TW200531781A - Straight advancement type abrasive finishing method and apparatus using the same - Google Patents

Straight advancement type abrasive finishing method and apparatus using the same

Info

Publication number
TW200531781A
TW200531781A TW094110147A TW94110147A TW200531781A TW 200531781 A TW200531781 A TW 200531781A TW 094110147 A TW094110147 A TW 094110147A TW 94110147 A TW94110147 A TW 94110147A TW 200531781 A TW200531781 A TW 200531781A
Authority
TW
Taiwan
Prior art keywords
work
couple
surface plate
finishing method
abrasive finishing
Prior art date
Application number
TW094110147A
Other languages
Chinese (zh)
Other versions
TWI271261B (en
Inventor
Heiji Yasui
Original Assignee
Japan Science & Tech Agency
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Science & Tech Agency filed Critical Japan Science & Tech Agency
Publication of TW200531781A publication Critical patent/TW200531781A/en
Application granted granted Critical
Publication of TWI271261B publication Critical patent/TWI271261B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

In the rotation type abrasive finishing method, effective use for the space around the apparatus and continuously supplying the work to the apparatus is difficult. This invention provides a straight advancement type abrasive finishing method and an apparatus of a new concept solving these problems. Each of a couple of plane surface plate adjacent in parallel moves linearly in the counter direction mutually. The couple force to cause the gyration is given to the work by pressing it against both of a couple of surface plate. As a result, the work is finished by abrasive particles with relative movement of the gyration of the work and the linear movement of the both surface plates. Both or one surface of the work can be abrasive finished by setting the work between a pair of the couple of surface plate. The method of using a couple of polisher of the belt type that passes on the stand to support the work is acceptable in place of the above described couple of surface plate.
TW094110147A 2004-03-31 2005-03-30 Straight advancement type abrasive finishing method and apparatus using the same TWI271261B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004105655 2004-03-31

Publications (2)

Publication Number Publication Date
TW200531781A true TW200531781A (en) 2005-10-01
TWI271261B TWI271261B (en) 2007-01-21

Family

ID=35063594

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094110147A TWI271261B (en) 2004-03-31 2005-03-30 Straight advancement type abrasive finishing method and apparatus using the same

Country Status (7)

Country Link
US (1) US20070202777A1 (en)
EP (1) EP1745888A4 (en)
JP (1) JP4472694B2 (en)
KR (1) KR100806949B1 (en)
CN (1) CN1929954B (en)
TW (1) TWI271261B (en)
WO (1) WO2005095053A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101249632B (en) * 2008-03-20 2010-06-09 沈阳材佳机械设备有限公司 Reciprocating straight-line and rotating motion grinding polishing device
US8684791B2 (en) * 2011-11-09 2014-04-01 Alvin Gabriel Stern Linear, automated apparatus and method for clean, high purity, simultaneous lapping and polishing of optics, semiconductors and optoelectronic materials
US9950404B1 (en) * 2012-03-29 2018-04-24 Alta Devices, Inc. High throughput polishing system for workpieces

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2144354B (en) * 1983-07-15 1987-03-11 Helical Springs Limited Grinding apparatus
JPS6080559A (en) * 1983-10-12 1985-05-08 Mitsubishi Metal Corp Polishing device
US5371973A (en) * 1992-09-30 1994-12-13 Western Atlas Inc. Grinding machine utilizing multiple, parallel, abrasive belts simultaneously grinding surfaces on a workpiece
DE69512971T2 (en) * 1994-08-09 2000-05-18 Ontrak Systems Inc., Milpitas Linear polisher and wafer planarization process
US5575707A (en) * 1994-10-11 1996-11-19 Ontrak Systems, Inc. Polishing pad cluster for polishing a semiconductor wafer
JPH10249720A (en) * 1997-03-13 1998-09-22 Kobe Steel Ltd Polishing work method of flat workpiece
US6241583B1 (en) * 1999-02-04 2001-06-05 Applied Materials, Inc. Chemical mechanical polishing with a plurality of polishing sheets
US6626744B1 (en) * 1999-12-17 2003-09-30 Applied Materials, Inc. Planarization system with multiple polishing pads
US6422929B1 (en) * 2000-03-31 2002-07-23 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing pad for a linear polisher and method for forming
US20040137830A1 (en) * 2002-12-24 2004-07-15 Kazumasa Ohnishi Lapping method and lapping machine

Also Published As

Publication number Publication date
EP1745888A4 (en) 2008-01-02
US20070202777A1 (en) 2007-08-30
WO2005095053A1 (en) 2005-10-13
TWI271261B (en) 2007-01-21
CN1929954A (en) 2007-03-14
JPWO2005095053A1 (en) 2008-07-31
KR20060132954A (en) 2006-12-22
CN1929954B (en) 2011-12-14
JP4472694B2 (en) 2010-06-02
EP1745888A1 (en) 2007-01-24
KR100806949B1 (en) 2008-02-22

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees