EP1915034B1 - PTC heating element - Google Patents
PTC heating element Download PDFInfo
- Publication number
- EP1915034B1 EP1915034B1 EP06021777A EP06021777A EP1915034B1 EP 1915034 B1 EP1915034 B1 EP 1915034B1 EP 06021777 A EP06021777 A EP 06021777A EP 06021777 A EP06021777 A EP 06021777A EP 1915034 B1 EP1915034 B1 EP 1915034B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- housing
- opening
- heating element
- ptc heating
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 title claims description 46
- 238000005452 bending Methods 0.000 claims description 5
- 230000008719 thickening Effects 0.000 claims description 5
- 210000002105 tongue Anatomy 0.000 description 24
- 239000000463 material Substances 0.000 description 5
- 235000014676 Phragmites communis Nutrition 0.000 description 4
- 235000008452 baby food Nutrition 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 244000273256 Phragmites communis Species 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
- H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
- H05B3/50—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material heating conductor arranged in metal tubes, the radiating surface having heat-conducting fins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H3/00—Air heaters
- F24H3/02—Air heaters with forced circulation
- F24H3/04—Air heaters with forced circulation the air being in direct contact with the heating medium, e.g. electric heating element
- F24H3/0405—Air heaters with forced circulation the air being in direct contact with the heating medium, e.g. electric heating element using electric energy supply, e.g. the heating medium being a resistive element; Heating by direct contact, i.e. with resistive elements, electrodes and fins being bonded together without additional element in-between
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H9/00—Details
- F24H9/18—Arrangement or mounting of grates or heating means
- F24H9/1854—Arrangement or mounting of grates or heating means for air heaters
- F24H9/1863—Arrangement or mounting of electric heating means
- F24H9/1872—PTC
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
Definitions
- the present invention relates to a PTC heating element having at least one PTC resistor element which is arranged between two printed circuit boards in a housing opening of a housing and is biased under the interposition of at least one of the printed circuit boards against a heat-emitting element, which is held by the housing.
- Such a PTC heating element is, for example, from the date of the Applicant EP 0 350 528 known.
- several PTC heating elements in several levels with the interposition of heat-emitting elements in the form of meandering bent metal strip in a frame are arranged. Within the frame is a spring, which presses the two externally applied to the PTC heating circuit boards for good thermal and electrical contact with the PTC element and the heat-emitting elements for good heat transfer of the heat generated by the PTC resistor element against the adjacent Printed circuit board.
- the PTC heating element is used for air heating.
- other embodiments are known in which the PTC resistor element heats a heating plate. Such embodiments are known in particular for heating or keeping food warm, for example baby food.
- the present invention is based on the problem to provide a generic heating element, which can be easily and thus inexpensively.
- the present invention provides a PTC heating element having the features of claim 1. This differs from the generic state of the art by a housing opening, which is surmounted by fastening edges arranged at the edge of the housing opening, wherein the heat-releasing element has pin recesses which are engaged behind by the pins in the case of a heat-emitting element mounted on the housing.
- the pins may also have at their free end, a peg opening engaging behind, formed by melting of the respective pin thickening. Such thickened pins are achieved for example by hot stamping.
- the pins are not only the attachment of the heat-emitting element relative to the housing. Rather, the pins surround the housing opening and extend beyond the housing opening on the outside. As a result, the pins form a guide formed by the housing in the insertion direction of the printed circuit boards and the at least one PTC resistor element, by means of which the assembly is simplified.
- the pins may additionally be funnel-shaped at the upper free end for facilitating the easy insertion of the two strip conductors with the at least one PTC resistor element arranged therebetween.
- the pin of the PTC heating element according to the invention then comes to a double function.
- they due to their arrangement relative to the housing opening, they permit a simple guided introduction of the printed circuit boards together with the at least one PTC resistance element.
- they ensure a secure fixation of the heat-emitting element after the final assembly.
- the pin project beyond an upper, formed by the housing bearing surface for the heat-emitting element having a height which is dimensioned such that lifted by the bias before applying the heat element on the contact surface with respect to this raised PCB not higher than the top of the pin reaches.
- the pins are approximately sized so that the raised over the contact surface upper circuit board is approximately equal in height to the upper end of the pin. With regard to the most gentle possible use of material for the formation of the housing and the pin these should only slightly protrude the upper circuit board in the raised position.
- the printed circuit board opposite the heat-emitting element i. the printed circuit board which is provided with respect to the PTC resistor element on the other side than the heat-emitting element, to be provided with at least one spring element which is integrally formed thereon by punching and bending the sheet material forming the printed circuit board and on the housing supported.
- the spring element is preferably cut out of the sheet metal material forming the printed circuit board in such a way that it first projects on the outside of the contact surface of the at least one PTC resistor element on the corresponding printed circuit board.
- a housing opening in the sense of the present invention is understood as meaning, in particular, a recess which opens to the contact surface for the heat-releasing element and whose size corresponds approximately to the dimensions of the PTC resistance elements accommodated in the housing.
- the housing opening has in plan view approximately the contour of the PTC or resistance elements of the PTC heating element.
- the printed circuit boards have an abutting on the PTC resistor element abutment portion, which is surmounted on its outer peripheral surface by a free-punched connection portion.
