Classifications

• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
  • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
  • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
  • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49016—Antenna or wave energy "plumbing" making
  • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component

Definitions

• the present invention relates to a chip card with a chip module which is connected to an external contact arrangement arranged in the contact surface of a card body and to an antenna device arranged in a card inlay.
• the invention relates to a method for producing such a chip card.
• Chip cards of the type mentioned are also known as so-called
• Chip card index enable contact-based access to the information contained on the chip via the external contact arrangement arranged in the card surface, as well as contactless data access by means of the antenna device, which forms a transponder unit in connection with the chip.
• the subsequent introduction of the recess into the card body for accommodating the chip module in the card body requires one based on the production further processing of the card body.
• the contacting of the antenna device with the chip module must be carried out in a concealed manner following the implementation of the chip module as a rear-side contact.
• the present invention is based on the object of proposing a chip card which is suitable both for contact-based as well as for contactless operation, and a method for the production thereof which enables the chip card to be produced in a substantially simplified manner.
• the chip card according to the invention has the features of claim 1 and claim 2 and the method according to the invention has the features of claim 8.
• the chip card has a card inlay with at least two layers, namely a receiving layer provided with a recess for partially receiving the chip module and a cover layer covering the chip module on one side.
• the card inlay of the chip card according to the invention is at least one on both sides Provided outer layer, wherein the recess serves to receive a chip housing arranged on an inner contact side of a chip carrier of the chip module, and the cover layer defines a bottom of the recess.
• the outer contact arrangement arranged on the outer contact side of the chip carrier forms a protrusion from the plane of the receiving position which is received in a recess in the outer layer such that the outer contact arrangement is arranged flush with the contact surface of the card body.
• the chip card according to the invention is therefore based on a
• Card inlay constructed from which the external contact arrangement of the chip module protrudes, so that an overall flush arrangement of the external contact arrangement in the card body can be achieved in a simple manner by applying an external layer whose thickness corresponds to the layer projection formed by the external contact arrangement.
• the contacting points for contacting the chip module with the antenna device are freely accessible. so that a reliable and checkable quality of the contact can be made between the chip module and the antenna device.
• the contacting does not have to be carried out as a rear-side contact, but can be done by directly contacting the contacting point.
• the card inlay according to the invention has at least two layers, namely a receiving layer provided with a recess for partially receiving the chip module and a cover layer covering the chip module on one side, which receive the antenna device between them.
• the clock side of a chip carrier of the chip module arranged chip housing allows free access to the contact points between the inner contacts arranged on the inner contact side of the chip carrier and the antenna device before applying the cover layer. Only after contacting can by applying the top layer
• Bottom of the recess can be defined, so that then from the card inlay only the outer contact arrangement arranged on the outer contact side of the chip carrier forms a protrusion from the plane of the receiving position.
• this projection can then be received flush by an outer layer provided with a corresponding recess, the layer projection simultaneously forming a positioning aid for the relative positioning of the outer layer on the card inlay.
• a particularly precisely defined relative positioning between the inner contact side of the chip carrier and the antenna device arranged in the card inlay becomes possible if the receiving position itself forms the substrate for the antenna device.
• the chip housing of the chip module is provided with an adhesive application on its upper side facing the cover layer.
• the adhesive application is formed by a hot-melt adhesive, since this is activated by the temperature application of the hot-melt adhesive during a lamination process, so that the adhesive effect is not only impaired by the lamination process, but rather is supported.
• the adhesive application is also in the form of a tape, particularly easy handling of the adhesive composition and adaptation to the contour of the chip housing is possible during the production of the card inlay.
• the tape-shaped adhesive application is provided with a pressure-sensitive adhesive coating, the adhesive application precedes the lamination process by securely fixing the adhesive application to the chip housing, and the hot-melt composition subsequently activated in the course of the lamination process ensures a permanent, secure connection between the Given chip module and the card inlay.
