EP1859486A1 - Pile solaire - Google Patents
Pile solaireInfo
- Publication number
- EP1859486A1 EP1859486A1 EP06707276A EP06707276A EP1859486A1 EP 1859486 A1 EP1859486 A1 EP 1859486A1 EP 06707276 A EP06707276 A EP 06707276A EP 06707276 A EP06707276 A EP 06707276A EP 1859486 A1 EP1859486 A1 EP 1859486A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- solar cell
- cell according
- doped
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000002161 passivation Methods 0.000 claims abstract description 25
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 18
- 229910021424 microcrystalline silicon Inorganic materials 0.000 claims description 17
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 13
- 229910052739 hydrogen Inorganic materials 0.000 claims description 10
- 239000001257 hydrogen Substances 0.000 claims description 10
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 238000004050 hot filament vapor deposition Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 4
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 3
- 229920001940 conductive polymer Polymers 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 claims description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 230000004888 barrier function Effects 0.000 claims 1
- 239000002019 doping agent Substances 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 description 10
- 239000004020 conductor Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000006101 laboratory sample Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the invention relates to a solar cell, in particular a solar cell with improved back contact to achieve a higher efficiency.
- the back contacts are formed, for example, as a continuous metal layer, then recombination losses at the metal-semiconductor interface lead to a drop in the efficiency. For this reason, the back contacts are usually formed as point or line contacts, which are preferably applied by screen printing.
- Full-surface back contacts also produce strong mechanical stresses when cooling on thin silicon wafers, which in turn leads to breakage and to difficult processability.
- Screen printing processes are also relatively expensive and require temperatures of at least about 400 ° C. Such high temperatures mean that the problem with thin wafers is that they break easily in the process and the production yield is thus substantially reduced.
- the special screen printing pastes are a major cost factor in solar cell production and, moreover, their composition and the reproducibility of the contact formation are difficult to control.
- a solar cell is known in which the base material is provided with a p-doped and at the back with a passivation layer of highly doped material p +. There's a layer on it transparent, electrically conductive material, such as ITO (indium tin oxide) applied, on which the electrodes are applied as a point or line electrode.
- the transparent, electrically conductive layer can be produced by a sputtering process, whereby a maximum temperature of 200 0 C is not exceeded.
- the electrically conductive translucent layer of ITO or the like is applied on both sides of the substrate in order to avoid bending stresses that may lead to buckling of the cell (See Patent Abstract of Japan, JP-A-20031977943).
- the invention is therefore based on the object to provide an improved solar cell, in which a good back contact is guaranteed even when using p-doped material.
- the solar cell should be as inexpensive to produce and have the highest possible efficiency.
- This object is achieved by a solar cell having a base layer with a first doping, which forms a boundary layer with a front layer having a second doping of opposite polarity (E-center), with at least one front contact and at least one back contact, wherein between the base layer and the back contact at least one passivation layer and a tunnel contact layer are arranged.
- a tunnel contact layer makes it possible to achieve a particularly high-quality contacting with an electron conductor, for example with a metal or with a transparent conductor, such as zinc oxide or ITO, even when using p-doped material as the base material.
- the passivation layer consists of doped material of the same polarity as the base layer.
- the back contact as a metallic surface contact, without the efficiency is thereby deteriorated.
- a transparent electrically conductive layer is provided in an advantageous development of the invention between the tunnel contact layer and the back contact, which preferably consists of zinc oxide, indium tin oxide or a conductive polymer. This layer is also used for Improvement of the reflection on the back, whereby the efficiency is increased.
- the back contact and possibly the front contact may be metallic and may consist of aluminum or, in the case of particularly high-quality applications, gold, silver or another metal.
- the passivation layer is preferably made of amorphous silicon (a-Si).
- the tunnel contact layer is preferably made of microcrystalline silicon ( ⁇ c-Si).
- ⁇ c-Si microcrystalline silicon
- it may consist of a first highly doped layer of the same polarity as the base layer followed by a second highly doped layer of opposite polarity.
