US20100012311A1 - Heat flow device - Google Patents

Heat flow device Download PDF

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Publication number
US20100012311A1
US20100012311A1 US12/373,988 US37398807A US2010012311A1 US 20100012311 A1 US20100012311 A1 US 20100012311A1 US 37398807 A US37398807 A US 37398807A US 2010012311 A1 US2010012311 A1 US 2010012311A1
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US
United States
Prior art keywords
state
equipment item
change
cold part
thermal conditions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/373,988
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English (en)
Inventor
Emile Colongo
Stephane Ortet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Airbus Operations SAS
Original Assignee
Airbus Operations SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Airbus Operations SAS filed Critical Airbus Operations SAS
Assigned to AIRBUS FRANCE reassignment AIRBUS FRANCE ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: COLONGO, EMILE, ORTET, STEPHANE
Publication of US20100012311A1 publication Critical patent/US20100012311A1/en
Assigned to AIRBUS OPERATIONS SAS reassignment AIRBUS OPERATIONS SAS MERGER (SEE DOCUMENT FOR DETAILS). Assignors: AIRBUS FRANCE
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/008—Variable conductance materials; Thermal switches
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/10—Safety or protection arrangements; Arrangements for preventing malfunction for preventing overheating, e.g. heat shields
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2270/00—Thermal insulation; Thermal decoupling

