CN100592196C - 投射发光二极管的冷却 - Google Patents

投射发光二极管的冷却 Download PDF

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CN100592196C
CN100592196C CN200580015335A CN200580015335A CN100592196C CN 100592196 C CN100592196 C CN 100592196C CN 200580015335 A CN200580015335 A CN 200580015335A CN 200580015335 A CN200580015335 A CN 200580015335A CN 100592196 C CN100592196 C CN 100592196C
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led
emitting diode
light emitting
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CN1957296A (zh
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T·斯科特·恩格尔
大卫·E·斯洛博丁
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/16—Cooling; Preventing overheating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Life Sciences & Earth Sciences (AREA)
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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
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Abstract

本发明提供了投射发光二极管的冷却。本文描述了包括发光二极管(LED)和冷却装置的投射设备。

Description

投射发光二极管的冷却
技术领域
本发明涉及投射领域，具体地涉及将发光二极管(LED)作为光源的使用以及对发光二极管的冷却。
背景技术
LED的使用已经增加。特别地是，对使用LED作为投射引擎/系统的光源的兴趣增长了。该增长在很大程度上是由于LED的光输出的增大所导致的。在历史上，LED的低光输出使得它们对于在需要相当大的光输出的应用(例如，在室外应用中)中的使用是不实际的。然而，随着LED光输出持续增大，LED正在越来越多的领域中得到应用。
LED的视光输出取决于许多因素。这种因素包括LED相对于光心的视角以及LED的亮度。LED的亮度本身是许多因素的函数。例如，该亮度会受被传送到LED的电流的量和LED的结(junction)温的影响。
附图说明
以下参照附图对本发明的实施例进行描述，在这些附图中，类似的标符表示类似的要素，在附图中：
图1例示了作为结温的函数的特定绿LED的相对光输出；
图2例示了根据一个实施例的包括针对LED的冷却装置的装置；
图3例示了根据一个实施例的具有另选结构的LED；
图4例示了根据另一实施例的利用冷却棒的LED冷却场景；
图5例示了在没有热电冷却器的情况下连接有热块的LED冷却系统；
图6例示了根据一个实施例的利用液体冷却系统的LED；
图7例示了根据另一实施例的利用液体冷却系统的LED；
图8例示了利用热传感器来监测LED的热输出的实施例；
图9例示了根据一个实施例的利用热反馈来控制LED的输出的系统；以及
图10例示了根据另一实施例的利用热反馈来控制LED的输出的系统。
图11例示了根据本发明一个实施例的用于投射图像的投射系统的框图。
具体实施方式
在以下详细说明中，公开了用于对发光二极管(LED)进行冷却的新方法和新设备。在本说明中，参照了构成本说明的一部分的附图，在所有附图中，类似的标号表示类似的部分，并且在附图中以例示的方式示出了可以实践本发明的具体实施例。应当明白，在不脱离本发明的范围的情况下可以使用其他实施例并进行结构或逻辑变化。因此，以下详细说明不具限制意义，本发明的范围由所附权利要求及其等同物来限定。
通常利用在特定结温(即，LED的发光部分的温度)下的某个光输出特性来对LED进行评定。例如，可以将LED评定为在25摄氏度下针对它的光输出具有100％的值(例如，归一化的)。对于结温的其他值，可以相对于该值来确定光输出。图1例示了作为结温的函数的特定绿LED的相对光输出。通常，随着结温的升高，相对光输出值相对于25摄氏度下的值减小。例如，特定绿LED可能在70摄氏度下具有它的25摄氏度值的80％的相对光输出183。特定绿LED可能在120摄氏度下仅具有它的25摄氏度值的60％的相对光输出185。
由此，与未被冷却的LED相比，对LED进行冷却可以提供产生更大的光输出的能力。可以使用各种方法来对LED进行冷却。例如，可以将热沉耦合到LED。作为另一种选择，可以使用强制空气来对LED进行冷却。尽管这些方法可以使结温降低，但是结温的降低可能不能达到获得目标光输出的足够温度。如本文所公开的，可以使用附加方法来产生更大的LED的结温的降低，从而允许LED的光输出增大。
图2例示了根据一个实施例的包括LED的冷却装置的装置。在所例示的实施例中，将LED 210通过热传导路径热耦合(couple)到热电冷却器230(例如，珀尔帖装置)。该热传导路径可以是隔热基板224中的传热片(thermal conductive slug)222。在另一实施例中，将LED直接耦合到热电冷却器。将该热电冷却器的冷端232热耦合到LED 210。在所例示的实施例中，将热电冷却器的热端234耦合到热沉240。将该热沉布置于强制气流250中，以提供更大的冷却。然而，在另选实施例中，可以利用自然对流而非强制对流来对热沉进行冷却。在其他实施例中，可以在不使用热沉的情况下利用强制气流来对热电冷却器直接进行冷却。还要注意，尽管将热沉240例示为物理地耦合到热电冷却器230，但是在另选实施例中该耦合可以在本质上仅仅是热耦合。
热电冷却器的热端的温度可能显著高于未冷却LED的温度。由此，可以使用更广泛的消散该较高温度的方法。例如，可以使用更大的热沉来对热电冷却器和LED都进行冷却。然而，就获得更高光输出的所得机会方面，对更大热沉的增加支出是否合理进行确定。
