CN104409570A - 一种晶体硅太阳能电池的制作方法 - Google Patents
一种晶体硅太阳能电池的制作方法 Download PDFInfo
- Publication number
- CN104409570A CN104409570A CN201410673494.XA CN201410673494A CN104409570A CN 104409570 A CN104409570 A CN 104409570A CN 201410673494 A CN201410673494 A CN 201410673494A CN 104409570 A CN104409570 A CN 104409570A
- Authority
- CN
- China
- Prior art keywords
- silicon solar
- layer
- solar energy
- crystal silicon
- energy battery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 229910021419 crystalline silicon Inorganic materials 0.000 title abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 41
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 41
- 239000010703 silicon Substances 0.000 claims abstract description 41
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000002131 composite material Substances 0.000 claims abstract description 18
- 238000007650 screen-printing Methods 0.000 claims abstract description 13
- 229910052738 indium Inorganic materials 0.000 claims abstract description 12
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000009766 low-temperature sintering Methods 0.000 claims abstract description 7
- 229910000807 Ga alloy Inorganic materials 0.000 claims abstract description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 32
- 239000013078 crystal Substances 0.000 claims description 19
- 239000004570 mortar (masonry) Substances 0.000 claims description 15
- 238000002161 passivation Methods 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 239000002019 doping agent Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000002002 slurry Substances 0.000 abstract description 8
- 229910052802 copper Inorganic materials 0.000 abstract description 5
- 239000010949 copper Substances 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 5
- 239000007772 electrode material Substances 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 3
- 238000005245 sintering Methods 0.000 description 11
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 6
- 229910052733 gallium Inorganic materials 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011267 electrode slurry Substances 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Sustainable Development (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Sustainable Energy (AREA)
