EP1723669A1 - Cellule de memoire eeprom destinee a des temperatures elevees - Google Patents

Cellule de memoire eeprom destinee a des temperatures elevees

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Publication number
EP1723669A1
EP1723669A1 EP05716998A EP05716998A EP1723669A1 EP 1723669 A1 EP1723669 A1 EP 1723669A1 EP 05716998 A EP05716998 A EP 05716998A EP 05716998 A EP05716998 A EP 05716998A EP 1723669 A1 EP1723669 A1 EP 1723669A1
Authority
EP
European Patent Office
Prior art keywords
memory cell
region
transistor
selection transistor
programmable read
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05716998A
Other languages
German (de)
English (en)
Inventor
Steffen Richter
Sonja Richter
Dirk Nuernbergk
Dagmar Kirsten
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
X Fab Semiconductor Foundries GmbH
Original Assignee
X Fab Semiconductor Foundries GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by X Fab Semiconductor Foundries GmbH filed Critical X Fab Semiconductor Foundries GmbH
Publication of EP1723669A1 publication Critical patent/EP1723669A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
    • H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices

Definitions

  • the invention relates to an EEPROM memory cell (electrically erasable programmable read-only memory) for high temperatures, which is produced with MOS transistors based on SOI technology (silicon on insulator)
  • Transistors made on an SOI substrate have certain advantages over transistors made on a solid semiconductor substrate, such as avoiding a parasitic thyristor structure, smaller parasitic capacitances, increased immunity to high-energy radiation, and the like make SOI technology an attractive alternative to components on solid semiconductor substrates.
  • SOI-MOS transistors there are certain SOI-specific restrictions due to the desired complete isolation from neighboring components.
  • FIG. 1 shows two n-channel transistors which are designed for different voltages.
  • FIG. 1 shows an SOI structure 100, which has a silicon substrate 1 01, on which an insulating layer 102, which is also referred to as a buried oxide layer, is formed.
  • Two transistor structures 1 10 and 120 are formed on the oxide layer 102, the transistor structure 1 10 having a heavily n-doped drain region 1 1 1 and a heavily n-doped source region 1 12, which is formed by a slightly p-doped inner active region 1 13 , which is also referred to as a body and in which a conductive n-channel is also formed during the operation of the transistor 110, are separated.
  • a gate 1 14 is arranged, which is separated from the inner active region 1 13 and from the drain and source region 1 1 1, 1 12 by an insulating layer 1 1 5, which also acts as a gate oxide is referred to, is electrically insulated. Furthermore, the transistor 1 1 0 has a contact region 1 16, which is connected to the inner active region 1 13, which is also referred to as a body.
  • the transistor structure 1 10 shown has an essentially symmetrical structure with respect to the drain region 1 1 1 and the source region 1 12.
  • the transistor structure 120 has a heavily n-doped drain region 121 and a heavily n-doped source region 122, a less doped extension or drift region 127 being provided in the drain region 121.
  • the drain region 21 adjoins an inner active region 123 with its drift region 127, so that the resulting PN junction 128 between the regions 123 and 127 results in a lower dopant concentration gradient than with the corresponding PN junction 129 of the source region 122 the inner active region 123 is the faii. Furthermore, the transistor 120 has a contact region 126 which is connected to the inner active region 123 and the source region 22. A gate 124 disposed over the inner active region 123 is isolated by an insulating layer 125 from the inner active region 123, the drift region 127 and the source region 122.
  • the drain region of the transistor 110 can be supplied with a positive supply voltage, for example 5 volts, while the source region 112 is at zero potential.
  • a suitable control voltage to the gate electrode 114, a conductive channel is built up in the inner region 113 in the vicinity of the boundary layer to the insulating layer 115. The conductivity of the channel depends on the control voltage and one determined by the transistor structure
  • threshold voltage Characteristic, which is referred to as threshold voltage or threshold voltage. That is, as soon as the control voltage at the gate electrode 114 exceeds the threshold voltage, the conductive channel builds up in the inner active region 113 and allows a current to flow between the drain region 111 and the source region 112.
  • the control voltage is applied to the gate electrode 114, for example When a rising edge is applied from 0 volts to 5 volts, a high electric field results, in particular on the drain side, that is to say on the parasitic capacitance which is formed by the gate electrode 114 and the drain region 111 with the gate oxide layer 115 therebetween as a dielectric high drain voltages means that the electrons can receive a sufficiently high kinetic energy so that penetration or even penetration of the gate oxide layer 115 is possible.
  • the inner active region for example regions 113 and 123, is not necessarily contacted. As shown in FIG. 1, however, it is possible to connect these areas by means of the corresponding contact areas 116, 126 or to let them float freely.
  • MOS transistors with a floating body potential are referred to as floating bodies (FB components), while transistors whose contact regions 116, 126 are connected, i. H. are supplied with a reference potential, typically referred to as body-tied (BT) transistors.
  • FB components floating bodies
  • BT body-tied
  • the contact area 116 or 126 is typically connected to the respective source area. If the respective contact regions 116, 126 remain unconnected, an avalanche generation, ie. H.
  • the electrons - the electrons caused by the generated electron-hole pairs also flow away via the drain.
  • the other type of load - d. H. in the case of the n-channel transistors shown the holes remain in the inner active region 113 or 123, so that charging occurs there. This can lead to a change in the