Definitions

  • the invention relates to a heat-flow device.
  • a heat source of any kind (such as an electrical circuit or an electronic component).
  • the invention proposes a device comprising an equipment item with a heat source, a part relatively colder than the equipment item and a member capable of transmitting the heat (especially by conduction) from the equipment item to the cold part, characterized in that the member is such that, under certain thermal conditions situated above a given thermal condition, the equipment item and the cold part are substantially insulated thermally.
  • the equipment item and the cold part may additionally be separated substantially by a gas screen, at least under the said thermal conditions, in order that the transmission of electrical phenomena (such as electrical arcs), especially the propagation of electrical arcs from the equipment item to the cold source, can also be avoided under these conditions: in this case, the equipment item and the cold part are effectively insulated electrically.
  • electrical phenomena such as electrical arcs
  • the element comprises, for example, a good heat conductor outside the said thermal conditions (or in other words, beyond the given thermal condition).
  • the member is such that its thermal resistance is capable of increasing under the said thermal conditions, in such a way that the member becomes substantially insulating. In this way the thermal insulation of the equipment item and of the cold source is made possible by the modification of the thermal-conduction properties of the member.
  • the member comprises at least one component whose change of state (for example from the liquid state to the gas state) under the said thermal conditions causes an increase of the said thermal resistance.
  • the component may then form the said screen after the said change of state, which is a practical way of obtaining this screen.
  • the member is configured to lose contact with the equipment item or the cold part under the said thermal conditions. In this case it is the breaking of contact between the different components that causes the interruption of the heat path between the equipment item and the cold part.
  • the member in this case comprises, for example, at least one component whose change of state under the said thermal conditions causes the said loss of contact.
  • the said component participates in conduction from the equipment item to the cold part outside the said thermal conditions, and disappears due to its change of state under the said thermal conditions, thus substantially insulating the equipment item and the cold part.
  • the change of a mechanical property of the component during its change of state may lead to a movement of part of the member, thus causing the said loss of contact.
  • the member may be configured in such a way that the change of state of the component makes it possible to form the said gas screen.
  • the change of state then makes it possible not only to interrupt the thermal path but also to prevent the propagation of electrical phenomena.
  • the change of state may be a transition from the solid state to the liquid state or a transition from the liquid state to the gas state.
  • the equipment may be a fuel pump and the cold part a liquid fuel, for example in an aircraft; the invention is particularly interesting in this context, although it naturally has numerous other applications, such as protection against overheating of members of heat sinks that are sensitive to temperature elevations, such as carbon structures.
  • the invention also proposes an aircraft equipped with such a device.
  • FIGS. 1A to 1C represent a first exemplary embodiment of the invention
  • FIGS. 2A to 2C represent a second exemplary embodiment of the invention
  • FIGS. 2D to 2F represent a variant of the second example presented in FIGS. 2A to 2C ;
  • FIGS. 3A to 3C represent a third exemplary embodiment of the invention.
  • FIGS. 4A to 4C represent a fourth exemplary embodiment of the invention.
  • FIG. 1A represents a first exemplary embodiment of the invention under normal operating conditions.
  • a hot plate 101 comprising a heat source (not illustrated) is connected to a cold plate 102 (such as a structural part of the device) by means of a material 103 that is solid at the nominal temperature T nominal corresponding to normal operation.
  • Material 103 is a heat conductor, and its thermal resistance R material is therefore relatively low. Thus the heat generated by the heat source within hot plate 101 is evacuated under normal operating conditions across material 103 to cold plate 102 , which acts as a heat sink or cold source.
  • Material 103 is also chosen such that its melting temperature T melting is lower than or equal to the desired maximum operating temperature T max .
  • T melting is lower than or equal to the desired maximum operating temperature T max .
  • T max is the desired maximum operating temperature
  • Such a maximum temperature may be desired, for example, to avoid degradation of cold plate 102 or other negative consequences, such as, for example, a risk of fire when the cold plate is made in the form of a combustible material, such as the fuel of an aircraft.
  • Cold plate 102 is then thermally insulated from hot plate 101 by virtue of air screen 106 separating them; this screen also acts as an electrical insulator, which also makes it possible to prevent transmission of electrical energy (for example, in the form of electrical arcs) from the hot plate to cold plate 102 .
  • This latter advantage is particularly interesting in the case in which hot plate 101 is provided with an electrical or electronic equipment item whose potential malfunctions could prove dangerous to cold plate 102 , especially when this has attained a temperature above the desired maximum temperature T max .
  • Wax is used, for example, as material 103 , since its thermal properties permit heat conduction clearly greater than that permitted by the thermal resistance of air 106 .
  • FIG. 2A represents a second exemplary embodiment of the invention under normal operating conditions, that is, for example, at an operating temperature T nominal clearly lower than a desired maximum temperature.
  • an equipment item 201 comprising a heat source is situated at a distance from a cold plate 202 and is consequently separated from it by an air screen 206 . Furthermore, equipment item 201 is connected to cold plate 202 by means of a heat drain 203 formed in a material that is a good heat conductor (that is having low thermal resistance) and that therefore extends partly into the space formed by air screen 206 .
  • Heat drain 203 is maintained in contact with cold plate 202 by interposition of a bonding material 204 in solid state between a part of equipment item 201 and conducting drain 203 . Furthermore, a compression spring 205 is interposed between drain 203 and cold plate 202 , spring 205 being compressed when drain 203 is in contact with cold plate 202 .
  • Drain 203 is connected to equipment 201 , on the one hand across bonding material 204 and on the other hand directly at parts of equipment item 201 other than those receiving bonding material 204 , for example at a side wall 208 of equipment item 201 .
  • drain 203 is no longer maintained in contact with cold plate 202 but instead is moved away under the action of spring 205 . Because of the displacement of drain 203 and its loss of contact with cold plate 202 , equipment item 201 and cold plate 202 are separated by the thickness (or screen) of air 206 , except for spring 205 , whose thermal conductivity is negligible, and these two members are therefore substantially insulated by means of air screen 206 , as represented in FIG. 2C .
  • FIG. 2D represents a variant, under normal operating conditions, of the second example just described.
  • an equipment item 211 comprising a heat source is situated at a distance from a cold plate 212 and consequently separated therefrom by an air screen 216 . Furthermore, equipment item 211 is connected to cold plate 212 by means of a heat drain 213 formed in a material that has low thermal resistance and that therefore extends partly into the space formed by air screen 216 .
  • heat drain 213 is maintained braced against cold plate 212 by means of a solid block 214 interposed between conducting drain 213 and a structural part 210 .
  • a compression spring 215 is interposed between drain 213 and cold plate 212 , spring 215 being compressed when drain 213 is in contact with cold plate 212 because of the presence of solid block 214 .
  • solid block 214 does not necessarily participate in the flow of heat.
  • drain 213 is no longer maintained in contact with cold plate 212 but instead is moved away under the action of spring 215 . Because of the displacement of drain 213 and its loss of contact with cold plate 212 , equipment item 211 and cold plate 212 are separated by the thickness (or screen) of air 216 , except for spring 215 , whose thermal conductivity is negligible, and these two members are therefore substantially insulated by means of air screen 216 .
  • the displacement of drain 213 then continues until it comes into contact with structural part 210 , which then in this case could in turn act as a heat sink.
  • FIG. 3A represents a third exemplary embodiment of the invention under normal operating conditions.
  • heat-generating equipment item 301 and cold part 302 acting as cold source are situated respectively in the upper part and the lower part of a chamber 305 .
  • a space formed in the chamber between equipment item 301 and cold part 302 is filled with a bonding material 303 in liquid form having low thermal resistance, and which forms a heat-conduction path between equipment 301 and cold part 302 .
  • Chamber 305 hermetically houses equipment item 301 , bonding material 303 and cold part 302 . Only a safety valve 304 penetrating into the chamber in the space filled with bonding material 303 makes it possible, if necessary, to evacuate liquid when the pressure exceeds a threshold, as explained hereinafter.
  • Bonding material 303 is such that its vaporization temperature corresponds approximately (and preferably is slightly lower) to a desired maximum temperature in cold part 302 .
  • bonding material 303 passes from the liquid state to the gas state during a phase represented in FIG. 3B (the material in gaseous form 303 ′ naturally appearing in the upper part of the space of chamber 305 previously occupied by the liquid, in contact with equipment item 301 ).
  • the change of state in hermetic chamber 305 causes a pressure rise therein until the pressure attains the trip threshold of safety valve 304 , and the liquid part of bonding material 303 consequently begins to escape, as represented in FIG. 3B .
  • the heat path initially formed by bonding material 303 in liquid form is therefore interrupted, and by virtue of this fact cold part 302 is thermally insulated from equipment item 301 , since the thermal resistance of the bonding material in gaseous form is much greater than that of the bonding material in liquid form.
  • the change of phase (or in other words the transition from the liquid state to the gas state) of the bonding material has also made it possible to replace the heat path by a gas screen, which makes it possible in particular to prevent the formation of electrical arcs between equipment item 301 and cold part 302 .
  • FIG. 4A represents a fourth exemplary embodiment of the invention under normal operating conditions, or in other words for temperatures (including the normal operating temperature) clearly lower than a permitted maximum temperature.
  • a chamber 405 is formed in the lower prolongation of a hot plate 401 (which constitutes, for example, part of an equipment item containing a heat source, such as a fuel pump with which the aircraft are equipped).
  • Chamber 405 is hermetic and its lower part contains, under normal operating conditions, a liquid component 403 .
  • Part of a heat drain 404 is also accommodated inside chamber 405 : an upper part 406 (substantially horizontal in this case) extends over the entire surface (horizontal in this case) of chamber 405 , in such a way as to form a piston separating an upper part of chamber 405 , filled with air, for example, from a lower part of chamber 405 , filled with liquid component 403 under normal operating conditions.
  • Heat drain 404 also comprises a rod (substantially vertical in this case), a lower part 407 of which is in contact, during normal operation as illustrated in FIG. 4A , with a cold part forming a heat sink, in this case composed of liquid fuel 402 of the aircraft. Lower part 407 in this case is precisely immersed in fuel 402 as represented in FIG. 4A .
  • a heat path is therefore formed between equipment item 401 and cold part 402 by means of materials having relatively low thermal resistance, namely in this case the walls of chamber 405 , liquid component 403 and heat drain 404 .
  • a gas phase 403 ′ is formed in the lower part of chamber 405 , and the pressure exerted thereby tends to displace upward heat drain 404 , whose upper part 406 it is recalled, forms a piston, as represented in FIG. 4B .

