EP1745330A2 - Cooling for light emitting diode - Google Patents

Cooling for light emitting diode

Info

Publication number
EP1745330A2
EP1745330A2 EP05742672A EP05742672A EP1745330A2 EP 1745330 A2 EP1745330 A2 EP 1745330A2 EP 05742672 A EP05742672 A EP 05742672A EP 05742672 A EP05742672 A EP 05742672A EP 1745330 A2 EP1745330 A2 EP 1745330A2
Authority
EP
European Patent Office
Prior art keywords
coupled
led
cooling
projection
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05742672A
Other languages
German (de)
English (en)
French (fr)
Inventor
T. Scott Engle
David E. Slobodin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Infocus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infocus Corp filed Critical Infocus Corp
Publication of EP1745330A2 publication Critical patent/EP1745330A2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/16—Cooling; Preventing overheating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to the field of projection, in particular, the employment of Light Emitting Diodes (LEDs) as light sources, and their cooling.
  • LEDs Light Emitting Diodes
  • Background of Invention The uses for LEDs have grown. In particular, there is increase interest in the employment of LEDs as light sources for projection engines/system. This growth has been due in large part to the increase in the light output of the LEDs. Historically, the low light output from LEDs made them impractical for use in applications requiring significant light output, for example, in outdoor applications. However, as LED light output continues to increase, LEDs are finding application in an increase number of areas.
  • the apparent light output of an LED depends on a number of factors. Such factors include the viewing angle of the LED with respect to the optical center as well as the brightness of the LED.
  • the brightness of the LED is itself a function of a number of factors. For example, the brightness can be affected by the amount of current being delivered to an LED and the junction temperature of the LED.
  • FIG. 1 illustrates a relative light output for a particular green LED as a function of junction temperature.
  • FIG. 2 illustrates a device comprising a cooling device for an LED, in accordance with one embodiment.
  • FIG. 3 illustrates an LED with an alternative arrangement in accordance with one embodiment.
  • FIG. 4 illustrates an LED cooling scenario utilizing cooling sticks in accordance with another embodiment.
  • FIG. 5 illustrates an LED cooling system with a thermal block connected without the thermoelectric cooler.
  • FIG. 6 illustrates an LED utilizing a liquid cooling system in accordance with one embodiment.
  • FIG. 7 illustrates an LED utilizing a liquid cooling system in accordance with another embodiment.
  • FIG. 1 illustrates a relative light output for a particular green LED as a function of junction temperature.
  • FIG. 2 illustrates a device comprising a cooling device for an LED, in accordance with one embodiment.
  • FIG. 3 illustrates an LED with an alternative arrangement in accordance with one embodiment.
  • FIG. 4 illustrates an LED cooling scenario utilizing cooling sticks in accordance with
  • FIG. 8 illustrates an embodiment where a thermal sensor is utilized to monitor the thermal output of an LED.
  • FIG. 9 illustrates a system wherein thermal feedback is utilized to control the output of an LED, in accordance with one embodiment.
  • FIG. 10 illustrates a system wherein thermal feedback is utilized to control the output of an LED, in accordance with another embodiment.
  • FIG. 11 illustrates a block diagram view of a projection system for projecting images, in accordance with one embodiment of the present invention.
  • LEDs are frequently rated with a certain light output characteristics at a particular junction temperature (i.e.
  • FIG. 1 illustrates a relative light output for a particular green LED as a function of junction temperature. As the junction temperature increases, generally, the relative light output value is reduced relative to the value at 25 degrees C.
  • the particular green LED for example, may have a relative light output of 80% of its 25 degree value at 70 degrees C 183.
  • the particular green LED may have a relative light output of only 60% of its 25 degree C value at 120 degree C 185. Thus, cooling an LED may provide the ability to produce greater light output when compared to an uncooled LED.
  • FIG. 2 illustrates a device comprising a cooling device for an LED, in accordance with one embodiment.
  • an LED 210 is thermally coupled via a thermally conductive path to a thermoelectric cooler 230 (e.g. a Peltier Device).
  • a thermoelectric cooler 230 e.g. a Peltier Device
  • the thermally conductive path may be a thermal conductive slug 222 in a thermally insulating substrate 224.
  • the LED is coupled directly to the thermoelectric cooler.
  • the cool end 232 of the thermoelectric cooler is thermally coupled to the LED 210.
  • the hot end 234 of the thermoelectric cooler is coupled to a heat sink 240.
