DE102004011858A8 - EEPROM-Speicherzelle für hohe Temperaturen - Google Patents
EEPROM-Speicherzelle für hohe Temperaturen Download PDFInfo
- Publication number
- DE102004011858A8 DE102004011858A8 DE102004011858A DE102004011858A DE102004011858A8 DE 102004011858 A8 DE102004011858 A8 DE 102004011858A8 DE 102004011858 A DE102004011858 A DE 102004011858A DE 102004011858 A DE102004011858 A DE 102004011858A DE 102004011858 A8 DE102004011858 A8 DE 102004011858A8
- Authority
- DE
- Germany
- Prior art keywords
- memory cell
- high temperatures
- eeprom memory
- eeprom
- temperatures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
- H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
- Read Only Memory (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004011858A DE102004011858B4 (de) | 2004-03-11 | 2004-03-11 | EEPROM-Speicherzelle und ihr Auswahltransistor |
US10/592,246 US20070194378A1 (en) | 2004-03-11 | 2005-03-10 | Eeprom memory cell for high temperatures |
PCT/EP2005/051099 WO2005088705A1 (de) | 2004-03-11 | 2005-03-10 | Eeprom-speicherzelle für hohe temperaturen |
EP05716998A EP1723669A1 (de) | 2004-03-11 | 2005-03-10 | Eeprom-speicherzelle für hohe temperaturen |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004011858A DE102004011858B4 (de) | 2004-03-11 | 2004-03-11 | EEPROM-Speicherzelle und ihr Auswahltransistor |
Publications (3)
Publication Number | Publication Date |
---|---|
DE102004011858A1 DE102004011858A1 (de) | 2005-12-01 |
DE102004011858A8 true DE102004011858A8 (de) | 2006-03-30 |
DE102004011858B4 DE102004011858B4 (de) | 2009-11-05 |
Family
ID=34961235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102004011858A Expired - Lifetime DE102004011858B4 (de) | 2004-03-11 | 2004-03-11 | EEPROM-Speicherzelle und ihr Auswahltransistor |
Country Status (4)
Country | Link |
---|---|
US (1) | US20070194378A1 (de) |
EP (1) | EP1723669A1 (de) |
DE (1) | DE102004011858B4 (de) |
WO (1) | WO2005088705A1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7919801B2 (en) * | 2007-10-26 | 2011-04-05 | Hvvi Semiconductors, Inc. | RF power transistor structure and a method of forming the same |
US8133783B2 (en) * | 2007-10-26 | 2012-03-13 | Hvvi Semiconductors, Inc. | Semiconductor device having different structures formed simultaneously |
US8125044B2 (en) * | 2007-10-26 | 2012-02-28 | Hvvi Semiconductors, Inc. | Semiconductor structure having a unidirectional and a bidirectional device and method of manufacture |
US8299519B2 (en) * | 2010-01-11 | 2012-10-30 | International Business Machines Corporation | Read transistor for single poly non-volatile memory using body contacted SOI device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5656845A (en) * | 1995-03-08 | 1997-08-12 | Atmel Corporation | EEPROM on insulator |
US20010001490A1 (en) * | 1998-06-08 | 2001-05-24 | Kuo-Tung Sung | Device with differential field isolation thicknesses and related methods |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3447927B2 (ja) * | 1997-09-19 | 2003-09-16 | 株式会社東芝 | 半導体装置およびその製造方法 |
US6164781A (en) * | 1998-11-13 | 2000-12-26 | Alliedsignal Inc. | High temperature transistor with reduced risk of electromigration and differently shaped electrodes |
-
2004
- 2004-03-11 DE DE102004011858A patent/DE102004011858B4/de not_active Expired - Lifetime
-
2005
- 2005-03-10 WO PCT/EP2005/051099 patent/WO2005088705A1/de not_active Application Discontinuation
- 2005-03-10 US US10/592,246 patent/US20070194378A1/en not_active Abandoned
- 2005-03-10 EP EP05716998A patent/EP1723669A1/de not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5656845A (en) * | 1995-03-08 | 1997-08-12 | Atmel Corporation | EEPROM on insulator |
US20010001490A1 (en) * | 1998-06-08 | 2001-05-24 | Kuo-Tung Sung | Device with differential field isolation thicknesses and related methods |
Also Published As
Publication number | Publication date |
---|---|
WO2005088705A1 (de) | 2005-09-22 |
DE102004011858A1 (de) | 2005-12-01 |
DE102004011858B4 (de) | 2009-11-05 |
EP1723669A1 (de) | 2006-11-22 |
US20070194378A1 (en) | 2007-08-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8127 | New person/name/address of the applicant |
Owner name: IMMS INSTITUT FUER MIKROELEKTRONIK- UND MECHATRONIK Owner name: X-FAB SEMICONDUCTOR FOUNDRIES AG, 99097 ERFURT, DE |
|
OP8 | Request for examination as to paragraph 44 patent law | ||
8364 | No opposition during term of opposition | ||
R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01L0027115000 Ipc: H10B0069000000 |
|
R082 | Change of representative |
Representative=s name: LEONHARD, REIMUND, DIPL.-ING., DE |
|
R071 | Expiry of right |