  • FIG. 2 schematically shows the circuit diagram of an EEPROM memory cell 200 for applications with temperatures up to approximately 150 ° C.
  • the memory cell 200 is constructed from two n-channel MOS transistors, which have a structure similar to that shown in FIG. 1 Transistors 110 and 120. Here, the represents
  • Transistor 110 is a memory transistor, the structure of transistor 110 being modified compared to FIG. 1 in such a way that a further conductive layer 118 is provided, which is electrically isolated from the gate electrode 114 and the inner active region 113.
  • the electrically conductive layer 118 is also referred to as a floating gate.
  • the drain 111 of the memory transistor 110 there is a small area (not shown) with thin oxide through which a tunnel current flow can start if a sufficiently high drain voltage leads to a corresponding acceleration of the channel charge carriers and thus to a correspondingly high probability of penetration leads to the thin oxide surface, as previously explained.
  • the area with thin oxide is also referred to as an injector window, the corresponding part of the drain region 111 being accordingly referred to as an injector.
  • the information of the memory cell 200 is stored in the form of a threshold voltage shift, i. h, by introducing channel charge carriers into the floating gate 118, a corresponding applied control voltage applied to the gate 114 (positive voltage) is shielded, so that a higher voltage is required to establish a conductive channel. Conversely, when positive charge carriers are introduced into the floating gate 118, the formation of a conductive channel can be brought about without the need for an additional control voltage at the gate electrode 1 4.
  • Fowler-Nordheim tunnels where Fowler-Nordheim theory quantitatively quantifies the quantum mechanical effect of penetrating a potential barrier Load carrier describes.
  • the selection transistor 120 In order to be able to carry out the various operating states of the memory cell 200, i.e. programming, erasing, reading out, in a controlled manner for a large number of interconnected memory cells, the selection transistor 120 is required, which essentially has the same structure as the transistor 120 from FIG 1. Furthermore, the selection transistor 120 has its source region 122 connected to the drain region 111 of the memory transistor 110, in order thereby to form a node 201. During programming, a suitably high voltage sufficient for triggering tunnel currents is now applied to the gate 124 of the selection transistor 120, which is also referred to as a selection gate (SG) and to the drain 121 (D).
  • SG selection gate
  • D drain 121
  • the gate 114 of the memory transistor 110 which is also referred to as a control gate (CG), remains at 0 volts.
  • the source region 112 of the memory transistor 110 (S) remains unconnected. Due to the high drain voltage, which over the when the selection transistor 120 is also connected to the node 201 and thus to the drain 111, a high electric field results for the control gate 114 which is at 0 volts, so that electrons flow from the floating gate 118 as a result of the tunnel effect, so that the floating gate is positively charged becomes. This positive charge remains even after the
  • the floating gate 118 is negatively charged even after the programming voltage on the gate 114 has been switched off, so that the threshold voltage shifts to high values, since a higher gate voltage is now required at the control gate 114 in order to open a conductive channel in the inner active region 113 of the memory transistor 110.
  • CG * When reading out the memory cell 200, a constant voltage is present at the control gate 114 (CG *), for example 0 volts, while a voltage of, for example, 5 volts is present at the selection gate 124 (SG) and at the drain 121 (D) of the selection transistor 120, while the source 121 of the memory transistor 110 is at 0 volts.
  • the states "erased” and “written” can now be distinguished on the basis of the current flow that is starting, since for a given voltage at the control gate 114 (CG), for example 0 volts, essentially none in the erased state Current flows while current flows through memory transistor 110 in the programmed state.
  • the EEPROM cell 200 is operated at high temperatures, ie at temperatures of approximately 150 ° C., there is a high thermal generation rate of electron-hole pairs, in particular in the drift region 127, which leads to an increased leakage current to the source 122 of the selection transistor 120 and thus leads to the inner node 201, so that it charges up to the voltage present at the drain 121.
  • EEPROM memories available on the market, which are suitable for applications at higher temperatures, memory cells are therefore used which have an additional transistor which connects the inner node 201 of an unselected memory cell to ground potential during critical operations, in order to thereby cause charging of the inner node 201 and thus to prevent a corresponding unintentional corruption of data.
  • the invention has for its object to provide a Teehnik that allows a more space-efficient construction of an EEPROM memory cell for high temperature applications.
  • this object is achieved by an electrically erasable programmable read-only memory cell (EEPROM memory cell) using SOI technology, which is also suitable for high temperatures, the memory cell comprising a MOS memory transistor with a floating or Has floating gate. Furthermore, the memory cell has a MOS selection transistor which is designed as a high-voltage transistor and which has a polysilicon gate electrode, a drain region with a connection and a source region, an inner active region with a contact arranged below the gate electrode, a drift region additionally being provided in the source region , so that there are diodes at PN junctions between the drain region and the inner active region and between the source region and the inner active region. The Diodes are due to the separately contacted body, not to the drift area.