  • the heat sink is disposed in a forced air flow 250 to provide for greater cooling.
  • natural, instead of forced, convection may be utilized to cool the heat sink instead.
  • the forced air flow may be utilized to cool the thermoelectric cooler directly without the use of a heat sink.
  • thermoelectric cooler 210 in alternative embodiments the coupling may be just thermal in nature.
  • the temperature on the hot side of the thermoelectric cooler may be substantially higher than the temperature of the un-cooled LED.
  • more extensive method of dissipating the higher temperature may be employed.
  • a larger heat sink may be employed to cool both the thermoelectric cooler and the LED.
  • a determination may be made on whether the added expenditure of the larger heat sink is justified, in view of the resulting opportunity to obtain a higher light output.
  • FIG. 3 illustrates an LED with an alternative arrangement in accordance with one embodiment. Illustrated in FIG. 3, the LED 310 is mounted on printed circuit board 320 having a metal core, e.g. an aluminum core.
  • the printed circuit board 320 is coupled to a thermoelectric cooler 330.
  • the thermoelectric cooler 330 is in turn coupled to a thermal block 335.
  • the thermal block 335 has in it the ends of several cooling sticks 340.
  • the cooling sticks 340 are hollow sticks having a refrigerant inside.
  • the other ends of the cooling sticks 340 are in a forced air flow 350.
  • As the refrigerant heats inside the thermal block it vaporizes and is transferred to the cooler sides 344 of the heat sticks in the forced airflow. The vapor then condenses and the cooler condensed liquid is transferred back to the warmer sides 342 of the heat sticks.
  • FIG. 4 illustrates an LED cooling scenario utilizing cooling sticks in accordance with another embodiment.
  • the sides of the cooling sticks 440 not in the thermal block are coupled to one or more heat sinks 460.
  • the heat sinks 460 are then utilized to disperse the heat transferred to the heat sinks 460 by the cooling sticks 440.
  • the cooling may be via natural convection of heat off the heat sink.
  • FIG. 5 illustrates an LED cooling system with a thermal block connected without the thermoelectric cooler.
  • the thermal block 535 is coupled to a 520 PCB containing a thermal slug 522.
  • the thermal slug 522 provides a thermal coupling between the LED 510 and the thermal block 535.
  • the thermal block 535 is thermally coupled to heat sticks 540. This embodiment may provide a lower cost solution that also consumes less power vis-a-vis embodiments utilizing the thermoelectric cooler.
  • FIG. 6 illustrates an LED utilizing a liquid cooling system in accordance with one embodiment.
  • the LED 610 is thermally coupled to a thermal block 635.
  • the thermal block 635 is coupled to a liquid cooling system.
  • the liquid cooling system includes liquid in a liquid path 640 coupled to a heat exchanger 650 and the thermal block 635.
  • the liquid may be a refrigerant.
  • the liquid cooling system further comprises a fluid pump 660 to facilitate circulation of the liquid through the system. The liquid is heated as it passes through the thermal block 635.
  • FIG. 7 illustrates an LED utilizing a liquid cooling system in accordance with another embodiment.
  • a thermoelectric cooler 730 is thermally coupled between the thermal block 730 and the LED 710.
  • a liquid cooling system 740 is then utilized to cool the hot side of the thermoelectric cooler 730.
  • the above disclosed embodiments for cooling an LED may be part of a feedback loop. Feedback may be utilized to control the operation of an LED or the cooling of an LED.
  • a thermal sensor is placed near an LED, or thermally downstream from the LED (which is nonetheless indicative of the thermal state of the LED).
  • a thermal sensor is integral to a LED.
  • the thermal sensor may be characterized such that output from the thermal sensor is well correlated to a key temperature in the LED.
  • the output from the thermal sensor may be sent to a processor for processing.
  • the processing may involve generating control outputs to control a cooling controller.
  • the cooling controller may control any cooling device that can responsively affect cooling such as a thermoelectric cooler, a heat pump or a fan.
  • Algorithms utilized by the processor may be designed to improve any desired parameter such as LED lifetime, LED brightness, system acoustics, etc.
  • FIG. 8 illustrates an embodiment where a thermal sensor 830 is utilized to monitor the thermal output of an LED 810.
  • the thermal sensor 830 is on a thermally conductive printed circuit board 820 upon which the LED 810 is mounted.
  • the thermally conductive printed circuit board 820 is coupled to a thermoelectric cooler 835 and cooling system 850.