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Hydrogen, Water And Hydrids (AREA)
  • Thermal Insulation (AREA)
US12/373,988 2006-07-18 2007-07-17 Heat flow device Abandoned US20100012311A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0653016A FR2904103B1 (fr) 2006-07-18 2006-07-18 Dispositif a ecoulement de chaleur
FR0653016 2006-07-18
PCT/FR2007/001223 WO2008009812A1 (fr) 2006-07-18 2007-07-17 Dispositif a ecoulement de chaleur

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2007/001223 A-371-Of-International WO2008009812A1 (fr) 2006-07-18 2007-07-17 Dispositif a ecoulement de chaleur

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/716,951 Division US9310145B2 (en) 2006-07-18 2012-12-17 Heat flow device

Publications (1)

Publication Number Publication Date
US20100012311A1 true US20100012311A1 (en) 2010-01-21

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
US12/373,988 Abandoned US20100012311A1 (en) 2006-07-18 2007-07-17 Heat flow device
US13/716,951 Active 2029-04-22 US9310145B2 (en) 2006-07-18 2012-12-17 Heat flow device

Family Applications After (1)

Application Number Title Priority Date Filing Date
US13/716,951 Active 2029-04-22 US9310145B2 (en) 2006-07-18 2012-12-17 Heat flow device

Country Status (9)