- the passivation layer is preferably a p-doped layer, followed by the tunnel contact layer in the form of a highly doped p + layer, to which a highly doped n + -. Layer connects.
- the n + layer can then be easily and reliably contacted with an electronically conductive material, such as ZnO.
- High doped in this context means that the layer has a higher doping than the base material, that is the number of doping atoms per unit volume is for example at least one order of magnitude larger.
- the tunnel contact layer waiving an n + -layer with only a first p-layer, followed by a second pH-layer, which preferably consists both of ⁇ c-Si.
- a thin undoped (intrinsic) layer of a-Si is arranged between the passivation layer and the base layer.
- This intrinsic layer serves as a buffer between the wafer and the passivation layer. In combination, this results in a particularly good passivation.
- At least the passivation layer, the tunnel contact layer or the intrinsic layer contains hydrogen.
- the base material of the solar cell is preferably made of monocrystalline silicon, if a particularly high efficiency is desired.
- the base material may also consist of multicrystalline silicon (mc-Si).
- the light-side structure of the solar cell can be designed in any manner as known in principle in the prior art.
- metallic front contacts can be used, while the light-side surface of the solar cell is made with a reflection-reducing passivation layer such as SiO 2 . It is understood that the passivation layer is interrupted in the region of the front contacts.
- the light-side structure of the solar cell as generally known in the art as HeteroÜganggang, for example with a-Si emitter, at low process temperature of at most about 250 0 C, preferably of at most 200 0 C are performed.
- the layers of the solar cell are preferably applied by the thin-film method, in particular by plasma CVD, by sputtering or by catalytic CVD (Hot Wire CVD).
- the process temperature in the entire production of the solar cell can be limited to temperatures of at most about 250 ° C., preferably of at most 200 ° C. In this way, bending, buckling and fracture of the solar cell can be avoided even when using thin substrate material.
- FIGURE 1 shows a partial section through a solar cell according to the invention in a simplified representation.
- FIG. 1 shows a solar cell according to the invention is shown schematically in cross-section and designated by numeral 10 in total.
- the solar cell 10 has a p-doped base layer 12 of monocrystalline silicon.
- an n-doped silicon layer 14 is applied, which forms an interface layer (pn junction) with the base layer 12.
- the n-doped silicon layer 14 is preferably structured such that the reflections are reduced.
- a contact on the front side with front contacts 18 can be made, for example, by means of aluminum contacts.
- clocks are made, which are preferably contacted in each case over a region 20 with a highly doped n + layer.
- the front layer 14 is passivated by a passivation layer 16, which may be made of SiO 2 , for example.
- the base layer 12 is followed on the back by a thin intrinsic layer 22 of amorphous silicon.
- the intrinsic layer 22 is followed by a passivation layer 24, which is preferably formed as a p-doped a-Si layer.
- This layer 24 is followed by another layer 26 of microcrystalline silicon ⁇ c-Si, which is highly doped (p +) ⁇
- ⁇ c-Si layer 26 another layer 28 of microcrystalline silicon ⁇ c-Si connects, which is also highly doped, but with the opposite polarity (n +).
- the two layers 26, 28 of ⁇ c-Si with p + doping, followed by n + doping together form a tunnel contact layer.
- n + -doped ⁇ c-Si layer 28 is followed by a zinc oxide layer 30, on which the back contact layer 32 is applied as a continuous metallic layer, which may be made of aluminum, for example.
- the layers 22 to 28 preferably contain hydrogen in a proportion of between 1 and 20 at.%. This layer construction ensures a very good contacting of the base layer 12 with an electron conductor, although the base layer 12 is a weakly p-doped layer. This is achieved in particular by the tunnel contact layer 26, 28, which is formed from the microcrystalline p + layer followed by the microcrystalline n + layer. Alternatively, the tunnel contact layer 26, 28 may consist of a first p-doped a-Si or ⁇ c-Si layer followed by a pH-doped microcrystalline ⁇ c-Si layer with equally good results.