  • the thermal sensor 830 provides information to a processor 840 on the thermal output of the LED 810.
  • the processor 840 then acts to control a fan 870 forcing air over the heat exchanger in the cooling system 850, and/or to control the cooling system pump, and/or to control the TE cooler current based on the provided information.
  • FIG. 9 illustrates a system wherein thermal feedback is utilized to control the output of an LED 910, in accordance with one embodiment.
  • a thermal sensor 930 is thermally coupled to the LED 910.
  • Signals 935 from the thermal sensor 930 may be sent to a processor 940.
  • the processor 940 controls an LED driver 920 that, in turn, controls the LED 910.
  • the processor 940 may be executing software instructions containing algorithms designed to analyze the feedback thermal information from the thermal sensor 930 and provide control information to the LED driver 920. For example, if the LED 910 is too hot, the LED driver 920 may be instructed by the processor via a control value to attenuate the light output of the LED 910. This attenuation may be accomplished by the processor 940 "looking up" a new control value from a table stored in memory 945.
  • the table may contain control values for particular thermal information provided to the processor 940 by the thermal sensor 930.
  • control value may be a new current level to be provided to the LED 910 and the thermal information may be a measured temperature by the thermal sensor 930.
  • the control system may operate on the LED 910 until a desired temperature is obtained at the thermal sensor 930.
  • algorithms instead of lookup tables may be used to determine control information to be provided to the LED controller.
  • a processor 1040 may control both the power to the LED 1010 and the driver 1020 to the cooling device.
  • a light output monitor 1035 may provide information to the processor 1040 on the light output of the LED 1010.
  • the current is provided to the LED 1010 through signal traces in a circuit board 1060. It may be determined that it is undesirable to further reduce the light output of the LED 1010 by informing controller to decrease current to the LED 1010. In this case, it may be desirable to increase the cooling of the LED by the cooling system 1050.
  • a forced air cooling solution may increase the cooling of the LED 1010 by increasing the forced air flow 1070 across a heat exchanger.
  • projection system 1100 includes a projection engine having LED light sources 1102, a number of other optical components 1106 and projection lens 1108, optically coupled to each other as shown.
  • other optical components 1106 include in particular, a light valve (not explicitly shown).
  • projection system 1100 includes control block 1110 electrically coupled to control LED lights sources 1102 through LED controller 1112, LED cooling system 1114 and other optical components 1106.
  • LED Light sources 1102 are employed to provide a number of primary color light bundles.
  • the primary color light bundles comprise a red, a blue and a green light bundle.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Projection Apparatus (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
EP05742672A 2004-05-11 2005-05-06 Cooling for light emitting diode Withdrawn EP1745330A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/843,829 US7252385B2 (en) 2004-05-11 2004-05-11 Projection LED cooling
PCT/US2005/016018 WO2005111715A2 (en) 2004-05-11 2005-05-06 Cooling for light emitting diode

Publications (1)

Publication Number Publication Date
