EP1708238A1 - Ecran plat d'affichage d'images - Google Patents
Ecran plat d'affichage d'images Download PDFInfo
- Publication number
- EP1708238A1 EP1708238A1 EP04807112A EP04807112A EP1708238A1 EP 1708238 A1 EP1708238 A1 EP 1708238A1 EP 04807112 A EP04807112 A EP 04807112A EP 04807112 A EP04807112 A EP 04807112A EP 1708238 A1 EP1708238 A1 EP 1708238A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- metal
- melting
- low
- image display
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/30—Cold cathodes, e.g. field-emissive cathode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/26—Sealing together parts of vessels
- H01J9/261—Sealing together parts of vessels the vessel being for a flat panel display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/86—Vessels; Containers; Vacuum locks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/20—Seals between parts of vessels
- H01J5/22—Vacuum-tight joints between parts of vessel
- H01J5/24—Vacuum-tight joints between parts of vessel between insulating parts of vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/26—Sealing together parts of vessels
Definitions
- This invention relates to a flat image display device having substrates located opposite each other and a vacuum seal structure that seals the substrates together.
- an image display device of an electron emission type such as a field emission device (hereinafter referred to as an FED)
- an FED field emission device
- a flat image display device comprises two substrates that are located opposite each other in a spaced manner and formed of a glass plate each. These substrates have their respective peripheral edge portions sealed together to form an envelope. It is important to keep the space between the two substrates, that is, the interior of the envelope, at a high degree of vacuum. If the degree of vacuum is low, the life of electron emitting elements and hence the life of the device is inevitably reduced.
- low-melting-point metals such as In and Ga
- these low-melting-point metals are heated to their melting points and melted, they can perform highly airtight sealing, owing to their high wettability with glass.
- This invention has been made in consideration of these circumstances, and its object is to provide a flat image display device capable of maintaining a high degree of vacuum and having improved reliability.
- a flat image display device comprising: two glass substrates located opposite each other with a gap therebetween; and a seal portion which seals a predetermined position on the glass substrates and defines a sealed space between the two glass substrates, the seal portion having a low-melting-point metal filled along the predetermined position and a metal layer provided between respective surfaces of the glass substrates and low-melting-point metal and formed of a metal which has connectivity to glass, affinity to the low-melting-point metal, and a solubility of less than 1% to the low-melting-point metal to be melted at a temperature of 500°C or less.
- a flat image display device comprising: two glass substrates located opposite each other with a gap therebetween; and a seal portion which seals a predetermined position on the glass substrates and defines a sealed space between the two glass substrates, the seal portion having a low-melting-point metal filled along the predetermined position, a metal layer provided between respective surfaces of the glass substrates and the low-melting-point metal and formed of a metal which has connectivity to glass, affinity to the low-melting-point metal, and a solubility of less than 1% to the low-melting-point metal to be melted at a temperature of 500°C or less, and a protective layer provided between the metal layer and the low-melting-point metal and having affinity to the low-melting-point metal.
- the FED comprises a first substrate 11 and a second substrate 12, which are formed of a rectangular glass substrate each. These substrates are located opposite each other with a gap of about 1.0 to 2.0 mm between them.
- the first substrate 11 and the second substrate 12 have their respective peripheral edge portions joined together by a sidewall 13 of glass in the form of a rectangular frame, thereby forming a flat vacuum envelope 10 the inside of which is kept evacuated.
- the sidewall 13 that functions as a joint member is sealed to the peripheral edge portion of the inner surface of the second substrate 12 by a low-melting-point glass 30, such as fritted glass.
- a low-melting-point glass 30 such as fritted glass.
- the sidewall 13 is sealed to the peripheral edge portion of the inner surface of the first substrate 11 by a seal portion 33 that contains a low-melting-point metal as a sealing material.
- the sidewall 13 and the seal portion 33 airtightly join together the respective peripheral edge portions of the first substrate 11 and the second substrate 12, thereby defining a sealed space between the first and second substrates.