  • the structure of the selection transistor according to the invention results in an arrangement in which a thermally generated leakage current is now also generated on the source side of the selection transistor, so that the conventionally pointing to the source and thus the inner node (see FIG. 2, node 201 ) charging leakage current can be compensated to a high degree by the leakage current generated in the source region, whereby at high temperatures, i. H. in a range of approximately 100 to 200 ° C, a very high degree of compensation can be achieved, since the thermal components of the leakage currents dominate here.
  • the electrically erasable programmable read-only memory cell has no more than two MOS transistors. Due to this structure, the memory cell can be constructed in an extremely space-efficient manner.
  • the contact is designed such that a potential can be freely applied to it.
  • the contact which is connected to the inner active region of the selection transistor, can thus be connected to a suitable reference potential, for example the ground potential, if necessary, in order to avoid or reduce any charging of the inner active region of the selection transistor, so that effects on the threshold voltage of the selection transistor resulting from a possible charging of the inner active region can be avoided or at least reduced.
  • the selection transistor has a drift region in its drain region.
  • the selection transistor has a high dielectric strength, so that reliable operation is ensured.
  • the drain region and the source region of the selection transistor are essentially symmetrical to one another. Due to this structure, there is a high degree of symmetry even with the leakage currents occurring at high temperatures, so that a high Degree of compensation and thus a minimization of the charge of the inner node can be achieved.
  • the aforementioned object is achieved by an electrically erasable programmable read-only memory cell (EEPROM memory cell) using SOI technology, the memory cell having a floating gate MOS memory transistor and a selection transistor.
  • the selection transistor comprises a drain region with a connection and a source region and an inner region which is arranged between the drain region and the source region and which is connected to a freely assignable connection.
  • a thermally induced leakage current which starts from the drain to the inner active region and from the source to the inner active region, can be reliably derived, since the freely assignable connection connects the inner active region to one any reference potential, such as ground potential.
  • a drift area is provided in each case in the drain area and the source area.
  • the required high-voltage stability of the selection transistor can be achieved with this arrangement.
  • the drainage area and the source area are advantageously constructed essentially symmetrically to one another.
  • a high degree of symmetry in transistor behavior can be achieved, in particular with regard to the thermally generated leakage currents at high temperatures, so that the data integrity of the EEPROM memory cell is reliably ensured, particularly at very high temperatures.
  • the EEPROM memory cell has no more than two transistor structures, which results in an extremely compact and area-efficient memory cell structure.
  • the aforementioned object is achieved by a method for operating an electrically erasable programmable read-only memory cell (EEPROM memory cell).
  • the method includes providing a floating gate memory transistor made in SOI technology and a selection transistor, and connecting an inner active region of the selection transistor, which can be freely supplied with a potential, with a specified reference potential during at least one specified functional state of the memory cell in order to generate thermally generated Derive leakage currents in the selection transistor.
  • this method allows the data integrity of the EEPROM memory cell to be maintained even at very high temperatures, since a charge due to thermally induced leakage currents can at least be reduced, with an adverse effect of possible charging of the inner active region of the
  • Selection transistor can be avoided efficiently at least temporarily by deriving appropriate leakage currents.
  • the at least one specified functional state comprises a read state.
  • the object is achieved by a method for producing an electrically erasable programmable read-only memory cell.
  • the method includes forming a floating gate memory transistor on an SOI substrate, forming a selection transistor on the SOI substrate, and forming a contact region that is isolated from a drain region and a source region of the selection transistor and is connected to an inner active region of the selection transistor is.
  • forming the selection transistor comprises: forming the drain region with a drift region and forming the source region with a drift region.
  • the method further comprises forming a connection which can be connected to a potential source external to the memory cell and is electrically connected to the contact area.
  • FIG. 1 shows a perspective view of an SOI structure with two n-channel MOS transistors
  • FIG. 2 shows schematically as a circuit diagram the structure of a known EEPROM memory cell with transistor structures which are similar to those in FIG. 1,
  • FIG. 3 schematically shows a circuit diagram of a transistor structure for an EEPROM memory cell for high temperatures according to a first embodiment of the invention
  • FIG. 4 shows a comparison of a conventional unidirectional high-voltage selection transistor, in which the inner active region and the source region are connected, against a bidirectional high-voltage selection transistor, in which a contact for the inner active region is led out separately, according to a first embodiment of the Invention,
  • FIG. 6 shows a top view and two sectional views of a typical SOI memory transistor as can be used in the memory cell according to the invention
  • 7b shows a top view of selection transistors according to illustrative embodiments of the invention, the inner active region being contacted separately and a drift region being provided on the source side
  • 7c is a top view of a typical conventional selection transistor