EP1745330A2 true EP1745330A2 (en) 2007-01-24

Family

ID=34967966

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05742672A Withdrawn EP1745330A2 (en) 2004-05-11 2005-05-06 Cooling for light emitting diode

Country Status (6)

Country Link
US (2) US7252385B2 (zh)
EP (1) EP1745330A2 (zh)
JP (1) JP4365436B2 (zh)
CN (3) CN100592196C (zh)
DE (1) DE202005007407U1 (zh)
WO (1) WO2005111715A2 (zh)

Families Citing this family (133)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4096896B2 (ja) * 2004-03-10 2008-06-04 セイコーエプソン株式会社 プロジェクタ
US7252385B2 (en) * 2004-05-11 2007-08-07 Infocus Corporation Projection LED cooling
US7299639B2 (en) * 2004-06-22 2007-11-27 Intel Corporation Thermoelectric module
US20060044524A1 (en) * 2004-08-31 2006-03-02 Feliss Norbert A System and method for cooling a beam projector
US20100096993A1 (en) * 2004-11-29 2010-04-22 Ian Ashdown Integrated Modular Lighting Unit
US20060151801A1 (en) * 2005-01-11 2006-07-13 Doan Trung T Light emitting diode with thermo-electric cooler
KR100683171B1 (ko) * 2005-03-08 2007-02-15 삼성전자주식회사 방열장치 및 그것을 구비하는 프로젝터
JP2006251149A (ja) * 2005-03-09 2006-09-21 Fujinon Corp 照明装置及び投写型画像表示装置。
KR100688978B1 (ko) * 2005-04-21 2007-03-08 삼성전자주식회사 영상투사장치
TWI301722B (en) * 2005-04-28 2008-10-01 Benq Corp Water-cooled projector
US20060279706A1 (en) * 2005-06-14 2006-12-14 Bash Cullen E Projection system
KR100628726B1 (ko) * 2005-07-26 2006-09-28 삼성전자주식회사 영상투사장치
KR101264675B1 (ko) * 2005-09-01 2013-05-16 엘지디스플레이 주식회사 Ｌｃｄ 검사 장비용 백라이트 유닛
TWI391600B (zh) * 2005-09-27 2013-04-01 Koninkl Philips Electronics Nv 發光二極體之照明燈具
DE102005060040A1 (de) * 2005-12-15 2007-06-21 BSH Bosch und Siemens Hausgeräte GmbH Schaltungsanordnung für ein Peltiermodul
JP4449894B2 (ja) * 2005-12-16 2010-04-14 セイコーエプソン株式会社 熱交換器、光源装置、プロジェクタおよび電子機器
US20100177519A1 (en) * 2006-01-23 2010-07-15 Schlitz Daniel J Electro-hydrodynamic gas flow led cooling system
TWI295115B (en) 2006-02-13 2008-03-21 Ind Tech Res Inst Encapsulation and methods thereof
CN100459194C (zh) * 2006-02-28 2009-02-04 财团法人工业技术研究院 封装结构与封装方法
DE102006011498A1 (de) * 2006-03-14 2007-09-20 Compal Communications, Inc. Leuchtanordnung für einen Bildprojektor
JP4812483B2 (ja) * 2006-03-23 2011-11-09 三洋電機株式会社 投写型映像表示装置
CN101063798B (zh) * 2006-04-27 2010-06-16 三洋电机株式会社 投射型视频显示装置
DE202006020360U1 (de) * 2006-05-04 2008-07-10 Compal Communications, Inc. Miniaturprojektionsbauteil
JP2008216579A (ja) * 2007-03-02 2008-09-18 Olympus Corp ホログラフィックプロジェクション方法及びホログラフィックプロジェクション装置
TWI333593B (en) * 2007-03-22 2010-11-21 Young Optics Inc Illumination module and projection apparatus
US7467882B2 (en) * 2007-05-17 2008-12-23 Kun-Jung Chang Light-emitting diode heat-dissipating module
WO2009008166A1 (ja) * 2007-07-12 2009-01-15 Panasonic Corporation 画像表示装置
TWI352253B (en) * 2007-07-24 2011-11-11 Delta Electronics Inc Projection apparatus
US8297061B2 (en) * 2007-08-02 2012-10-30 Cree, Inc. Optoelectronic device with upconverting luminophoric medium
CN101398601B (zh) 2007-09-28 2010-11-10 鸿富锦精密工业（深圳）有限公司 散热装置
US10655837B1 (en) 2007-11-13 2020-05-19 Silescent Lighting Corporation Light fixture assembly having a heat conductive cover with sufficiently large surface area for improved heat dissipation
US7810960B1 (en) 2007-11-13 2010-10-12 Inteltech Corporation Light fixture assembly having improved heat dissipation capabilities
US9080760B1 (en) 2007-11-13 2015-07-14 Daryl Soderman Light fixture assembly
US8789980B1 (en) 2007-11-13 2014-07-29 Silescent Lighting Corporation Light fixture assembly
US8534873B1 (en) 2007-11-13 2013-09-17 Inteltech Corporation Light fixture assembly
