EP1994363A1 - Capteur de vitesse de rotation micromécanique - Google Patents

Capteur de vitesse de rotation micromécanique

Info

Publication number
EP1994363A1
EP1994363A1 EP07722020A EP07722020A EP1994363A1 EP 1994363 A1 EP1994363 A1 EP 1994363A1 EP 07722020 A EP07722020 A EP 07722020A EP 07722020 A EP07722020 A EP 07722020A EP 1994363 A1 EP1994363 A1 EP 1994363A1
Authority
EP
European Patent Office
Prior art keywords
rotation rate
spring
axis
rate sensor
base element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP07722020A
Other languages
German (de)
English (en)
Inventor
Bernhard Hartmann
Stefan GÜNTHNER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of EP1994363A1 publication Critical patent/EP1994363A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5733Structural details or topology
    • G01C19/5755Structural details or topology the devices having a single sensing mass
    • G01C19/5762Structural details or topology the devices having a single sensing mass the sensing mass being connected to a driving mass, e.g. driving frames
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5733Structural details or topology
    • G01C19/574Structural details or topology the devices having two sensing masses in anti-phase motion
    • G01C19/5747Structural details or topology the devices having two sensing masses in anti-phase motion each sensing mass being connected to a driving mass, e.g. driving frames

Definitions

  • the present invention relates to a micromechanical rotation rate sensor according to the preamble of claim 1.
  • Yaw rate sensors are commonly used to determine an angular rate of rotation of an object about an axis. If the rotation rate sensor is micromechanically manufactured on the basis of silicon substrate, it offers, for example, the advantage over a precision industrial spinning top that it can be manufactured in very small dimensions at a relatively low cost. Furthermore, a relatively low measurement uncertainty and low energy consumption during operation are advantageous.
  • An important field of application of rotation rate sensors is in automotive engineering, for example in vehicle dynamics control systems such as the Electronic Stability Program (ESP).
  • ESP Electronic Stability Program
  • An anti-lock braking system, an automatic braking force distribution, a traction control system and a yaw moment control act in such a way that lateral and longitudinal stabilization of the vehicle is achieved by targeted braking of individual wheels.
  • yaw rate sensors Another application for yaw rate sensors is the so-called rollover detection of a vehicle in connection with airbag control units and restraint systems for vehicle occupants. Furthermore, gyroscopes are used for navigation purposes as well as for the determination of the position and the state of motion of vehicles of all kinds. Other Fields of application include image stabilizers for video cameras, dynamics control of satellites when exposed to the Earth orbit, and in civil aviation in back-up attitude control systems.
  • Micromechanically produced rotation rate sensors generally have a seismic mass, which is set in vibration via an excitation means. If the seismic mass moves radially inwards or outwards in a rotating system, then your orbit velocity will change. It thus experiences a tangential acceleration, which is caused by the Coriolis force. The reaction of the seismic mass to the rotation can be detected, for example, by means of a read-out device.
  • German Patent DE 196 41 284 Cl discloses a micromechanical rotation rate sensor with a substrate, a base element suspended on the substrate by a plurality of spring elements and comprising a seismic mass, an excitation means and a read-out device, in which the spring element is designed as a linear spring.
  • Such micromechanically produced rotation rate sensors are preferably etched out of a silicon block. Even very small deviations in the manufacturing accuracy lead to flank angles of the respective structures. The flank angles cause an ner deflection of the spring elements, a movement of the base member perpendicular to the excitation, ie in the measuring direction of the rotation rate sensor. This leads to very high demands on the manufacturing accuracy or to a high rejection of, for example, etched from a silicon wafer structures. In addition, complex electronic evaluation circuits are required to compensate for the measurement inaccuracies caused by the flank angle.
  • the object of the present invention is to provide a micromechanical rotation rate sensor with a high measuring accuracy, which can be produced cost-effectively with a small scrap.
  • a micromechanical rotation rate sensor with a substrate, at least one substrate element suspended by at least one spring element comprising at least one seismic mass, an excitation means and a read-out, the at least one spring element perpendicular to the direction of movement of the base member movable is.
  • the spring element has at least two spring sections.
  • the spring element is in particular U-shaped (three spring sections), V-shaped (two spring sections) or S-shaped (several spring sections).
  • a base member is suspended from four spring members.
  • the spring elements are arranged in particular mirror-symmetrical siselement on Ba ⁇ .
  • the spring elements benachbar ⁇ ter base elements advantageously by means of a coupling spring can be coupled.
  • a base element has a frame, a seismic mass and at least one suspension of the seismic mass on the frame.
  • the seismic masses are then formed, for example, as a paddle.
  • Micromechanical rotation rate sensors according to the invention can be designed as x-axis sensor, z-axis sensor or as xz-axis sensor, which can sense rotational movements about the x-axis, the z-axis or both axes.
  • 1 is a schematic view of three examples of various base elements with paddle abandonedbil ⁇ Deten seismic masses
  • 2 is a schematic view of a rigid base member
  • FIG. 3 is a schematic view of another form of a base element
  • FIG. 5 shows a schematic view of a read-out device via the movement in the substrate plane
  • FIG. 6 is a schematic view of a capacitive reading device
  • FIG. 7 shows a schematic view of a micromechanical rotation rate sensor with linear spring elements according to the prior art
  • FIG. 8 is a schematic view of the deflection caused by flank angle of the base member of Fig. 7,
  • FIG. 9 is a schematic view of an embodiment of the present invention with spring elements according to the invention.
  • FIG. 10 is a schematic view of the right part of FIG. 9 with reaction forces