- a plurality of plate-like support members 14 of, e.g., glass are provided in the vacuum envelope 10 in order to support the atmospheric load that acts on the first substrate 11 and the second substrate 12. These support members 14 extend parallel to the short sides of the vacuum envelope 10 and are arranged at predetermined intervals in a direction parallel to the long sides.
- the shape of the support members 14 is not limited to this configuration, and columnar support members may be used instead.
- a phosphor screen 16 that functions as a phosphor surface is formed on the inner surface of the first substrate 11.
- the phosphor screen 16 is provided with a plurality of phosphor layers 15, which glow red, green, and blue, and a plurality of light shielding layers 17 formed between the phosphor layers.
- Each phosphor layer 15 is stripe-shaped, dot-shaped, or rectangular.
- a metal back 18 of aluminum or the like and a getter film 19 are successively formed on the phosphor screen 16.
- a large number of electron emitting elements 22 which individually emit electron beams as electron sources for exciting the phosphor layers 15 of the phosphor screen 16.
- a conductive cathode layer 24 is formed on the inner surface of the second substrate 12, and a silicon dioxide film 26 having a large number of cavities 25 is formed on the conductive cathode layer.
- a gate electrode 28 of molybdenum, niobium, or the like is formed on the silicon dioxide film 26.
- the electron emitting elements 22 of molybdenum, which are cone-shaped, are provided individually in the cavities 25 on the inner surface of the second substrate 12. These electron emitting elements 22 are arranged in a plurality of columns and a plurality of rows corresponding to individual pixels.
- a number of wires 21 for supplying potential to the electron emitting elements 22 are provided in a matrix on the second substrate 12, and their respective end portions are drawn out of the vacuum envelope 10.
- a video signal is input to the electron emitting elements 22 and the gate electrode 28.
- a gate voltage of +100 V is applied in a state for the highest luminance based on the electron emitting elements 22.
- a voltage of +10 kV is applied to the phosphor screen 16.
- the size of electron beams emitted from the electron emitting elements 22 is modulated by the voltage of the gate electrode 28, and an image is displayed as the electron beams excite the phosphor layers of the phosphor screen 16 to luminescence. Since the high voltage is applied to the phosphor screen 16, high-strain-point glass is used as plate glass for the first substrate 11, second substrate 12, sidewall 13, and support members 14.
- seal portion 33 that seals a space between the first substrate 11 and the sidewall 13.
- the seal portion 33 has a metal layer 31a, a metal layer 31b, and a sealing layer 32 of a low-melting-point metal.
- the metal layer 31a is in the form of a rectangular frame that extends along the peripheral edge portion of the inner surface of the first substrate.
- the metal layer 31b is in the form of a rectangular frame that extends along the first-substrate-side end face of the sidewall 13.
- the sealing layer 32 is situated between the metal layers 31a and 31b.
- Each of the metal layers 31a and 31b is formed of a metal that has connectivity to glass, affinity to a low-melting-point metal, and a solubility of less than 1% to a low-melting-point metal to be melted at a temperature of 500°C or less.
- the inventors hereof repeatedly studied mechanisms related to bonds between glass and metal, and systematically observed a wetting phenomenon of indium (In) as a conventionally used sealing material on glass as one of the mechanisms.
- In indium
- molten In although wettable with glass, was induced to become hemispherical without spreading by wetting on the glass surface, owing to its high surface tension. It was noticed, therefore, that it is hard to seal a long distance with In and that a substance that fixes In in a predetermined place and relatively eases the surface tension must be provided between glass and In.
- the inventors hereof intended to form a metal layer on the glass surface and repeated experiments using many types of metal layers.
- many substances were separated from the glass surface as In solidified, although the surface tension of In was able to be relatively lowered when the substances are metallic.
- the metal layers became ineffective, disappearing from the glass surface, with the passage of time when they have some solubility to In even at a low temperature lower than 500°C.
