EP1840945A4 - Method of adjusting lighting optical device, lighting optical device, exposure system, and exposure method - Google Patents

Method of adjusting lighting optical device, lighting optical device, exposure system, and exposure method

Info

Publication number
EP1840945A4
EP1840945A4 EP06711853A EP06711853A EP1840945A4 EP 1840945 A4 EP1840945 A4 EP 1840945A4 EP 06711853 A EP06711853 A EP 06711853A EP 06711853 A EP06711853 A EP 06711853A EP 1840945 A4 EP1840945 A4 EP 1840945A4
Authority
EP
European Patent Office
Prior art keywords
optical device
lighting optical
exposure
adjusting
exposure system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP06711853A
Other languages
German (de)
French (fr)
Other versions
EP1840945B1 (en
EP1840945A1 (en
Inventor
Osamu Tanitsu
Hiroyuki Hirota
Koji Shigematsu
Shinichi Kurita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to EP17199654.9A priority Critical patent/EP3358414A1/en
Priority to EP16185285.0A priority patent/EP3153925A3/en
Publication of EP1840945A1 publication Critical patent/EP1840945A1/en
Publication of EP1840945A4 publication Critical patent/EP1840945A4/en
Application granted granted Critical
Publication of EP1840945B1 publication Critical patent/EP1840945B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70191Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/007Optical devices or arrangements for the control of light using movable or deformable optical elements the movable or deformable optical element controlling the colour, i.e. a spectral characteristic, of the light
    • G02B26/008Optical devices or arrangements for the control of light using movable or deformable optical elements the movable or deformable optical element controlling the colour, i.e. a spectral characteristic, of the light in the form of devices for effecting sequential colour changes, e.g. colour wheels
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/06Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the phase of light
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/286Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70091Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/70108Off-axis setting using a light-guiding element, e.g. diffractive optical elements [DOEs] or light guides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70566Polarisation control
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/706843Metrology apparatus
    • G03F7/706849Irradiation branch, e.g. optical system details, illumination mode or polarisation control
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Astronomy & Astrophysics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Polarising Elements (AREA)
  • Microscoopes, Condenser (AREA)
EP06711853.9A 2005-01-21 2006-01-18 Lighting optical device, exposure system, and exposure method Active EP1840945B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP17199654.9A EP3358414A1 (en) 2005-01-21 2006-01-18 Illumination optical apparatus, exposure apparatus and device manufacturing method
EP16185285.0A EP3153925A3 (en) 2005-01-21 2006-01-18 Illumination optical apparatus, exposure apparatus and exposure method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005013576 2005-01-21
JP2005120709 2005-04-19
PCT/JP2006/300584 WO2006077849A1 (en) 2005-01-21 2006-01-18 Method of adjusting lighting optical device, lighting optical device, exposure system, and exposure method

Related Child Applications (3)

Application Number Title Priority Date Filing Date
EP16185285.0A Division EP3153925A3 (en) 2005-01-21 2006-01-18 Illumination optical apparatus, exposure apparatus and exposure method
EP16185285.0A Division-Into EP3153925A3 (en) 2005-01-21 2006-01-18 Illumination optical apparatus, exposure apparatus and exposure method
EP17199654.9A Division EP3358414A1 (en) 2005-01-21 2006-01-18 Illumination optical apparatus, exposure apparatus and device manufacturing method

Publications (3)

Publication Number Publication Date
EP1840945A1 EP1840945A1 (en) 2007-10-03
EP1840945A4 true EP1840945A4 (en) 2010-03-03
EP1840945B1 EP1840945B1 (en) 2016-10-05

Family

ID=36692238

Family Applications (3)

Application Number Title Priority Date Filing Date
EP17199654.9A Withdrawn EP3358414A1 (en) 2005-01-21 2006-01-18 Illumination optical apparatus, exposure apparatus and device manufacturing method
EP06711853.9A Active EP1840945B1 (en) 2005-01-21 2006-01-18 Lighting optical device, exposure system, and exposure method
EP16185285.0A Withdrawn EP3153925A3 (en) 2005-01-21 2006-01-18 Illumination optical apparatus, exposure apparatus and exposure method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP17199654.9A Withdrawn EP3358414A1 (en) 2005-01-21 2006-01-18 Illumination optical apparatus, exposure apparatus and device manufacturing method

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP16185285.0A Withdrawn EP3153925A3 (en) 2005-01-21 2006-01-18 Illumination optical apparatus, exposure apparatus and exposure method

Country Status (10)

Country Link
US (1) US20070146676A1 (en)
EP (3) EP3358414A1 (en)
JP (3) JP4582096B2 (en)
KR (6) KR20170123348A (en)
CN (3) CN101866058B (en)
HK (1) HK1251992A1 (en)
IL (2) IL182064A (en)
SG (1) SG159495A1 (en)
TW (4) TWI423301B (en)
WO (1) WO2006077849A1 (en)