Country Link
US (2) US20100012311A1 (ja)
EP (1) EP2047201B1 (ja)
JP (1) JP2009543998A (ja)
CN (1) CN101490497B (ja)
BR (1) BRPI0713191A2 (ja)
CA (1) CA2657778C (ja)
FR (1) FR2904103B1 (ja)
RU (1) RU2460955C2 (ja)
WO (1) WO2008009812A1 (ja)

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US8562626B2 (en) 2010-08-06 2013-10-22 MoMelan Technologies, Inc. Devices for harvesting a skin graft
US8617181B2 (en) 2010-08-06 2013-12-31 MoMelan Technologies, Inc. Methods for preparing a skin graft
US20140158334A1 (en) * 2011-06-22 2014-06-12 Commissariat A L'energie Atomique Et Aux Ene Alt Thermal management system with variable-volume material
US8926631B2 (en) 2010-08-06 2015-01-06 MoMelan Technologies, Inc. Methods for preparing a skin graft without culturing or use of biologics
US8978234B2 (en) 2011-12-07 2015-03-17 MoMelan Technologies, Inc. Methods of manufacturing devices for generating skin grafts
US9173674B2 (en) 2010-08-06 2015-11-03 MoMelan Technologies, Inc. Devices for harvesting a skin graft
US9597111B2 (en) 2010-08-06 2017-03-21 Kci Licensing, Inc. Methods for applying a skin graft
US9610093B2 (en) 2010-08-06 2017-04-04 Kci Licensing, Inc. Microblister skin grafting
US9962254B2 (en) 2013-03-14 2018-05-08 Kci Licensing, Inc. Absorbent substrates for harvesting skin grafts
US9993261B2 (en) 2013-12-31 2018-06-12 Kci Licensing, Inc. Sensor systems for skin graft harvesting
US10463392B2 (en) 2013-12-31 2019-11-05 Kci Licensing, Inc. Fluid-assisted skin graft harvesting
US10912861B2 (en) 2015-04-09 2021-02-09 Kci Licensing, Inc. Soft-tack, porous substrates for harvesting skin grafts
US11006974B2 (en) 2015-11-03 2021-05-18 Kci Licensing, Inc. Devices for creating an epidermal graft sheet

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US10866036B1 (en) 2020-05-18 2020-12-15 Envertic Thermal Systems, Llc Thermal switch
US11493551B2 (en) 2020-06-22 2022-11-08 Advantest Test Solutions, Inc. Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
US11549981B2 (en) 2020-10-01 2023-01-10 Advantest Test Solutions, Inc. Thermal solution for massively parallel testing
US11821913B2 (en) 2020-11-02 2023-11-21 Advantest Test Solutions, Inc. Shielded socket and carrier for high-volume test of semiconductor devices
US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US20220155364A1 (en) 2020-11-19 2022-05-19 Advantest Test Solutions, Inc. Wafer scale active thermal interposer for device testing
US11609266B2 (en) 2020-12-04 2023-03-21 Advantest Test Solutions, Inc. Active thermal interposer device
US11573262B2 (en) 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
US11587640B2 (en) 2021-03-08 2023-02-21 Advantest Test Solutions, Inc. Carrier based high volume system level testing of devices with pop structures
US11656273B1 (en) 2021-11-05 2023-05-23 Advantest Test Solutions, Inc. High current device testing apparatus and systems
US11835549B2 (en) 2022-01-26 2023-12-05 Advantest Test Solutions, Inc. Thermal array with gimbal features and enhanced thermal performance

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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10537355B2 (en) 2010-08-06 2020-01-21 Kci Licensing, Inc. Microblister skin grafting
US8617181B2 (en) 2010-08-06 2013-12-31 MoMelan Technologies, Inc. Methods for preparing a skin graft
US8926631B2 (en) 2010-08-06 2015-01-06 MoMelan Technologies, Inc. Methods for preparing a skin graft without culturing or use of biologics
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US9310145B2 (en) 2016-04-12
JP2009543998A (ja) 2009-12-10
EP2047201B1 (fr) 2021-09-01
FR2904103A1 (fr) 2008-01-25
WO2008009812A1 (fr) 2008-01-24
RU2460955C2 (ru) 2012-09-10
US20130098594A1 (en) 2013-04-25
EP2047201A1 (fr) 2009-04-15
CA2657778C (en) 2015-11-24
RU2009105501A (ru) 2010-08-27
CA2657778A1 (en) 2008-01-24
FR2904103B1 (fr) 2015-05-15
CN101490497A (zh) 2009-07-22
CN101490497B (zh) 2014-07-23
BRPI0713191A2 (pt) 2012-03-20

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