- the aforesaid two problems were solvable by using materials having good adhesion to glass, low solubility to In, and good affinity to In.
- high vacuum sealing capacity was able to be obtained with use of other materials than In that fulfill these conditions, such as low-melting-point metals or alloys.
- Effective metals that have high adhesion to glass include simple active transition metals, such as Cr, Ti, Hf, Zr, Ta, Al, etc., alloys that contain two or more of these metals each, simple rare-earth metals, such as Y, Ce, etc., or alloys that contain two or more of them each. Further, simple transition metals, such as Fe, Ni, W, Mo, etc., or alloys consisting mainly of these metals may be used as materials that have low solubility to low-melting-point metals.
- a metal layer that has the aforesaid two functions is formed by laminating a plurality of metal layers that have their respective functions.
- each of the metal layers 31a and 31b is formed by laminating a first metal layer 34a of Cr and a second metal layer 34b of Fe.
- Cr has high connectivity to glass
- Fe has a solubility of less than 1% to a low-melting-point metal to be melted at a temperature of 500°C or less.
- the first metal layer 34a is formed on the glass surface, while the second metal layer 34b is laminated to the first metal layer and interposed between the first metal layer and the low-melting-point metal 32.
- the metal layer can produce an effect as a single layer of a form such that elements having the aforesaid two functions are mixed together.
- a single metal layer of Cr may be used as each of the metal layers 31a and 31b.
- At least one kind of metal selected from In, Ga, Bi, Pb, Sn, Zn and Sb or a metal that contains Ag, Cu, Al, etc., besides them may be practically used as the low-melting-point metal or alloy.
- Those metals other than Al which are highly connective to the glass substrates are poorly soluble to a low-melting-point alloy and have the aforesaid two functions. However, it is effective to make these metals wettable with the low-melting-point metal to, for example, clean or coat them with a highly wettable material.
- the metal layer may be located on the glass surface by any of dry processes, such as vapor deposition, sputtering, low-pressure inert atmosphere thermal spraying, etc., and wet processes, such as electroless plating. In any of these processes, a plurality of layers should be formed continuously.
- the metal film can be enhanced in connectivity and adhesion to glass by being heat-treated in an inert atmosphere or a reducing atmosphere after film formation.
- the metal layers 31a and 31b formed individually on the respective surfaces of the first substrate 11 and the sidewall 13 serve to enhance the connectivity to glass and prevent depletion by the molten low-melting-point metal 32.
- the outermost surface layer of the metal layer becomes a nonmetallic substance based mainly on oxidation immediately after its formation, so that its wettability with the low-melting-point metal 32 for sealing may possibly lower.
- the inventors hereof repeated process studies and experiments to form the metal layers 31a and 31b with high connectivity to glass, combining various materials. Thereupon, it was found that the problem was solvable by forming a metallic protective layer 36 with oxidation resistance and affinity to the low-melting-point metal immediately after the formation, that is, before the surface state changed.
- the metallic protective layer 36 is formed overlapping the metal layers 31a and 31b, whereby the outer surface of the metal layer is prevented from oxidation, and the metallic protective layer is provided between the metal layer and the low-melting-point metal 32.
- a low-melting-point metal component or a metal such as Ag, Au, Cu, Al, Pt, Pd, Ir or Sn may be effectively used as the metallic protective layer 36.
- the metallic protective layer 1 In forming the metallic protective layer 36 by a dry process, it is desirable that the metallic protective layer 1 be continuously formed without being exposed to the atmosphere after the formation of the metal layers 31a and 31b.
- first and second substrates each formed of a glass plate 65 cm long and 110 cm wide, were prepared, and the sidewall 13 of glass in the form of a rectangular frame was bonded to the peripheral edge portion of the inner surface of one of them, e.g., the second substrate, with fritted glass.
- Cr as a first metal layer was formed to a thickness of 0.4 ⁇ m on the upper surface of the sidewall 13 and the peripheral edge portion of the inner surface of the first substrate 11, that is, in a predetermined position opposite the sidewall 13, by means of a vacuum vapor deposition apparatus.