US7980736B2 (en) * 2007-11-13 2011-07-19 Inteltech Corporation Light fixture assembly having improved heat dissipation capabilities
US7878692B2 (en) * 2007-11-13 2011-02-01 Inteltech Corporation Light fixture assembly having improved heat dissipation capabilities
US8360614B1 (en) 2007-11-13 2013-01-29 Inteltech Corporation Light fixture assembly having improved heat dissipation capabilities
DE102007057056A1 (de) 2007-11-27 2009-05-28 Hella Kgaa Hueck & Co. Scheinwerfer für ein Kraftfahrzeug mit Mitteln zum Wärmeaustausch zwischen dem Innenraum und der Außenseite des Scheinwerfers
KR20090056089A (ko) * 2007-11-29 2009-06-03 삼성전자주식회사 냉각장치 및 이를 구비한 투사형 영상장치
CN101463984A (zh) 2007-12-17 2009-06-24 富士迈半导体精密工业（上海）有限公司 照明装置
KR20110034579A (ko) * 2008-01-16 2011-04-05 라이츠, 카메라, 액션 엘엘시 수중형 고조명 ｌｅｄ 광원
US20090195159A1 (en) * 2008-02-03 2009-08-06 Smith Jerry L Led cooling system
JP4525767B2 (ja) * 2008-02-14 2010-08-18 ソニー株式会社 照明装置及び表示装置
US8118456B2 (en) * 2008-05-08 2012-02-21 Express Imaging Systems, Llc Low-profile pathway illumination system
US8926138B2 (en) * 2008-05-13 2015-01-06 Express Imaging Systems, Llc Gas-discharge lamp replacement
JP5756752B2 (ja) 2008-07-03 2015-07-29 セルカコール・ラボラトリーズ・インコーポレイテッドＣｅｒｃａｃｏｒ Ｌａｂｏｒａｔｏｒｉｅｓ， Ｉｎｃ． センサ
US8515509B2 (en) 2008-08-04 2013-08-20 Cercacor Laboratories, Inc. Multi-stream emitter for noninvasive measurement of blood constituents
CN101644398B (zh) * 2008-08-05 2011-06-29 王钦戊 兼具快速储能与散热的led照明装置
US20100033689A1 (en) * 2008-08-11 2010-02-11 Texas Instruments Incorporated Cooling solution for a solid state light illuminated display
US8334640B2 (en) * 2008-08-13 2012-12-18 Express Imaging Systems, Llc Turbulent flow cooling for electronic ballast
US8087787B2 (en) * 2008-09-11 2012-01-03 Spatial Photonics, Inc. Maximizing performance of an electronic device by maintaining constant junction temperature independent of ambient temperature
CN101673034B (zh) * 2008-09-12 2011-05-04 鸿富锦精密工业（深圳）有限公司 投影机
KR101781399B1 (ko) 2008-11-17 2017-09-25 익스프레스 이미징 시스템즈, 엘엘씨 고체 상태 전등을 위한 전력을 조절하기 위한 전자 제어 및 그 방법들
US8240885B2 (en) * 2008-11-18 2012-08-14 Abl Ip Holding Llc Thermal management of LED lighting systems
US20100127299A1 (en) * 2008-11-25 2010-05-27 Cooper Technologies Company Actively Cooled LED Lighting System and Method for Making the Same
GB2465493B (en) * 2008-11-25 2011-07-27 Stanley Electric Co Ltd Liquid-cooled LED lighting device
JP2010272472A (ja) * 2009-05-25 2010-12-02 Stanley Electric Co Ltd Ｌｅｄ照明装置
JP2010272440A (ja) * 2009-05-25 2010-12-02 Stanley Electric Co Ltd 冷却式ｌｅｄ照明装置
GB2469551B (en) * 2009-04-15 2013-11-20 Stanley Electric Co Ltd Liquid-cooled led lighting device
DE202009005871U1 (de) * 2009-04-21 2010-09-16 Autokühler GmbH & Co. KG Thermoelektrische Wärmepumpe und damit hergestelltes Hausgerät zur Pflege von Wäschestücken
WO2010127138A2 (en) 2009-05-01 2010-11-04 Express Imaging Systems, Llc Gas-discharge lamp replacement with passive cooling
TW201043098A (en) * 2009-05-18 2010-12-01 Young Optics Inc Light-emitting apparatus and control method thereof
WO2010135575A2 (en) 2009-05-20 2010-11-25 Express Imaging Systems, Llc Long-range motion detection for illumination control
US8541950B2 (en) * 2009-05-20 2013-09-24 Express Imaging Systems, Llc Apparatus and method of energy efficient illumination
TW201104156A (en) * 2009-07-28 2011-02-01 Young Dong Tech Co Ltd Light emitting diode lighting device
US20110026264A1 (en) * 2009-07-29 2011-02-03 Reed William G Electrically isolated heat sink for solid-state light
US20110030754A1 (en) * 2009-08-06 2011-02-10 Laird Technologies, Inc. Thermoelectric modules and related methods