  • Fig. 11 in the upper part of a section along the line AA of Fig. 10 and in the lower part a section along the line BB and 12 is a schematic view of another embodiment of the present invention with coupled Federenseen-
  • a base element 1 preferably comprises one or more seismic masses 3.
  • the seismic masses are suspended in a frame 2.
  • the suspension can be realized for example via bending beam 4 or torsion beam 5.
  • Bending beam 4 have a linear spring characteristic, but the seismic masses 3 of the rotation rate sensors according to the invention can also be attached to the frame 2 via torsion beams 5.
  • one or more seismic masses 3 may be formed, for example, as a paddle with an opposite suspension 5.
  • the suspension 4, 5 allows a movement of the center of gravity of the seismic mass 3 only in the z-direction perpendicular to the plane of the frame 2.
  • the plane of the frame 2 is parallel to the substrate or to the plane defined by the substrate (x / y plane).
  • a rigid base member 1 is shown, are rigidly connected in the frame 2 and seismic mass 3 as a unit.
  • one or more seismic masses 3 can also be suspended on a rigid frame 2.
  • This suspension for example via torsion spring or spiral spring, allows a movement of the center of gravity SP of the seismic mass 3 only in a direction perpendicular to the frame plane (z-direction), the center of gravity SP of the seismic mass 3 outside the Frame level is.
  • the frame plane (x / y plane) is parallel to the substrate.
  • the excitation of the base element 1 can take place via a comb structure 6 against which a voltage Ü is present.
  • An excitation means 6 is a device which can excite the base element 1 to vibrate along the first axis (y-axis), which can be done, for example, electrically, thermally, magnetically or piezoelectrically.
  • Fig. 5 and 6 two different readout devices 15 are shown schematically.
  • a deflection of the seismic mass or the base element 1 can be measured perpendicular or parallel to the frame plane, which can be capacitive, piezoresistive, magnetic, piezoelectric or optical.
  • the read-out device according to FIG. 5 a movement in the substrate plane and with the read-out device 15 according to FIG. 6 a movement perpendicular to the substrate plane can be measured.
  • Fig. 7 shows a known from the prior art, conventional concept for suspending base elements 1 in a substrate 9.
  • the known suspension via linear spring elements 8.
  • suspension means an arrangement of spring elements which are fastened on the one hand to the base element 1, on the other hand to the substrate 9 or other elements.
  • the spring elements allow a movement of the base element 1 in the direction of a first axis (y-direction) parallel to the substrate 9. If the flanks of the spring elements 8, 8 'are tilted as shown in FIG.
  • FIGS. 9 and 10 show a micromechanical rotation rate sensor according to the invention.
  • the spring elements 11 are in their neutral position, in the right side, the spring elements 11 'are shown deflected.
  • 10 shows the reaction forces F R acting on the base element 1.
  • FIG. 11 the upper half of Fig. 11 is a sectional view taken along the line AA of Fig. 10 and the lower half is a sectional view taken along the line BB.
  • y-axis the 1st axis
  • substantially only the vertices of the spring elements 11, 11' are raised or lowered.
  • FIG. 10 there is a preferred spring arrangement of four folded spring elements 11, 11 ', the at the respective corners of the base element 1 engage each other mirror-symmetrically.
  • the spring element 11, 11 ' according to the invention has at least two spring sections.
  • the spring element 11, 11 ' is in particular U-shaped (three spring sections, as shown in FIGS. 9 and 10), V-shaped (two spring sections) or S-shaped (a plurality of spring sections).
  • the principle of the rotation rate sensor according to the invention as a two-mass oscillator will be explained in more detail in connection with FIG. 12.
  • the coupling sets a common resonance frequency of the two oscillators.
  • the advantage of the two-mass oscillator as a rotation rate sensor k lies in the fact that linear accelerations cause a movement of both seismic masses or basic elements in the same direction. Coriolis forces acting on the elements depend on their direction of motion and thus force out-of-phase deflections. Thus, disturbing linear accelerations can be eliminated from the outside by signal subtraction and signals due to rotational movements are added.
  • the base element is excited to periodic oscillations along the 1st axis (y-axis).
  • a Coriolis force occurs perpendicular to the 1st and 2nd axis (z-axis).
  • the suspension of the frame is so basic element 2 so specifies that a movement in z-direction is possible.
  • the suspension of the frame is mainly rigid for movement in the Z direction, only the seismic mass is deflected in the direction of this axis. The deflection of the base element configurations in the z-direction is detected with the read-out device, as shown in FIG. 6, and is a measure of the rotational speed which has occurred.
  • the base element is excited to periodic oscillations along the 1st axis (y-axis).
  • y-axis a rotational movement of the sensor about the 3rd axis (z-axis, perpendicular to the substrate plane and perpendicular to the first axis)
  • x-axis a Coriolis force perpendicular to the 1st and 3rd axis occurs (x-axis). This affects both the frame and the seismic mass suspended in it.
  • Variant 1 The suspension of the frame is designed so that movement in the x-direction is possible, so that the seismic mass is deflected along this axis. The deflection can be measured, such. B. shown in Fig. 5
  • Variant 2 For base element 3, a frame movement in the x direction is possible, but not necessary. About the outsourced center of gravity (SP) is the Coriolis force acting in the x direction, decomposed into a force in the x and z direction. Thus, the seismic mass is moved in the z-direction and a measuring device, as in the case of the x-axis sensor, can be applied as shown in FIG. However, it is important that the torsion axis (suspension of the mass on the frame) is parallel to the first axis and perpendicular to the Coriolis force. This deflection, either in the z or x direction, is proportional to the rotational speed that occurs.
  • SP outsourced center of gravity
  • Variant 1 combination of the above sensor
  • Base element 3 contains 2 masses in a frame, which are oriented 180 ° to each other.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Gyroscopes (AREA)
  • Pressure Sensors (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Micromachines (AREA)