- Fe as a second metal layer was formed to a thickness of 0.4 ⁇ m.
- an alloy as a low-melting-point metal composed of 53% by weight of Bi and 47% by weight of Sn was melted in a nitrogen atmosphere and spread on a metal layer on the sidewall 13 by using a flatiron.
- a space of 100 mm was secured between the two glass substrates, and they were heat-treated in a vacuum of 5 ⁇ 10 -6 Pa. Since the Bi-Sin has good affinity to a film, the Bi-Si wetted. Thereafter, the two glass substrates were adhered to each other so that the position of the alloy was aligned afterward in a cooling process, whereupon the Bi-Sn alloy was made continuous with the surfaces of the two substrates. In this state, the alloy was solidified by cooling, whereupon the sidewall 13 and the first substrate were sealed together.
- first and second substrates each formed of a glass plate 65 cm long and 110 cm wide, were prepared.
- a metal layer of Cr was formed to a thickness of 0.6 ⁇ m in a predetermined place where the glass substrates face each other, that is, on the peripheral edge portion of the inner surface of each glass substrate in this case, by means of the vapor deposition apparatus.
- Cu as a metallic protective layer was formed to a thickness of 0.4 ⁇ m on the metal layer.
- An alloy paste as a low-melting-point metal composed of 53% by weight of Bi and 47% by weight of Sn and containing a decomposition-volatile binder was spread to a thickness of 0.3 mm on each metallic protective layer.
- a wire (1.5 mm in diameter) of an Fe-37 weight % Ni alloy plated with Ag was set as a sidewall on the low-melting-point metal of one of the glass substrates.
- a space of 100 mm was secured between the two glass substrates, and these glass substrates were temporarily fired in a vacuum of about 10 -3 Pa at 130°C for 30 minutes. Thereafter, the substrates were subjected to heating-deaeration treatment in a vacuum of 5 ⁇ 10 -6 Pa. When 200°C was then reached in the cooling process, these two glass substrates were pasted together in a predetermined position. Thereupon, the molten Bi-Sn alloy wetted and spread over the Fe-Ni alloy wire without a gap, owing to their good mutual affinity. In this state, the alloy was solidified to seal the two glass substrates together. When this FED was subjected to the same vacuum leak test as the one conducted for Example 1, the same result was obtained.
- First and second substrates each formed of a glass plate 65 cm long and 110 cm wide, were prepared.
- a metal layer of Cr was formed to a thickness of 0.6 ⁇ m in a predetermined place where the glass substrates face each other, that is, on the peripheral edge portion of the inner surface of each glass substrate in this case, by means of the vapor deposition apparatus with use of 13 Cr steel as a vaporization source.
- Ag as a metallic protective layer was formed to a thickness of 0.4 ⁇ m on the metal layer.
- the two glass substrates were kept horizontal with a space of 100 mm between them, and they were subjected to heating-deaeration treatment in a vacuum of 5 ⁇ 10 -6 Pa.
- these two glass substrates were joined together in a predetermined position.
- the molten Bi-In alloy wetted and spread over the Ti wire without a gap, owing to their good mutual affinity.
- the alloy was solidified to seal the two glass substrates together.
- First and second substrates each formed of a glass plate 65 cm long and 110 cm wide, were prepared.
- a metal layer of Ce was formed to a thickness of 0.4 ⁇ m in a predetermined place where the glass substrates face each other, that is, on the peripheral edge portion of the inner surface of each glass substrate in this case, by means of the vapor deposition apparatus with use of Ce as a vaporization source.
- Cu as a metallic protective layer was formed to a thickness of 0.4 ⁇ m on the metal layer.
- An alloy paste as a low-melting-point metal composed of 53% by weight of Bi and 47% by weight of Sn and containing a decomposition-volatile binder was spread to a thickness of 0.3 mm on each metallic protective layer. Then, a wire (1.5 mm in diameter) of ferritic stainless steel (SUS 410) plated with Ag was set as a sidewall on the low-melting-point metal layer of one of the glass substrates.
