EP1745888A4 - Procédé et appareil de polissage a avance lineaire - Google Patents

Procédé et appareil de polissage a avance lineaire

Info

Publication number
EP1745888A4
EP1745888A4 EP05727544A EP05727544A EP1745888A4 EP 1745888 A4 EP1745888 A4 EP 1745888A4 EP 05727544 A EP05727544 A EP 05727544A EP 05727544 A EP05727544 A EP 05727544A EP 1745888 A4 EP1745888 A4 EP 1745888A4
Authority
EP
European Patent Office
Prior art keywords
work
surface plates
pair
flat plane
plane surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05727544A
Other languages
German (de)
English (en)
Japanese (ja)
Other versions
EP1745888A1 (fr
Inventor
Heiji Yasui
Original Assignee
Japan Science and Technology Agency
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Science and Technology Agency filed Critical Japan Science and Technology Agency
Publication of EP1745888A1 publication Critical patent/EP1745888A1/fr
Publication of EP1745888A4 publication Critical patent/EP1745888A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Dans un procédé de polissage de type rotatif, il est difficile d’envoyer de manière continue des pièces d’usinage à un appareil et d’utiliser efficacement un espace dans la périphérie de l’appareil. Il est ainsi prévu un procédé et un appareil de polissage à avance linéaire ayant un nouveau concept pour résoudre de tels problèmes. Chacune d’une paire de plaques superficielles plates parallèles adjacentes l’une à l’autre parallèlement effectue un mouvement linéaire dans une direction opposée l’une à l’autre. Une pièce d’usinage est comprimée contre les deux plaques superficielles pour appliquer un couple à la pièce d’usinage et initier un mouvement rotatif. La pièce d’usinage est polie par des grains abrasifs par le mouvement relatif de la rotation de la pièce d’usinage et de la paire de plaques superficielles effectuant les mouvements linéaires. La paire de plaques superficielles plates parallèles s’oppose à une autre paire de plaques superficielles plates parallèles. Ensuite, la pièce d’usinage peut être prise en sandwich entre les paires et l’on va pouvoir polir un plan ou les deux plans. Au lieu d’utiliser les plaques superficielles plates, on peut envisager un appareil de polissage à courroie traversant une table support de pièces d’usinage.
EP05727544A 2004-03-31 2005-03-29 Procédé et appareil de polissage a avance lineaire Withdrawn EP1745888A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004105655 2004-03-31
PCT/JP2005/005858 WO2005095053A1 (fr) 2004-03-31 2005-03-29 Procédé et appareil de polissage a avance lineaire

Publications (2)

Publication Number Publication Date
EP1745888A1 EP1745888A1 (fr) 2007-01-24
EP1745888A4 true EP1745888A4 (fr) 2008-01-02

Family

ID=35063594

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05727544A Withdrawn EP1745888A4 (fr) 2004-03-31 2005-03-29 Procédé et appareil de polissage a avance lineaire

Country Status (7)

Country Link
US (1) US20070202777A1 (fr)
EP (1) EP1745888A4 (fr)
JP (1) JP4472694B2 (fr)
KR (1) KR100806949B1 (fr)
CN (1) CN1929954B (fr)
TW (1) TWI271261B (fr)
WO (1) WO2005095053A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101249632B (zh) * 2008-03-20 2010-06-09 沈阳材佳机械设备有限公司 往复直线加旋转运动研磨抛光装置
US8684791B2 (en) * 2011-11-09 2014-04-01 Alvin Gabriel Stern Linear, automated apparatus and method for clean, high purity, simultaneous lapping and polishing of optics, semiconductors and optoelectronic materials
US9950404B1 (en) * 2012-03-29 2018-04-24 Alta Devices, Inc. High throughput polishing system for workpieces

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0696495A1 (fr) * 1994-08-09 1996-02-14 Ontrak Systems, Inc. Polisseuse linéaire et procédé pour la planarization de plaquettes semi-conductrices
US6422929B1 (en) * 2000-03-31 2002-07-23 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing pad for a linear polisher and method for forming

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2144354B (en) * 1983-07-15 1987-03-11 Helical Springs Limited Grinding apparatus
JPS6080559A (ja) 1983-10-12 1985-05-08 Mitsubishi Metal Corp 研磨装置
US5371973A (en) * 1992-09-30 1994-12-13 Western Atlas Inc. Grinding machine utilizing multiple, parallel, abrasive belts simultaneously grinding surfaces on a workpiece
US5575707A (en) * 1994-10-11 1996-11-19 Ontrak Systems, Inc. Polishing pad cluster for polishing a semiconductor wafer
JPH10249720A (ja) 1997-03-13 1998-09-22 Kobe Steel Ltd 平板状工作物のポリッシング加工方法
US6241583B1 (en) * 1999-02-04 2001-06-05 Applied Materials, Inc. Chemical mechanical polishing with a plurality of polishing sheets
US6626744B1 (en) * 1999-12-17 2003-09-30 Applied Materials, Inc. Planarization system with multiple polishing pads
US20040137830A1 (en) * 2002-12-24 2004-07-15 Kazumasa Ohnishi Lapping method and lapping machine

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0696495A1 (fr) * 1994-08-09 1996-02-14 Ontrak Systems, Inc. Polisseuse linéaire et procédé pour la planarization de plaquettes semi-conductrices
JPH0852652A (ja) * 1994-08-09 1996-02-27 Ontrak Syst Inc リニアポリシャ及び半導体ウエハ平滑化方法
US6422929B1 (en) * 2000-03-31 2002-07-23 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing pad for a linear polisher and method for forming

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2005095053A1 *

Also Published As

Publication number Publication date
KR100806949B1 (ko) 2008-02-22
JPWO2005095053A1 (ja) 2008-07-31
TW200531781A (en) 2005-10-01
WO2005095053A1 (fr) 2005-10-13
KR20060132954A (ko) 2006-12-22
CN1929954A (zh) 2007-03-14
JP4472694B2 (ja) 2010-06-02
US20070202777A1 (en) 2007-08-30
EP1745888A1 (fr) 2007-01-24
CN1929954B (zh) 2011-12-14
TWI271261B (en) 2007-01-21

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20061019

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE

DAX Request for extension of the european patent (deleted)
RBV Designated contracting states (corrected)

Designated state(s): DE

A4 Supplementary search report drawn up and despatched

Effective date: 20071203

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: YASUI, HEIJI

RIN1 Information on inventor provided before grant (corrected)

Inventor name: YASUI, HEIJI

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20121002