- the layer thickness of the only optionally used intrinsic a-Si layer 22 is preferably between about 5 and 20 nm, preferably about 10 nm.
- the layer thickness of the passivation layer 24 is preferably between about 20 and 60 nm, preferably about 40 nm.
- the layer thickness of the microcrystalline layer 26 is preferably between about 5 and 25 nm, in particular about 10 nm.
- the layer thickness of the microcrystalline layer 28 is preferably between about 1 and 15 nm, in particular about 5 nm.
- the thickness of the transparent electrically conductive layer of ZnO, ITO or the like is preferably between about 20 and 150 nm, in particular between about 40 and 120 nm, for example about 80 nm.
- the rear contact layer 32 made of aluminum may have a thickness between about 0.5 and 5 ⁇ m, for example 1 ⁇ m.
- the electrically conductive layer 30 of (in the wavelength range of interest) transparent material, such as ZnO, improves the reflection of the back contact layer 32 and thus the efficiency.
- ZnO transparent material
- the application of the layers to the base layer takes place by means of a suitable thin-layer method, such as plasma enhanced CVD (PECVD), sputtering, hot-wire CVD etc.
- PECVD plasma enhanced CVD
- sputtering sputtering
- hot-wire CVD hot-wire CVD
- the preferred hydrogen diffusion within the layers 22 to 28 is effected by a final temperature increase up to about 200 ° C.
- the intrinsic a-Si layer was deposited in PECVD with silane (SiH 4 ) and hydrogen at a plasma frequency of 13.56 MHz and a pressure of 200 mTorr and a power of 4 watts.
- the doped a-Si layer was fabricated with silane, hydrogen and diborane (B 2 H 6 ), alternatively with phosphine (PH 4 ) at 80 MHz plasma frequency and a pressure of 400 mTorr and a power of 20 watts.
- a wire temperature of about 1700 0 C and a pressure of 100 mTorr is used. All depositions are carried out in high or ultra-high vacuum systems.
- the back contact according to the invention is suitable for all silicon solar cells, regardless of the type of contact used on the front.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005013668A DE102005013668B3 (de) | 2005-03-14 | 2005-03-14 | Solarzelle |
PCT/EP2006/001752 WO2006097189A1 (fr) | 2005-03-14 | 2006-02-25 | Pile solaire |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1859486A1 true EP1859486A1 (fr) | 2007-11-28 |
Family
ID=36685778
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06707276A Withdrawn EP1859486A1 (fr) | 2005-03-14 | 2006-02-25 | Pile solaire |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080251117A1 (fr) |
EP (1) | EP1859486A1 (fr) |
JP (1) | JP2008533729A (fr) |
KR (1) | KR20070119702A (fr) |
CN (1) | CN101142689A (fr) |
DE (1) | DE102005013668B3 (fr) |
WO (1) | WO2006097189A1 (fr) |
Families Citing this family (54)
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KR100964153B1 (ko) * | 2006-11-22 | 2010-06-17 | 엘지전자 주식회사 | 태양전지의 제조방법 및 그에 의해 제조되는 태양전지 |
US8273983B2 (en) * | 2007-12-21 | 2012-09-25 | Hewlett-Packard Development Company, L.P. | Photonic device and method of making same using nanowires |