- Inorganic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Photovoltaic Devices (AREA)
Abstract
本发明公开了一种晶体硅太阳能电池的制作方法,包括以下步骤:步骤1、制备复合浆料:在液态铟镓合金中混合固态铜粉,搅拌均匀后得到复合浆料;步骤2、制备选择性发射极:在硅片正面电极区域进行激光开槽;步骤3、丝网印刷正面电极:用高准丝网印刷工艺在开槽区域印刷步骤1得到的复合浆料;步骤4、低温烧结;步骤5、在基底层和背面接触件之间形成一第一钝化层和一隧道接触层,在钝化层和基底层之间装有一个由a-Si构成的本征层,钝化层由与基底层极性相同的掺杂材料构成。本发明的制作方法采用低熔点铟镓合金和铜粉的混合物作为电极材料,在保持现有电极材料-铜所具有的高导通性和低电阻率的同时,大大降低了成本。
Description
技术领域
本发明涉及太阳能电池技术领域,特别是涉及一种晶体硅太阳能电池的制作方法。
背景技术
晶体硅太阳能电池是一种把光能直接转换成电能的半导体器件。对于整个晶体硅太阳能电池器件而言,结构和性能的体现都需要经过电极采样数据来实现,因此,在晶体硅太阳能电池制作工艺中,当形成PN结后,制备能够将采集的光电流导出的正面电极是该工艺中关键的步骤之一,并且正面电极的均匀性和导通性对产品的性能及成品率有很大影响。
晶体硅太阳能电池正面电极的制备方法可以分为电镀、溅射和丝网印刷。电镀方法制备的电极质量高,但是该方法成本高,并且制备速度慢,另外该方法在电镀过程中可能会使用一些有毒有害的物质,存在一定的安全和健康隐患。溅射方法制备的电极质量也较高,但是,与电镀方法相同,该方法的成本也较高,并且制备速度慢。与电镀和溅射方法相比,尽管丝网印刷方法具有设备简单,操作方便,成本低廉,安全无毒,易形成电极,以及能够得到良好的金属和半导体的欧姆接触,并且表面状态良好的优点。因此,目前工业界多采用丝网印刷方法制备晶体硅太阳能电池的正面电极。
丝网印刷工艺是在高温条件下将特定的金属材质固化,以形成金属半导体的欧姆接触。对于晶体硅太阳能电池的正面电极而言,现有丝网印刷工艺是用胶刮条刮抹印刷用电极浆料,使其透过不绣钢丝网网孔至硅片表面,然后通过烧结形成电极。目前,丝网印刷工艺中一般采用银浆作为晶体硅太阳能电池的正面电极浆料,烧结温度一般在850℃~900℃之间。该工艺存在如下缺点:(1)银作为贵金属,其价格昂贵,而且正面电极材料的用量很大,因此,采用该工艺制备晶体硅太阳能电池正面电极的成本很高;(2)该工艺中的烧结温度较高,存在易损伤硅片、引起产品翘曲度较大,以及能耗高等问题。
发明内容
本发明的目的是针对现有技术的不足,提供一种晶体硅太阳能电池的制作方法,该方法具有成本低,能够低温形成电极的优点。
本发明实现上述技术目的所采用的技术方案为:一种晶体硅太阳能电池的制作方法,包括以下步骤:
步骤1、制备复合浆料:在液态铟镓合金中混合固态铜粉,搅拌均匀后得到复合浆料;
步骤2、制备选择性发射极:在硅片正面电极区域进行激光开槽;
步骤3、丝网印刷正面电极:用高准丝网印刷工艺在开槽区域印刷步骤1得到的复合浆料;
步骤4、低温烧结:在温度为300℃~400℃下进行烧结,形成正面电极。
步骤5、在基底层和背面接触件之间形成一第一钝化层和一隧道接触层,在钝化层和基底层之间装有一个由a-Si构成的本征层,钝化层由与基底层极性相同的掺杂材料构成。
上述复合浆料中,铜的质量百分含量优选为60%~90%。
上述复合浆料中,铜粉的纯度优选为99.99%。
上述复合浆料中,铜粉的粒径优选为2微米~20微米。
上述步骤1中,搅拌温度优选为160℃~220℃,搅拌时间优选为30分钟~300分钟。
上述步骤2中,激光功率优选为10W~20W。
本发明一种晶体硅太阳能电池的制作方法采用低熔点铟镓合金和铜粉的混合物作为复合浆料,在硅片正面电极区域进行激光开槽制备选择性发射电极,然后用高准丝网印刷工艺将复合浆料印刷在开槽区域,最后在温度为300~400℃下进行低温烧结,形成正面电极。与现有技术相比,本发明的制作方法采用低熔点铟镓合金和铜粉的混合物作为电极材料,在保持现有电极材料-铜所具有的高导通性和低电阻率的同时,大大降低了成本;同时,通过低温烧结形成正面电极,克服了现有技术中存在的易损伤硅片、引起产品翘曲度较大,以及能耗高等问题。另外,为了解决铟镓铜合金和半导体的欧姆接触问题,本发明的制作方法用激光在需要印刷区域进行激光刻槽,形成选择性发射极,在铜粉混合铟镓的复合浆料固化后能在低温条件下与半导体形成欧姆接触。因此,本发明的制作方法能够提高产品质量,降低制造成本,在晶体硅太阳能电池领域具有重要的产业化前景。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其它附图。
图1是本发明实施例1中硅片表面的激光开槽区域。
具体实施方式
以下通过特定的具体实例说明本发明的实施方式,本领域技术人员可由本说明书所揭露的内容轻易地了解本发明的其他优点与功效。本发明还可以通过另外不同的具体实施方式加以实施或应用,本说明书中的各项细节也可以基于不同观点与应用,在没有背离本发明的精神下进行各种修饰或改变。
实施例1:
步骤1、制备铟镓铜浆料:
在160℃的恒温操作台中,在铟镓液态合金中加入粒径为2微米~20微米,纯度为99.99%的铜粉颗粒并搅拌形成粘稠状浆料,按照质量百分比计,在整个混合物中铜粉的含量为60%;