Families Citing this family (121)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101547077B1 (en) 2003-04-09 2015-08-25 가부시키가이샤 니콘 Exposure method and apparatus, and device manufacturing method
TWI569308B (en) 2003-10-28 2017-02-01 尼康股份有限公司 Optical illumination device, exposure device, exposure method and device manufacturing method
TWI385414B (en) * 2003-11-20 2013-02-11 尼康股份有限公司 Optical illuminating apparatus, illuminating method, exposure apparatus, exposure method and device fabricating method
CN101793993B (en) 2004-01-16 2013-04-03 卡尔蔡司Smt有限责任公司 Optical elements, optical arrangement and system
US8270077B2 (en) * 2004-01-16 2012-09-18 Carl Zeiss Smt Gmbh Polarization-modulating optical element
US20070019179A1 (en) * 2004-01-16 2007-01-25 Damian Fiolka Polarization-modulating optical element
TWI395068B (en) 2004-01-27 2013-05-01 尼康股份有限公司 Optical system, exposure device and method of exposure
TWI379344B (en) 2004-02-06 2012-12-11 Nikon Corp Polarization changing device, optical illumination apparatus, light-exposure apparatus and light-exposure method
US7324280B2 (en) 2004-05-25 2008-01-29 Asml Holding N.V. Apparatus for providing a pattern of polarization
WO2006078843A1 (en) * 2005-01-19 2006-07-27 Litel Instruments Method and apparatus for determination of source polarization matrix
TWI423301B (en) * 2005-01-21 2014-01-11 尼康股份有限公司 Illumination optical device, exposure device, exposure method and fabricating method of device
US7375799B2 (en) 2005-02-25 2008-05-20 Asml Netherlands B.V. Lithographic apparatus
JP4612849B2 (en) * 2005-03-01 2011-01-12 キヤノン株式会社 Exposure method, exposure apparatus, and device manufacturing method
CN101253452A (en) * 2005-06-13 2008-08-27 Asml荷兰有限公司 Active reticle tool, lithographic apparatus, and method of patterning devices in a lithographic tool
DE102006031807A1 (en) * 2005-07-12 2007-01-18 Carl Zeiss Smt Ag Lighting device for microlithographic projection exposure system, has depolarizing system to effect polarization direction variation such that light mixer produces light without preferred direction, and including plates of crystal material
KR101459157B1 (en) 2005-10-04 2014-11-07 칼 짜이스 에스엠티 게엠베하 Apparatus and method for influencing the polarization distribution in an optical system, in particular a projection exposure apparatus for microlithography
WO2007055120A1 (en) * 2005-11-10 2007-05-18 Nikon Corporation Lighting optical system, exposure system, and exposure method
JP2007220767A (en) * 2006-02-15 2007-08-30 Canon Inc Exposure apparatus and device manufacturing method
WO2007119514A1 (en) * 2006-04-17 2007-10-25 Nikon Corporation Illuminating optical apparatus, exposure apparatus and device manufacturing method
JP5105316B2 (en) * 2006-07-07 2012-12-26 株式会社ニコン Illumination optical apparatus, exposure apparatus, and device manufacturing method
DE102006032810A1 (en) 2006-07-14 2008-01-17 Carl Zeiss Smt Ag Illumination optics for a microlithography projection exposure apparatus, illumination system with such an illumination optics, microlithography projection exposure apparatus with such an illumination system, microlithographic production method for components and component produced by this method
JP5308638B2 (en) * 2006-07-14 2013-10-09 カール・ツァイス・エスエムティー・ゲーエムベーハー Illumination optical system for microlithographic projection exposure apparatus
JP2008108851A (en) * 2006-10-24 2008-05-08 Canon Inc Illumination apparatus, exposure apparatus having the illumination apparatus, and device manufacturing method
DE102007027985A1 (en) 2006-12-21 2008-06-26 Carl Zeiss Smt Ag Optical system, in particular illumination device or projection objective of a microlithographic projection exposure apparatus
US7952685B2 (en) * 2007-03-15 2011-05-31 Carl Zeiss Smt Ag Illuminator for a lithographic apparatus and method
WO2008119794A1 (en) 2007-04-03 2008-10-09 Carl Zeiss Smt Ag Optical system, in particular illumination device or projection objective of a microlithographic projection exposure apparatus
DE102008011134A1 (en) 2007-04-03 2008-10-09 Carl Zeiss Smt Ag Method for adapting imaging characteristics, involves determining polarization distribution which is presented in predetermined level of illumination equipment of projection lighting device
US7872731B2 (en) * 2007-04-20 2011-01-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7817250B2 (en) 2007-07-18 2010-10-19 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
DE102007043958B4 (en) * 2007-09-14 2011-08-25 Carl Zeiss SMT GmbH, 73447 Illumination device of a microlithographic projection exposure apparatus
US20090091730A1 (en) * 2007-10-03 2009-04-09 Nikon Corporation Spatial light modulation unit, illumination apparatus, exposure apparatus, and device manufacturing method
JPWO2009048051A1 (en) * 2007-10-12 2011-02-17 株式会社ニコン Illumination optical apparatus, and exposure method and apparatus
JP5267029B2 (en) 2007-10-12 2013-08-21 株式会社ニコン Illumination optical apparatus, exposure apparatus, and device manufacturing method
SG185313A1 (en) * 2007-10-16 2012-11-29 Nikon Corp Illumination optical system, exposure apparatus, and device manufacturing method
CN101681123B (en) * 2007-10-16 2013-06-12 株式会社尼康 Illumination optical system, exposure apparatus, and device manufacturing method
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
JP2010004008A (en) * 2007-10-31 2010-01-07 Nikon Corp Optical unit, illumination optical device, exposure apparatus, exposure method and production process of device
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
JP5326259B2 (en) 2007-11-08 2013-10-30 株式会社ニコン Illumination optical apparatus, exposure apparatus, and device manufacturing method
DE102007055062A1 (en) * 2007-11-16 2009-05-28 Carl Zeiss Smt Ag Optical system, and method for characterizing an optical system
DE102007055567A1 (en) 2007-11-20 2009-05-28 Carl Zeiss Smt Ag Optical system
US8040492B2 (en) * 2007-11-27 2011-10-18 Carl Zeiss Smt Gmbh Illumination system of a microlithographic projection exposure apparatus
TW200929333A (en) 2007-12-17 2009-07-01 Nikon Corp Illumination optical system, exposure apparatus, and device manufacturing method
KR20100105649A (en) * 2007-12-17 2010-09-29 가부시키가이샤 니콘 Spatial light modulating unit, illumination optical system, aligner, and device manufacturing method
DE102008003289A1 (en) 2008-01-05 2009-07-09 Carl Zeiss Smt Ag Illumination device for microlithographic projection exposure system for manufacturing e.g. LCD, has manipulator in connection with light mixing bar producing locally varying contribution for polarization distribution in reticle plane