Abstract

La présente invention concerne un capteur de vitesse de rotation micromécanique comportant un substrat (9), au moins un élément de base (1) suspendu au substrat (9) par l'intermédiaire d'au moins un élément élastique (11, 11'), lequel élément de base est pourvu d'une masse sismique (3), un moyen d'excitation (8) et un dispositif de lecture (15). Selon ladite invention, l'élément élastique (11, 11') peut effectuer un mouvement perpendiculaire au sens de mouvement (x, y) de l'élément de base (1).
EP07722020A 2006-03-10 2007-03-12 Capteur de vitesse de rotation micromécanique Ceased EP1994363A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006012610 2006-03-10
PCT/DE2007/000445 WO2007104289A1 (fr) 2006-03-10 2007-03-12 Capteur de vitesse de rotation micromécanique

Publications (1)

Publication Number Publication Date
EP1994363A1 true EP1994363A1 (fr) 2008-11-26

Family

ID=38222131

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07722020A Ceased EP1994363A1 (fr) 2006-03-10 2007-03-12 Capteur de vitesse de rotation micromécanique

Country Status (7)

Country Link
US (1) US8342022B2 (fr)
EP (1) EP1994363A1 (fr)
JP (1) JP2009529697A (fr)
KR (1) KR20080113048A (fr)
CN (1) CN101400969A (fr)
DE (1) DE112007000303A5 (fr)
WO (1) WO2007104289A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010021242A1 (fr) 2008-08-18 2010-02-25 株式会社日立製作所 Système micro-électromécanique
FI20095201A0 (fi) * 2009-03-02 2009-03-02 Vti Technologies Oy Värähtelevä mikromekaaninen kulmanopeusanturi
DE102009002701B4 (de) * 2009-04-28 2018-01-18 Hanking Electronics, Ltd. Mikromechanischer Sensor
FR2945621B1 (fr) * 2009-05-15 2011-08-26 Commissariat Energie Atomique Structure de couplage pour gyrometre resonnant
JP5790915B2 (ja) * 2011-01-13 2015-10-07 セイコーエプソン株式会社 物理量センサー及び電子機器
ITUA20162172A1 (it) 2016-03-31 2017-10-01 St Microelectronics Srl Sensore accelerometrico realizzato in tecnologia mems avente elevata accuratezza e ridotta sensibilita' nei confronti della temperatura e dell'invecchiamento
US10830302B2 (en) * 2017-03-27 2020-11-10 Hutchinson Aerospace & Industry, Inc. Continuous framework for shock, vibration and thermal isolation and motion accommodation
IT201900017546A1 (it) 2019-09-30 2021-03-30 St Microelectronics Srl Dispositivo a pulsante mems resistente all'acqua, dispositivo di ingresso comprendente il dispositivo a pulsante mems e apparecchio elettronico