- SUS 410 ferritic stainless steel
- a space of 100 mm was secured between the two glass substrates, and these glass substrates were temporarily fired in a vacuum of about 10 -3 Pa at 130°C for 30 minutes. Thereafter, the substrates were subjected to heating-deaeration treatment in a vacuum of 5 ⁇ 10 -6 Pa. When 200°C was then reached in the cooling process, these two glass substrates were pasted together in a predetermined position. Thereupon, the molten Bi-Sn alloy wetted and spread over the SUS 410 wire without a gap, owing to their good mutual affinity. In this state, the alloy was solidified to seal two glass substrates together. When this FED was subjected to the same vacuum leak test as the one conducted for Example 1, the same result was obtained.
- first and second substrates each formed of a glass plate 65 cm long and 110 cm wide, were prepared.
- a metal layer of Cr was formed to a thickness of 0.6 ⁇ m in a predetermined place where the glass substrates face each other, that is, on the peripheral edge portion of the inner surface of each glass substrate in this case, by means of the vapor deposition apparatus.
- Ag as a metallic protective layer was formed to a thickness of 0.4 ⁇ m on the metal layer.
- a wire (1.5 mm in diameter) of an Fe-37 weight % Ni alloy plated with Ag was set as a sidewall on In of one of the glass substrates.
- a space of 100 mm was secured between the two glass substrates, and these glass substrates were temporarily fired in a vacuum of about 10 -3 Pa at 130 °C for 30 minutes. Thereafter, the substrates were subjected to heating-deaeration treatment in a vacuum of 5 ⁇ 10 -6 Pa. When 200°C was then reached in the cooling process, these two glass substrates were pasted together in a predetermined position. Thereupon, the molten In alloy wetted and spread over the Fe-Ni alloy wire without a gap, owing to their good mutual affinity. In this state, the alloy was solidified to seal the two glass substrates together. When this FED was subjected to the same vacuum leak test as the one conducted for Example 1, the same result was obtained.
- First and second substrates each formed of a glass plate 65 cm long and 110 cm wide, were prepared.
- a metal layer of Cr was formed to a thickness of 0.6 ⁇ m in a predetermined place where the glass substrates face each other, that is, on the peripheral edge portion of the inner surface of each glass substrate in this case, by means of the vapor deposition apparatus with use of 13 Cr steel as a vaporization source.
- Ag as a metallic protective layer was formed to a thickness of 0.4 ⁇ m on the metal layer.
- the two glass substrates were kept horizontal with a space of 100 mm between them, and they were subjected to heating-deaeration treatment in a vacuum of 5 ⁇ 10 -6 Pa.
- these two glass substrates were joined together in a predetermined position.
- the molten Bi-In alloy wetted and spread over the Ti wire without a gap, owing to their good mutual affinity.
- the alloy was solidified to seal the two glass substrates together.
- a glass container that requires a high vacuum can be sealed, so that there may be obtained a flat image display device of improved reliability capable of maintaining a high degree of vacuum.
- the present invention is not limited directly to the embodiment described above, and its components may be embodied in modified forms without departing from the spirit of the invention. Further, various inventions may be made by suitably combining a plurality of components described in connection with the foregoing embodiment. For example, some of the components according to the foregoing embodiment may be omitted. Furthermore, components according to different embodiments may be combined as required.
- the dimensions, materials, etc., of the sidewall and other components are not limited to those of the foregoing embodiment, but may be suitably selected as required.
- This invention is not limited to image display devices that use electron emitting elements of the field-emission type as electron sources, but may be also applied to image display devices that use other electron sources, such as the surface-conduction type, carbon nanotubes, etc., and other flat image display devices of which the inside is kept vacuum.