JP2009194107A (en) * 2008-02-13 2009-08-27 Canon Inc Effective light source shape database generation method, optical image calculation method, program, exposure method, and device manufacturing method
US8908151B2 (en) * 2008-02-14 2014-12-09 Nikon Corporation Illumination optical system, exposure apparatus, device manufacturing method, compensation filter, and exposure optical system
WO2009125511A1 (en) * 2008-04-11 2009-10-15 株式会社ニコン Spatial light modulating unit, illumination optical system, aligner, and device manufacturing method
US20090257043A1 (en) * 2008-04-14 2009-10-15 Nikon Corporation Illumination optical system, exposure apparatus, device manufacturing method, and exposure optical system
CN105606344B (en) 2008-05-28 2019-07-30 株式会社尼康 Lamp optical system, means of illumination, exposure device and exposure method
US7796259B2 (en) * 2008-07-09 2010-09-14 Weifour, Inc. Rapid acquisition ellipsometry
DE102008040611A1 (en) * 2008-07-22 2010-01-28 Carl Zeiss Smt Ag Method for modifying a polarization distribution in a microlithographic projection exposure apparatus, and a microlithographic projection exposure apparatus
US20100123883A1 (en) * 2008-11-17 2010-05-20 Nikon Corporation Projection optical system, exposure apparatus, and device manufacturing method
KR101960153B1 (en) 2008-12-24 2019-03-19 가부시키가이샤 니콘 Illumination optical system, exposure apparatus, and device manufacturing method
JP5365641B2 (en) 2008-12-24 2013-12-11 株式会社ニコン Illumination optical system, exposure apparatus, and device manufacturing method
JP4447651B1 (en) * 2009-02-06 2010-04-07 武蔵オプティカルシステム株式会社 Lens adapter
JP5633021B2 (en) * 2009-06-29 2014-12-03 株式会社ブイ・テクノロジー Alignment method, alignment apparatus, and exposure apparatus
TW201102765A (en) 2009-07-01 2011-01-16 Nikon Corp Grinding device, grinding method, exposure device and production method of a device
US20110037962A1 (en) * 2009-08-17 2011-02-17 Nikon Corporation Polarization converting unit, illumination optical system, exposure apparatus, and device manufacturing method
JP5531518B2 (en) * 2009-09-08 2014-06-25 株式会社ニコン Polarization conversion unit, illumination optical system, exposure apparatus, and device manufacturing method
DE102011003035A1 (en) 2010-02-08 2011-08-11 Carl Zeiss SMT GmbH, 73447 Polarization-influencing optical arrangement, as well as optical system of a microlithographic projection exposure apparatus
KR20120116329A (en) 2010-02-20 2012-10-22 가부시키가이샤 니콘 Light source optimizing method, exposure method, device manufacturing method, program, exposure apparatus, lithography system, light source evaluation method, and light source modulation method
US9389519B2 (en) 2010-02-25 2016-07-12 Nikon Corporation Measuring method and measuring apparatus of pupil transmittance distribution, exposure method and exposure apparatus, and device manufacturing method
US20110205519A1 (en) * 2010-02-25 2011-08-25 Nikon Corporation Polarization converting unit, illumination optical system, exposure apparatus, and device manufacturing method
EP2369413B1 (en) * 2010-03-22 2021-04-07 ASML Netherlands BV Illumination system and lithographic apparatus
DE102010029339A1 (en) 2010-05-27 2011-12-01 Carl Zeiss Smt Gmbh Optical system for a microlithographic projection exposure apparatus and microlithographic exposure method
DE102010029905A1 (en) 2010-06-10 2011-12-15 Carl Zeiss Smt Gmbh Optical system of a microlithographic projection exposure apparatus
JP2012004465A (en) 2010-06-19 2012-01-05 Nikon Corp Illumination optical system, exposure equipment, and device manufacturing method
JP5366019B2 (en) 2010-08-02 2013-12-11 株式会社ニコン Transmission optical system, illumination optical system, exposure apparatus, and device manufacturing method
WO2012041339A1 (en) * 2010-09-28 2012-04-05 Carl Zeiss Smt Gmbh Optical system of a microlithographic projection exposure apparatus and method of reducing image placement errors
US20120212722A1 (en) 2011-02-21 2012-08-23 Nikon Corporation Fast Illumination Simulator Based on a Calibrated Flexible Point Spread Function
DE102011076434A1 (en) 2011-05-25 2012-11-29 Carl Zeiss Smt Gmbh Illumination device for use in microlithographic projection exposure system for illuminating mask i.e. reticle, for manufacturing e.g. LCD, has optical element arranged between mirror assembly and pupil plane of illumination device
JP5807761B2 (en) 2011-06-06 2015-11-10 株式会社ニコン Illumination method, illumination optical apparatus, and exposure apparatus
TWI519816B (en) 2011-06-13 2016-02-01 尼康股份有限公司 Illumination optical system, exposure apparatus, and device manufacturing method
DE102011079548A1 (en) 2011-07-21 2012-07-19 Carl Zeiss Smt Gmbh Micro-lithographic projection exposure system for manufacturing e.g. integrated switching circuits, has optical arrangement configured in such manner that modification of maximum value is minimized in comparison with analog system
DE102011079777A1 (en) 2011-07-26 2013-01-31 Carl Zeiss Smt Gmbh Microlithographic exposure method
US9760012B2 (en) 2011-08-04 2017-09-12 Nikon Corporation Illumination device
JP6103467B2 (en) * 2011-10-06 2017-03-29 株式会社ニコン Illumination optical system, illumination method, exposure apparatus, exposure method, and device manufacturing method
DE102011085334A1 (en) 2011-10-27 2013-05-02 Carl Zeiss Smt Gmbh Optical system in a lighting device of a microlithographic projection exposure apparatus
US9732934B2 (en) 2011-10-28 2017-08-15 Nikon Corporation Illumination device for optimizing polarization in an illumination pupil
DE102012200368A1 (en) 2012-01-12 2013-07-18 Carl Zeiss Smt Gmbh Polarization-influencing optical arrangement, in particular in a microlithographic projection exposure apparatus
DE102012200370A1 (en) 2012-01-12 2013-08-01 Carl Zeiss Smt Gmbh Method for manufacturing optical element in microlithographic projection exposure system of optical system for manufacturing microstructured components, involves providing substrate that is made from material and has thickness
DE102012203944A1 (en) 2012-03-14 2013-10-02 Carl Zeiss Smt Gmbh Method for adjusting an optical system of a microlithographic projection exposure apparatus
DE102012205045A1 (en) 2012-03-29 2013-10-02 Carl Zeiss Smt Gmbh Optical system of a microlithographic projection exposure apparatus
