EP1850010A2 - Pompe centrifuge - Google Patents
Pompe centrifuge Download PDFInfo
- Publication number
- EP1850010A2 EP1850010A2 EP07008052A EP07008052A EP1850010A2 EP 1850010 A2 EP1850010 A2 EP 1850010A2 EP 07008052 A EP07008052 A EP 07008052A EP 07008052 A EP07008052 A EP 07008052A EP 1850010 A2 EP1850010 A2 EP 1850010A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- centrifugal pump
- printed circuit
- heat
- pump according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001035 drying Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 7
- 239000011888 foil Substances 0.000 claims abstract description 5
- 239000004020 conductor Substances 0.000 claims description 32
- 238000001746 injection moulding Methods 0.000 claims description 2
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 description 13
- 238000004804 winding Methods 0.000 description 13
- 210000000078 claw Anatomy 0.000 description 6
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000005415 magnetization Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D13/00—Pumping installations or systems
- F04D13/02—Units comprising pumps and their driving means
- F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D13/0606—Canned motor pumps
- F04D13/064—Details of the magnetic circuit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D13/00—Pumping installations or systems
- F04D13/02—Units comprising pumps and their driving means
- F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D13/0686—Mechanical details of the pump control unit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/5813—Cooling the control unit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/586—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps
- F04D29/5893—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps heat insulation or conduction
Definitions
- the invention relates to a centrifugal pump (100) comprising a pump housing (102) made of plastic material that can be processed by injection molding, comprising a first housing part (103) having a suction nozzle (105) and a discharge nozzle (106) and a second, an electronically commutated DC motor (10) receiving and a containment shell (116) having the second housing part (104), a motor housing part (44) having a drying space, which separates the containment shell (116) from a wet room and in which a stator (40) and an electronics ( 60), and a permanent magnet rotor (50) rotatably supported in the wet space and driving a pump impeller (59) extending into the pump chamber 109, the electronics being mounted at a right angle to an axis (49) and parallel arranged to a bottom (117) of the can (116) aligned printed circuit board (61) and the circuit board (61) in heat-conducting contact with the bottom (117).
- the object of the invention is to cool heat-sensitive electronic components in a simple manner and with high efficiency, with a simple installation of the electronics is guaranteed and only a small number of parts is needed and the space is as small as possible.
- This object is achieved in that one or more tracks (66) of the circuit board (61) in heat-conducting contact with the bottom (117). Since electronic components first conduct the heat generated in them to the immediately adjacent printed conductors, it is particularly effective to bring these printed conductors (66) into heat-conducting contact with a heat sink. As a heat sink here comes the bottom (117) of the split pot (116) in question. As a result, no additional heat sinks are needed.
- At least three transistors as electronic components (70) are thermally coupled to the bottom (117).
- the heat-conducting agent is preferably a heat-conducting foil (67).
- skilletleitfolien are compared to thermal paste easy and reliable to install.
- the printed circuit board (61) has conductor tracks (66) whose cross-sections are selected differently depending on the components (70) or component terminals electrically and thermally connected thereto, the cross-section being larger at a higher heat development to be expected is selected. More heat can be dissipated to the environment via the larger cross sections.
- printed circuit boards are provided with a copper lamination.
- the printed circuit board (61) has printed conductors (66) whose surface area on the printed circuit board is selected differently depending on the components or component connections electrically and thermally connected thereto, wherein the surface area is chosen to be larger with higher expected heat development.
- the inventive direct thermal coupling of the tracks (66) to the bottom (117) is only possible if components do not interfere on the circuit board, so it is provided in an advantageous development of the invention that at least one electronic component to be cooled (70) on the Bottom (117) facing away from the circuit board (61) is arranged and connected via at least one thermally conductive via with the interconnects (66) on the opposite side of the circuit board (61).
- a plurality of plated-through holes are provided. Vias of this type are known from RF technology. There, an electromagnetic shield for high frequencies is maintained through the use of a plurality of small size vias.
- a recess (107) is provided in the bottom (117), which serves as a cutout for an electronic component (70) arranged on the printed circuit board (61) and electrically and thermally connected to printed conductors (66) of the printed circuit board.
- a depression can be realized only in the middle of the bottom (107).
- a direct thermal coupling of the electronic component (70) in the recess (107) would be desirable, but is not provided due to the component tolerances.
