EP1998368B8 - Method for manufacturing soi wafer - Google Patents

Method for manufacturing soi wafer Download PDF

Info

Publication number
EP1998368B8
EP1998368B8 EP08009380.0A EP08009380A EP1998368B8 EP 1998368 B8 EP1998368 B8 EP 1998368B8 EP 08009380 A EP08009380 A EP 08009380A EP 1998368 B8 EP1998368 B8 EP 1998368B8
Authority
EP
European Patent Office
Prior art keywords
soi wafer
manufacturing soi
manufacturing
wafer
soi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP08009380.0A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1998368B1 (en
EP1998368A3 (en
EP1998368A2 (en
Inventor
Shoji Akiyama
Yoshihiro Kubota
Atsuo Ito
Koichi Tanaka
Makoto Kawai
Yuuji Tobisaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of EP1998368A2 publication Critical patent/EP1998368A2/en
Publication of EP1998368A3 publication Critical patent/EP1998368A3/en
Publication of EP1998368B1 publication Critical patent/EP1998368B1/en
Application granted granted Critical
Publication of EP1998368B8 publication Critical patent/EP1998368B8/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Recrystallisation Techniques (AREA)
EP08009380.0A 2007-05-31 2008-05-21 Method for manufacturing soi wafer Active EP1998368B8 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007145624A JP5143477B2 (ja) 2007-05-31 2007-05-31 Ｓｏｉウエーハの製造方法

Publications (4)

Publication Number Publication Date
EP1998368A2 EP1998368A2 (en) 2008-12-03
EP1998368A3 EP1998368A3 (en) 2012-05-23
EP1998368B1 EP1998368B1 (en) 2014-06-04
EP1998368B8 true EP1998368B8 (en) 2014-07-30

Family

ID=39789380

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08009380.0A Active EP1998368B8 (en) 2007-05-31 2008-05-21 Method for manufacturing soi wafer

Country Status (5)

Country Link
US (1) US8268700B2 (ko)
EP (1) EP1998368B8 (ko)
JP (1) JP5143477B2 (ko)
KR (1) KR101482792B1 (ko)
TW (1) TWI456689B (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2935536B1 (fr) 2008-09-02 2010-09-24 Soitec Silicon On Insulator Procede de detourage progressif
EP2200077B1 (en) * 2008-12-22 2012-12-05 Soitec Method for bonding two substrates
JP2011061060A (ja) * 2009-09-11 2011-03-24 Sumco Corp 貼り合わせ基板の製造方法
FR2961630B1 (fr) 2010-06-22 2013-03-29 Soitec Silicon On Insulator Technologies Appareil de fabrication de dispositifs semi-conducteurs
US8141429B2 (en) * 2010-07-30 2012-03-27 Rosemount Aerospace Inc. High temperature capacitive static/dynamic pressure sensors and methods of making the same
US8338266B2 (en) 2010-08-11 2012-12-25 Soitec Method for molecular adhesion bonding at low pressure
FR2964193A1 (fr) 2010-08-24 2012-03-02 Soitec Silicon On Insulator Procede de mesure d'une energie d'adhesion, et substrats associes
JP5629594B2 (ja) * 2011-02-09 2014-11-19 信越化学工業株式会社 シリコン薄膜転写ウェーハの製造方法および研磨装置
CN102431961A (zh) * 2011-12-07 2012-05-02 华中科技大学 一种低温等离子体活化直接键合的三维硅模具制备方法
CN103776660B (zh) 2012-10-24 2016-03-09 艾博生物医药(杭州)有限公司 一种装置
US9202711B2 (en) * 2013-03-14 2015-12-01 Sunedison Semiconductor Limited (Uen201334164H) Semiconductor-on-insulator wafer manufacturing method for reducing light point defects and surface roughness
US9240357B2 (en) 2013-04-25 2016-01-19 Samsung Electronics Co., Ltd. Method of fabricating semiconductor device having preliminary stacked structure with offset oxide etched using gas cluster ion
DE102014223603B4 (de) 2014-11-19 2018-05-30 Siltronic Ag Halbleiterscheibe und Verfahren zu deren Herstellung
JP6545053B2 (ja) * 2015-03-30 2019-07-17 東京エレクトロン株式会社 処理装置および処理方法、ならびにガスクラスター発生装置および発生方法
CN108695147A (zh) * 2017-04-08 2018-10-23 沈阳硅基科技有限公司 Soi键合硅片的制备方法
WO2019236320A1 (en) * 2018-06-08 2019-12-12 Globalwafers Co., Ltd. Method for transfer of a thin layer of silicon