WO2013143594A1 (en) 2012-03-29 2013-10-03 Carl Zeiss Smt Gmbh Apparatus and method for compensating a defect of a channel of a microlithographic projection exposure system
DE102012206159A1 (en) 2012-04-16 2013-06-20 Carl Zeiss Smt Gmbh Optical arrangement of illumination device of micro-lithographic projection exposure system, converts input polarization distribution of light into desired output polarization distribution due to Faraday rotation of optical element
DE102012206148A1 (en) 2012-04-16 2013-10-17 Carl Zeiss Smt Gmbh Optical system of a microlithographic projection exposure apparatus, and method for adjusting an optical system
DE102012206154A1 (en) 2012-04-16 2013-06-06 Carl Zeiss Smt Gmbh Optical system for microlithographic projection exposure system utilized for manufacturing e.g. LCD, has mirror elements adjusted independent of each other, and retarding layer arranged on reflection surface of one of mirror elements
CN104395985B (en) 2012-05-02 2018-01-30 株式会社尼康 Evaluation method and improvement method of pupil luminance distribution, illumination optical system and adjustment method thereof, exposure apparatus, exposure method, and device manufacturing method
CN104379296B (en) * 2012-06-15 2016-06-29 三菱电机株式会社 Laser processing device
DE102012212864A1 (en) 2012-07-23 2013-08-22 Carl Zeiss Smt Gmbh Optical system for microlithographic projection exposure system for manufacture of e.g. LCD, has polarization manipulator whose two sub-elements are made of respective optical positive and negative uniaxial crystal materials
DE102012214052A1 (en) 2012-08-08 2014-02-13 Carl Zeiss Smt Gmbh Microlithographic exposure method, and microlithographic projection exposure apparatus
DE102012214198A1 (en) 2012-08-09 2013-05-29 Carl Zeiss Smt Gmbh Illumination device for use in microlithographic projection exposure system, has polarization influencing optical element attached to reflecting side surface so that state of polarization of light beam on beam path is differently influenced
CN102890058B (en) * 2012-09-18 2014-07-30 上海仪电物理光学仪器有限公司 Wavelength conversion mechanism of multi-wavelength polarimeter
DE102012217769A1 (en) 2012-09-28 2014-04-03 Carl Zeiss Smt Gmbh Optical system for a microlithographic projection exposure apparatus and microlithographic exposure method
DE102012223217B9 (en) * 2012-12-14 2014-07-10 Carl Zeiss Smt Gmbh Optical system of a microlithographic projection exposure apparatus
DE102013200137A1 (en) 2013-01-08 2013-11-14 Carl Zeiss Smt Gmbh Microlithographic projection exposure system operating method for manufacturing e.g. LCDs, involves illuminating regions of plane in rotational positions of lambda/two-plate, and adjusting mirror arrangement with light pulses
DE102013204453B4 (en) 2013-03-14 2019-11-21 Carl Zeiss Smt Gmbh Optical system for a microlithographic projection exposure apparatus, microlithographic projection exposure apparatus and method for the microlithographic production of microstructured components
US8922753B2 (en) 2013-03-14 2014-12-30 Carl Zeiss Smt Gmbh Optical system for a microlithographic projection exposure apparatus
JP2015025977A (en) * 2013-07-26 2015-02-05 日本精機株式会社 Scanning projection device
JP5534276B2 (en) * 2013-08-23 2014-06-25 株式会社ニコン Illumination optical system, exposure apparatus, and device manufacturing method
US20150294037A1 (en) * 2014-04-11 2015-10-15 General Electric Company System and method for automated substation design and configuration
JP5839076B2 (en) * 2014-04-25 2016-01-06 株式会社ニコン Illumination optical system, exposure apparatus, and device manufacturing method
CN105549327B (en) 2014-10-29 2018-03-02 上海微电子装备(集团)股份有限公司 The adjusting apparatus and method of adjustment of exposure device
CN104991258A (en) * 2015-07-16 2015-10-21 哈尔滨工业大学 Infrared laser light uniformizing illumination detecting system
KR102460551B1 (en) * 2015-10-29 2022-10-31 삼성디스플레이 주식회사 Laser crystalling apparatus
CN110431486B (en) 2017-03-16 2022-03-15 株式会社尼康 Control device and control method, exposure device and exposure method, device manufacturing method, data generation method, and computer-readable medium
KR102384289B1 (en) * 2017-10-17 2022-04-08 삼성디스플레이 주식회사 Laser crystalling apparatus
TWI670541B (en) * 2018-07-04 2019-09-01 陽程科技股份有限公司 Polarization alignment detecting device and detecting method
JP6979391B2 (en) * 2018-07-11 2021-12-15 株式会社日立製作所 Distance measuring device, distance measuring method, and three-dimensional shape measuring device
CN113498488A (en) * 2019-03-19 2021-10-12 株式会社村田制作所 Optical device
KR102584252B1 (en) * 2019-06-10 2023-10-05 삼성디스플레이 주식회사 Laser annealing apparatus
TWI728831B (en) * 2019-08-14 2021-05-21 香港商立景創新有限公司 Optical imaging apparatus with adjustable focal length
JP7469867B2 (en) * 2019-11-26 2024-04-17 三星電子株式会社 Ellipsometer and semiconductor device inspection device
US12326588B2 (en) 2020-01-30 2025-06-10 Lawrence Livermore National Security, Llc Polarization manipulation of free-space electromagnetic radiation fields
TWI773067B (en) * 2021-01-04 2022-08-01 財團法人工業技術研究院 Adjustment method of laser light path and adjustment device of laser light path
TW202236117A (en) 2021-02-03 2022-09-16 日商東京威力科創股份有限公司 Film thickness analysis method, film thickness analysis device, and storage medium
USD1100636S1 (en) 2022-06-22 2025-11-04 Fernand Brunschwig Polyhedral optical conduit
US12482377B2 (en) 2022-05-05 2025-11-25 Fernand Brunschwig Polyhedral optical conduit
DE102023119826A1 (en) * 2023-07-26 2025-01-30 TRUMPF Lasersystems for Semiconductor Manufacturing SE depolarization compensator and optical system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5459000A (en) * 1992-10-14 1995-10-17 Canon Kabushiki Kaisha Image projection method and device manufacturing method using the image projection method
US5933219A (en) * 1994-04-22 1999-08-03 Canon Kabushiki Kaisha Projection exposure apparatus and device manufacturing method capable of controlling polarization direction
US20010035942A1 (en) * 2000-03-30 2001-11-01 Shinichi Hara Exposure apparatus, gas replacement method, semiconductor device manufacturing method, semiconductor manufacturing factory and exposure apparatus maintenance method
EP1260849A1 (en) * 2001-05-22 2002-11-27 Carl Zeiss Semiconductor Manufacturing Technologies Ag Polarisation compensator and microlithography projection device with polarisation compensator
WO2005031467A2 (en) * 2003-09-26 2005-04-07 Carl Zeiss Smt Ag Microlithographic projection exposure

