR 0653016 A FR0653016 A FR 0653016A FR 0653016 A FR0653016 A FR 0653016A FR 2904103 A1 FR2904103 A1 FR 2904103A1
- Authority
- FR
- France
- Prior art keywords
- equipment
- state
- change
- cold
- cold part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
- F28F2013/008—Variable conductance materials; Thermal switches
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/10—Safety or protection arrangements; Arrangements for preventing malfunction for preventing overheating, e.g. heat shields
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2270/00—Thermal insulation; Thermal decoupling
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Thermal Insulation (AREA)
- Hydrogen, Water And Hydrids (AREA)
Abstract
Description
Claims (18)
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0653016A FR2904103B1 (fr) | 2006-07-18 | 2006-07-18 | Dispositif a ecoulement de chaleur |
JP2009520012A JP2009543998A (ja) | 2006-07-18 | 2007-07-17 | 排熱装置 |
BRPI0713191-7A BRPI0713191A2 (pt) | 2006-07-18 | 2007-07-17 | dispositivo compreendendo um equipamento com uma fonte de calor e aeronave |
PCT/FR2007/001223 WO2008009812A1 (fr) | 2006-07-18 | 2007-07-17 | Dispositif a ecoulement de chaleur |
RU2009105501/06A RU2460955C2 (ru) | 2006-07-18 | 2007-07-17 | Устройство с перетеканием тепловой энергии |
EP07823290.7A EP2047201B1 (fr) | 2006-07-18 | 2007-07-17 | Dispositif a ecoulement de chaleur |
US12/373,988 US20100012311A1 (en) | 2006-07-18 | 2007-07-17 | Heat flow device |
CA2657778A CA2657778C (fr) | 2006-07-18 | 2007-07-17 | Dispositif a flux de chaleur |
CN200780027095.4A CN101490497B (zh) | 2006-07-18 | 2007-07-17 | 热流动装置 |
US13/716,951 US9310145B2 (en) | 2006-07-18 | 2012-12-17 | Heat flow device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0653016A FR2904103B1 (fr) | 2006-07-18 | 2006-07-18 | Dispositif a ecoulement de chaleur |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2904103A1 true FR2904103A1 (fr) | 2008-01-25 |
FR2904103B1 FR2904103B1 (fr) | 2015-05-15 |
Family
ID=37691806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0653016A Expired - Fee Related FR2904103B1 (fr) | 2006-07-18 | 2006-07-18 | Dispositif a ecoulement de chaleur |
Country Status (9)
Country | Link |
---|---|
US (2) | US20100012311A1 (fr) |
EP (1) | EP2047201B1 (fr) |
JP (1) | JP2009543998A (fr) |
CN (1) | CN101490497B (fr) |
BR (1) | BRPI0713191A2 (fr) |
CA (1) | CA2657778C (fr) |
FR (1) | FR2904103B1 (fr) |
RU (1) | RU2460955C2 (fr) |
WO (1) | WO2008009812A1 (fr) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8978234B2 (en) | 2011-12-07 | 2015-03-17 | MoMelan Technologies, Inc. | Methods of manufacturing devices for generating skin grafts |
US9173674B2 (en) | 2010-08-06 | 2015-11-03 | MoMelan Technologies, Inc. | Devices for harvesting a skin graft |
US8562626B2 (en) | 2010-08-06 | 2013-10-22 | MoMelan Technologies, Inc. | Devices for harvesting a skin graft |
US9610093B2 (en) | 2010-08-06 | 2017-04-04 | Kci Licensing, Inc. | Microblister skin grafting |
US9597111B2 (en) | 2010-08-06 | 2017-03-21 | Kci Licensing, Inc. | Methods for applying a skin graft |
US8926631B2 (en) | 2010-08-06 | 2015-01-06 | MoMelan Technologies, Inc. | Methods for preparing a skin graft without culturing or use of biologics |
US8617181B2 (en) | 2010-08-06 | 2013-12-31 | MoMelan Technologies, Inc. | Methods for preparing a skin graft |
FR2977121B1 (fr) * | 2011-06-22 | 2014-04-25 | Commissariat Energie Atomique | Systeme de gestion thermique a materiau a volume variable |
