EP1915034B1 - PTC-Heizelement - Google Patents

PTC-Heizelement Download PDF

Info

Publication number
EP1915034B1
EP1915034B1 EP06021777A EP06021777A EP1915034B1 EP 1915034 B1 EP1915034 B1 EP 1915034B1 EP 06021777 A EP06021777 A EP 06021777A EP 06021777 A EP06021777 A EP 06021777A EP 1915034 B1 EP1915034 B1 EP 1915034B1
Authority
EP
European Patent Office
Prior art keywords
housing
opening
heating element
ptc heating
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP06021777A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1915034A1 (de
Inventor
Franz Bohlender
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eberspaecher Catem GmbH and Co KG
Original Assignee
Eberspaecher Catem GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eberspaecher Catem GmbH and Co KG filed Critical Eberspaecher Catem GmbH and Co KG
Priority to DE502006009401T priority Critical patent/DE502006009401D1/de
Priority to EP06021777A priority patent/EP1915034B1/de
Priority to ES06021777T priority patent/ES2360926T3/es
Priority to KR1020070102695A priority patent/KR20080034780A/ko
Priority to JP2007269524A priority patent/JP2008103726A/ja
Priority to US11/873,624 priority patent/US7910864B2/en
Priority to CNA2007101642621A priority patent/CN101166379A/zh
Publication of EP1915034A1 publication Critical patent/EP1915034A1/de
Application granted granted Critical
Publication of EP1915034B1 publication Critical patent/EP1915034B1/de
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H05B3/42—Heating elements having the shape of rods or tubes non-flexible
    • H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
    • H05B3/50—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material heating conductor arranged in metal tubes, the radiating surface having heat-conducting fins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H3/00—Air heaters
    • F24H3/02—Air heaters with forced circulation
    • F24H3/04—Air heaters with forced circulation the air being in direct contact with the heating medium, e.g. electric heating element
    • F24H3/0405—Air heaters with forced circulation the air being in direct contact with the heating medium, e.g. electric heating element using electric energy supply, e.g. the heating medium being a resistive element; Heating by direct contact, i.e. with resistive elements, electrodes and fins being bonded together without additional element in-between
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H9/00—Details
    • F24H9/18—Arrangement or mounting of grates or heating means
    • F24H9/1854—Arrangement or mounting of grates or heating means for air heaters
    • F24H9/1863—Arrangement or mounting of electric heating means
    • F24H9/1872—PTC
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic

Definitions

  • the present invention relates to a PTC heating element having at least one PTC resistor element which is arranged between two printed circuit boards in a housing opening of a housing and is biased under the interposition of at least one of the printed circuit boards against a heat-emitting element, which is held by the housing.
  • Such a PTC heating element is, for example, from the date of the Applicant EP 0 350 528 known.
  • several PTC heating elements in several levels with the interposition of heat-emitting elements in the form of meandering bent metal strip in a frame are arranged. Within the frame is a spring, which presses the two externally applied to the PTC heating circuit boards for good thermal and electrical contact with the PTC element and the heat-emitting elements for good heat transfer of the heat generated by the PTC resistor element against the adjacent Printed circuit board.
  • the PTC heating element is used for air heating.
  • other embodiments are known in which the PTC resistor element heats a heating plate. Such embodiments are known in particular for heating or keeping food warm, for example baby food.
  • the present invention is based on the problem to provide a generic heating element, which can be easily and thus inexpensively.
  • the present invention provides a PTC heating element having the features of claim 1. This differs from the generic state of the art by a housing opening, which is surmounted by fastening edges arranged at the edge of the housing opening, wherein the heat-releasing element has pin recesses which are engaged behind by the pins in the case of a heat-emitting element mounted on the housing.
  • the pins may also have at their free end, a peg opening engaging behind, formed by melting of the respective pin thickening. Such thickened pins are achieved for example by hot stamping.
  • the pins are not only the attachment of the heat-emitting element relative to the housing. Rather, the pins surround the housing opening and extend beyond the housing opening on the outside. As a result, the pins form a guide formed by the housing in the insertion direction of the printed circuit boards and the at least one PTC resistor element, by means of which the assembly is simplified.
  • the pins may additionally be funnel-shaped at the upper free end for facilitating the easy insertion of the two strip conductors with the at least one PTC resistor element arranged therebetween.
  • the pin of the PTC heating element according to the invention then comes to a double function.
  • they due to their arrangement relative to the housing opening, they permit a simple guided introduction of the printed circuit boards together with the at least one PTC resistance element.
  • they ensure a secure fixation of the heat-emitting element after the final assembly.
  • the pin project beyond an upper, formed by the housing bearing surface for the heat-emitting element having a height which is dimensioned such that lifted by the bias before applying the heat element on the contact surface with respect to this raised PCB not higher than the top of the pin reaches.
  • the pins are approximately sized so that the raised over the contact surface upper circuit board is approximately equal in height to the upper end of the pin. With regard to the most gentle possible use of material for the formation of the housing and the pin these should only slightly protrude the upper circuit board in the raised position.
  • the printed circuit board opposite the heat-emitting element i. the printed circuit board which is provided with respect to the PTC resistor element on the other side than the heat-emitting element, to be provided with at least one spring element which is integrally formed thereon by punching and bending the sheet material forming the printed circuit board and on the housing supported.
  • the spring element is preferably cut out of the sheet metal material forming the printed circuit board in such a way that it first projects on the outside of the contact surface of the at least one PTC resistor element on the corresponding printed circuit board.
  • a housing opening in the sense of the present invention is understood as meaning, in particular, a recess which opens to the contact surface for the heat-releasing element and whose size corresponds approximately to the dimensions of the PTC resistance elements accommodated in the housing.
  • the housing opening has in plan view approximately the contour of the PTC or resistance elements of the PTC heating element.
  • the printed circuit boards have an abutting on the PTC resistor element abutment portion, which is surmounted on its outer peripheral surface by a free-punched connection portion.
  • This connection portion is initially in the plane of the circuit board forming sheet metal strip.
  • a partial region of the connection section, ie the front end of the connection section forming the contact tongue, is then bent over by 90 °, so that the contact tongue protrudes substantially at a right angle from the plane of the sheet material.
  • the circuit board is introduced with its contact portion in the opening of the housing.
  • the contact tongue passes through the recessed on the underside of the housing KunststoffzonneausEnglishung and extends beyond the housing on the outside.
  • the projecting portion is formed, for example, by a slider and introduced into the contact tongue receptacle, which extends substantially parallel to the contact surface of the abutment portion, ie parallel to the support surface for the heat-emitting element.
  • the respective conductor track is securely received in the housing.
  • the connection section of the printed circuit board is preferably surrounded relatively tightly by walls of the housing and thus held fixed in position in the housing.
  • the embodiment shown in the drawing is a PTC heating element for heating or keeping warm baby food and is housed within an injection-molded, not shown housing, which forms the holder for the baby food containing vessel (bottle, glass).
  • the PTC heating element shown in the drawing This forms with its heating plate 2, the support for the baby food receiving vessel, which is directly on the heating plate 2.