步骤2、制备选择性发射极:
在硅片表面,按图1所示的区域对硅片进行激光刻槽,制得选择性发射极;
步骤3、丝网印刷正面电极:
将选择性发射极制备完成之后的硅片放入HF溶液中除去磷硅玻璃层,然后取出硅片,在180℃的温度下,将复合浆料精准印刷在图1所示的激光刻槽区域上;
步骤4、低温烧结:
将硅片放入烧结炉,在氮气保护下进行快速烧结,烧结温度为300℃,烧结时间为8秒,然后将硅片取出并自然冷却到室温,硅片表面即得到正面电极。
实施例2:
步骤1、制备铟镓铜浆料:
在220℃的恒温操作台中,在铟镓液态合金中加入粒径为2微米~20微米、纯度为99.99%的铜粉颗粒并搅拌形成粘稠状浆料,按照质量百分比计,在整个混合物中铜粉的含量为80%;
步骤2、制备选择性发射极:
在硅片表面,按图1所示的区域对硅片进行激光刻槽,制得选择性发射极;
步骤3、丝网印刷正面电极:
将选择性发射极制备完成之后的硅片放入HF溶液中除去磷硅玻璃层,然后取出硅片,在180℃的温度下,将复合浆料精准印刷在图1所示的激光刻槽区域上;
步骤4、低温烧结:
将硅片放入烧结炉,在氮气保护下进行快速烧结,烧结温度为400℃,烧结时间为8秒,然后将硅片取出并自然冷却到室温,硅片表面即得到正面电极。
步骤5、背面电极形成:
在基底层和背面接触件之间形成一第一钝化层和一隧道接触层,在钝化层和基底层之间装有一个由a-Si构成的本征层,钝化层由与基底层极性相同的掺杂材料构成。
Claims (5)
1.一种晶体硅太阳能电池的制作方法,其特征是:包括以下步骤:
步骤1、制备复合浆料:在液态铟镓合金中混合固态铜粉,搅拌均匀后得到复合浆料;
步骤2、制备选择性发射极:在硅片正面电极区域进行激光开槽;
步骤3、丝网印刷正面电极:用高准丝网印刷工艺在开槽区域印刷步骤1得到的复合浆料;
步骤4、低温烧结:在温度为300~400℃下进行烧结,形成正面电极;
步骤5、在基底层和背面接触件之间形成一第一钝化层和一隧道接触层,在钝化层和基底层之间装有一个由a-Si构成的本征层,钝化层由与基底层极性相同的掺杂材料构成。
2.根据权利要求1所述的晶体硅太阳能电池的制作方法,其特征是:所述的复合浆料中,铜粉的质量百分含量为60%~90%。
3.根据权利要求1或2所述的晶体硅太阳能电池的制作方法,其特征是:所述的铜粉的粒径为2微米~20微米。
4.根据权利要求1或2所述的晶体硅太阳能电池的制作方法,其特征是:所述的步骤1中,搅拌温度为160℃~220℃,搅拌时间为30分钟~300分钟。
5.根据权利要求1或2所述的晶体硅太阳能电池的制作方法,其特征是:所述的步骤2中,激光功率为10W~20W。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410673494.XA CN104409570A (zh) | 2014-11-21 | 2014-11-21 | 一种晶体硅太阳能电池的制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410673494.XA CN104409570A (zh) | 2014-11-21 | 2014-11-21 | 一种晶体硅太阳能电池的制作方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104409570A true CN104409570A (zh) | 2015-03-11 |
Family
ID=52647183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410673494.XA Pending CN104409570A (zh) | 2014-11-21 | 2014-11-21 | 一种晶体硅太阳能电池的制作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104409570A (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107039546A (zh) * | 2017-03-03 | 2017-08-11 | 广东爱康太阳能科技有限公司 | P型perc双面太阳能电池及其制备方法、组件和系统 |
CN107093637A (zh) * | 2017-03-03 | 2017-08-25 | 广东爱康太阳能科技有限公司 | P型perc双面太阳能电池及其制备方法、组件和系统 |
CN110518084A (zh) * | 2019-08-06 | 2019-11-29 | 苏州腾晖光伏技术有限公司 | 一种镓局域掺杂的perc电池及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080251117A1 (en) * | 2005-03-14 | 2008-10-16 | Markus Schubert | Solar Cell |
CN102185020A (zh) * | 2011-03-29 | 2011-09-14 | 中国科学院宁波材料技术与工程研究所 | 一种晶体硅太阳能电池正面电极的制作方法 |
CN102456752A (zh) * | 2010-11-04 | 2012-05-16 | Q-电池公司 | 太阳能电池及太阳能电池制造方法 |