- This connection portion is initially in the plane of the circuit board forming sheet metal strip.
- a partial region of the connection section, ie the front end of the connection section forming the contact tongue, is then bent over by 90 °, so that the contact tongue protrudes substantially at a right angle from the plane of the sheet material.
- the circuit board is introduced with its contact portion in the opening of the housing.
- the contact tongue passes through the recessed on the underside of the housing KunststoffzonneausEnglishung and extends beyond the housing on the outside.
- the projecting portion is formed, for example, by a slider and introduced into the contact tongue receptacle, which extends substantially parallel to the contact surface of the abutment portion, ie parallel to the support surface for the heat-emitting element.
- the respective conductor track is securely received in the housing.
- the connection section of the printed circuit board is preferably surrounded relatively tightly by walls of the housing and thus held fixed in position in the housing.
- the embodiment shown in the drawing is a PTC heating element for heating or keeping warm baby food and is housed within an injection-molded, not shown housing, which forms the holder for the baby food containing vessel (bottle, glass).
- the PTC heating element shown in the drawing This forms with its heating plate 2, the support for the baby food receiving vessel, which is directly on the heating plate 2.
- the embodiment shown in the drawing has a housing 4, which consists essentially of three separate segments.
- the housing has a receiving portion 6 for receiving a heat-generating layer structure, comprising a lower printed circuit board 8, an interposed PTC heating element 10 having a substantially circular shape and an upper printed circuit board 12 (see. Fig. 3 ).
- a substantially round opening 14 which is only slightly larger than the layer structure.
- the lower printed circuit board 8 and the upper printed circuit board 12 each have a circular abutment portion 16 corresponding to the contour of the round PTC element.
- opening to the opening 14 printed circuit board chambers 18, 20 are provided by the housing 4, the bottom of which may be slightly raised relative to the bottom of the opening 14.
- the housing 4 forms next to the receiving portion 6, two plug receptacles 22, 24.
- These plug receptacles 22, 24 are opposite to in Fig. 1 shown top of the PTC heating element by a cover 26 which is located below a formed by the top of the housing 4 contact surface 28 for the heating plate 2.
- the plug receptacles 22 and 24 each have a latching opening 36 which is recessed in the embodiment shown on the inside of the cover 24 and 26, respectively, without enforcing the respective cover 24, 26.
- FIG. 3 shows the outer bottom 40 of the circuit board chambers 18, 20 equal in height to the bottom 42 of the housing 4.
- 24 form contact webs 43 bottom 42 of the housing 2.
- the housing 4 forms a stop 44 for the plug sleeve 30.
- the recess formed by the plug receptacle 22, 24 is pulled through on the underside of the housing 2 to the rear end of the same.
- the plug receptacle 22 or 24 continues over the recess 46 to the rear end of the housing 4.
- To the recess 46 opens a reed 48, which connects as a slot downwardly exposed bottom 40 of the housing with the inside of the receiving portion 40 and which is provided outside the opening 14 and in extension of the plug receptacles 22, 24.
- the plug receptacles 22, 24 are bounded on the underside by a web 50 which is provided in the insertion direction of the plug sleeve 30 in the front region of the plug receptacle 22 and 24 and the two contact webs 43 of the respective plug receptacles 22, 24 connects.
- a web 50 which is provided in the insertion direction of the plug sleeve 30 in the front region of the plug receptacle 22 and 24 and the two contact webs 43 of the respective plug receptacles 22, 24 connects.
- In the insertion direction behind the plug receptacles 22, 24 each have a Grezonneeintechnology Engineering Institute 52, which is formed for reasons of injection molding production of the housing 4 with the width of the plug receptacle 22 and 24 (see. Fig. 2 ).
- the contact surface 28 is surmounted by three pins 54 which are provided at the edge of the circular inner peripheral surface of the opening 14.
- the pins 54 may be integrally provided on the housing 4 by means of injection molding. alternative can be recessed in the injection molding production of the housing 4 pin recesses into which the pins 54 are inserted.
- the lower circuit board 8 integrally formed thereon spring projections 56 (see. Fig. 4 ).
- These spring projections 56 are first formed by free cutting of the lower printed circuit board 8 forming sheet material and in a subsequent manufacturing step below the bottom of the lower circuit board 8, so that formed on the inside of the bottom 40, integrally provided with the lower circuit board 8 spring projections 56 are formed are.
- a plurality of spring projections 56 are provided on the circumference of the circular contact portion 16 and guided from there under the lower circuit board 8.
- the pins 54 project beyond the contact surface 28 at a height that depends on two factors: on the one hand, the pins serve to hold the pre-assembled layer structure. Due to the force of the spring projections 56, the layer structure for good heat transfer to the heating plate 2 is pressed against the inside of the heating plate 2 after assembly. This means that before the finished assembly, i. before the attachment of the heating plate 2 to the housing 4 of the layer structure, the contact surface 28 surmounted. The distributed around the circumference of the opening 14 pins 54 ensure that even in this raised position, the upper circuit board 12 within the peripheral surface of the opening 14 remains.
- the heating plate 2 has corresponding to the pin 54 recessed pin recesses 58, which are engaged behind after the laying of the heating plate 2 on the contact surface 28 of the pin 54.