图3例示了根据一个实施例的具有另选结构的LED。如图3所示，将LED 310安装在具有金属核心(例如铝核心)的印刷电路板320上。将该印刷电路板320耦合到热电冷却器330。接着将该热电冷却器330耦合到热块335。在热块335内容纳有几根冷却棒340的端部。这些冷却棒340是内部具有制冷剂的空心棒。将这些冷却棒340的另一端部布置于强制气流350中。当在热块内部制冷剂受热时，它蒸发并被传送到位于强制气流中的热棒的较冷侧344。然后蒸汽液化，然后较冷的液化液体被传送回到这些热棒的较热侧342。
图4例示了根据另一实施例的利用冷却棒的LED冷却场景。在本实施例中，将多根冷却棒440的不在热块中的一侧耦合到一个或更多个热沉460。然后利用这些热沉460将通过所述多根冷却棒440传送到这些热沉460的热散去。该冷却过程可以是通过热沉外的热的自然对流。作为另一种选择，可以在热沉460的周围存在提供强制对流冷却的强制空气环境450。
图5例示了在没有热电冷却器的情况下连接有热块的LED冷却系统。在该更被动的实施例中，将热块535耦合到含有散热片(thermal slug)522的PCB 520。该散热片522提供了在LED 510与热块535之间的热耦合。将该热块535热耦合到多根热棒540。本实施例可以提供较低成本的解决方案，该解决方案与利用热电冷却器的实施例相比还消耗更少的电力。
图6例示了根据一个实施例的利用液体冷却系统的LED。将LED 610热耦合到热块635。将热块635耦合到液体冷却系统，在所例示的实施例中，该液体冷却系统包括耦合到换热器650和热块635的液体路径640中的液体。在一个实施例，该液体可以是制冷剂。该液体冷却系统还包括促进该液体在该系统中循环的流体泵660。该液体在经过热块635时被加热。加热后的液体被泵送到换热器650。利用该换热器650对该液体进行冷却。在所例示的实施例中，由强制空气670来辅助对液体的冷却。
图7例示了根据另一实施例的利用液体冷却系统的LED。为了进一步促进对LED 710的冷却，将热电冷却器730热耦合在热块730与LED710之间。然后利用液体冷却系统740来对热电冷却器730的热端进行冷却。
以上公开的用于对LED进行冷却的实施例可以是反馈环的一部分。可以利用反馈来对LED的操作或对LED的冷却进行控制。在一个实施例中，在LED附近或LED的热下游(其仍然指示LED的热状态)设置热传感器。在另一实施例中，将热传感器集成到LED。该热传感器可以具有如下的特征：使得来自该热传感器的输出与LED中的关键温度很相关。可以将来自该热传感器的输出发送给处理器以进行处理。该处理可以包括生成控制输出以对冷却控制器进行控制。该冷却控制器可以对能够响应性地影响冷却的任何冷却装置(如热电冷却器、热泵或风扇)进行控制。可以对由该处理器使用的算法进行设计，以改进诸如LED使用寿命、LED亮度、系统声学特性等的任何期望的参数。
图8例示了利用热传感器830来监测LED 810的热输出的实施例。在本实施例中，热传感器830位于热传导印刷电路板820上，在该热传导印刷电路板820上安装有LED 810。将该热传导印刷电路板820耦合到热电冷却器835和冷却系统850。热传感器830向处理器840提供与LED 810的热输出有关的信息。然后处理器840进行动作，以基于所提供的信息对风扇870(其对通过冷却系统850中的换热器上方的空气进行强制)进行控制，并且/或者对冷却系统泵进行控制，并且/或者对TE冷却电流进行控制。
图9例示了根据一个实施例的利用热反馈来控制LED 910的输出的系统。将热传感器930热耦合到LED 910。可以将来自热传感器930的信号935发送给处理器940。处理器940对LED驱动器920进行控制，LED驱动器920接着对LED 910进行控制。处理器940可以执行含有被设计成对来自热传感器930的反馈热信息进行分析的算法的软件指令，并向LED驱动器920提供控制信息。例如，如果LED 910太热，则可以由该处理器通过控制值指示LED驱动器920以使LED 910的光输出减小。可以通过处理器940从存储在存储器945中的表中“查找”新控制值来实现该减小。该表可以含有针对由热传感器930提供给处理器940的特定热信息的控制值。在一个实施例中，该控制值可以是待提供给LED910的新电流电平，该热信息可以是由热传感器930测得的温度。本控制系统可以对LED 910进行操作，直到在热传感器930处获得了期望的温度。在另一实施例中，可以使用算法而非查找表来确定待提供给LED控制器的控制信息。标题为“LED PROJECTOR DRIVE SCHEMES”的共同未决申请(其被同时提交)提供了与LED驱动方案有关的信息。将其说明书通过引用全部并入于此。
图10例示了根据另一实施例的利用热反馈来控制LED 1010的输出的系统。在本实施例中，通过热传感器1030对LED 1010的温度进行监测，处理器1040可以对到LED 1010的电力和对到冷却装置的驱动器1020进行控制。例如，光输出检测器1035可以向处理器1040提供与LED 1010的光输出有关的信息。在所例示的实施例中，通过电路板1060中的信号示踪器(traces)向LED 1010提供电流。可以通过通知控制器减小到LED1010的电流来确定不期望进一步减小LED 1010的光输出。在此情况下，可能期望增强冷却系统1050对LED的冷却。例如，强制空气冷却解决方案可以通过增强经过换热器的强制气流1070来增强对LED 1010的冷却。
图11例示了根据本发明一个实施例的用于投射图像的投射系统1100的框图。如例示的那样，对于本实施例，投射系统1100包括投射引擎，该投射引擎具有LED光源1102、如所示出的那样相互光学地耦合的许多其他光学组件1106以及投射透镜1108。在各种实施例中，其他光学组件1106具体包括光阀(未明确地示出)。此外，对于本实施例，投射系统1100包括通过LED控制器1112、LED冷却系统1114以及其他光学组件1106电耦合的控制块1110，以对LED光源1102进行控制。
使用LED光源1102来提供大量基色光束。在各种实施例中，这些基色光束包括红、蓝以及绿光束。在另选实施例中，可以替代地提供其他基色光束。
尽管这里出于对优选实施例进行说明的目的而对具体实施例进行了例示和描述，但是本领域的普通技术人员将理解，在不脱离本发明的范围的情况下意图实现相同目的的广泛的各种变化和/或等同实现可以取代所示出和说明的具体实施例。本领域的技术人员容易理解，可以在广泛的各种实施例中实现本发明。本申请旨在覆盖对这里讨论的实施例的任何修改或变化。因此，显然本发明只受所附权利要求及其等同物的限制。