KR20110001935U (ko) * 2009-08-19 2011-02-25 주식회사 영동테크 모듈화 된 엘이디 등기구의 냉각 장치
TWI422276B (zh) * 2009-09-30 2014-01-01 Lumens Digital Optics Inc 發光二極體光源的投影機電力控制方法
KR101055095B1 (ko) * 2010-03-09 2011-08-08 엘지이노텍 주식회사 발광장치
DE102010012078A1 (de) * 2010-03-11 2011-09-15 Technische Universität Ilmenau Verfahren und Anordnung zur Stabilisierung des von einer Halbleiterlichtquelle emittierten Lichtes
WO2011117778A1 (en) 2010-03-22 2011-09-29 Koninklijke Philips Electronics N.V. Lighting system with cooling arrangement
WO2011163334A1 (en) 2010-06-22 2011-12-29 Express Imaging Systems, Llc Solid state lighting device and method employing heat exchanger thermally coupled circuit board
US9223193B2 (en) 2010-08-02 2015-12-29 Nec Display Solutions, Ltd. Projection type display apparatus and method of cooling light source
TWI467115B (zh) 2010-08-06 2015-01-01 Ind Tech Res Inst 具高散熱效能之光源裝置
US20120103574A1 (en) * 2010-11-01 2012-05-03 Mingwei Zhu Heating system utilizing waste heat from illuminating device
CN102102868B (zh) * 2010-11-18 2013-03-06 常州星宇车灯股份有限公司 车灯用大功率led的主动散热装置
TW201223426A (en) * 2010-11-25 2012-06-01 Delta Electronics Inc Cooling system for cooling a heat source and projector having the same
US8649179B2 (en) 2011-02-05 2014-02-11 Laird Technologies, Inc. Circuit assemblies including thermoelectric modules
DE102011004811A1 (de) * 2011-02-28 2012-08-30 Siemens Aktiengesellschaft Vorrichtung und Verfahren zum Erzeugen von Licht mit hoher Lichtintensität
US9067014B2 (en) 2011-03-04 2015-06-30 Becton, Dickinson And Company Attachment device for identifying constituents within a fluid
US8901825B2 (en) 2011-04-12 2014-12-02 Express Imaging Systems, Llc Apparatus and method of energy efficient illumination using received signals
US9055630B1 (en) 2011-07-21 2015-06-09 Dale B. Stepps Power control system and method for providing an optimal power level to a designated light assembly
US8643300B1 (en) 2011-07-21 2014-02-04 Dale B. Stepps Power control system and method for providing an optimal power level to a designated light fixture
US8610358B2 (en) 2011-08-17 2013-12-17 Express Imaging Systems, Llc Electrostatic discharge protection for luminaire
WO2013028834A1 (en) 2011-08-24 2013-02-28 Express Imaging Systems, Llc Resonant network for reduction of flicker perception in solid state lighting systems
US8922124B2 (en) 2011-11-18 2014-12-30 Express Imaging Systems, Llc Adjustable output solid-state lamp with security features
US9360198B2 (en) 2011-12-06 2016-06-07 Express Imaging Systems, Llc Adjustable output solid-state lighting device
US9497393B2 (en) 2012-03-02 2016-11-15 Express Imaging Systems, Llc Systems and methods that employ object recognition
US9210751B2 (en) 2012-05-01 2015-12-08 Express Imaging Systems, Llc Solid state lighting, drive circuit and method of driving same
US9204523B2 (en) 2012-05-02 2015-12-01 Express Imaging Systems, Llc Remotely adjustable solid-state lamp
CN102810620A (zh) * 2012-07-13 2012-12-05 重庆绿色科技开发有限公司 以半导体制冷片为支架封装的led
US9131552B2 (en) 2012-07-25 2015-09-08 Express Imaging Systems, Llc Apparatus and method of operating a luminaire
US8878440B2 (en) 2012-08-28 2014-11-04 Express Imaging Systems, Llc Luminaire with atmospheric electrical activity detection and visual alert capabilities
US8896215B2 (en) 2012-09-05 2014-11-25 Express Imaging Systems, Llc Apparatus and method for schedule based operation of a luminaire
JP2014067568A (ja) 2012-09-26 2014-04-17 Sony Corp 光源装置、投影装置
US9301365B2 (en) 2012-11-07 2016-03-29 Express Imaging Systems, Llc Luminaire with switch-mode converter power monitoring