  • the embodiment shown in the drawing has a housing 4, which consists essentially of three separate segments.
  • the housing has a receiving portion 6 for receiving a heat-generating layer structure, comprising a lower printed circuit board 8, an interposed PTC heating element 10 having a substantially circular shape and an upper printed circuit board 12 (see. Fig. 3 ).
  • a substantially round opening 14 which is only slightly larger than the layer structure.
  • the lower printed circuit board 8 and the upper printed circuit board 12 each have a circular abutment portion 16 corresponding to the contour of the round PTC element.
  • opening to the opening 14 printed circuit board chambers 18, 20 are provided by the housing 4, the bottom of which may be slightly raised relative to the bottom of the opening 14.
  • the housing 4 forms next to the receiving portion 6, two plug receptacles 22, 24.
  • These plug receptacles 22, 24 are opposite to in Fig. 1 shown top of the PTC heating element by a cover 26 which is located below a formed by the top of the housing 4 contact surface 28 for the heating plate 2.
  • the plug receptacles 22 and 24 each have a latching opening 36 which is recessed in the embodiment shown on the inside of the cover 24 and 26, respectively, without enforcing the respective cover 24, 26.
  • FIG. 3 shows the outer bottom 40 of the circuit board chambers 18, 20 equal in height to the bottom 42 of the housing 4.
  • 24 form contact webs 43 bottom 42 of the housing 2.
  • the housing 4 forms a stop 44 for the plug sleeve 30.
  • the recess formed by the plug receptacle 22, 24 is pulled through on the underside of the housing 2 to the rear end of the same.
  • the plug receptacle 22 or 24 continues over the recess 46 to the rear end of the housing 4.
  • To the recess 46 opens a reed 48, which connects as a slot downwardly exposed bottom 40 of the housing with the inside of the receiving portion 40 and which is provided outside the opening 14 and in extension of the plug receptacles 22, 24.
  • the plug receptacles 22, 24 are bounded on the underside by a web 50 which is provided in the insertion direction of the plug sleeve 30 in the front region of the plug receptacle 22 and 24 and the two contact webs 43 of the respective plug receptacles 22, 24 connects.
  • a web 50 which is provided in the insertion direction of the plug sleeve 30 in the front region of the plug receptacle 22 and 24 and the two contact webs 43 of the respective plug receptacles 22, 24 connects.
  • In the insertion direction behind the plug receptacles 22, 24 each have a Grezonneeintechnology Engineering Institute 52, which is formed for reasons of injection molding production of the housing 4 with the width of the plug receptacle 22 and 24 (see. Fig. 2 ).
  • the contact surface 28 is surmounted by three pins 54 which are provided at the edge of the circular inner peripheral surface of the opening 14.
  • the pins 54 may be integrally provided on the housing 4 by means of injection molding. alternative can be recessed in the injection molding production of the housing 4 pin recesses into which the pins 54 are inserted.
  • the lower circuit board 8 integrally formed thereon spring projections 56 (see. Fig. 4 ).
  • These spring projections 56 are first formed by free cutting of the lower printed circuit board 8 forming sheet material and in a subsequent manufacturing step below the bottom of the lower circuit board 8, so that formed on the inside of the bottom 40, integrally provided with the lower circuit board 8 spring projections 56 are formed are.
  • a plurality of spring projections 56 are provided on the circumference of the circular contact portion 16 and guided from there under the lower circuit board 8.
  • the pins 54 project beyond the contact surface 28 at a height that depends on two factors: on the one hand, the pins serve to hold the pre-assembled layer structure. Due to the force of the spring projections 56, the layer structure for good heat transfer to the heating plate 2 is pressed against the inside of the heating plate 2 after assembly. This means that before the finished assembly, i. before the attachment of the heating plate 2 to the housing 4 of the layer structure, the contact surface 28 surmounted. The distributed around the circumference of the opening 14 pins 54 ensure that even in this raised position, the upper circuit board 12 within the peripheral surface of the opening 14 remains.
  • the heating plate 2 has corresponding to the pin 54 recessed pin recesses 58, which are engaged behind after the laying of the heating plate 2 on the contact surface 28 of the pin 54.
  • the pins 54 may have the pin recesses 58 engaging behind latching projections.
  • the pins 54 are formed by hot stamping with a thickening 60 after mounting the heating plate 2, which projects beyond the pin recess 58.
  • the reed base 64 lies within the board chambers 18 and 20, respectively; the contact tongue 66 is electrically connected to the plug sleeve 30.
  • the contact tongue 66 is first bent at the transition to the contact tongue base 64 by 90 ° from the plane of the sheet material out.
  • a bent edge 68 formed in this way is dimensioned such that, when the printed circuit board 8, 12 is inserted into the opening 14, it lies in an extension of the slot-shaped contact tongue receptacle 48.
  • the contact tongues 66 are accordingly passed through the Reeds 48 recordings.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Resistance Heating (AREA)
  • Thermistors And Varistors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
EP06021777A 2006-10-17 2006-10-17 PTC-Heizelement Not-in-force EP1915034B1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE502006009401T DE502006009401D1 (de) 2006-10-17 2006-10-17 PTC-Heizelement
EP06021777A EP1915034B1 (de) 2006-10-17 2006-10-17 PTC-Heizelement
ES06021777T ES2360926T3 (es) 2006-10-17 2006-10-17 Elemento de calentamiento de coeficiente positivo de temperatura.
KR1020070102695A KR20080034780A (ko) 2006-10-17 2007-10-11 Ｐｔｃ 가열 소자
JP2007269524A JP2008103726A (ja) 2006-10-17 2007-10-16 Ｐｔｃ加熱素子
US11/873,624 US7910864B2 (en) 2006-10-17 2007-10-17 PTC heating element
CNA2007101642621A CN101166379A (zh) 2006-10-17 2007-10-17 Ptc加热元件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06021777A EP1915034B1 (de) 2006-10-17 2006-10-17 PTC-Heizelement

