EP1620883B1 - Laser machining using an active assist gas - Google Patents

Laser machining using an active assist gas Download PDF

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Publication number
EP1620883B1
EP1620883B1 EP04716586A EP04716586A EP1620883B1 EP 1620883 B1 EP1620883 B1 EP 1620883B1 EP 04716586 A EP04716586 A EP 04716586A EP 04716586 A EP04716586 A EP 04716586A EP 1620883 B1 EP1620883 B1 EP 1620883B1
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EP
European Patent Office
Prior art keywords
workpiece
laser
silicon
environment
dicing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP04716586A
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German (de)
English (en)
French (fr)
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EP1620883A1 (en
Inventor
Adrian Boyle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
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Xsil Technology Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Definitions

  • This invention relates to method of laser dicing according to the preamble of claim 1.
  • US 3866398 discloses such a method wherein a reagent gas such as SF 6 is disclosed as being introduced locally to a machining region during a laser scribing process. The reagent gas reacts with high temperature vapour ejected from a substrate material during laser machining to produce gaseous compounds that do not redeposit as solid debris on the substrate to be machined.
  • the presence of SF 6 during laser machining improves both the quality and efficiency of the material removal process.
  • this gas assists the material removal, typically this does not allow laser machining at a rate to enable sufficiently high throughput machining for manufacturing.
  • US 3679502 describes a method for non-localised etching of silicon wafer substrates heated to a temperature in a region of 950 to 1250 °C in an SF 6 environment. Fluorine radicals produced at such elevated temperatures etch the silicon surface resulting in a smooth clean surface.
  • US 4331504 discloses the utilisation of a CO 2 laser vibrationally to excite SF 6 molecules for directional non-localised etching of a masked wafer substrate.
  • the CO 2 laser energy is sufficiently low so as to prevent direct laser ablation of the wafer substrate.
  • US 4617086 describes a method for fast local etching of a silicon substrate in an SF 6 environment using a continuous laser at a wavelength of 0.6 microns or less to photo-dissociate the SF 6 molecule.
  • the laser power density is in the region of 6 ⁇ 10 5 W/cm 2 and is below an ablation threshold of silicon and so etching is primarily preformed by the interaction between the silicon substrate and fluorine radicals produced when the laser is on.
  • US 4731158 discloses a mixture of H 2 and a fluorine-containing molecule such as NF 3 , SF 6 and COF 2 used in order to improve a speed of laser photo-dissociative etching of silicon relative to performing a same etching process in an environment of just fluorine-containing molecules. Etching of the substrate material is performed by fluorine radicals produced as a result of the photo-dissociation process.
  • a fluorine-containing molecule such as NF 3 , SF 6 and COF 2
  • WO 97/24768 discloses a method of simultaneously laser grooving silicon in a halogen, preferably chlorine, environment to reduce deposition of debris on the workpiece, and doping of the grooves with a gaseous boron or phosphorous fluorine compound.
  • a halogen preferably chlorine
  • This superior die strength arises from the high quality machining achievable using an SF 6 assist gas during the laser machining process.
  • the method is for dicing a silicon wafer, such that use of the assist gas increases strength of resultant dies.
  • the step of providing a halogen environment comprises providing a fluorine environment as the active assist gas and the step of reacting the active assist gas with the silicon workpiece comprises reacting the fluorine with the silicon workpiece to form gaseous silicon tetrafluoride (SiF 4 ).
  • the step of laser dicing the workpiece comprises wafer dicing.
  • the method includes an additional step of providing gas extraction means for removing at least one of gas-borne debris and waste gas from the environment of the workpiece.
  • the method includes a further step, after the step of laser dicing the workpiece, of cleaning the workpiece of residues generated by the laser dicing.
  • the step of cleaning the workpiece comprises the step of dry wiping the workpiece.
  • the step of cleaning the workpiece comprises a water spin-rinse-dry process.
  • the step of cleaning the workpiece comprises the step of laser cleaning the workpiece.
  • the step of laser cleaning the workpiece comprises scanning the workpiece with a defocused or low energy laser beam.