CN105636532B (zh) | 2013-03-14 | 2019-06-21 | 凯希特许有限公司 | 用于采集皮肤移植片的吸收性基底 |
CN106028982B (zh) | 2013-12-31 | 2020-06-12 | 凯希特许有限公司 | 流体辅助的皮肤移植物采集 |
WO2015103043A1 (fr) | 2013-12-31 | 2015-07-09 | Kci Licensing, Inc. | Systèmes de capteurs pour prélèvement de greffons de peau |
EP3280465B1 (fr) | 2015-04-09 | 2020-12-16 | 3M Innovative Properties Company | Substrats poreux absorbants pour le prélèvement de greffons de peau |
US11006974B2 (en) | 2015-11-03 | 2021-05-18 | Kci Licensing, Inc. | Devices for creating an epidermal graft sheet |
US11204206B2 (en) | 2020-05-18 | 2021-12-21 | Envertic Thermal Systems, Llc | Thermal switch |
US11493551B2 (en) | 2020-06-22 | 2022-11-08 | Advantest Test Solutions, Inc. | Integrated test cell using active thermal interposer (ATI) with parallel socket actuation |
US11549981B2 (en) | 2020-10-01 | 2023-01-10 | Advantest Test Solutions, Inc. | Thermal solution for massively parallel testing |
US11808812B2 (en) | 2020-11-02 | 2023-11-07 | Advantest Test Solutions, Inc. | Passive carrier-based device delivery for slot-based high-volume semiconductor test system |
US11821913B2 (en) | 2020-11-02 | 2023-11-21 | Advantest Test Solutions, Inc. | Shielded socket and carrier for high-volume test of semiconductor devices |
US20220155364A1 (en) | 2020-11-19 | 2022-05-19 | Advantest Test Solutions, Inc. | Wafer scale active thermal interposer for device testing |
US11567119B2 (en) | 2020-12-04 | 2023-01-31 | Advantest Test Solutions, Inc. | Testing system including active thermal interposer device |
US11573262B2 (en) | 2020-12-31 | 2023-02-07 | Advantest Test Solutions, Inc. | Multi-input multi-zone thermal control for device testing |
US11587640B2 (en) | 2021-03-08 | 2023-02-21 | Advantest Test Solutions, Inc. | Carrier based high volume system level testing of devices with pop structures |
US11656273B1 (en) | 2021-11-05 | 2023-05-23 | Advantest Test Solutions, Inc. | High current device testing apparatus and systems |
US11835549B2 (en) | 2022-01-26 | 2023-12-05 | Advantest Test Solutions, Inc. | Thermal array with gimbal features and enhanced thermal performance |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3463224A (en) * | 1966-10-24 | 1969-08-26 | Trw Inc | Thermal heat switch |
US3519067A (en) * | 1967-12-28 | 1970-07-07 | Honeywell Inc | Variable thermal conductance devices |
US4384610A (en) * | 1981-10-19 | 1983-05-24 | Mcdonnell Douglas Corporation | Simple thermal joint |
US4402358A (en) * | 1982-10-15 | 1983-09-06 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Heat pipe thermal switch |
US4742867A (en) * | 1986-12-01 | 1988-05-10 | Cape Cod Research, Inc. | Method and apparatuses for heat transfer |
US5216580A (en) * | 1992-01-14 | 1993-06-01 | Sun Microsystems, Inc. | Optimized integral heat pipe and electronic circuit module arrangement |
DE10123473A1 (de) * | 2001-05-15 | 2002-11-21 | Volkswagen Ag | Vorrichtung zur Wärmeeinbringung in eine Flüssigkeit |
DE10342425A1 (de) * | 2003-09-13 | 2005-01-05 | Daimlerchrysler Ag | Steuerbare Wärmeisolationsschicht |
US20060141308A1 (en) * | 2004-12-23 | 2006-06-29 | Becerra Juan J | Apparatus and method for variable conductance temperature control |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3391728A (en) * | 1964-07-03 | 1968-07-09 | Trw Inc | Thermal valve |
US3399717A (en) * | 1966-12-27 | 1968-09-03 | Trw Inc | Thermal switch |
