EP1745888A4 - Verfahren und vorrichtung für linear vorrückendes polieren - Google Patents
Verfahren und vorrichtung für linear vorrückendes polierenInfo
- Publication number
- EP1745888A4 EP1745888A4 EP05727544A EP05727544A EP1745888A4 EP 1745888 A4 EP1745888 A4 EP 1745888A4 EP 05727544 A EP05727544 A EP 05727544A EP 05727544 A EP05727544 A EP 05727544A EP 1745888 A4 EP1745888 A4 EP 1745888A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- work
- surface plates
- pair
- flat plane
- plane surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000005498 polishing Methods 0.000 title 1
- 238000007517 polishing process Methods 0.000 abstract 2
- 239000006061 abrasive grain Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004105655 | 2004-03-31 | ||
PCT/JP2005/005858 WO2005095053A1 (ja) | 2004-03-31 | 2005-03-29 | 直進型研磨方法及び装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1745888A1 EP1745888A1 (de) | 2007-01-24 |
EP1745888A4 true EP1745888A4 (de) | 2008-01-02 |
Family
ID=35063594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05727544A Withdrawn EP1745888A4 (de) | 2004-03-31 | 2005-03-29 | Verfahren und vorrichtung für linear vorrückendes polieren |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070202777A1 (de) |
EP (1) | EP1745888A4 (de) |
JP (1) | JP4472694B2 (de) |
KR (1) | KR100806949B1 (de) |
CN (1) | CN1929954B (de) |
TW (1) | TWI271261B (de) |
WO (1) | WO2005095053A1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101249632B (zh) * | 2008-03-20 | 2010-06-09 | 沈阳材佳机械设备有限公司 | 往复直线加旋转运动研磨抛光装置 |
US8684791B2 (en) * | 2011-11-09 | 2014-04-01 | Alvin Gabriel Stern | Linear, automated apparatus and method for clean, high purity, simultaneous lapping and polishing of optics, semiconductors and optoelectronic materials |
US9950404B1 (en) * | 2012-03-29 | 2018-04-24 | Alta Devices, Inc. | High throughput polishing system for workpieces |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0696495A1 (de) * | 1994-08-09 | 1996-02-14 | Ontrak Systems, Inc. | Linear Poliergerät und Wafer Planarisierungsverfahren |
US6422929B1 (en) * | 2000-03-31 | 2002-07-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Polishing pad for a linear polisher and method for forming |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2144354B (en) * | 1983-07-15 | 1987-03-11 | Helical Springs Limited | Grinding apparatus |
JPS6080559A (ja) | 1983-10-12 | 1985-05-08 | Mitsubishi Metal Corp | 研磨装置 |
US5371973A (en) * | 1992-09-30 | 1994-12-13 | Western Atlas Inc. | Grinding machine utilizing multiple, parallel, abrasive belts simultaneously grinding surfaces on a workpiece |
US5575707A (en) * | 1994-10-11 | 1996-11-19 | Ontrak Systems, Inc. | Polishing pad cluster for polishing a semiconductor wafer |
JPH10249720A (ja) | 1997-03-13 | 1998-09-22 | Kobe Steel Ltd | 平板状工作物のポリッシング加工方法 |
US6241583B1 (en) * | 1999-02-04 | 2001-06-05 | Applied Materials, Inc. | Chemical mechanical polishing with a plurality of polishing sheets |
US6626744B1 (en) * | 1999-12-17 | 2003-09-30 | Applied Materials, Inc. | Planarization system with multiple polishing pads |
US20040137830A1 (en) * | 2002-12-24 | 2004-07-15 | Kazumasa Ohnishi | Lapping method and lapping machine |
-
2005
- 2005-03-29 CN CN2005800079883A patent/CN1929954B/zh not_active Expired - Fee Related
- 2005-03-29 KR KR1020067019958A patent/KR100806949B1/ko active IP Right Grant
- 2005-03-29 EP EP05727544A patent/EP1745888A4/de not_active Withdrawn
- 2005-03-29 JP JP2006511668A patent/JP4472694B2/ja not_active Expired - Fee Related
- 2005-03-29 WO PCT/JP2005/005858 patent/WO2005095053A1/ja active Application Filing
- 2005-03-29 US US10/599,562 patent/US20070202777A1/en not_active Abandoned
- 2005-03-30 TW TW094110147A patent/TWI271261B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0696495A1 (de) * | 1994-08-09 | 1996-02-14 | Ontrak Systems, Inc. | Linear Poliergerät und Wafer Planarisierungsverfahren |
JPH0852652A (ja) * | 1994-08-09 | 1996-02-27 | Ontrak Syst Inc | リニアポリシャ及び半導体ウエハ平滑化方法 |
US6422929B1 (en) * | 2000-03-31 | 2002-07-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Polishing pad for a linear polisher and method for forming |
Non-Patent Citations (1)
Title |
---|
See also references of WO2005095053A1 * |
Also Published As
Publication number | Publication date |
---|---|
TWI271261B (en) | 2007-01-21 |
JPWO2005095053A1 (ja) | 2008-07-31 |
US20070202777A1 (en) | 2007-08-30 |
CN1929954B (zh) | 2011-12-14 |
EP1745888A1 (de) | 2007-01-24 |
TW200531781A (en) | 2005-10-01 |
CN1929954A (zh) | 2007-03-14 |
JP4472694B2 (ja) | 2010-06-02 |
KR20060132954A (ko) | 2006-12-22 |
KR100806949B1 (ko) | 2008-02-22 |
WO2005095053A1 (ja) | 2005-10-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20061019 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE |
|
DAX | Request for extension of the european patent (deleted) | ||
RBV | Designated contracting states (corrected) |
Designated state(s): DE |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20071203 |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: YASUI, HEIJI |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: YASUI, HEIJI |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20121002 |