- the pins 54 may have the pin recesses 58 engaging behind latching projections.
- the pins 54 are formed by hot stamping with a thickening 60 after mounting the heating plate 2, which projects beyond the pin recess 58.
- the reed base 64 lies within the board chambers 18 and 20, respectively; the contact tongue 66 is electrically connected to the plug sleeve 30.
- the contact tongue 66 is first bent at the transition to the contact tongue base 64 by 90 ° from the plane of the sheet material out.
- a bent edge 68 formed in this way is dimensioned such that, when the printed circuit board 8, 12 is inserted into the opening 14, it lies in an extension of the slot-shaped contact tongue receptacle 48.
- the contact tongues 66 are accordingly passed through the Reeds 48 recordings.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Resistance Heating (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Thermistors And Varistors (AREA)
Description
Die vorliegende Erfindung betrifft ein PTC-Heizelement mit wenigstens einem PTC-Widerstandselement, welches zwischen zwei Leiterplatten in einer Gehäuseöffnung eines Gehäuses angeordnet und unter Zwischenlage wenigstens einer der Leiterplatten unter Vorspannung gegen ein Wärme abgebendes Element gedrückt wird, welches von dem Gehäuse gehalten ist.The present invention relates to a PTC heating element having at least one PTC resistor element which is arranged between two printed circuit boards in a housing opening of a housing and is biased under the interposition of at least one of the printed circuit boards against a heat-emitting element, which is held by the housing.
Ein derartiges PTC-Heizelement ist beispielsweise aus der auf die Anmelderin zurückgehenden
Der vorliegenden Erfindung liegt das Problem zugrunde, ein gattungsgemäßes Heizelement anzugeben, welches sich einfach und damit kostengünstig herstellen lässt.The present invention is based on the problem to provide a generic heating element, which can be easily and thus inexpensively.
Zur Lösung dieses Problems wird mit der vorliegenden Erfindung ein PTC-Heizelement mit den Merkmalen von Anspruch 1 angegeben. Dieses unterscheidet sich von dem gattungsbildenden Stand der Technik durch eine Gehäuseöffnung, die durch randseitig zu der Gehäuseöffnung angeordnete Befestigungszapfen überragt ist, wobei das Wärme abgebende Element Zapfenausnehmungen hat, die bei einem an dem Gehäuse montierten Wärme abgebenden Element von den Zapfen hintergriffen sind.To solve this problem, the present invention provides a PTC heating element having the features of claim 1. This differs from the generic state of the art by a housing opening, which is surmounted by fastening edges arranged at the edge of the housing opening, wherein the heat-releasing element has pin recesses which are engaged behind by the pins in the case of a heat-emitting element mounted on the housing.
Durch dieses Hintergreifen ist das Wärme abgebende Element auf einfache Weise mit dem Gehäuse verbunden, beispielsweise verrastet. Alternativ können die Zapfen auch an ihrem freien Ende eine die Zapfenöffnung hintergreifende, durch Anschmelzen des jeweiligen Zapfens ausgebildete Verdickung haben. Solche verdickte Zapfen werden beispielsweise durch Heißprägung erzielt.By this engaging behind the heat-emitting element is easily connected to the housing, for example, locked. Alternatively, the pins may also have at their free end, a peg opening engaging behind, formed by melting of the respective pin thickening. Such thickened pins are achieved for example by hot stamping.
Die Zapfen dienen aber nicht nur der Befestigung des Wärme abgebenden Elementes gegenüber dem Gehäuse. Vielmehr umranden die Zapfen die Gehäuseöffnung und überragen die Gehäuseöffnung außenseitig. Dadurch bilden die Zapfen eine die Führung des Gehäuses in Einführrichtung der Leiterplatten und des wenigstens einen PTC-Widerstandselementes gebildete Führung, durch welche die Montage vereinfacht wird. Die Zapfen können am oberen freien Ende hierzu zusätzlich trichterförmig ausgebildet sein, um ein leichtes Einbringen der beiden Leiterbahnen mit dem wenigstens einen dazwischen angeordneten PTC-Widerstandselement zu ermöglichen.However, the pins are not only the attachment of the heat-emitting element relative to the housing. Rather, the pins surround the housing opening and extend beyond the housing opening on the outside. As a result, the pins form a guide formed by the housing in the insertion direction of the printed circuit boards and the at least one PTC resistor element, by means of which the assembly is simplified. The pins may additionally be funnel-shaped at the upper free end for facilitating the easy insertion of the two strip conductors with the at least one PTC resistor element arranged therebetween.
Den Zapfen des erfindungsgemäßen PTC-Heizelementes kommt danach eine doppelte Funktion zu. Sie erlauben zum einen aufgrund ihrer Anordnung relativ zu der Gehäuseöffnung ein einfaches geführtes Einbringen der Leiterplatten zusammen mit dem wenigstens einen PTC-Widerstandselement. Darüber hinaus sorgen sie für eine sichere Fixierung des Wärme abgebenden Elementes nach der Fertigmontage.The pin of the PTC heating element according to the invention then comes to a double function. On the one hand, due to their arrangement relative to the housing opening, they permit a simple guided introduction of the printed circuit boards together with the at least one PTC resistance element. In addition, they ensure a secure fixation of the heat-emitting element after the final assembly.