Family Cites Families (111)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2465241A1 (en) * 1979-09-10 1981-03-20 Thomson Csf ILLUMINATOR DEVICE FOR PROVIDING AN ADJUSTABLE INTENSITY DISTRIBUTION ILLUMINATION BEAM AND PATTERN TRANSFER SYSTEM COMPRISING SUCH A DEVICE
US4744615A (en) * 1986-01-29 1988-05-17 International Business Machines Corporation Laser beam homogenizer
JP2527807B2 (en) * 1989-05-09 1996-08-28 住友大阪セメント株式会社 Optical associative identification device
JP2995820B2 (en) * 1990-08-21 1999-12-27 株式会社ニコン Exposure method and method, and device manufacturing method
US7656504B1 (en) * 1990-08-21 2010-02-02 Nikon Corporation Projection exposure apparatus with luminous flux distribution
US6710855B2 (en) * 1990-11-15 2004-03-23 Nikon Corporation Projection exposure apparatus and method
US6252647B1 (en) * 1990-11-15 2001-06-26 Nikon Corporation Projection exposure apparatus
KR950004968B1 (en) * 1991-10-15 1995-05-16 가부시키가이샤 도시바 Projection exposure apparatus
JP2866243B2 (en) * 1992-02-10 1999-03-08 三菱電機株式会社 Projection exposure apparatus and method of manufacturing semiconductor device
US5312513A (en) * 1992-04-03 1994-05-17 Texas Instruments Incorporated Methods of forming multiple phase light modulators
JPH06188169A (en) * 1992-08-24 1994-07-08 Canon Inc Imaging method, exposure apparatus using the method, and device manufacturing method using the method
US6404482B1 (en) * 1992-10-01 2002-06-11 Nikon Corporation Projection exposure method and apparatus
JP2698521B2 (en) * 1992-12-14 1998-01-19 キヤノン株式会社 Catadioptric optical system and projection exposure apparatus having the optical system
US5739898A (en) * 1993-02-03 1998-04-14 Nikon Corporation Exposure method and apparatus
JPH06244082A (en) * 1993-02-19 1994-09-02 Nikon Corp Projection exposure device
US6304317B1 (en) * 1993-07-15 2001-10-16 Nikon Corporation Projection apparatus and method
JP3463335B2 (en) * 1994-02-17 2003-11-05 株式会社ニコン Projection exposure equipment
JP3099933B2 (en) * 1993-12-28 2000-10-16 株式会社東芝 Exposure method and exposure apparatus
US20020080338A1 (en) * 1994-03-29 2002-06-27 Nikon Corporation Projection exposure apparatus
US5453814A (en) * 1994-04-13 1995-09-26 Nikon Precision Inc. Illumination source and method for microlithography
US5631721A (en) * 1995-05-24 1997-05-20 Svg Lithography Systems, Inc. Hybrid illumination system for use in photolithography
US5815247A (en) * 1995-09-21 1998-09-29 Siemens Aktiengesellschaft Avoidance of pattern shortening by using off axis illumination with dipole and polarizing apertures
DE19535392A1 (en) * 1995-09-23 1997-03-27 Zeiss Carl Fa Radial polarization-rotating optical arrangement and microlithography projection exposure system with it
JPH1079337A (en) * 1996-09-04 1998-03-24 Nikon Corp Projection exposure equipment
DE19781041B4 (en) * 1996-10-08 2010-02-18 Citizen Holdings Co., Ltd., Nishitokyo Optical device
CN1244018C (en) * 1996-11-28 2006-03-01 株式会社尼康 Exposure method and exposure apparatus
US6208407B1 (en) * 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
DE19807120A1 (en) * 1998-02-20 1999-08-26 Zeiss Carl Fa Optical system with polarization compensator
DE69931690T2 (en) * 1998-04-08 2007-06-14 Asml Netherlands B.V. Lithographic apparatus
US6238063B1 (en) * 1998-04-27 2001-05-29 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
DE19829612A1 (en) * 1998-07-02 2000-01-05 Zeiss Carl Fa Microlithography lighting system with depolarizer
US6031658A (en) * 1998-09-25 2000-02-29 University Of Central Florida Digital control polarization based optical scanner
US6406148B1 (en) * 1998-12-31 2002-06-18 Texas Instruments Incorporated Electronic color switching in field sequential video displays
WO2000041226A1 (en) * 1999-01-06 2000-07-13 Nikon Corporation Projection optical system, method for producing the same, and projection exposure apparatus using the same
JP2001100311A (en) * 1999-07-23 2001-04-13 Seiko Epson Corp projector
WO2001023933A1 (en) * 1999-09-29 2001-04-05 Nikon Corporation Projection optical system
US6361909B1 (en) * 1999-12-06 2002-03-26 Industrial Technology Research Institute Illumination aperture filter design using superposition
KR20010085493A (en) * 2000-02-25 2001-09-07 시마무라 기로 Exposure apparatus, method for adjusting the same, and method for manufacturing device using the exposure apparatus
JP2001264696A (en) * 2000-03-16 2001-09-26 Canon Inc Illumination optical system and exposure apparatus having the same
JP3927753B2 (en) * 2000-03-31 2007-06-13 キヤノン株式会社 Exposure apparatus and device manufacturing method
KR100783669B1 (en) * 2000-04-25 2007-12-07 에이에스엠엘 유에스, 인크. Optical reduction system eliminates reticle diffraction induced by bias
KR100894303B1 (en) * 2000-04-25 2009-04-24 에이에스엠엘 유에스, 인크. Optical Reduction System with Irradiation Polarization Control
JP3645801B2 (en) * 2000-08-24 2005-05-11 ペンタックス株式会社 Beam train detection method and phase filter for detection