- a flat image display device of improved reliability capable of maintaining a high degree of vacuum.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
- Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003429754A JP2005190790A (ja) | 2003-12-25 | 2003-12-25 | 平面型の画像表示装置 |
PCT/JP2004/018753 WO2005064638A1 (fr) | 2003-12-25 | 2004-12-15 | Ecran plat d'affichage d'images |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1708238A1 true EP1708238A1 (fr) | 2006-10-04 |
Family
ID=34736315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04807112A Withdrawn EP1708238A1 (fr) | 2003-12-25 | 2004-12-15 | Ecran plat d'affichage d'images |
Country Status (7)
Country | Link |
---|---|
US (1) | US20060232188A1 (fr) |
EP (1) | EP1708238A1 (fr) |
JP (1) | JP2005190790A (fr) |
KR (1) | KR20060101547A (fr) |
CN (1) | CN1898766A (fr) |
TW (1) | TWI258157B (fr) |
WO (1) | WO2005064638A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2001037A4 (fr) * | 2006-03-29 | 2012-05-09 | Hamamatsu Photonics Kk | Procédé de fabrication d'un dispositif de conversion photoélectrique |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090065266A (ko) * | 2007-12-17 | 2009-06-22 | 한국전자통신연구원 | 전계 방출형 백라이트 유닛 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04206327A (ja) * | 1990-11-30 | 1992-07-28 | Sony Corp | 陰極線管 |
JP2000311641A (ja) * | 1999-04-28 | 2000-11-07 | Sony Corp | 封止パネル装置及びその製造方法 |
JP2002184313A (ja) * | 2000-12-12 | 2002-06-28 | Toshiba Corp | 画像表示装置の製造方法および封着材充填装置 |
JP2001210258A (ja) * | 2000-01-24 | 2001-08-03 | Toshiba Corp | 画像表示装置およびその製造方法 |
JP3780239B2 (ja) * | 2001-08-31 | 2006-05-31 | キヤノン株式会社 | 画像表示装置とその製造方法 |
JP2003109502A (ja) * | 2001-09-28 | 2003-04-11 | Canon Inc | 表示パネルの封着方法、表示パネルおよびこれを備える画像表示装置 |
US20050082975A1 (en) * | 2002-06-11 | 2005-04-21 | Akiyoshi Yamada | Image display device and method of manufacturing the same |
US20050140913A1 (en) * | 2002-08-29 | 2005-06-30 | Masahiro Yokota | Flat display device |
JP2004362926A (ja) * | 2003-06-04 | 2004-12-24 | Toshiba Corp | 画像表示装置およびその製造方法 |
-
2003
- 2003-12-25 JP JP2003429754A patent/JP2005190790A/ja not_active Abandoned
-
2004
- 2004-12-15 KR KR1020067012408A patent/KR20060101547A/ko active IP Right Grant
- 2004-12-15 WO PCT/JP2004/018753 patent/WO2005064638A1/fr not_active Application Discontinuation
- 2004-12-15 CN CNA2004800390632A patent/CN1898766A/zh active Pending
- 2004-12-15 EP EP04807112A patent/EP1708238A1/fr not_active Withdrawn
- 2004-12-23 TW TW093140333A patent/TWI258157B/zh not_active IP Right Cessation
-
2006
- 2006-06-14 US US11/452,362 patent/US20060232188A1/en not_active Abandoned
Non-Patent Citations (1)
Title |
---|
See references of WO2005064638A1 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2001037A4 (fr) * | 2006-03-29 | 2012-05-09 | Hamamatsu Photonics Kk | Procédé de fabrication d'un dispositif de conversion photoélectrique |
Also Published As
Publication number | Publication date |
---|---|
US20060232188A1 (en) | 2006-10-19 |
CN1898766A (zh) | 2007-01-17 |
TW200534318A (en) | 2005-10-16 |
WO2005064638A1 (fr) | 2005-07-14 |
JP2005190790A (ja) | 2005-07-14 |
TWI258157B (en) | 2006-07-11 |
KR20060101547A (ko) | 2006-09-25 |
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