- a space-saving electronics is known to be achieved in that electronic components (70) are formed as an SMD component and is soldered to the surface of printed conductors (66) of the circuit board (61) without connecting wires. Due to the low height of the SMD components and the recess (107) can be chosen correspondingly flatter.
- the component (70) is, for example, an integrated circuit (IC) which switches the stator winding (41).
- IC integrated circuit
- FIG. 1 and FIG. 10 show a sectional view through a centrifugal pump 100 according to the invention, comprising a pump housing 102, comprising a first housing part 103 and a second housing part 104 adjoining it.
- a motor housing part 44 delimits a drying space provided by a stator (40) of a motor housing electronically commutated DC motor and its control electronics is filled.
- the motor housing part 44 connects to the second housing part 102 and.
- the first and the second housing part 103, 104 define a wet space 101 of the centrifugal pump.
- the second housing part 104 is formed integrally with a split pot 116 which separates the wet room 101 from a drying room 99.
- the wet room 101 includes an axle 49 which is fixedly installed between a cradle-side axle receptacle 48 and an intake-side axle receptacle 47. A knurling at the axis end prevents rotation of the axis 49 during pump operation.
- a fixed bearing 54 is rotatably mounted, which is pressed in a hollow shaft 51 of the rotor 50.
- the shaft 51 is integral with a pump impeller 59 which includes a plurality of approximately spirally shaped wings 591 for the fluid delivery.
- the end faces of the fixed bearing 54 can be supported axially with the interposition of thrust washers against the gap-side axle receptacle 48 and against the intake-side axle receptacle 47.
- a hollow cylindrical ferrite magnet 52 is adhered to the hollow shaft 51, using an elastic adhesive which is inserted into three, four or five axially parallel grooves 511 formed in the hollow shaft.
- the drying space 99 contains the stator 40 of the electronically commutated DC motor 10, which is formed in the form of a hollow cylindrical stator winding 41, wherein the magnetic field is guided in operation via claw poles in an alternating manner to the periphery of the can 116 and the hollow cylindrical permanent magnet 52 in the wet space 101st interacts.
- the magnetic circuit is closed by a return ring 43, which is connected to the claw poles 42.
- the claw poles 42 are provided by encapsulation with an insulating body 46 which connects the claw poles 42 mechanically but not magnetically.
- the stator 40 has four pole pairs in the present example.
- the Isolierstoff Sciences 46 is geometrically shaped so that the winding wires of the stator winding 41 with Klemmschneid brieflye having contact pins 62 are connected, said Klemmschneid brieflye are mechanically fastened in Isolierstoff emotions 46.
- the contact pins 62 are formed as combination contacts and pressed at its end opposite the clamping cutting contact 63 in a printed circuit board 61 and thereby contacted with this.
- the contact pins 62 contain one or two deformable press-fit zones for this purpose.
- the printed circuit board 61 is equipped with a Hall sensor 71, at least one electronic component 70 for the winding circuit and a PTC for the winding protection, and connector pins 64 for the power supply.
- the motor housing part 44 includes a connector housing 65 in which the connector pins 64 are arranged.
- FIG. 1 An electronic component 70 in the form of an integrated circuit (IC) would hinder this direct coupling to the ground, therefore, a depression 107 is provided in the containment shell in the the component can dip.
- the embodiment of FIG. 1 is not optimized space. However, it is possible to provide in the shaft 51 recesses for the recess 107 of the bottom 117, so that no space loss occurs by the described first embodiment of the invention. The position of the electronic component 70 is then fixed on the PCB center.
- the conductor tracks 66 which serve to make contact with components 70 to be cooled, are dimensioned such that the broadest possible conductor tracks 66 on the printed circuit board 61 are provided for easier heat dissipation.
- the different conductor tracks 66 are of different widths, depending on how much heat is generated in the component connection to be contacted.
- the conductor tracks 66 can be thermally coupled well to the floor 117 over their large area.
- a longitudinal groove is formed as a cooling channel between a bottom 117 of the containment shell 116 and the pump impeller 59, which forces a continuous circulation of the fluid also in the interior of the containment shell 116.
- the printed circuit board is arranged between an end face 45 of the motor housing 44 and the bottom 117 of the can 116 and held in heat-conducting contact with the bottom 117 via the heat-conducting film 67.