US6870668B2 (en) 2000-10-10 2005-03-22 Nikon Corporation Method for evaluating image formation performance
SE0100336L (en) * 2001-02-05 2002-08-06 Micronic Laser Systems Ab Addressing method and apparatus using the same technical area
US7217503B2 (en) * 2001-04-24 2007-05-15 Canon Kabushiki Kaisha Exposure method and apparatus
JP3780873B2 (en) * 2001-05-01 2006-05-31 ソニー株式会社 Lighting device
JP4401060B2 (en) * 2001-06-01 2010-01-20 エーエスエムエル ネザーランズ ビー.ブイ. Lithographic apparatus and device manufacturing method
KR20030036254A (en) * 2001-06-13 2003-05-09 가부시키가이샤 니콘 Scanning exposure method and scanning exposure system, and device production method
CN1393702A (en) * 2001-06-26 2003-01-29 山东新光量子科技股份有限公司 Polarizing-splitting prism
US6831731B2 (en) * 2001-06-28 2004-12-14 Nikon Corporation Projection optical system and an exposure apparatus with the projection optical system
US6727992B2 (en) * 2001-07-06 2004-04-27 Zygo Corporation Method and apparatus to reduce effects of sheared wavefronts on interferometric phase measurements
US6788389B2 (en) * 2001-07-10 2004-09-07 Nikon Corporation Production method of projection optical system
JP2003068600A (en) * 2001-08-22 2003-03-07 Canon Inc Exposure apparatus and substrate chuck cooling method
TW554411B (en) * 2001-08-23 2003-09-21 Nikon Corp Exposure apparatus
US6970232B2 (en) * 2001-10-30 2005-11-29 Asml Netherlands B.V. Structures and methods for reducing aberration in integrated circuit fabrication systems
JP2003202523A (en) * 2001-11-02 2003-07-18 Nec Viewtechnology Ltd Polarization unit, polarization illumination device and projection type display device using the illumination device
US6577379B1 (en) * 2001-11-05 2003-06-10 Micron Technology, Inc. Method and apparatus for shaping and/or orienting radiation irradiating a microlithographic substrate
US6900915B2 (en) * 2001-11-14 2005-05-31 Ricoh Company, Ltd. Light deflecting method and apparatus efficiently using a floating mirror
TW567406B (en) * 2001-12-12 2003-12-21 Nikon Corp Diffraction optical device, refraction optical device, illuminating optical device, exposure system and exposure method
US20050134825A1 (en) * 2002-02-08 2005-06-23 Carl Zeiss Smt Ag Polarization-optimized illumination system
JP2003257812A (en) 2002-02-27 2003-09-12 Nikon Corp Evaluation method of imaging optical system, adjustment method of imaging optical system, exposure apparatus and exposure method
JP4352458B2 (en) * 2002-03-01 2009-10-28 株式会社ニコン Projection optical system adjustment method, prediction method, evaluation method, adjustment method, exposure method and exposure apparatus, exposure apparatus manufacturing method, program, and device manufacturing method
US20050094268A1 (en) * 2002-03-14 2005-05-05 Carl Zeiss Smt Ag Optical system with birefringent optical elements
JP3950732B2 (en) * 2002-04-23 2007-08-01 キヤノン株式会社 Illumination optical system, illumination method and exposure apparatus
JP4333078B2 (en) * 2002-04-26 2009-09-16 株式会社ニコン Projection optical system, exposure apparatus including the projection optical system, exposure method using the projection optical system, and device manufacturing method
US20050095749A1 (en) * 2002-04-29 2005-05-05 Mathias Krellmann Device for protecting a chip and method for operating a chip
TW200307179A (en) * 2002-05-27 2003-12-01 Nikon Corp Lighting device, exposing device and exposing method
US7038763B2 (en) * 2002-05-31 2006-05-02 Asml Netherlands B.V. Kit of parts for assembling an optical element, method of assembling an optical element, optical element, lithographic apparatus, and device manufacturing method
JP2004051717A (en) * 2002-07-17 2004-02-19 Mitsubishi Heavy Ind Ltd Biomass gasifier
JP4095376B2 (en) * 2002-08-28 2008-06-04 キヤノン株式会社 Exposure apparatus and method, and device manufacturing method
JP2004104654A (en) * 2002-09-12 2004-04-02 Ricoh Co Ltd Image reading device
JP2004111579A (en) * 2002-09-17 2004-04-08 Canon Inc Exposure method and apparatus
KR100480620B1 (en) * 2002-09-19 2005-03-31 삼성전자주식회사 Exposing equipment including a Micro Mirror Array and exposing method using the exposing equipment
JP3958163B2 (en) * 2002-09-19 2007-08-15 キヤノン株式会社 Exposure method
US6844927B2 (en) * 2002-11-27 2005-01-18 Kla-Tencor Technologies Corporation Apparatus and methods for removing optical abberations during an optical inspection
TW200412617A (en) * 2002-12-03 2004-07-16 Nikon Corp Optical illumination device, method for adjusting optical illumination device, exposure device and exposure method
EP1429190B1 (en) * 2002-12-10 2012-05-09 Canon Kabushiki Kaisha Exposure apparatus and method
US6891655B2 (en) * 2003-01-02 2005-05-10 Micronic Laser Systems Ab High energy, low energy density, radiation-resistant optics used with micro-electromechanical devices
KR101547077B1 (en) * 2003-04-09 2015-08-25 가부시키가이샤 니콘 Exposure method and apparatus, and device manufacturing method