Claims (4)

1、一种投射设备，该投射设备包括：
产生投射用光的发光二极管；
耦合到所述发光二极管以向所述发光二极管供给功率的电源；
热耦合到所述发光二极管的热传感器，其被配置为基于所述发光二极管的热状况来提供输出；
热耦合到所述发光二极管的冷却系统；以及
耦合到所述热传感器的处理器，其被配置为基于从所述热传感器接收的所述输出，以减小供给到所述发光二极管的所述功率的方式来控制所述电源并且控制所述冷却系统以冷却所述发光二极管，其中，所述处理器被进一步配置为基于从所述热传感器接收的所述输出，通过从查找表中查找功率值来减小供给到所述发光二极管的所述功率。
2、根据权利要求1所述的投射设备，其中，所述冷却系统包括液体冷却系统。
3、根据权利要求1所述的投射设备，其中，所述冷却系统包括热电冷却器。
4、根据权利要求1所述的投射设备，还包括：
耦合到所述处理器的光输出监测器，其被配置为向所述处理器提供与所述发光二极管的光输出有关的信息；并且
所述处理器被进一步配置为：
基于所述发光二极管的光输出来确定不期望进一步减小所述发光二极管的光输出；并且
基于所述确定，利用所述冷却系统来增强对所述发光二极管的冷却。
CN200580015335A 2004-05-11 2005-05-06 投射发光二极管的冷却 Active CN100592196C (zh)

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JP2007537490A (ja) 2007-12-20
JP4365436B2 (ja) 2009-11-18
US20080007696A1 (en) 2008-01-10
CN101852976A (zh) 2010-10-06
US7553028B2 (en) 2009-06-30
WO2005111715A3 (en) 2005-12-22
DE202005007407U1 (de) 2005-11-10
CN101852976B (zh) 2013-01-09
US7252385B2 (en) 2007-08-07
EP1745330A2 (en) 2007-01-24
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CN2872591Y (zh) 2007-02-21
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