Gemäß einer bevorzugten Weiterbildung der vorliegenden Erfindung überragen die Zapfen eine obere, durch das Gehäuse ausgebildete Anlagefläche für das Wärme abgebende Element mit einer Höhe, die derart bemessen ist, dass die durch die Vorspannung vor dem Auflegen des Wärme abgebenden Elementes auf die Anlagefläche gegenüber dieser herausgehobene Leiterplatte nicht höher als das obere Ende der Zapfen reicht. Dadurch wird die Möglichkeit geschaffen, den die Wärme abgebenden und in der Gehäuseöffnung aufgenommenen Schichtaufbau bei der Montage zu fixieren. Vorzugsweise sind die Zapfen in etwa so bemessen, dass die über die Anlagefläche herausgehobene obere Leiterplatte in etwa höhengleich zu dem oberen Ende der Zapfen ist. Im Hinblick auf einen möglichst schonenden Einsatz von Material zur Ausbildung des Gehäuses und der Zapfen sollten diese die obere Leiterplatte in der herausgehobenen Stellung nur geringfügig überragen.According to a preferred embodiment of the present invention, the pin project beyond an upper, formed by the housing bearing surface for the heat-emitting element having a height which is dimensioned such that lifted by the bias before applying the heat element on the contact surface with respect to this raised PCB not higher than the top of the pin reaches. This creates the possibility to fix the heat-releasing and recorded in the housing opening layer structure during assembly. Preferably, the pins are approximately sized so that the raised over the contact surface upper circuit board is approximately equal in height to the upper end of the pin. With regard to the most gentle possible use of material for the formation of the housing and the pin these should only slightly protrude the upper circuit board in the raised position.
Zur weiteren Vereinfachung des PTC-Heizelementes wird gemäß einer bevorzugten Ausgestaltung der vorliegenden Erfindung vorgeschlagen, die dem Wärme abgebenden Element gegenüberliegende Leiterplatte, d.h. diejenige Leiterplatte, die in Bezug auf das PTC-Widerstandselement auf der anderen Seite als das Wärme abgebende Element vorgesehen ist, mit wenigstens einem Federelement zu versehen, die mittels Stanzbearbeitung und Umbiegen des die Leiterplatte bildenden Blechmaterials einteilig an diesem ausgebildet ist und sich an dem Gehäuse abstützt. Das Federelement wird vorzugsweise aus dem die Leiterplatte bildenden Blechmaterial so ausgeschnitten, dass es zunächst die Anlagefläche des wenigstens einen PTC-Widerstandselementes an der entsprechenden Leiterplatte außenseitig umragt. Der überragende Abschnitt wird dann vorzugsweise auf der Rückseite der Anlagefläche unter die Leiterplatte gebogen und kann sich mit diesem Federschenkel an dem Gehäuse abstützen, welches vorzugsweise an seiner der Gehäuseöffnung gegenüberliegenden Unterseite verschlossen ist. Als Gehäuseöffnung im Sinne der vorliegenden Erfindung wird hierbei insbesondere eine sich zu der Anlagefläche für das Wärme abgebende Element öffnende Ausnehmung verstanden, deren Größe in etwa den Abmessungen des bzw. der in dem Gehäuse aufgenommenen PTC-Widerstandselemente entspricht. Mit anderen Worten hat die Gehäuseöffnung in der Draufsicht in etwa die Kontur des bzw. der PTC-Widerstandselemente des PTC-Heizelementes.For further simplification of the PTC heating element, it is proposed according to a preferred embodiment of the present invention, the printed circuit board opposite the heat-emitting element, i. the printed circuit board which is provided with respect to the PTC resistor element on the other side than the heat-emitting element, to be provided with at least one spring element which is integrally formed thereon by punching and bending the sheet material forming the printed circuit board and on the housing supported. The spring element is preferably cut out of the sheet metal material forming the printed circuit board in such a way that it first projects on the outside of the contact surface of the at least one PTC resistor element on the corresponding printed circuit board. The projecting portion is then preferably bent on the back of the contact surface under the circuit board and can be supported with this spring leg on the housing, which is preferably closed on its underside opposite the housing opening. In this case, a housing opening in the sense of the present invention is understood as meaning, in particular, a recess which opens to the contact surface for the heat-releasing element and whose size corresponds approximately to the dimensions of the PTC resistance elements accommodated in the housing. In other words, the housing opening has in plan view approximately the contour of the PTC or resistance elements of the PTC heating element.
Im Hinblick auf eine sichere und einfache Festlegung von mit Kabeln zum elektrischen Anschluss des PTC-Heizelementes an eine elektrische Stromquelle verbundenen Steckerhülsen wird gemäß einer weiteren bevorzugten Ausgestaltung der vorliegenden Erfindung vorgeschlagen, das Gehäuse mit zwei Steckeraufnahmen zu versehen, die jeweils eine Rastöffnung zum Eingriff einer an der Steckerhülse ausgebildeten Rastzunge haben, wobei eine durch Stanzbearbeitung und Umbiegen der Leiterplatte gebildete Kontaktzunge in der Steckeraufnahme angeordnet und somit auf einfache Weise und dauerhaft mit der durch die Rastverbindung unverlierbar in dem Gehäuse gesicherten Steckerhülse elektrisch verbunden ist.With regard to a secure and simple determination of connected with cables for electrical connection of the PTC heating element to an electrical power source plug sockets is proposed according to a further preferred embodiment of the present invention to provide the housing with two connector receptacles, each having a detent opening for engaging a formed on the plug sleeve locking tongue, wherein a contact formed by punching and bending the printed circuit board contact tongue arranged in the connector receptacle and thus in a simple manner and permanently electrically connected to the captive secured by the locking connection in the housing connector sleeve.