US6842223B2 (en) * 2003-04-11 2005-01-11 Nikon Precision Inc. Enhanced illuminator for use in photolithographic systems
TW200507055A (en) * 2003-05-21 2005-02-16 Nikon Corp Polarized cancellation element, illumination device, exposure device, and exposure method
JP2005012190A (en) 2003-05-23 2005-01-13 Nikon Corp Imaging optical system evaluation method, imaging optical system adjustment method, exposure apparatus, and exposure method
JP4323903B2 (en) * 2003-09-12 2009-09-02 キヤノン株式会社 Illumination optical system and exposure apparatus using the same
US7408616B2 (en) * 2003-09-26 2008-08-05 Carl Zeiss Smt Ag Microlithographic exposure method as well as a projection exposure system for carrying out the method
US6970233B2 (en) * 2003-12-03 2005-11-29 Texas Instruments Incorporated System and method for custom-polarized photolithography illumination
US20070019179A1 (en) * 2004-01-16 2007-01-25 Damian Fiolka Polarization-modulating optical element
CN101793993B (en) * 2004-01-16 2013-04-03 卡尔蔡司Smt有限责任公司 Optical elements, optical arrangement and system
TWI379344B (en) 2004-02-06 2012-12-11 Nikon Corp Polarization changing device, optical illumination apparatus, light-exposure apparatus and light-exposure method
JP4693088B2 (en) * 2004-02-20 2011-06-01 株式会社ニコン Illumination optical apparatus, exposure apparatus, and exposure method
JP5159027B2 (en) * 2004-06-04 2013-03-06 キヤノン株式会社 Illumination optical system and exposure apparatus
US7283209B2 (en) * 2004-07-09 2007-10-16 Carl Zeiss Smt Ag Illumination system for microlithography
EP1621930A3 (en) * 2004-07-29 2011-07-06 Carl Zeiss SMT GmbH Illumination system for a microlithographic projection exposure apparatus
JP4599936B2 (en) * 2004-08-17 2010-12-15 株式会社ニコン Illumination optical apparatus, adjustment method of illumination optical apparatus, exposure apparatus, and exposure method
US7245353B2 (en) * 2004-10-12 2007-07-17 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method
GB2419208A (en) * 2004-10-18 2006-04-19 Qinetiq Ltd Optical correlation employing an optical bit delay
US7271874B2 (en) * 2004-11-02 2007-09-18 Asml Holding N.V. Method and apparatus for variable polarization control in a lithography system
JP2006179516A (en) * 2004-12-20 2006-07-06 Toshiba Corp Exposure apparatus, exposure method, and semiconductor device manufacturing method
US7345740B2 (en) * 2004-12-28 2008-03-18 Asml Netherlands B.V. Polarized radiation in lithographic apparatus and device manufacturing method
US7312852B2 (en) * 2004-12-28 2007-12-25 Asml Netherlands B.V. Polarized radiation in lithographic apparatus and device manufacturing method
TWI423301B (en) * 2005-01-21 2014-01-11 尼康股份有限公司 Illumination optical device, exposure device, exposure method and fabricating method of device
US7317512B2 (en) * 2005-07-11 2008-01-08 Asml Netherlands B.V. Different polarization in cross-section of a radiation beam in a lithographic apparatus and device manufacturing method
US20070058151A1 (en) * 2005-09-13 2007-03-15 Asml Netherlands B.V. Optical element for use in lithography apparatus and method of conditioning radiation beam
JP2008041710A (en) * 2006-08-01 2008-02-21 Fujitsu Ltd Illumination optical apparatus, exposure method and design method
US8451427B2 (en) * 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US20090091730A1 (en) * 2007-10-03 2009-04-09 Nikon Corporation Spatial light modulation unit, illumination apparatus, exposure apparatus, and device manufacturing method
CN101681123B (en) * 2007-10-16 2013-06-12 株式会社尼康 Illumination optical system, exposure apparatus, and device manufacturing method
US8379187B2 (en) * 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) * 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US20110037962A1 (en) * 2009-08-17 2011-02-17 Nikon Corporation Polarization converting unit, illumination optical system, exposure apparatus, and device manufacturing method
US20110205519A1 (en) * 2010-02-25 2011-08-25 Nikon Corporation Polarization converting unit, illumination optical system, exposure apparatus, and device manufacturing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5459000A (en) * 1992-10-14 1995-10-17 Canon Kabushiki Kaisha Image projection method and device manufacturing method using the image projection method
US5933219A (en) * 1994-04-22 1999-08-03 Canon Kabushiki Kaisha Projection exposure apparatus and device manufacturing method capable of controlling polarization direction
US20010035942A1 (en) * 2000-03-30 2001-11-01 Shinichi Hara Exposure apparatus, gas replacement method, semiconductor device manufacturing method, semiconductor manufacturing factory and exposure apparatus maintenance method
EP1260849A1 (en) * 2001-05-22 2002-11-27 Carl Zeiss Semiconductor Manufacturing Technologies Ag Polarisation compensator and microlithography projection device with polarisation compensator
WO2005031467A2 (en) * 2003-09-26 2005-04-07 Carl Zeiss Smt Ag Microlithographic projection exposure