US9210759B2 (en) 2012-11-19 2015-12-08 Express Imaging Systems, Llc Luminaire with ambient sensing and autonomous control capabilities
US9313849B2 (en) 2013-01-23 2016-04-12 Silescent Lighting Corporation Dimming control system for solid state illumination source
JP5723900B2 (ja) * 2013-02-04 2015-05-27 昭和電工株式会社 植物栽培方法
US9288873B2 (en) 2013-02-13 2016-03-15 Express Imaging Systems, Llc Systems, methods, and apparatuses for using a high current switching device as a logic level sensor
US9192001B2 (en) 2013-03-15 2015-11-17 Ambionce Systems Llc. Reactive power balancing current limited power supply for driving floating DC loads
US9466443B2 (en) 2013-07-24 2016-10-11 Express Imaging Systems, Llc Photocontrol for luminaire consumes very low power
US9414449B2 (en) 2013-11-18 2016-08-09 Express Imaging Systems, Llc High efficiency power controller for luminaire
US9185777B2 (en) 2014-01-30 2015-11-10 Express Imaging Systems, Llc Ambient light control in solid state lamps and luminaires
US9410688B1 (en) 2014-05-09 2016-08-09 Mark Sutherland Heat dissipating assembly
US9572230B2 (en) 2014-09-30 2017-02-14 Express Imaging Systems, Llc Centralized control of area lighting hours of illumination
WO2016064542A1 (en) 2014-10-24 2016-04-28 Express Imaging Systems, Llc Detection and correction of faulty photo controls in outdoor luminaires
US9380653B1 (en) 2014-10-31 2016-06-28 Dale Stepps Driver assembly for solid state lighting
US9644831B2 (en) * 2015-01-15 2017-05-09 Heraeus Noblelight America Llc Intelligent manifold assemblies for a light source, light sources including intelligent manifold assemblies, and methods of operating the same
CN104638199B (zh) * 2015-02-28 2017-10-10 北京维信诺科技有限公司 一种有机电致发光装置及其温度调节方法
US9462662B1 (en) 2015-03-24 2016-10-04 Express Imaging Systems, Llc Low power photocontrol for luminaire
JP6545991B2 (ja) * 2015-03-31 2019-07-17 株式会社小糸製作所 光源モジュール
US9538612B1 (en) 2015-09-03 2017-01-03 Express Imaging Systems, Llc Low power photocontrol for luminaire
US10655910B2 (en) 2015-12-22 2020-05-19 The Coca-Cola Company Beverage cooler with enhanced thermoelectric cooling modules
US9924582B2 (en) 2016-04-26 2018-03-20 Express Imaging Systems, Llc Luminaire dimming module uses 3 contact NEMA photocontrol socket
US9985429B2 (en) 2016-09-21 2018-05-29 Express Imaging Systems, Llc Inrush current limiter circuit
US10230296B2 (en) 2016-09-21 2019-03-12 Express Imaging Systems, Llc Output ripple reduction for power converters
FR3058503B1 (fr) * 2016-11-09 2019-01-25 Valeo Vision Dispositif lumineux equipe d'au moins un element peltier
US10794667B2 (en) 2017-01-04 2020-10-06 Rolls-Royce Corporation Optical thermal profile
US10098212B2 (en) 2017-02-14 2018-10-09 Express Imaging Systems, Llc Systems and methods for controlling outdoor luminaire wireless network using smart appliance
US10568191B2 (en) 2017-04-03 2020-02-18 Express Imaging Systems, Llc Systems and methods for outdoor luminaire wireless control
US11375599B2 (en) 2017-04-03 2022-06-28 Express Imaging Systems, Llc Systems and methods for outdoor luminaire wireless control
US10219360B2 (en) 2017-04-03 2019-02-26 Express Imaging Systems, Llc Systems and methods for outdoor luminaire wireless control
US10904992B2 (en) 2017-04-03 2021-01-26 Express Imaging Systems, Llc Systems and methods for outdoor luminaire wireless control
US10164374B1 (en) 2017-10-31 2018-12-25 Express Imaging Systems, Llc Receptacle sockets for twist-lock connectors
US11234304B2 (en) 2019-05-24 2022-01-25 Express Imaging Systems, Llc Photocontroller to control operation of a luminaire having a dimming line