Zur einfachen Sicherung der beiden Leiterplatten in dem Gehäuse hat es sich als vorteilhaft erwiesen, die Kontaktzunge zu der jeweiligen Leiterplatte jeweils durch eine außerhalb der Gehäuseöffnung auf der Unterseite ausgesparte Kontaktzungenausnehmung in einer Richtung rechtwinklig zu der Ebene der Leiterplatte aus dem Gehäuse heraus zu führen und durch Umlenken in die Steckeraufnahme in eine Ausrichtung zu bringen, in der sich die Kontaktzunge im Wesentlichen parallel zu der Leiterplatte erstreckt und in die Steckeraufnahme eingeführt ist. Bei dieser Weiterbildung ist als Gehäuseöffnung lediglich diejenige Ausnehmung in dem Gehäuse zu verstehen, die der Aufnahme des oder der PTC-Widerstandselemente dient. So kann beispielsweise eine mit der Grundfläche eines einzigen PTC-Widerstandselementes ausgebildete Gehäuseöffnung an dem Gehäuse ausgespart sein. Die Leiterplatten haben einen an dem PTC-Widerstandselement anliegenden Anlageabschnitt, der an seiner äußeren Umfangsfläche durch einen freigestanzten Anschlussabschnitt überragt ist. Dieser Anschlussabschnitt liegt zunächst in der Ebene des die Leiterplatte bildenden Blechbandes. Ein Teilbereich des Anschlussabschnitts, d.h. das die Kontaktzunge ausbildende vordere Ende des Anschlussabschnitts wird danach um 90° umbogen, so dass die Kontaktzunge im Wesentlichen rechtwinklig von der Ebene des Blechmaterials abragt. In diesem Zustand wird die Leiterplatte mit ihrem Anlageabschnitt in die Öffnung des Gehäuses eingebracht. Die Kontaktzunge durchsetzt hierbei die auf der Unterseite des Gehäuses ausgesparte Kontaktzungenausnehmung und überragt das Gehäuse außenseitig. Danach wird der abragende Abschnitt beispielsweise durch einen Schieber umgeformt und in die Kontaktzungenaufnahme eingebracht, die sich im Wesentlichen parallel zu der Anlagefläche des Anlageabschnitts, d.h. parallel zu der Auflagefläche für das Wärme abgebende Element, erstreckt. Nach diesem Umformschritt ist die jeweilige Leiterbahn sicher in dem Gehäuse aufgenommen. Der Anschlussabschnitt der Leiterplatte wird hierzu vorzugsweise relativ eng von Wandungen des Gehäuses umgeben und somit lagefixiert in dem Gehäuse gehalten.For easy securing of the two circuit boards in the housing, it has proven advantageous to guide the contact tongue to the respective circuit board in each case by a recessed outside the housing opening on the underside Kontaktzungenausnehmung in a direction perpendicular to the plane of the circuit board out of the housing and by deflecting into the connector receptacle to bring in an orientation in which the contact tongue extends substantially parallel to the circuit board and is inserted into the connector receptacle. In this development is to be understood as a housing opening only that recess in the housing, which serves to receive the PTC or the resistance elements. For example, a housing opening formed with the base area of a single PTC resistance element can be recessed on the housing. The printed circuit boards have an abutting on the PTC resistor element abutment portion, which is surmounted on its outer peripheral surface by a free-punched connection portion. This connection portion is initially in the plane of the circuit board forming sheet metal strip. A partial region of the connection section, ie the front end of the connection section forming the contact tongue, is then bent over by 90 °, so that the contact tongue protrudes substantially at a right angle from the plane of the sheet material. In this state, the circuit board is introduced with its contact portion in the opening of the housing. The contact tongue passes through the recessed on the underside of the housing Kontaktzungenausnehmung and extends beyond the housing on the outside. Thereafter, the projecting portion is formed, for example, by a slider and introduced into the contact tongue receptacle, which extends substantially parallel to the contact surface of the abutment portion, ie parallel to the support surface for the heat-emitting element. After this forming step, the respective conductor track is securely received in the housing. For this purpose, the connection section of the printed circuit board is preferably surrounded relatively tightly by walls of the housing and thus held fixed in position in the housing.
Weitere Vorteile und Einzelheiten der vorliegenden Erfindung ergeben sich aus der nachfolgenden Beschreibung in Verbindung mit der Zeichnung. In dieser zeigen:
- Fig. 1
- eine Draufsicht auf die Oberseite eines Ausführungsbeispiels eines PTC-Heizelementes bei abgenommener Heizplatte;
- Fig. 2
- eine perspektivische Draufsicht auf die Unterseite des in
Fig. 1 dargestellten Ausführungsbeispiels, - Fig. 3
- eine Längsschnittansicht entlang der Linie III-III gemäß der Darstellung in
Fig. 1 bei aufgelegter Heizplatte und - Fig. 4
- eine Längsschnittansicht entlang der Linie IV-IV gemäß der Darstellung in
Fig. 1 bei aufgelegter Heizplatte.