GB1356115A (en) * | 1970-10-27 | 1974-06-12 | Lucas Industries Ltd | Fuel supply arrangements for internal combustion engines |
US4212346A (en) * | 1977-09-19 | 1980-07-15 | Rockwell International Corporation | Variable heat transfer device |
US4281708A (en) * | 1979-05-30 | 1981-08-04 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Automatic thermal switch |
JPS63161388A (ja) | 1986-12-23 | 1988-07-05 | Ishikawajima Harima Heavy Ind Co Ltd | ヒ−トパイプ |
JPH01110245A (ja) * | 1987-10-23 | 1989-04-26 | Iwatani Internatl Corp | 極低温試験装置 |
US6435454B1 (en) * | 1987-12-14 | 2002-08-20 | Northrop Grumman Corporation | Heat pipe cooling of aircraft skins for infrared radiation matching |
JPH0645177Y2 (ja) | 1988-07-11 | 1994-11-16 | 三菱重工業株式会社 | ヒートパイプ |
JPH0528721Y2 (fr) * | 1989-09-06 | 1993-07-23 | ||
US5188909A (en) * | 1991-09-12 | 1993-02-23 | Eveready Battery Co., Inc. | Electrochemical cell with circuit disconnect device |
AT399951B (de) * | 1991-11-05 | 1995-08-25 | Grabner Werner | Verfahren und vorrichtung zur begrenzung der temperatur |
US5379601A (en) * | 1993-09-15 | 1995-01-10 | International Business Machines Corporation | Temperature actuated switch for cryo-coolers |
JP3324107B2 (ja) * | 1996-03-29 | 2002-09-17 | 株式会社トヨトミ | ポット式石油燃焼器の燃料管構造 |
RU2110902C1 (ru) * | 1996-11-13 | 1998-05-10 | Российский Федеральный Ядерный Центр - Всероссийский Научно-Исследовательский Институт Экспериментальной Физики | Способ охлаждения электрорадиоэлементов |
US6047766A (en) | 1998-08-03 | 2000-04-11 | Hewlett-Packard Company | Multi-mode heat transfer using a thermal heat pipe valve |
RU2161384C1 (ru) * | 1999-05-13 | 2000-12-27 | Фонд Сертификации "Энергия" | Устройство для температурной стабилизации электронного оборудования |
US6940716B1 (en) * | 2000-07-13 | 2005-09-06 | Intel Corporation | Method and apparatus for dissipating heat from an electronic device |
RU2183310C1 (ru) * | 2000-10-31 | 2002-06-10 | Центр КОРТЭС | Устройство термостабилизации |
JP4273680B2 (ja) * | 2001-06-14 | 2009-06-03 | パナソニック株式会社 | 液化ガス気化装置 |
US20030196787A1 (en) * | 2002-04-19 | 2003-10-23 | Mahoney William G. | Passive thermal regulator for temperature sensitive components |
RU2212358C1 (ru) * | 2002-12-18 | 2003-09-20 | Макаров Игорь Альбертович | Летательный аппарат |
US6768781B1 (en) * | 2003-03-31 | 2004-07-27 | The Boeing Company | Methods and apparatuses for removing thermal energy from a nuclear reactor |
JP4131196B2 (ja) * | 2003-05-21 | 2008-08-13 | 株式会社ノーリツ | 燃焼装置 |
US6864571B2 (en) | 2003-07-07 | 2005-03-08 | Gelcore Llc | Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking |
TWI229789B (en) | 2003-12-29 | 2005-03-21 | Li Mei Feng | Cooling method and device of micro heat pipe with pressure difference flow shunt |
DE10361653B4 (de) | 2003-12-30 | 2008-08-07 | Airbus Deutschland Gmbh | Kühleinrichtung zum Abführen von Wärme von einer im Innenraum eines Flugzeuges angeordneten Wärmequelle |
JP4407509B2 (ja) | 2004-01-20 | 2010-02-03 | 三菱マテリアル株式会社 | 絶縁伝熱構造体及びパワーモジュール用基板 |
US20060037589A1 (en) * | 2004-08-17 | 2006-02-23 | Ramesh Gupta | Heat pipe for heating of gasoline for on-board octane segregation |
US7268292B2 (en) * | 2004-09-20 | 2007-09-11 | International Business Machines Corporation | Multi-dimensional compliant thermal cap for an electronic device |
JP4410183B2 (ja) * | 2005-01-27 | 2010-02-03 | 愛三工業株式会社 | 燃料供給装置 |
US7755899B2 (en) * | 2006-01-18 | 2010-07-13 | ÅAC Microtec AB | Miniaturized high conductivity thermal/electrical switch |