-
2014
- 2014-11-21 CN CN201410673494.XA patent/CN104409570A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080251117A1 (en) * | 2005-03-14 | 2008-10-16 | Markus Schubert | Solar Cell |
CN102456752A (zh) * | 2010-11-04 | 2012-05-16 | Q-电池公司 | 太阳能电池及太阳能电池制造方法 |
CN102185020A (zh) * | 2011-03-29 | 2011-09-14 | 中国科学院宁波材料技术与工程研究所 | 一种晶体硅太阳能电池正面电极的制作方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107039546A (zh) * | 2017-03-03 | 2017-08-11 | 广东爱康太阳能科技有限公司 | P型perc双面太阳能电池及其制备方法、组件和系统 |
CN107093637A (zh) * | 2017-03-03 | 2017-08-25 | 广东爱康太阳能科技有限公司 | P型perc双面太阳能电池及其制备方法、组件和系统 |
CN110518084A (zh) * | 2019-08-06 | 2019-11-29 | 苏州腾晖光伏技术有限公司 | 一种镓局域掺杂的perc电池及其制备方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102185020B (zh) | 一种晶体硅太阳能电池正面电极的制作方法 | |
ES2572679T3 (es) | Pasta conductora | |
Qin et al. | Effect of Pb–Te–O glasses on Ag thick-film contact in crystalline silicon solar cells | |
CN102456427A (zh) | 一种导电浆料及其制备方法 | |
CN102623564B (zh) | 一种具有激光开槽正面电极的晶体硅太阳电池的制作方法 | |
CN104409570A (zh) | 一种晶体硅太阳能电池的制作方法 | |
WO2013085961A1 (en) | Conductive silver paste for a metal-wrap-through silicon solar cell | |
WO2017028020A1 (en) | Sinterable composition for use in solar photovoltaic cells | |
CN103484935A (zh) | 一种石英坩埚及其制造方法 | |
CN102522156A (zh) | 一种晶体硅太阳能电池铝硼浆的制备方法 | |
CN105637593A (zh) | 用于太阳能电池导电触点的晶种层 | |
CN108883965A (zh) | 用于硅太阳能电池的金属化浆料中的含卤化物玻璃 | |
Zheng et al. | Effect of the Pb–Te–B–O system glass frits in the front contact paste on the conversion efficiency of crystalline silicon solar cells | |
CN103337277A (zh) | 一种太阳能电池正面电极用导电银浆及其制备方法 | |
CN104681123A (zh) | 太阳能电池背银浆料及其制备方法、太阳能电池及其制备方法 | |
CN102368411A (zh) | 一种铝硼合金粉及晶体硅太阳能电池铝硼浆的制备方法 | |
CN105185873B (zh) | 太阳能电池片生产工艺 | |
CN105637046B (zh) | 包含纳米级化学熔料的导电糊料或导电油墨 | |
CN104752531A (zh) | 一种太阳能电池用电极浆料和太阳能电池背电极及其制备方法 | |
CN108538440A (zh) | 银包覆石墨烯的太阳能电池复合银电极浆料及制备方法 | |
CN103617824B (zh) | 一种高附着力太阳能电池正面银浆及其制备方法 | |
CN105118873A (zh) | 晶体硅太阳能电池正面电极银浆 | |
CN104465869A (zh) | 一种硅太阳能电池的制作方法 | |
CN103426496A (zh) | 太阳能电池用铝背场浆料及其制备方法、太阳能电池片的制备方法以及太阳能电池片 | |
Wang et al. | Effects of screen printing and sintering processing of front side silver grid line on the electrical performances of multi-crystalline silicon solar cells |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150311 |