- Fig. 1
- a plan view of the top of an embodiment of a PTC heating element with removed heating plate;
- Fig. 2
- a perspective top view of the underside of in
Fig. 1 illustrated embodiment, - Fig. 3
- a longitudinal sectional view along the line III-III as shown in FIG
Fig. 1 with the heating plate and - Fig. 4
- a longitudinal sectional view along the line IV-IV as shown in FIG
Fig. 1 with the heating plate on.
Das in der Zeichnung dargestellte Ausführungsbeispiel ist ein PTC-Heizelement für die Erwärmung bzw. das Warmhalten von Babynahrung und wird innerhalb eines spritzgegossenen, nicht dargestellten Gehäuses aufgenommen, welches die Halterung für das die Babynahrung enthaltende Gefäß (Flasche, Glas) ausbildet. Im Boden dieses spritzgegossenen Gehäuses befindet sich das in der Zeichnung gezeigte PTC-Heizelement. Dieses bildet mit seiner Heizplatte 2 die Auflage für das die Babynahrung aufnehmende Gefäß, welches unmittelbar auf der Heizplatte 2 steht.The embodiment shown in the drawing is a PTC heating element for heating or keeping warm baby food and is housed within an injection-molded, not shown housing, which forms the holder for the baby food containing vessel (bottle, glass). In the bottom of this injection-molded housing is the PTC heating element shown in the drawing. This forms with its
Das in der Zeichnung gezeigte Ausführungsbeispiel hat ein Gehäuse 4, welches im Wesentlichen aus drei getrennten Segmenten besteht. So hat das Gehäuse einen Aufnahmeabschnitt 6 zur Aufnahme eines Wärme erzeugenden Schichtaufbaus, umfassend eine untere Leiterplatte 8, ein dazwischen angeordnetes PTC-Heizelement 10 mit im Wesentlichen kreisrunder Form und eine obere Leiterplatte 12 (vgl.
An gegenüber liegenden Seiten sind durch das Gehäuse 4 von der Öffnung 14 abgehende, sich zu der Öffnung 14 öffnende Leiterplattenkammern 18, 20 vorgesehen, deren Boden geringfügig gegenüber dem Boden der Öffnung 14 angehoben sein kann.On opposite sides of the opening 14 from the
Das Gehäuse 4 bildet neben dem Aufnahmeabschnitt 6 zwei Steckeraufnahmen 22, 24 aus. Diese Steckeraufnahmen 22, 24 sind gegenüber der in
Wie die Schnittdarstellung gemäß
Die Steckeraufnahmen 22, 24 werden unterseitig durch einen Steg 50 begrenzt, der in Einführrichtung der Steckerhülse 30 im vorderen Bereich der Steckeraufnahme 22 bzw. 24 vorgesehen ist und die zwei Anlagestege 43 der jeweiligen Steckeraufnahmen 22, 24 verbindet. In Einführrichtung dahinter weisen die Steckeraufnahmen 22, 24 jeweils eine Kontaktzungeneinführöffnung 52 auf, die aus Gründen einer spritzgießtechnischen Herstellung des Gehäuses 4 mit der Breite der Steckeraufnahme 22 bzw. 24 ausgebildet ist (vgl.
Wie der
Bei einer alternativen Ausgestaltung, die in dem gezeigten Ausführungsbeispiel verwirklicht ist, weist die untere Leiterplatte 8 einteilig daran ausgebildete Federvorsprünge 56 auf (vgl.