  • FIG. 8 is a top view and a sectional view of a memory cell with a memory transistor and a selection transistor according to an illustrative embodiment of the present invention.
  • an EEPROM memory cell structure in which a memory transistor with a floating gate and a selection transistor with a freely assignable connection for an inner active region and with an additional drift region in the source region of the selection transistor are provided.
  • FIG. 3 schematically shows a circuit diagram of a transistor structure for an EEPROM memory cell 300 according to an illustrative embodiment of the present invention.
  • the memory cell 300 has a memory transistor 310 and a selection transistor 320. In a particularly advantageous embodiment, no further transistor structures are provided in the memory cell 300.
  • the memory transistor 310 has a source S, a control gate or control gate CG, a floating gate 1 and a drain region which is connected to an inner node 2.
  • the structure of the memory transistor 310 is similar to the memory transistor 210 as described with reference to FIGS. 2 and 1, so that a more detailed description is omitted.
  • a typical structure of the memory transistor 310 is also shown by way of example in FIG. 6, in which the top view and two sectional views are shown.
  • the selection transistor 320 comprises a selection gate SG, a drain region D (with 321) with a drift region 327, a source region 322 with a drift region 3, the source region 322 being connected internally to the inner node 2. Furthermore, the transistor 320 has an inner active region 123 (see FIG. 1) which can be subjected to any potential by means of a connection B. Other structural features of selection transistor 320 are similar to that
  • FIG. 7a shows a top view of an exemplary embodiment of the selection transistor 320, wherein the terminal B, which is referred to as a body contact, is provided on one side in the transistor width direction, while in FIG. 7b two contacts are shown.
  • a typical conventional selection transistor with a body contact is on in FIG. 7c shown on the source side and without extension or extension area on the source side.
  • the control gate CG being at 0 volts for example, the drain D and the selection gate SG being at 5 volts
  • the terminal B and thus the inner active region of the selection transistor 320 can also be at a suitable reference potential, for example 0 volts be placed in such a way that charging of the inner active region caused by thermal leakage currents is avoided and thus a stable functioning of the selection transistor 320 is also guaranteed in the reading mode.
  • the EEPROM memory cell 300 according to the invention in the same way as that conventional high-temperature memory cell with three transistors can be controlled for the individual functional states.
  • FIG. 4 shows a comparison of a conventional high-voltage selection transistor, which is represented by the selection transistor 220 (see FIG. 2), against a bidirectional high-voltage selection transistor according to the invention, which is represented by the transistor 320 (see FIG. 3).
  • the source region 222 is connected to the inner active region (body) of the transistor, so that only a PN junction acts as a diode, as shown in the figure.
  • a leakage current E AK is generated, which is shown in the figure as a variable current source.
  • electron-hole pairs are generated by thermal energy, whereby the electrons (for an N-channel transistor) can flow off via the drain D as the holes migrate to the inner active region, as indicated by the arrow direction of the variable
  • the inner active region is not connected to the source region 322, but rather can be acted upon with a reference potential via a separate, freely-usable connection B. Accordingly, a PN junction occurring from the inner active region to the source region 322 is also effective, which is represented in the drawing by the diodes D1 and D2. Due to the structure of the transistor 320 with the additional drift region 3 in the source region 322, corresponding leakage currents are also produced there at higher temperatures, as is shown by the additional variable current source in the figure. When the electrons flow from the source region 322 at a drain current, a leakage current to the inner active region begins, so that essentially a charge of the
  • FIG. 5 qualitatively shows the behavior of the transistors 220 and 320 from FIG. 4 when they are operated over a wide temperature range from -50 to + 200 ° C.
  • the solid line shows the voltage of transistor 220 at its source 222 when the drain voltage is 5 volts and the voltage at the selection gate SG is 0 volts. It can be clearly seen that at temperatures above 100 ° C., the voltage at source 222 rises sharply, so that the corresponding node (see node 201 in FIG. 2) is also charged and thus leads to undesired programming of the memory transistor can. In contrast, the dashed curve shows the corresponding
  • the EEPROM memory cell structure according to the invention can be constructed using conventional manufacturing methods, the corresponding method steps and lithography masks as used for the formation of the drain region including the corresponding drift region * ', too can be used for the formation of the source region if a symmetrical structure of the transistor cell is desired. Furthermore, in the step of forming the contact area of the selection transistor, a corresponding change in the
  • FIG. 8 schematically shows a corresponding top view and a sectional view of a memory cell according to an illustrative embodiment, in order to clarify how the layout design can be realized during manufacture.
  • the present invention thus provides an efficient technique to provide an EEPROM cell for use in a wide temperature range, the EEPROM cell having a memory transistor on MOS Technology with a floating gate and a high-voltage transistor on MOS technology as a selection transistor, both of which are produced on an SOI substrate.
  • the selection transistor has a freely assignable body connection and has an additional drift zone in its source area.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
  • Read Only Memory (AREA)