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19641284C1 (de) * 1996-10-07 1998-05-20 Inst Mikro Und Informationstec Drehratensensor mit entkoppelten orthogonalen Primär- und Sekundärschwingungen
US20050024527A1 (en) * 2003-07-30 2005-02-03 Chiou Jen-Huang Albert Flexible vibratory micro-electromechanical device

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4699006A (en) 1984-03-19 1987-10-13 The Charles Stark Draper Laboratory, Inc. Vibratory digital integrating accelerometer
US4598585A (en) * 1984-03-19 1986-07-08 The Charles Stark Draper Laboratory, Inc. Planar inertial sensor
DE3611360A1 (de) 1986-04-04 1987-10-08 Bosch Gmbh Robert Sensor zur selbsttaetigen ausloesung von insassenschutzvorrichtungen
FI81915C (fi) 1987-11-09 1990-12-10 Vaisala Oy Kapacitiv accelerationsgivare och foerfarande foer framstaellning daerav.
DE3741036A1 (de) * 1987-12-03 1989-06-15 Fraunhofer Ges Forschung Mikromechanischer beschleunigungsmesser
US5421213A (en) * 1990-10-12 1995-06-06 Okada; Kazuhiro Multi-dimensional force detector
US5205171A (en) * 1991-01-11 1993-04-27 Northrop Corporation Miniature silicon accelerometer and method
JP2938989B2 (ja) * 1991-01-29 1999-08-25 キヤノン株式会社 角加速度センサ
DE4106288C2 (de) * 1991-02-28 2001-05-31 Bosch Gmbh Robert Sensor zur Messung von Drücken oder Beschleunigungen
DE4126100A1 (de) 1991-08-07 1993-02-18 Univ Chemnitz Tech Mikromechanischer drehbeschleunigungssensor
US5707077A (en) * 1991-11-18 1998-01-13 Hitachi, Ltd. Airbag system using three-dimensional acceleration sensor
US5313835A (en) * 1991-12-19 1994-05-24 Motorola, Inc. Integrated monolithic gyroscopes/accelerometers with logic circuits
DE4414237A1 (de) * 1994-04-23 1995-10-26 Bosch Gmbh Robert Mikromechanischer Schwinger eines Schwingungsgyrometers
JP3307130B2 (ja) 1994-12-28 2002-07-24 株式会社村田製作所 角速度センサ
JP3433401B2 (ja) * 1995-05-18 2003-08-04 アイシン精機株式会社 静電容量型加速度センサ
JP3114570B2 (ja) * 1995-05-26 2000-12-04 オムロン株式会社 静電容量型圧力センサ
DE19541388A1 (de) * 1995-11-07 1997-05-15 Telefunken Microelectron Mikromechanischer Beschleunigungssensor
JP3090024B2 (ja) * 1996-01-22 2000-09-18 株式会社村田製作所 角速度センサ
JPH09318649A (ja) * 1996-05-30 1997-12-12 Texas Instr Japan Ltd 複合センサ
JPH1090299A (ja) * 1996-09-12 1998-04-10 Mitsubishi Electric Corp 静電容量式加速度センサ
DE19637265A1 (de) 1996-09-13 1998-03-26 Bosch Gmbh Robert Sensor zur kapazitiven Aufnahme einer Beschleunigung
DE19649715C2 (de) * 1996-11-30 2001-07-12 Telefunken Microelectron Anordnung zur Messung von Beschleunigungen
DE19709520B4 (de) 1997-03-10 2007-05-31 GEMAC-Gesellschaft für Mikroelektronikanwendung Chemnitz mbH Kapazitives Beschleunigungssensor-Element
JP4178192B2 (ja) 1998-04-22 2008-11-12 ミツミ電機株式会社 物理量検出センサ
JP2000009470A (ja) * 1998-06-18 2000-01-14 Aisin Seiki Co Ltd 角速度センサ
JP2000088878A (ja) * 1998-09-09 2000-03-31 Tokai Rika Co Ltd 加速度スイッチ及びその製造方法
US6469909B2 (en) * 2001-01-09 2002-10-22 3M Innovative Properties Company MEMS package with flexible circuit interconnect
EP1243930A1 (fr) * 2001-03-08 2002-09-25 EADS Deutschland Gmbh Accéléromètre micromécanique capacitif
DE10225714A1 (de) 2002-06-11 2004-01-08 Eads Deutschland Gmbh Mehrachsiger monolithischer Beschleunigungssensor
US6978673B2 (en) * 2003-02-07 2005-12-27 Honeywell International, Inc. Methods and systems for simultaneously fabricating multi-frequency MEMS devices
US6841992B2 (en) * 2003-02-18 2005-01-11 Honeywell International, Inc. MEMS enhanced capacitive pick-off and electrostatic rebalance electrode placement
US7036373B2 (en) * 2004-06-29 2006-05-02 Honeywell International, Inc. MEMS gyroscope with horizontally oriented drive electrodes
US20080276706A1 (en) * 2004-09-27 2008-11-13 Conti Temic Microelectronic Gmbh Rotation Speed Sensor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19641284C1 (de) * 1996-10-07 1998-05-20 Inst Mikro Und Informationstec Drehratensensor mit entkoppelten orthogonalen Primär- und Sekundärschwingungen
US20050024527A1 (en) * 2003-07-30 2005-02-03 Chiou Jen-Huang Albert Flexible vibratory micro-electromechanical device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2007104289A1 *