- the first housing part 103 has a first flange 130 and a first adjoining ring 131.
- the second housing part 104 has a second flange 140 and a second adjoining ring 141.
- the motor housing part has a third ring 441.
- the second flange 140 and the second ring 141 together form a T-shape in cross-section.
- the first sealing region is located on the radially outer side of the first ring 131 on the first housing part 103.
- Opposite on the radially inner side of the second ring 141 and the second housing part 104 is the second sealing region 144.
- the third sealing region 145 is located on the radially outer side of the third ring 441 and the motor housing part 44.
- the second housing part 104 consists of one for laser light of one wavelength or a wavelength range permeable material.
- the first housing part 103 and the motor housing part 44 are made of a material absorbing the same laser light. This allows a laser beam without heating the transparent material to a seam lead. There, the beam encounters material that absorbs the light and converts it to heat, causing the plastic to melt and intimately bond with the adjacent material.
- the welding apparatus may comprise two individual lasers, one weld being made with one laser beam at a time, or may comprise a single laser whose output beam is split by a beam splitter into two beams, each of which produces one of the welds.
- the laser beams are directed radially onto the pump housing.
- FIG. 2 shows a printed circuit board layout for the printed circuit board 61, with printed conductors 66.
- FIG. 3 shows a partially populated printed circuit board layout of the printed circuit board 61, with the integrated circuit 70 (IC), whose connection contacts are electrically and thermally connected to different conductor track regions 66 having different surface expansions. Next plug pins 64 and contact pins 62 are shown.
- IC integrated circuit
- the first housing part 103 has an intake nozzle 105, a discharge nozzle 106, the first flange 130 and the first ring 131 connects to the first flange and has a first sealing region 133.
- the second housing part comprises the containment shell 116, which has at its bottom 117 a recess 107 for an electronic component, the second flange 140 and the second ring 141, on its inside the second sealing region 144 (not visible here) and the third sealing region 145th having.
- the motor housing part 44 includes the third ring 441, the fourth sealing area 444, and a plug housing 65.
- FIG. 5 shows an exploded view with a stator 40 of a brushless DC motor 10 with a first housing part 103, the second housing part 104 and the motor housing part 44.
- the second housing part carries the stator 40 with a wound on an insulating body 46 stator winding 41st On the Isolierstoff emotions
- There are fasteners 463 consisting of a stop means 464 and a Snap means 465, wherein the stop means 464 and the snap means 465 project from the Isolierstoff emotions 46.
- the fastening means 463 serve for fastening the printed circuit board 61.
- the insulating body 46 has holders 467 which serve exclusively for the mechanical support of plug pins 64.
- the connector pins are electrically connected to the circuit board 61.
- An electrical connection between the printed circuit board 61 and the stator winding 41 is made by contact pins 62, wherein the contact pins 62 on the one hand have insulation displacement contacts and on the other hand Einpressessore.
- FIG. 6 shows an illustration of the assembled stator 40 with the second housing part 104, the insulating body 46, the stops 464 and snap means 465 as fastening means 463 of the printed circuit board 61, the holders 467 for the connector pins 64 and the contact pins 62, which are in the circuit board are pressed and electrically connected via insulation displacement contacts with the stator winding 41.
- FIG. 7 shows an illustration according to FIG. 6 with the printed circuit board 61 hidden, wherein the Hall sensor 71 and the integrated circuit (IC) with the heat conducting film are shown in the correct position.
- the contact pins 62 can be seen, which are inserted in the projections 466 and connected there via the insulation displacement contact with a winding wire, wherein the winding wire is inserted in slots 461 of the projection.
- the stops 464 which are provided in duplicate per fastener 463 and slotted snap means 465 can be seen.
- FIG. 8 and 9 show the stator 40 with annular disk-shaped stator laminations 420, to which claw poles 42 connect, the stator winding 41, the printed circuit board 61, the connector pins 64, which are provided with projections 641, with the help of which they are mechanically fixed in the insulating body hidden here , the integrated circuit (IC) 70 with heat conducting film 67 and the Hall sensor 71.
- the insulation displacement contacts 63 of the contact pins 62 are clearly visible.
- the circuit board 61 has recesses 611, which serve to receive the above-mentioned snap means.
- FIG. 10 shows a second embodiment of the invention, wherein the electronic components are arranged on the side opposite the bottom 117.