Die Zapfen 54 überragen die Anlagefläche 28 mit einer Höhe, die von zwei Faktoren abhängig ist: zum einen dienen die Zapfen der Halterung des vormontierten Schichtaufbaus. Aufgrund der Kraft der Federvorsprünge 56 wird der Schichtaufbau zur guten Wärmeübertragung an die Heizplatte 2 nach der Montage gegen die Innenseite der Heizplatte 2 gedrückt. Diese bedeutet, dass vor der fertigen Montage, d.h. vor der Befestigung der Heizplatte 2 an dem Gehäuse 4 der Schichtaufbau die Anlagefläche 28 überragt. Die auf dem Umfang verteilt um die Öffnung 14 vorgesehenen Zapfen 54 stellen hierbei sicher, dass auch in dieser herausgehobenen Stellung die obere Leiterplatte 12 innerhalb der Umfangsfläche der Öffnung 14 verbleibt.The
Darüber hinaus hat die Heizplatte 2 korrespondierend zu den Zapfen 54 ausgesparte Zapfenausnehmungen 58, die nach dem Auflegen der Heizplatte 2 auf die Anlagefläche 28 von den Zapfen 54 hintergriffen sind. Hierzu können die Zapfen 54 die Zapfenausnehmungen 58 hintergreifende Rastvorsprünge aufweisen. Bei dem gezeigten Ausführungsbeispiel sind die Zapfen 54 nach der Montage der Heizplatte 2 durch Heißprägen mit einer Verdickung 60 ausgebildet, die die Zapfenausnehmung 58 überragt. Die Kontaktzungenbasis 64 liegt innerhalb der Leiterplattenkammern 18 bzw. 20; die Kontaktzunge 66 ist elektrisch mit der Steckerhülse 30 verbunden.In addition, the
Zur Montage wird zunächst die Kontaktzunge 66 am Übergang zu der Kontaktzungenbasis 64 um 90° aus der Ebene des Blechmaterials heraus gebogen. Eine hierdurch gebildete Abkantung 68 ist derart bemessen, dass diese bei in die Öffnung 14 eingebrachte Leiterplatte 8, 12 in Verlängerung der schlitzförmigen Kontaktzungenaufnahme 48 liegt. Bei der Montage, d.h. beim Einlegen des Schichtaufbaues in die Öffnung 14, werden die Kontaktzungen 66 dementsprechend durch die Kontaktzungenaufnahmen 48 hindurchgeführt. Danach wird der den Boden 40 überragende Längenabschnitt der Kontaktzungen 66 durch einen Schieber um 90° in Richtung auf die jeweilige Steckeraufnahme 22 bzw. 24 umgelenkt, so dass das vordere Ende der Kontaktzunge 66 durch die Kontaktzungeneinführöffnung 52 hindurch in die Steckeraufnahme 20, 24 verschwenkt wird. Dieser Umformschritt erfolgt üblicherweise nachdem die Heizplatte 2 mit dem Gehäuse 4 fixiert und somit der Schichtaufbau aufgrund der Vorspannung der Federvorsprünge 56 in der Öffnung 14 höhenmäßig festgelegt ist. In diesem Fall kann die Kontaktzunge 66 zwischen der Kontaktzungenaufnahme 48 und dem Anschlag 44 im Wesentlichen gegen den Boden 40 angelegt werden, ohne dass zu befürchten ist, dass der gewünschte gute Wärmeübergang durch flächiges Anliegen von oberer Leiterplatte 12 und Unterseite der Heizplatte 2 verloren geht. Nach Umbiegen der Kontaktzunge 66 erstreckt sich diese nunmehr im Wesentlichen parallel zu der Ober- bzw. Unterseite 42 des Gehäuses 4, ist im Wesentlichen durch den Boden 40 höhenmäßig festgelegt und aufgrund der Führung innerhalb der Kontaktzungenaufnahme 48 in Breitenrichtung innerhalb bestimmter Grenzen fixiert und so gesichert, dass die Steckerhülse 20 auf die Kontaktzunge 66 aufgeschoben und somit elektrisch kontaktiert werden kann, ohne dass die Kontaktzunge 66 den hierbei wirkenden Reibkräften ausweichen kann.For assembly, the
- 22
- Heizplatteheating plate
- 44
- Gehäusecasing
- 66
- Aufnahmeabschnittreceiving portion
- 88th
- Untere LeiterplatteLower circuit board
- 1010
- PTC-WiderstandselementPTC resistive element
- 1212
- Obere LeiterplatteUpper circuit board
- 1414
- Öffnungopening
- 1616
- Anlageabschnittcontact section
- 1818
- LeiterplattenkammerBoard chamber
- 2020
- LeiterplattenkammerBoard chamber
- 2222
- Steckeraufnahmeplug receptacle
- 2424
- Steckeraufnahmeplug receptacle
- 2626
- Abdeckungcover
- 2828
- Anlageflächecontact surface
- 3030
- Steckerhülseplug sleeve
- 3232
- Oberseitetop
- 3333
- Unterseitebottom
- 3434
- Rastzungecatch tongue
- 3636
- Rastöffnunglatching opening
- 4040
- Bodenground
- 4242
- Unterseitebottom
- 4343
- Anlagestegmooring facilities
- 4444
- Anschlagattack
- 4646
- Aussparungrecess
- 4848
- KontaktzungenaufnahmeContact tongue receiving
- 5050
- Stegweb
- 5252
- KontaktzungeneinführöffnungKontaktzungeneinführöffnung
- 5454
- Zapfenspigot
- 5656
- Federvorsprungkey projection
- 5858
- Zapfenausnehmungpin recess
- 6060
- Verdickungthickening
- 6262
- Anschlussabschnittconnecting section
- 6464
- KontaktzungenbasisContact tongue base
- 6666
- Kontaktzungecontact tongue
- 6868
- Abkantungfold
Claims (9)
- PTC heating element with at least one PTC resistance element (10) that is arranged between two electrically conductive plates (8, 12) in a housing opening (14) of a housing (4) and that lies with initial tension against a heat-emitting element (2) with at least one of the electrically conductive plates (12) as an intermediate layer, wherein said heat-emitting element (2) is held at the housing (4), characterised in that attachment tabs (54) arranged on the edge of the housing opening (14) protrude beyond the housing opening (14) and in that the heat-emitting element (2) has tab cuts (58), with the tabs (54) engaging behind them.
- PTC heating element according to Claim 1, characterised in that the tabs (54) project beyond an upper contact surface (28) for the heat-emitting element (2) at a height that is dimensioned in such a way that the electrically conductive plate (12) that is raised above the contact surface (28) by the initial tension before the placement of the heat-emitting element (2) on to the contact surface (28) does not extend higher than the upper end of the tabs (54).