Also Published As

Publication number Publication date
JP2009529697A (ja) 2009-08-20
CN101400969A (zh) 2009-04-01
DE112007000303A5 (de) 2008-10-30
US20090031806A1 (en) 2009-02-05
US8342022B2 (en) 2013-01-01
WO2007104289A1 (fr) 2007-09-20
KR20080113048A (ko) 2008-12-26

Similar Documents

Publication Publication Date Title
EP1794543B1 (fr) Capteur de vitesse de rotation
EP2475959B1 (fr) Capteur de vitesse de rotation à double axe avec élements sismiques linéaires et rotatifs
EP2162702B1 (fr) Gyroscope coriolis
DE102009027897B4 (de) Mikromechanischer Drehratensensor
EP2406581B1 (fr) Capteur de vitesse de rotation biaxial
EP2208020B1 (fr) Capteur de vitesse de rotation
DE102007017209B4 (de) Mikromechanischer Inertialsensor zur Messung von Drehraten
EP1994363A1 (fr) Capteur de vitesse de rotation micromécanique
DE102010061755A1 (de) Drehratensensor und Verfahren zum Betrieb eines Drehratensensors
DE102012207937A1 (de) Drehratensensor
DE102010006584A1 (de) Corioliskreisel mit Korrektureinheiten und Verfahren zur Reduktion des Quadraturbias
DE102012219511A1 (de) Mikromechanische Struktur
DE102008043796B4 (de) Drehratensensor
EP0765464B1 (fr) Capteur de vitesse angulaire
DE10203515A1 (de) Mikromechanischer Drehratensensor
DE102010038461B4 (de) Drehratensensor und Verfahren zur Herstellung eines Masseelements
DE102012210374A1 (de) Drehratensensor
DE102021200483A1 (de) Dreiachsiger Drehratensensor mit einem Substrat und einem Doppelrotor
DE10060091B4 (de) Mikromechanischer Inertialsensor
DE29617410U1 (de) Drehratensensor mit entkoppelten orthogonalen Primär- und Sekundärschwingungen
EP2154538B1 (fr) Capteur d'accélération et procédé pour saisir une accélération
EP2153170B1 (fr) Capteur de vitesse de rotation
DE102017219933A1 (de) Drehratensensor mit einem eine Haupterstreckungsebene aufweisenden Substrat, Herstellungsverfahren für einen Drehratensensor
DE4430439C2 (de) Sensoreinheit mit mindestens einem Drehratensensor und Verfahren zu seiner Herstellung
DE102010040908A1 (de) Drehratensensor

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20080801

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

DAX Request for extension of the european patent (deleted)
17Q First examination report despatched

Effective date: 20150428

REG Reference to a national code

Ref country code: DE

Ref legal event code: R003

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED

18R Application refused

Effective date: 20180322