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57149301A (en) 1981-03-11 1982-09-14 Daiichi Togyo Kk Novel polysaccharide having coagulating property
EP0387753A1 (de) 1989-03-17 1990-09-19 Schott Glaswerke Verfahren und Vorrichtung zum Schutz der proximalen Einkoppelseiten von Laserkathetern
JP3324469B2 (ja) * 1997-09-26 2002-09-17 信越半導体株式会社 Ｓｏｉウエーハの製造方法ならびにこの方法で製造されるｓｏｉウエーハ
JPH11145438A (ja) 1997-11-13 1999-05-28 Shin Etsu Handotai Co Ltd Ｓｏｉウエーハの製造方法ならびにこの方法で製造されるｓｏｉウエーハ
JP3911901B2 (ja) * 1999-04-09 2007-05-09 信越半導体株式会社 Ｓｏｉウエーハおよびｓｏｉウエーハの製造方法
US6287941B1 (en) 1999-04-21 2001-09-11 Silicon Genesis Corporation Surface finishing of SOI substrates using an EPI process
WO2002005315A2 (en) * 2000-07-10 2002-01-17 Epion Corporation System and method for improving thin films by gas cluster ion be am processing
FR2827078B1 (fr) 2001-07-04 2005-02-04 Soitec Silicon On Insulator Procede de diminution de rugosite de surface
JP2004063730A (ja) * 2002-07-29 2004-02-26 Shin Etsu Handotai Co Ltd Ｓｏｉウェーハの製造方法
US6774040B2 (en) * 2002-09-12 2004-08-10 Applied Materials, Inc. Apparatus and method for surface finishing a silicon film
FR2846788B1 (fr) 2002-10-30 2005-06-17 Procede de fabrication de substrats demontables
JP4509488B2 (ja) 2003-04-02 2010-07-21 株式会社Ｓｕｍｃｏ 貼り合わせ基板の製造方法
US7026249B2 (en) * 2003-05-30 2006-04-11 International Business Machines Corporation SiGe lattice engineering using a combination of oxidation, thinning and epitaxial regrowth
US20060014363A1 (en) * 2004-03-05 2006-01-19 Nicolas Daval Thermal treatment of a semiconductor layer
EP1962340A3 (en) * 2004-11-09 2009-12-23 S.O.I. TEC Silicon Method for manufacturing compound material wafers
DE102004054564B4 (de) * 2004-11-11 2008-11-27 Siltronic Ag Halbleitersubstrat und Verfahren zu dessen Herstellung
JP2006210899A (ja) * 2004-12-28 2006-08-10 Shin Etsu Chem Co Ltd Ｓｏｉウエーハの製造方法及びｓｏｉウェーハ
US7405152B2 (en) * 2005-01-31 2008-07-29 International Business Machines Corporation Reducing wire erosion during damascene processing
JP4934966B2 (ja) * 2005-02-04 2012-05-23 株式会社Ｓｕｍｃｏ Ｓｏｉ基板の製造方法
JP5249511B2 (ja) 2006-11-22 2013-07-31 信越化学工業株式会社 Ｓｏｑ基板およびｓｏｑ基板の製造方法

Also Published As

Publication number Publication date
TW200913128A (en) 2009-03-16
US20090023270A1 (en) 2009-01-22
JP2008300660A (ja) 2008-12-11
KR101482792B1 (ko) 2015-01-14
JP5143477B2 (ja) 2013-02-13
EP1998368B1 (en) 2014-06-04
TWI456689B (zh) 2014-10-11
EP1998368A3 (en) 2012-05-23
US8268700B2 (en) 2012-09-18
EP1998368A2 (en) 2008-12-03
KR20080106094A (ko) 2008-12-04

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