• a card inlay is first produced in a first production facility.
• the card inlay is subsequently provided on both sides in a second production device with at least one outer layer each such that the outer contact arrangement arranged on the outer contact side of the chip carrier is inserted into a recess in the associated outer layer.
• the card inlay is then connected to the outer layers in a lamination process.
• the method according to the invention thus makes it possible to produce a generic chip card based on a card inlay and two mutually independent production devices, so that the card inlay can be handled as a semi-finished product produced in a first production facility, which subsequently follows in a second production process that is completely independent of the first production process second manufacturing device, which can be arranged spatially distant from the first manufacturing device, can be produced.
• the card inlay can thus be delivered as a semi-finished product to a card manufacturer for further processing or completion of a chip card.
• the chip module is first positioned in a recess in a laminator plate, in such a way that an external contact arrangement arranged on an outer contact side of a chip carrier of the chip module is accommodated in the recess of the laminator plate, and a chip housing arranged on an inner contact side of the chip carrier protrudes from the recess of the laminator plate.
• An arrangement of a receiving layer, preferably embodied as a substrate of an antenna device, on the laminator plate follows, such that the chip housing is inserted into a recess in the receiving layer, the antenna device being arranged on the surface of the substrate facing away from the laminator plate.
• the antenna device can subsequently be contacted with the internal contact side of the chip carrier with freely accessible internal contacts of the chip carrier, and only then can the cover layer be arranged on the receiving layer to cover the contact points.
• the subsequent production in a laminate composite between the receiving layer and the top layer thus produces a permanently sealed arrangement of the chip housing arranged on the chip carrier or the inner contact side of the chip carrier in the card inlay, so that the further storage and handling of the card inlay until the chip card is completed
• Laminating the outer layers at the card manufacturer can be done without any problems and without special precautions, for example with regard to particularly protective packaging of the card inlay.
• the card inlay is preferably provided on both sides with at least one outer layer, the outer contact arrangement arranged on the outer contact side of the chip carrier being inserted into a recess in the associated outer layer.
• a laminate composite is then produced between the outer layer and the Card inlay, such that a flush arrangement of the external contact arrangement with the contact surface of the card body formed by the production of the laminate composite is established.
• FIG. 1 shows a layer arrangement for producing a card inlay in a laminating device
• FIG. 2b shows the chip module shown in FIG. 2a in plan view
• 3a shows the chip module arranged in a receiving position in a side view
• 3b shows the chip module shown in FIG. 3a in plan view
• 4a shows a side view of the chip module covered by a cover layer and arranged between two laminator plates
• FIG. 4b shows the chip module shown in FIG. 4a in plan view
• FIG. 5 shows a partial illustration of a card inlay sheet with a plurality of connected card inlays
• FIG. 6 is a top view of the card inlay sheet shown in FIG. 5;
• Fig. 7 one of a card inlay sheet and a plurality of
• FIG. 1 shows an arrangement of a plurality of so-called utility sheets, each of which has a plurality of layers integrally connected to one another in a utility arrangement, for producing a card inlay sheet 10 shown in FIG. 5 with a plurality of interconnected card inlays 11.
• FIG 1 a receiving layer sheet 12 with a plurality of continuous receiving layers 13 and a cover sheet 14 with a plurality of continuous covering layers 15.
• the receiving layer sheet 12 and the cover sheet 14 are located in a laminator arrangement 16 between a lower laminating plate 17 and an upper laminating plate 18.
• the lower laminating plate 17 is provided with an arrangement 19 from FIG Provide recesses 20 which serve to receive a corresponding number of chip modules 21.
• the receiving layers 13 of the receiving layer sheet 12 each serve as antenna substrates, on each of which an antenna device 22, formed in the present case from a wire path, with a plurality of antenna windings 23 is arranged.
• the antenna devices 22 each have two contact ends 24, 25, which are led over contact bays 26 in an opening edge 27 of a recess 28.
• Both the receiving layer sheet 12 and the cover sheet 14 consist of a laminatable plastic material, such as polyethylene or PVC.
• FIG. 2a shows a chip module 21 accommodated in a recess 20 of the laminator plate 17 with a chip carrier 29, which has an outer contact surface arrangement 31 on an outer contact side 30 and inner contacts 33, 34 on an inner contact side 32, which contacts for contacting the contact ends 24, 25 serve the antenna device 22 (FIG. 1).