Publications (2)

Publication Number Publication Date
EP1915034A1 EP1915034A1 (de) 2008-04-23
EP1915034B1 true EP1915034B1 (de) 2011-04-27

Family

ID=37814302

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06021777A Not-in-force EP1915034B1 (de) 2006-10-17 2006-10-17 PTC-Heizelement

Country Status (7)

Country Link
US (1) US7910864B2 (ko)
EP (1) EP1915034B1 (ko)
JP (1) JP2008103726A (ko)
KR (1) KR20080034780A (ko)
CN (1) CN101166379A (ko)
DE (1) DE502006009401D1 (ko)
ES (1) ES2360926T3 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103945574B (zh) * 2014-03-25 2015-11-25 常熟市林芝电热器件有限公司 Ptc发热芯自动装配机的薄膜带及电极片转移机构结构

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3720807A (en) * 1972-05-01 1973-03-13 Texas Instruments Inc Food warming apparatus
EP0350528B1 (de) * 1988-07-15 1992-04-01 David & Baader DBK Spezialfabrik elektrischer Apparate und Heizwiderstände GmbH Radiator

Also Published As

Publication number Publication date
JP2008103726A (ja) 2008-05-01
CN101166379A (zh) 2008-04-23
KR20080034780A (ko) 2008-04-22
US20080087660A1 (en) 2008-04-17
ES2360926T3 (es) 2011-06-10
US7910864B2 (en) 2011-03-22
DE502006009401D1 (de) 2011-06-09
EP1915034A1 (de) 2008-04-23

Similar Documents

Publication Publication Date Title
DE4406644C2 (de) Steckkarte für elektronische Datenverarbeitungsgeräte und Verfahren zu dessen Herstellung und Montage
DE2245982C3 (de) Elektrischer Verbinder zur Herstellung einer Andrückverbindung mit einem Flachleiter eines Flachleiterkabels
DE2409075A1 (de) Elektrischer verbinder
EP0959529B1 (de) Elektrische Anschlussbaueinheit
DE1790342B2 (ko)
EP1738294B1 (de) Smart card connector insbesondere mit schirmeinrichtung
DE2819868C2 (de) Elektrischer Verbinder
DE10257759A1 (de) Elektrische Steckverbindung mit einem Gehäuse und einem Hochstromkontakt
DE10312066B4 (de) Stromschienen-Adapter
DE3231484A1 (de) Elektrisches kontaktelement zur herstellung eines elektrischen kontaktes mit einem abgeflachten kontaktorgan
DE19710515C1 (de) Steckkarte für elektronische Geräte
EP0627784B1 (de) Kontaktbuchse für den Anschluss von Gegenkontakten
EP0828320A1 (de) Steckverbinder
EP1915034B1 (de) PTC-Heizelement
DE10006848C1 (de) Steckkarte für elektronische Geräte
DE102006006316B3 (de) Elektrischer Buchsenkontakt
DE2349330A1 (de) Elektrischer kontakt fuer sicherungshalter
DE19945412A1 (de) Elektrischer Kontakt und elektrischer Steckverbinder mit einem solchen Kontakt
DE69023166T2 (de) Elektrischer Verbinder.
DE102017112548B4 (de) Elektrische kontakteinrichtung und metallische aufnahme für eine elektrische kontakteinrichtung
EP0928504A1 (de) Kontaktorgan mit doppel-schneidklemmanschluss
DE102006027674B3 (de) Elektrischer Buchsenkontakt
EP0131118B1 (de) Mehrfachsteckverbindung
DE3516858A1 (de) Hf-steckverbinder mit schaltfunktion
DE29622991U1 (de) Kontaktorgan mit Doppel-Schneidklemmanschluß

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20070417

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK RS

AKX Designation fees paid

Designated state(s): DE ES FR GB IT

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: EBERSPAECHER CATEM GMBH & CO. KG

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE ES FR GB IT

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REF Corresponds to:

Ref document number: 502006009401

Country of ref document: DE

Date of ref document: 20110609

Kind code of ref document: P

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502006009401

Country of ref document: DE

Effective date: 20110609

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2360926

Country of ref document: ES

Kind code of ref document: T3

Effective date: 20110610

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: ES

Payment date: 20111011

Year of fee payment: 6

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20120130

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 502006009401

Country of ref document: DE

Effective date: 20120130

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20111017

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20111017

REG Reference to a national code

Ref country code: ES

Ref legal event code: FD2A

Effective date: 20140115

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20121018

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 10

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 11

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 12

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20171023

Year of fee payment: 12

Ref country code: FR

Payment date: 20171023

Year of fee payment: 12

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20171020

Year of fee payment: 12

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 502006009401

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190501

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20181031

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20181017