- the components 70 are discrete transistors, because the transistors are not located in depressions and can therefore be distributed over the entire printed circuit board.
- a plurality of plated-through holes 612 are provided in the printed circuit board 61.
- the vias form a large conductor cross section and can the Heat on the traces 66 of the components opposite side of the circuit board 61 and forward over this on the floor 117.
- FIG. 11 shows a printed circuit board 61 according to the second embodiment of the invention, with electronic components 70 in the form of transistors, with recesses 611 for receiving the printed circuit board 61, printed conductors 66 and a multiplicity of plated-through holes 612, which occupy the majority of the components 70 resulting heat to the opposite side of the circuit board and there via the traces 66 in the bottom of the centrifugal pump and from there into the pump medium.
- FIG. 12 shows a printed circuit board 61 according to the second embodiment, in which the electronic components 70 face away from the floor.
- a heat-conducting foil is glued onto the conductor tracks.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006021243 | 2006-04-28 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1850010A2 true EP1850010A2 (fr) | 2007-10-31 |
EP1850010A3 EP1850010A3 (fr) | 2010-10-06 |
EP1850010B1 EP1850010B1 (fr) | 2011-11-30 |
Family
ID=38283074
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP07008052A Active EP1850010B1 (fr) | 2006-04-28 | 2007-04-20 | Pompe centrifuge |
Country Status (4)
Country | Link |
---|---|
US (1) | US8282367B2 (fr) |
EP (1) | EP1850010B1 (fr) |
AT (1) | ATE535714T1 (fr) |
DE (1) | DE102007016255B4 (fr) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1865202A2 (fr) * | 2006-06-08 | 2007-12-12 | Oase GmbH | Pompe à eau en particulier pour étangs, aquariums, fontaines et analogues |
EP2450575A1 (fr) * | 2010-11-05 | 2012-05-09 | Pierburg Pump Technology GmbH | Pompe de transport de liquide à moteur électrique pour véhicule automobile |
EP2690763A1 (fr) | 2012-07-26 | 2014-01-29 | Pierburg Pump Technology GmbH | Pompe de transport de liquide à moteur électrique pour véhicule automobile |
EP2200155A3 (fr) * | 2008-12-19 | 2017-03-22 | Bühler Motor GmbH | Moteur à courant continu commuté électroniquement pour une pompe de liquide |
WO2020011316A1 (fr) * | 2018-07-11 | 2020-01-16 | Magna Powertrain Bad Homburg GmbH | Pompe à eau |
WO2021097947A1 (fr) * | 2019-11-21 | 2021-05-27 | 惠州市兴顺和电子有限公司 | Dispositif de séchage rapide pour la production de brunissage de pcb |
WO2021170328A1 (fr) * | 2020-02-28 | 2021-09-02 | Nidec Gpm Gmbh | Pompe à liquide de refroidissement à assemblage optimisé |
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US8297920B2 (en) | 2008-11-13 | 2012-10-30 | Hayward Industries, Inc. | Booster pump system for pool applications |
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US8585378B2 (en) * | 2009-06-25 | 2013-11-19 | Nidec Motor Corporation | Integrated endshield and pump volute for an electric pump and method of forming an electric pump |
DE102010034563A1 (de) * | 2010-08-17 | 2012-02-23 | Bühler Motor GmbH | Elektronisch kommutierter Gleichstrommotor für eine Flüssigkeitspumpe |
JP2012087748A (ja) * | 2010-10-22 | 2012-05-10 | Nippon Densan Corp | 送風ファン |
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US9079128B2 (en) | 2011-12-09 | 2015-07-14 | Hayward Industries, Inc. | Strainer basket and related methods of use |
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DE102020201306A1 (de) * | 2019-10-15 | 2021-04-15 | Vitesco Technologies GmbH | Fluidpumpe |