• a chip housing 35 which is arranged on the inner contact side 32 of the chip carrier 29 and which serves to hold a chip (not shown here) is provided with an adhesive tape 36 which essentially consists of a hot-melt adhesive is formed, which is provided on its side facing the chip housing 35 with an adhesive application.
• FIG. 2a clearly shows that the laminator plate 17 is formed in two layers in the present case, with a ceramic base layer 37 and a metal layer 38 arranged thereon, in which the recesses 20 are formed.
• the sheet of sheets 12 is then arranged on the laminator plate 17 shown in FIG. 1 with the chip modules 21 accommodated in the recesses 20 of the laminator plate 17 such that the chip modules 21, as shown in FIG. 3a, with their housings 35 into the recesses 28 of the receiving layers 13 are arranged protruding.
• FIG 4a shows the contact ends 24, 25 of the antenna device 22 contacted with the inner contacts 33, 34 as well as the cover layer sheet 14 arranged on the receiving layer sheet 12 following the contacting process, with the cover layers 15 formed therein, each of which is on the chip module 21 or of the chip housing 35 are arranged and thus form a bottom 39 of the recess 28.
• the chip module 21 is accommodated covered on both sides in the laminator arrangement 16, and there is now an action on the arranged between the laminator plate 17 and the laminator plate 18, which is preferably formed entirely from metal Layer arrangement with pressure and temperature to form a laminate composite between the receiving layer sheet 12 and the cover layer sheet 14 for producing the card inlay sheet 10 shown in FIG. 5.
• Card inlay sheet 10 arranged outer layer sheets 45, 46 and 47, 48 connected to the card inlay sheet 10 in a further lamination process.
• the external contact arrangements 31 of the chip modules 21 which are arranged on the underside of the card inlay sheet 10 and protrude from the receiving sheet sheet 12 (FIG. 5) form sheet projections which interact with the sheet sheets 45 in the outer sheet , 46 correspondingly designed recesses 49, 50 enable positioning of the outer layer sheets 45, 46 relative to the card inlay sheet 10 as positioning aids.
• the thicknesses of the outer layer sheets 45, 46 are selected such that, as a result of the production of a laminate composite between the layers 45, 46, 10, 47, and 48 in the laminator arrangement 42, a flush arrangement of the outer contact arrangement 31 in a through the outer layer Bow 45 sets defined contact surface of the chip cards 41.
• the outer layer sheets 47 and 48 are closed and preferably have a thickness corresponding to the respective thicknesses of the outer layer sheets 45, 46.
• the outer layer sheets 45 to 48 applied in the further production device can be, for example, printed outer layer sheets 46 and 47, each of which is covered with a further outer layer 45, 48 designed as a protective film layer .
• the lower laminator plate 43 In order to ensure correct relative positioning of the individual layers 45, 46, 10, 47 and 48 shown in FIG. 7 for the lamination process, it is possible, for example, to provide the lower laminator plate 43 with positioning pins 52 which fit into corresponding positioning recesses 53 in FIG Intervene layers 45, 46, 10, 47 and 48. Since the production of the chip card sheets 40 in the laminator arrangement 42 is based on the card inlay sheet 10 produced in the laminator arrangement 16 (FIG. 1), the positioning can take place according to the positioning grid of the laminator plate 17 formed by the arrangement 19 of the recesses 20 the laminator arrangement 16. Basically, it is therefore also possible to carry out the The lamination process shown in FIG. 7 uses the same laminator plate 17 as in the lamination process shown in FIG. 1 for producing the card inlay sheet 10. In this case, the recesses 20 in the laminator plate 17 or the laminator plate 43 ensure that the external contact arrangements 31 are not subjected to direct thermal stress when the chip card sheet 40 is produced.
• the chip cards 41 which are formed in a continuous manner in the utility arrangement, can now be separated.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Computer Hardware Design (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Theoretical Computer Science (AREA)
• Credit Cards Or The Like (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=38016406

Family Applications (1)

Country Status (10)

Families Citing this family (41)

Citations (3)

Family Cites Families (20)

• 2005
  • 2005-12-05 DE DE102005058101.3A patent/DE102005058101B4/de active Active
• 2006
  • 2006-11-30 EP EP06828581A patent/EP1958131A2/de not_active Withdrawn
  • 2006-11-30 MY MYPI20081902A patent/MY154934A/en unknown
  • 2006-11-30 WO PCT/DE2006/002126 patent/WO2007065404A2/de active Application Filing
  • 2006-11-30 BR BRPI0619427-3A patent/BRPI0619427A2/pt not_active Application Discontinuation
  • 2006-11-30 KR KR1020087016388A patent/KR101035047B1/ko active IP Right Grant
  • 2006-11-30 CA CA2631744A patent/CA2631744C/en active Active
  • 2006-11-30 CN CN2006800452163A patent/CN101341499B/zh active Active
  • 2006-11-30 US US12/096,006 patent/US20080314990A1/en not_active Abandoned
  • 2006-11-30 JP JP2008543646A patent/JP2009518720A/ja active Pending

Patent Citations (3)

Non-Patent Citations (1)

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