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2006077849A1 *

Also Published As

Publication number Publication date
KR20120106904A (en) 2012-09-26
SG159495A1 (en) 2010-03-30
CN101788721B (en) 2012-12-05
TWI423301B (en) 2014-01-11
CN101164142B (en) 2010-05-19
IL216818A (en) 2015-01-29
KR101642242B1 (en) 2016-07-22
CN101866058B (en) 2013-12-04
JP5293689B2 (en) 2013-09-18
TW200923419A (en) 2009-06-01
JPWO2006077849A1 (en) 2008-08-07
JP5644685B2 (en) 2014-12-24
EP3153925A2 (en) 2017-04-12
KR20140029548A (en) 2014-03-10
TW200921147A (en) 2009-05-16
JP2011249814A (en) 2011-12-08
CN101164142A (en) 2008-04-16
TW200636290A (en) 2006-10-16
CN101788721A (en) 2010-07-28
HK1145714A1 (en) 2011-04-29
HK1117271A1 (en) 2009-01-09
TW200923418A (en) 2009-06-01
IL182064A (en) 2012-01-31
KR20070095271A (en) 2007-09-28
JP2011003908A (en) 2011-01-06
IL182064A0 (en) 2007-07-24
IL216818A0 (en) 2012-01-31
EP3153925A3 (en) 2017-05-03
KR101431359B1 (en) 2014-08-18
KR20160088960A (en) 2016-07-26
EP3358414A1 (en) 2018-08-08
HK1251992A1 (en) 2019-05-10
CN101866058A (en) 2010-10-20
JP4582096B2 (en) 2010-11-17
KR20150060992A (en) 2015-06-03
TWI453795B (en) 2014-09-21
KR20170123348A (en) 2017-11-07
US20070146676A1 (en) 2007-06-28
EP1840945B1 (en) 2016-10-05
TWI453796B (en) 2014-09-21
KR101332066B1 (en) 2013-11-22
HK1144840A1 (en) 2011-03-11
EP1840945A1 (en) 2007-10-03
WO2006077849A1 (en) 2006-07-27

Similar Documents

Publication Publication Date Title
IL182064A0 (en) Method of adjusting lighting optical device, lighting optical device, exposure system and exposure method
EP1953805A4 (en) Lighting optical system, exposure system, and exposure method
IL182857A0 (en) Optical integrator, illumination optical device, exposure device, and exposure method
EP1720047A4 (en) Polarization conversion element, lighting optical device, exposure system, and exposure method
SG10201602750RA (en) Illumination Optical System, Exposure Apparatus, And Device Manufacturing Method
EP2009678A4 (en) Illuminating optical apparatus, exposure apparatus and device manufacturing method
EP2040283A4 (en) Illuminating optical apparatus, exposure apparatus and device manufacturing method
SG10201708650WA (en) Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
ZA200905279B (en) Control device, system and method for public illumination
EP2020679A4 (en) Illuminating optical apparatus, exposure apparatus, and device manufacturing method
IL181136A0 (en) Projection optical system, exposure apparatus, and exposure method
EP2094064A4 (en) Light source, light source system and illumination device
EP2040284A4 (en) Illuminating optical apparatus, exposure apparatus and device manufacturing method
IL181506A0 (en) Lighting apparatus, exposure apparatus and microdevice manufacturing method
TWI347488B (en) Mirror array apparatus, lithographic apparatus, illumination system and method of cooling the mirror array apparatus
EP1901339A4 (en) Exposure apparatus, exposure method, device manufacturing method, and system
IL181243A0 (en) Method for controlling exposure system, exposure method and system using same, and method for manufacturing device
EP2001042A4 (en) Lighting optical system, exposure system, and device production method
EP1881520A4 (en) Projection optical system, exposure apparatus and exposure method
EP1896625A4 (en) DEVICE AND METHOD FOR ADJUSTING THE THICKNESS
EP1811544A4 (en) Lighting optical device, exposure system, and exposure method
EP1835527A4 (en) Projection optical system, exposure apparatus, exposure system, and exposure method
EP2200070A4 (en) Illuminating optical apparatus, and exposure method and apparatus
EP1843385A4 (en) Projection optical system, exposure system, and exposure method
EP1970943A4 (en) Optical integrator, illumination optical device, aligner, and method for fabricating device

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20070329

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK YU

RIN1 Information on inventor provided before grant (corrected)

Inventor name: KURITA, SHINICHI

Inventor name: SHIGEMATSU, KOJI

Inventor name: HIROTA, HIROYUKI

Inventor name: TANITSU, OSAMU

REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1108064

Country of ref document: HK

A4 Supplementary search report drawn up and despatched

Effective date: 20100128

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: NIKON CORPORATION

17Q First examination report despatched

Effective date: 20100712

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: NIKON CORPORATION

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 602006050475

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: H01L0021027000

Ipc: G03F0007200000

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20160413

RIC1 Information provided on ipc code assigned before grant

Ipc: G03F 7/20 20060101AFI20160401BHEP

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK YU

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 835126

Country of ref document: AT

Kind code of ref document: T

Effective date: 20161015

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602006050475

Country of ref document: DE

REG Reference to a national code

Ref country code: NL

Ref legal event code: FP

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161005

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 835126

Country of ref document: AT

Kind code of ref document: T

Effective date: 20161005

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161005

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170106

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161005

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161005

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161005

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161005

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170205

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170206

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161005

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161005

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602006050475

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161005

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161005

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161005

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161005

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161005

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

REG Reference to a national code

Ref country code: HK

Ref legal event code: GR

Ref document number: 1108064

Country of ref document: HK

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170105

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161005

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

26N No opposition filed

Effective date: 20170706

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20170118

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161005

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20170929

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170131

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170131

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170131

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170118

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170118

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161005

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170118

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20060118

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20161005

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20191212

Year of fee payment: 15

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161005

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20200107

Year of fee payment: 15

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602006050475

Country of ref document: DE

REG Reference to a national code

Ref country code: NL

Ref legal event code: MM

Effective date: 20210201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210803