FR2904102B1 (fr) | 2006-07-18 | 2015-03-27 | Airbus France | Dispositif a ecoulement de chaleur |
-
2006
- 2006-07-18 FR FR0653016A patent/FR2904103B1/fr not_active Expired - Fee Related
-
2007
- 2007-07-17 CA CA2657778A patent/CA2657778C/fr not_active Expired - Fee Related
- 2007-07-17 EP EP07823290.7A patent/EP2047201B1/fr active Active
- 2007-07-17 US US12/373,988 patent/US20100012311A1/en not_active Abandoned
- 2007-07-17 CN CN200780027095.4A patent/CN101490497B/zh active Active
- 2007-07-17 JP JP2009520012A patent/JP2009543998A/ja active Pending
- 2007-07-17 RU RU2009105501/06A patent/RU2460955C2/ru not_active IP Right Cessation
- 2007-07-17 BR BRPI0713191-7A patent/BRPI0713191A2/pt not_active Application Discontinuation
- 2007-07-17 WO PCT/FR2007/001223 patent/WO2008009812A1/fr active Application Filing
-
2012
- 2012-12-17 US US13/716,951 patent/US9310145B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3463224A (en) * | 1966-10-24 | 1969-08-26 | Trw Inc | Thermal heat switch |
US3519067A (en) * | 1967-12-28 | 1970-07-07 | Honeywell Inc | Variable thermal conductance devices |
US4384610A (en) * | 1981-10-19 | 1983-05-24 | Mcdonnell Douglas Corporation | Simple thermal joint |
US4402358A (en) * | 1982-10-15 | 1983-09-06 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Heat pipe thermal switch |
US4742867A (en) * | 1986-12-01 | 1988-05-10 | Cape Cod Research, Inc. | Method and apparatuses for heat transfer |
US5216580A (en) * | 1992-01-14 | 1993-06-01 | Sun Microsystems, Inc. | Optimized integral heat pipe and electronic circuit module arrangement |
DE10123473A1 (de) * | 2001-05-15 | 2002-11-21 | Volkswagen Ag | Vorrichtung zur Wärmeeinbringung in eine Flüssigkeit |
DE10342425A1 (de) * | 2003-09-13 | 2005-01-05 | Daimlerchrysler Ag | Steuerbare Wärmeisolationsschicht |
US20060141308A1 (en) * | 2004-12-23 | 2006-06-29 | Becerra Juan J | Apparatus and method for variable conductance temperature control |
Also Published As
Publication number | Publication date |
---|---|
WO2008009812A1 (fr) | 2008-01-24 |
US20130098594A1 (en) | 2013-04-25 |
CA2657778C (fr) | 2015-11-24 |
FR2904103B1 (fr) | 2015-05-15 |
RU2460955C2 (ru) | 2012-09-10 |
CN101490497A (zh) | 2009-07-22 |
BRPI0713191A2 (pt) | 2012-03-20 |
JP2009543998A (ja) | 2009-12-10 |
EP2047201A1 (fr) | 2009-04-15 |
CN101490497B (zh) | 2014-07-23 |
US20100012311A1 (en) | 2010-01-21 |
EP2047201B1 (fr) | 2021-09-01 |
US9310145B2 (en) | 2016-04-12 |
RU2009105501A (ru) | 2010-08-27 |
CA2657778A1 (fr) | 2008-01-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CA | Change of address |
Effective date: 20110916 |
|
CD | Change of name or company name |
Owner name: AIRBUS HOLDING, FR Effective date: 20110916 |
|
CJ | Change in legal form |
Effective date: 20110916 |
|
TP | Transmission of property |
Owner name: AIRBUS HOLDING, FR Effective date: 20110913 |
|
PLFP | Fee payment |
Year of fee payment: 11 |
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PLFP | Fee payment |
Year of fee payment: 12 |
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PLFP | Fee payment |
Year of fee payment: 13 |
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PLFP | Fee payment |
Year of fee payment: 15 |
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PLFP | Fee payment |
Year of fee payment: 16 |
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ST | Notification of lapse |
Effective date: 20230305 |