DE102008006987A1 (de) * | 2008-01-31 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Strahlungsempfänger und Verfahren zur Herstellung eines Strahlungsempfängers |
US7964499B2 (en) * | 2008-05-13 | 2011-06-21 | Samsung Electronics Co., Ltd. | Methods of forming semiconductor solar cells having front surface electrodes |
KR20100059410A (ko) | 2008-11-26 | 2010-06-04 | 삼성전자주식회사 | 태양 전지 및 이의 제조 방법 |
DE102008054756A1 (de) * | 2008-12-16 | 2010-06-24 | Q-Cells Se | Photovoltaikelement |
US8283557B2 (en) * | 2009-03-10 | 2012-10-09 | Silevo, Inc. | Heterojunction solar cell based on epitaxial crystalline-silicon thin film on metallurgical silicon substrate design |
US20100243042A1 (en) * | 2009-03-24 | 2010-09-30 | JA Development Co., Ltd. | High-efficiency photovoltaic cells |
EP2422373B1 (fr) * | 2009-04-21 | 2024-06-05 | Tetrasun, Inc. | Méthode de fabrication de structures de cellules solaires à efficacité élevée |
US8502191B2 (en) * | 2009-05-12 | 2013-08-06 | University Of Tsukuba | Semiconductor device, manufacturing method therefor, and solar cell |
US8614115B2 (en) * | 2009-10-30 | 2013-12-24 | International Business Machines Corporation | Photovoltaic solar cell device manufacture |
US9012766B2 (en) | 2009-11-12 | 2015-04-21 | Silevo, Inc. | Aluminum grid as backside conductor on epitaxial silicon thin film solar cells |
TWI514608B (zh) * | 2010-01-14 | 2015-12-21 | Dow Global Technologies Llc | 具曝露式導電柵格之防溼光伏打裝置 |
EP2534693A2 (fr) * | 2010-02-09 | 2012-12-19 | Dow Global Technologies LLC | Dispositifs photovoltaïques résistants à l'humidité possédant une adhérence améliorée d'un film barrière |
DE102010009795B4 (de) | 2010-03-01 | 2014-05-15 | Von Ardenne Anlagentechnik Gmbh | Verfahren und Vorrichtung zur Herstellung von metallischen Rückkontakten für waferbasierte Solarzellen |
US9214576B2 (en) | 2010-06-09 | 2015-12-15 | Solarcity Corporation | Transparent conducting oxide for photovoltaic devices |
KR101203623B1 (ko) | 2010-06-18 | 2012-11-21 | 엘지전자 주식회사 | 태양 전지 및 그 제조 방법 |
US9773928B2 (en) | 2010-09-10 | 2017-09-26 | Tesla, Inc. | Solar cell with electroplated metal grid |
US9800053B2 (en) | 2010-10-08 | 2017-10-24 | Tesla, Inc. | Solar panels with integrated cell-level MPPT devices |
JP2014116327A (ja) * | 2011-03-31 | 2014-06-26 | Sanyo Electric Co Ltd | 光電変換装置 |
US9054256B2 (en) | 2011-06-02 | 2015-06-09 | Solarcity Corporation | Tunneling-junction solar cell with copper grid for concentrated photovoltaic application |
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US9865754B2 (en) | 2012-10-10 | 2018-01-09 | Tesla, Inc. | Hole collectors for silicon photovoltaic cells |
KR101276884B1 (ko) | 2012-10-17 | 2013-06-19 | 엘지전자 주식회사 | 태양 전지 및 그 제조 방법 |
US9281436B2 (en) | 2012-12-28 | 2016-03-08 | Solarcity Corporation | Radio-frequency sputtering system with rotary target for fabricating solar cells |
US9219174B2 (en) | 2013-01-11 | 2015-12-22 | Solarcity Corporation | Module fabrication of solar cells with low resistivity electrodes |
US9412884B2 (en) | 2013-01-11 | 2016-08-09 | Solarcity Corporation | Module fabrication of solar cells with low resistivity electrodes |