Abstract

L'invention concerne une cellule de mémoire EEPROM destinée à être employée à des températures élevées, fabriquée à l'aide de la technologie silicium sur oxyde. Habituellement, une cellule EEPROM destinée à des températures élevées est composées de trois transistors MOS. La cellule EEPROM selon l'invention est composée d'un transistor à mémoire comportant une grille flottante et d'un transistor haute tension comportant une connexion pouvant être occupée librement. Une modification de la construction dudit transistor haute tension permet d'éviter l'emploi d'un troisième transistor dans la cellule de mémoire, de telle manière qu'il est possible d'en réduire la surface de plaquette à semiconducteurs et les coûts.
EP05716998A 2004-03-11 2005-03-10 Cellule de memoire eeprom destinee a des temperatures elevees Withdrawn EP1723669A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004011858A DE102004011858B4 (de) 2004-03-11 2004-03-11 EEPROM-Speicherzelle und ihr Auswahltransistor
PCT/EP2005/051099 WO2005088705A1 (fr) 2004-03-11 2005-03-10 Cellule de memoire eeprom destinee a des temperatures elevees

Publications (1)

Publication Number Publication Date
EP1723669A1 true EP1723669A1 (fr) 2006-11-22

Family

ID=34961235

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05716998A Withdrawn EP1723669A1 (fr) 2004-03-11 2005-03-10 Cellule de memoire eeprom destinee a des temperatures elevees

Country Status (4)

Country Link
US (1) US20070194378A1 (fr)
EP (1) EP1723669A1 (fr)
DE (1) DE102004011858B4 (fr)
WO (1) WO2005088705A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8125044B2 (en) * 2007-10-26 2012-02-28 Hvvi Semiconductors, Inc. Semiconductor structure having a unidirectional and a bidirectional device and method of manufacture
US7919801B2 (en) * 2007-10-26 2011-04-05 Hvvi Semiconductors, Inc. RF power transistor structure and a method of forming the same
US8133783B2 (en) * 2007-10-26 2012-03-13 Hvvi Semiconductors, Inc. Semiconductor device having different structures formed simultaneously
US8299519B2 (en) * 2010-01-11 2012-10-30 International Business Machines Corporation Read transistor for single poly non-volatile memory using body contacted SOI device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5656845A (en) * 1995-03-08 1997-08-12 Atmel Corporation EEPROM on insulator
JP3447927B2 (ja) * 1997-09-19 2003-09-16 株式会社東芝 半導体装置およびその製造方法
US6171927B1 (en) * 1998-06-08 2001-01-09 Kuo-Tung Sung Device with differential field isolation thicknesses and related methods
US6164781A (en) * 1998-11-13 2000-12-26 Alliedsignal Inc. High temperature transistor with reduced risk of electromigration and differently shaped electrodes

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2005088705A1 *

Also Published As

Publication number Publication date
DE102004011858A1 (de) 2005-12-01
US20070194378A1 (en) 2007-08-23
DE102004011858B4 (de) 2009-11-05
DE102004011858A8 (de) 2006-03-30
WO2005088705A1 (fr) 2005-09-22

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