US11317497B2 (en) 2019-06-20 2022-04-26 Express Imaging Systems, Llc Photocontroller and/or lamp with photocontrols to control operation of lamp
US11212887B2 (en) 2019-11-04 2021-12-28 Express Imaging Systems, Llc Light having selectively adjustable sets of solid state light sources, circuit and method of operation thereof, to provide variable output characteristics
US12114974B2 (en) 2020-01-13 2024-10-15 Masimo Corporation Wearable device with physiological parameters monitoring
CN114077133B (zh) 2020-08-12 2023-05-26 中强光电股份有限公司 投影装置及其控制方法
JP2023023762A (ja) * 2021-08-06 2023-02-16 パナソニックホールディングス株式会社 光源装置

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3761197A (en) * 1972-02-18 1973-09-25 D Kelly Variable speed vapor turbine
US3833297A (en) * 1972-03-13 1974-09-03 Sears Roebuck & Co Automatic brightness control for photographic projectors
US4011104A (en) * 1973-10-05 1977-03-08 Hughes Aircraft Company Thermoelectric system
AT349312B (de) * 1976-11-30 1979-03-26 Eumig Schalteinrichtung fuer projektionsleuchten
JPS5919382A (ja) 1982-07-26 1984-01-31 Fujitsu Ltd 発光ダイオ−ドの熱応答補償方式
US4829327A (en) * 1987-09-02 1989-05-09 Grunwald Peter H Overhead projector
JPH01166578A (ja) 1987-12-23 1989-06-30 Nec Corp 温度制御機能付ｌｅｄ駆動回路
JP3052318B2 (ja) * 1989-10-31 2000-06-12 セイコーエプソン株式会社 プロジェクタおよびその制御方法
JP2714205B2 (ja) * 1990-02-17 1998-02-16 キヤノン株式会社 複写装置
US5253260A (en) * 1991-12-20 1993-10-12 Hughes Aircraft Company Apparatus and method for passive heat pipe cooling of solid state laser heads
US5283694A (en) 1992-09-21 1994-02-01 Frady Richard A Line projector lens
US5918469A (en) * 1996-01-11 1999-07-06 Silicon Thermal, Inc. Cooling system and method of cooling electronic devices
KR100741690B1 (ko) * 1996-09-24 2007-07-23 세이코 엡슨 가부시키가이샤 투사표시장치 및 광원장치
JP3608428B2 (ja) * 1999-04-15 2005-01-12 セイコーエプソン株式会社 投写型表示装置
KR100540648B1 (ko) * 1999-05-17 2006-01-12 삼성전자주식회사 반사형 프로젝터
US6224216B1 (en) 2000-02-18 2001-05-01 Infocus Corporation System and method employing LED light sources for a projection display
US6401462B1 (en) * 2000-03-16 2002-06-11 George Bielinski Thermoelectric cooling system
JP2001264662A (ja) * 2000-03-16 2001-09-26 Fuji Photo Film Co Ltd カラーレーザディスプレイ
US6472828B1 (en) 2000-06-23 2002-10-29 Infocus Corporation Control for projector lamp heat dissipation
EP1193982A1 (en) * 2000-09-20 2002-04-03 Barco N.V. Projector with system for cooling the light modulators
GB2387025A (en) 2002-03-26 2003-10-01 Enfis Ltd LED and laser diode array cooling
JP2003295320A (ja) * 2002-04-04 2003-10-15 Hitachi Ltd 画像表示装置
AU2003235489A1 (en) * 2002-05-08 2003-11-11 Tom Mcneil High efficiency solid-state light source and methods of use and manufacture
US7369268B2 (en) * 2003-01-14 2008-05-06 Eastman Kodak Company Light source using large area LEDs
US7274043B2 (en) * 2003-04-15 2007-09-25 Luminus Devices, Inc. Light emitting diode systems
JP4016876B2 (ja) * 2003-04-23 2007-12-05 セイコーエプソン株式会社 プロジェクタ
US7128421B2 (en) * 2004-03-29 2006-10-31 Infocus Corporation Thermal management of projection apparatus
US7252385B2 (en) * 2004-05-11 2007-08-07 Infocus Corporation Projection LED cooling
US6978828B1 (en) * 2004-06-18 2005-12-27 Schlumberger Technology Corporation Heat pipe cooling system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2005111715A2 *

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US7553028B2 (en) 2009-06-30
WO2005111715A3 (en) 2005-12-22
DE202005007407U1 (de) 2005-11-10
CN101852976B (zh) 2013-01-09
US7252385B2 (en) 2007-08-07
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CN2872591Y (zh) 2007-02-21
US20050254013A1 (en) 2005-11-17

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