US10074755B2 (en) | 2013-01-11 | 2018-09-11 | Tesla, Inc. | High efficiency solar panel |
EP4092764A1 (fr) | 2013-04-03 | 2022-11-23 | Lg Electronics Inc. | Cellule solaire |
US9624595B2 (en) | 2013-05-24 | 2017-04-18 | Solarcity Corporation | Electroplating apparatus with improved throughput |
CN103413838B (zh) * | 2013-07-23 | 2016-12-07 | 新奥光伏能源有限公司 | 一种晶体硅太阳电池及其制备方法 |
EP2922101A1 (fr) * | 2014-03-19 | 2015-09-23 | Institut für Solarenergieforschung GmbH | Interfaces de Si/polymère conducteur au niveau de la partie arrière de cellules solaires |
US10309012B2 (en) | 2014-07-03 | 2019-06-04 | Tesla, Inc. | Wafer carrier for reducing contamination from carbon particles and outgassing |
KR102219804B1 (ko) | 2014-11-04 | 2021-02-24 | 엘지전자 주식회사 | 태양 전지 및 그의 제조 방법 |
CN104409571A (zh) * | 2014-11-21 | 2015-03-11 | 广西智通节能环保科技有限公司 | 一种选择性发射极太阳能电池的制作方法 |
CN104465870A (zh) * | 2014-11-21 | 2015-03-25 | 广西智通节能环保科技有限公司 | 一种太阳能电池发射极及其制作方法 |
CN104465803A (zh) * | 2014-11-21 | 2015-03-25 | 广西智通节能环保科技有限公司 | 一种背发射极异质结太阳电池及制备方法 |
CN104393059A (zh) * | 2014-11-21 | 2015-03-04 | 广西智通节能环保科技有限公司 | 一种太阳能电池 |
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CN104465873A (zh) * | 2014-12-03 | 2015-03-25 | 苏州贝多环保技术有限公司 | 一种选择性发射极太阳电池及其制作方法 |
US9899546B2 (en) | 2014-12-05 | 2018-02-20 | Tesla, Inc. | Photovoltaic cells with electrodes adapted to house conductive paste |
US9947822B2 (en) | 2015-02-02 | 2018-04-17 | Tesla, Inc. | Bifacial photovoltaic module using heterojunction solar cells |
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KR102272433B1 (ko) | 2015-06-30 | 2021-07-05 | 엘지전자 주식회사 | 태양 전지 및 이의 제조 방법 |
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JPH05145095A (ja) * | 1991-11-18 | 1993-06-11 | Sanyo Electric Co Ltd | 光起電力素子 |
JP3469729B2 (ja) * | 1996-10-31 | 2003-11-25 | 三洋電機株式会社 | 太陽電池素子 |
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JP2003197943A (ja) * | 2002-12-05 | 2003-07-11 | Sanyo Electric Co Ltd | 太陽電池素子及び太陽電池モジュール |
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JP4911878B2 (ja) * | 2003-06-26 | 2012-04-04 | 京セラ株式会社 | 半導体/電極のコンタクト構造とこれを用いた半導体素子、太陽電池素子、並びに太陽電池モジュール |
US20050252544A1 (en) * | 2004-05-11 | 2005-11-17 | Ajeet Rohatgi | Silicon solar cells and methods of fabrication |
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2005
- 2005-03-14 DE DE102005013668A patent/DE102005013668B3/de not_active Expired - Fee Related
-
2006
- 2006-02-25 KR KR1020077023662A patent/KR20070119702A/ko not_active Application Discontinuation
- 2006-02-25 JP JP2008501179A patent/JP2008533729A/ja active Pending
- 2006-02-25 CN CNA2006800082132A patent/CN101142689A/zh active Pending
- 2006-02-25 WO PCT/EP2006/001752 patent/WO2006097189A1/fr active Application Filing
- 2006-02-25 EP EP06707276A patent/EP1859486A1/fr not_active Withdrawn
- 2006-02-25 US US11/886,195 patent/US20080251117A1/en not_active Abandoned
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DE102005013668B3 (de) | 2006-11-16 |
JP2008533729A (ja) | 2008-08-21 |
WO2006097189A1 (fr) | 2006-09-21 |
CN101142689A (zh) | 2008-03-12 |
KR20070119702A (ko) | 2007-12-20 |
US20080251117A1 (en) | 2008-10-16 |
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