- PTC heating element according to Claim 1 or 2, characterised in that the tabs (54) have snap-in pins (34) on the ends that engage with the assigned tab cut (58).
- PTC heating element according to Claim 1 or 2, characterised in that the free end of the tabs (54) has a thickening (60) on the end that engages behind the tab cut (58), wherein this thickening (60) is formed by means of surface-fusing the tab (54).
- PTC heating element according to one of the preceding claims, characterised in that the electrically conductive plate (8) lying opposite the heat-emitting element (2) has at least one spring element (56) formed as a single piece on it by means of stamping processing and bending, and that this spring element (56) is supported on the housing (4).
- PTC heating element according to one of the preceding claims, characterised in that the housing opening (14) is closed on the underside (42) lying opposite the heat-emitting element (2).
- PTC heating element according to one of the preceding claims, characterised in that the housing (4) forms two plug holders (22, 24), each of which has a locking opening (36) for
engaging with a snap-in pin (34) formed from a plug socket (30) and in that a contact stud (66) formed by stamping processing and bending of the electrically conductive plate is arranged in the plug holder (22, 24). - PTC heating element according to Claim 7, characterised in that the contact stud (66) is guided out of the housing (4) through a contact stud holder (48) cut on the underside outside the housing opening (14) in a direction essentially at right angles to the plane of the electrically conductive plate (8, 12) and is introduced into the plug holder (22, 24) by means of being deviated into the plug holder (22, 24) in a direction running essentially parallel to the plane of the electrically conductive plate (8, 12).
- PTC heating element according to Claim 8, characterised in that the housing (4) has an opening (46, 52) in extension of the contact stud holder (48), which opening (46, 52) projects into the interior of the housing (4), wherein the contact stud (66) lies exposed towards the underside (42) of the housing (4) in this opening (46, 52).
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES06021777T ES2360926T3 (en) | 2006-10-17 | 2006-10-17 | HEATING ELEMENT OF POSITIVE TEMPERATURE COEFFICIENT. |
EP06021777A EP1915034B1 (en) | 2006-10-17 | 2006-10-17 | PTC heating element |
DE502006009401T DE502006009401D1 (en) | 2006-10-17 | 2006-10-17 | PTC heating element |
KR1020070102695A KR20080034780A (en) | 2006-10-17 | 2007-10-11 | Ptc heating element |
JP2007269524A JP2008103726A (en) | 2006-10-17 | 2007-10-16 | Ptc heating element |
CNA2007101642621A CN101166379A (en) | 2006-10-17 | 2007-10-17 | Ptc heating element |
US11/873,624 US7910864B2 (en) | 2006-10-17 | 2007-10-17 | PTC heating element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06021777A EP1915034B1 (en) | 2006-10-17 | 2006-10-17 | PTC heating element |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1915034A1 EP1915034A1 (en) | 2008-04-23 |
EP1915034B1 true EP1915034B1 (en) | 2011-04-27 |
Family
ID=37814302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06021777A Expired - Fee Related EP1915034B1 (en) | 2006-10-17 | 2006-10-17 | PTC heating element |
Country Status (7)
Country | Link |
---|---|
US (1) | US7910864B2 (en) |
EP (1) | EP1915034B1 (en) |
JP (1) | JP2008103726A (en) |
KR (1) | KR20080034780A (en) |
CN (1) | CN101166379A (en) |
DE (1) | DE502006009401D1 (en) |
ES (1) | ES2360926T3 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103945574B (en) * | 2014-03-25 | 2015-11-25 | 常熟市林芝电热器件有限公司 | The film strip of PTC heat generating core automatic assembling machine and electrode slice transfer device structure |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3720807A (en) * | 1972-05-01 | 1973-03-13 | Texas Instruments Inc | Food warming apparatus |
ES2031184T3 (en) * | 1988-07-15 | 1992-12-01 | David & Baader Dbk Spezialfabrik Elektrischer Apparate Und Heizwiderstande Gmbh | RADIATOR |
-
2006
- 2006-10-17 EP EP06021777A patent/EP1915034B1/en not_active Expired - Fee Related
- 2006-10-17 ES ES06021777T patent/ES2360926T3/en active Active
- 2006-10-17 DE DE502006009401T patent/DE502006009401D1/en active Active
-
2007
- 2007-10-11 KR KR1020070102695A patent/KR20080034780A/en not_active Application Discontinuation
- 2007-10-16 JP JP2007269524A patent/JP2008103726A/en active Pending
- 2007-10-17 CN CNA2007101642621A patent/CN101166379A/en active Pending
- 2007-10-17 US US11/873,624 patent/US7910864B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2008103726A (en) | 2008-05-01 |
US7910864B2 (en) | 2011-03-22 |
EP1915034A1 (en) | 2008-04-23 |
KR20080034780A (en) | 2008-04-22 |
DE502006009401D1 (en) | 2011-06-09 |
CN101166379A (en) | 2008-04-23 |
US20080087660A1 (en) | 2008-04-17 |
ES2360926T3 (en) | 2011-06-10 |
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