KR102241110B1 (ko) * | 2019-12-05 | 2021-04-19 | 주식회사 코아비스 | 모터 및 이를 포함한 전동식 펌프 |
DE102020106796A1 (de) | 2020-03-12 | 2021-09-16 | Schwäbische Hüttenwerke Automotive GmbH | Pumpeneinsatz und Pumpenanordnung mit einem solchen Pumpeneinsatz |
DE102020131360A1 (de) * | 2020-11-26 | 2022-06-02 | Fte Automotive Gmbh | Fluidpumpe, insbesondere für eine Komponente eines Antriebsstrangs eines Kraftfahrzeugs |
DE102021001714A1 (de) | 2021-04-01 | 2022-10-06 | KSB SE & Co. KGaA | Kreiselpumpe mit Kühlung der Elektronik innerhalb eines Elektronikgehäuses |
DE102021133692A1 (de) | 2021-12-17 | 2023-06-22 | Pierburg Pump Technology Gmbh | Elektrische Kraftfahrzeug-Fluidpumpe |
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DE19740582A1 (de) * | 1997-09-16 | 1999-03-18 | Pierburg Ag | Elektrische Luftpumpe für eine Vorrichtung zum Spülen einer Aktivkohlefalle |
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JP4034077B2 (ja) * | 2002-01-30 | 2008-01-16 | カルソニックカンセイ株式会社 | キャンドポンプ |
US20060245956A1 (en) * | 2003-07-24 | 2006-11-02 | Lacroix Michael C | Electric fluid pump |
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- 2007-04-20 AT AT07008052T patent/ATE535714T1/de active
- 2007-04-20 EP EP07008052A patent/EP1850010B1/fr active Active
- 2007-04-27 US US11/790,820 patent/US8282367B2/en active Active
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DE69917138T2 (de) | 1998-06-19 | 2005-05-04 | Siemens Vdo Automotive Inc., Chatham | Bürstenloser Pumpenmotor aus trennbarem Blechpaket mit flüssigem Kühlsystem |
US6524083B2 (en) | 2000-04-25 | 2003-02-25 | Aisan Kogyo Kabushiki Kaisha | Magnetic coupling pump |
DE20316535U1 (de) | 2003-07-30 | 2003-12-24 | Industrie Saleri Italo S.P.A., Lumezzane | Elektropumpe für Kühlsysteme |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1865202A2 (fr) * | 2006-06-08 | 2007-12-12 | Oase GmbH | Pompe à eau en particulier pour étangs, aquariums, fontaines et analogues |
EP1865202A3 (fr) * | 2006-06-08 | 2008-06-04 | Oase GmbH | Pompe à eau en particulier pour étangs, aquariums, fontaines et analogues |
EP2200155A3 (fr) * | 2008-12-19 | 2017-03-22 | Bühler Motor GmbH | Moteur à courant continu commuté électroniquement pour une pompe de liquide |
EP2450575A1 (fr) * | 2010-11-05 | 2012-05-09 | Pierburg Pump Technology GmbH | Pompe de transport de liquide à moteur électrique pour véhicule automobile |
WO2012059248A1 (fr) * | 2010-11-05 | 2012-05-10 | Pierburg Pump Technology Gmbh | Pompe de refoulement de liquide pour véhicule automobile entraînée par un moteur électrique |
EP2690763A1 (fr) | 2012-07-26 | 2014-01-29 | Pierburg Pump Technology GmbH | Pompe de transport de liquide à moteur électrique pour véhicule automobile |
WO2020011316A1 (fr) * | 2018-07-11 | 2020-01-16 | Magna Powertrain Bad Homburg GmbH | Pompe à eau |
CN112469901A (zh) * | 2018-07-11 | 2021-03-09 | 翰昂汽车零部件德国有限公司 | 水泵 |
US11506216B2 (en) | 2018-07-11 | 2022-11-22 | Hanon Systems Efp Deutschland Gmbh | Water pump |
WO2021097947A1 (fr) * | 2019-11-21 | 2021-05-27 | 惠州市兴顺和电子有限公司 | Dispositif de séchage rapide pour la production de brunissage de pcb |
WO2021170328A1 (fr) * | 2020-02-28 | 2021-09-02 | Nidec Gpm Gmbh | Pompe à liquide de refroidissement à assemblage optimisé |
Also Published As
Publication number | Publication date |
---|---|
EP1850010B1 (fr) | 2011-11-30 |
US8282367B2 (en) | 2012-10-09 |
US20070286723A1 (en) | 2007-12-13 |
EP1850010A3 (fr) | 2010-10-06 |
ATE535714T1 (de) | 2011-12-15 |
DE102007016255B4 (de) | 2012-11-29 |
DE102007016255A1 (de) | 2007-11-08 |
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