  • the step of laser cleaning the workpiece comprises laser cleaning the workpiece in an air environment.
  • the step of laser cleansing the workpiece comprises laser cleaning the workpiece in an active assist gas environment.
  • the active assist gas is fluorine or fluorine-based.
  • fluorine radicals are produced by laser photo-dissociation of sulphur hexafluoride at the silicon workpiece.
  • the step of providing a halogen environment for the workpiece comprises an initial step of mounting the substrate with the first major face on tape frame means and the step of dicing the workpiece comprises dicing the substrate from a second major face opposed to the first major face.
  • the laser source means comprises a diode-pumped laser operating at a second, third or fourth harmonic at a wavelength of less than 0.55 microns.
  • the laser beam delivery means comprises a galvanometer with a scan lens and an XY motion stage for positioning the workpiece in relation to the laser beam.
  • the apparatus further comprises tape frame means for mounting the workpiece for machining the workpiece from a second major face of the workpiece opposed to a first face of the workpiece having active devices thereon.
  • the present invention relates particularly to laser dicing of a silicon substrate at a laser power density above the silicon ablation threshold in an SF 6 environment.
  • Silicon material is primarily removed from the wafer substrate by the laser ablation process.
  • the addition of SF 6 results in an increase in laser dicing speed and also an increase in die strength of laser machined die due to an improvement in machining quality.
  • This improvement may be compared with improved etching with SF 6 in the prior art, namely, the surface of features laser machined in an SF 6 environment is smoother than that obtained with laser machining in air.
  • etching of the silicon is substantially confined to a localised region of the workpiece on which the laser is focused.
  • material ejected during the laser ablation process reacts with the SF 6 environment and can be removed from a machining site in a gaseous form rather than being re-deposited as solid debris around the laser machining site.
  • Silicon reacts vigorously with all halogens to form silicon tetrahalides. It reacts with fluorine (F 2 ), chlorine (Cl 2 ), bromine (Br 2 ) and iodine (I 2 ) to form respectively silicon tetrafluoride (SiF 4 ), silicon tetrachloride (SiCl 4 ), silicon tetrabromide (SiBr 4 ), and silicon tetra-iodide (SiI 4 ).
  • fluorine F 2
  • chlorine chlorine
  • SiF 4 silicon tetrafluoride
  • SiCl 4 silicon tetrachloride
  • SiBr 4 silicon tetrabromide
  • SiI 4 silicon tetra-iodide
  • reaction of SF 6 and silicon is not spontaneous, occurring only at energies above the melting threshold of silicon, it may be very localized and thus suitable for one-step silicon micro-machining applications such as wafer dicing, via drilling and surface patterning.
  • a laser dicing system 1 of the present invention includes a diode-pumped laser 2 operating in the second, third, or fourth harmonic, at a wavelength of less than 0.55 microns, and a beam delivery system 3 that delivers the laser beam to the surface of a silicon wafer 5. Wavelengths in the regions of 366nm or 355nm are suitable.
  • the silicon wafer may be blank or may have different layers patterned on it.
  • the beam delivery system includes a galvanometer with a scan lens to direct the beam within an available field of view while an XY motion stage 6 is used to position the silicon wafer 5 to be machined.
  • the system includes a gas delivery system 7 and an extraction system 8 that delivers SF 6 gas to the wafer surface and captures airborne debris and waste gas subsequent to laser machining, respectively.
  • the laser beam may be directed to the desired machining site on the wafer 5 through a laser window 9 in an enclosure for enclosing an active assist gas around the wafer 5.
  • the laser beam 4 heats the silicon wafer 5 such that its temperature is sufficient for Reaction 2 to take place.
  • Fluorine radicals dissociated from SF 6 by the laser then etch the silicon in Reaction 1 by bonding with the silicon to form gaseous silicon tetrafluoride (SiF 4 ). Due to the reaction with the SF 6 gas, the silicon machining rate is significantly faster than that achieved when an active assist gas is not used.
  • FIG. 1 An example of the advantage in the machining speed gained when SF 6 is used as an assist gas during laser machining is shown in Figure 1 , in which plot 11 is for laser machining in air and plot 12 is for laser machining in a SF 6 environment.
  • the machining speed for a wafer substrate is faster in a SF 6 environment for all thicknesses of wafer studied and for wafers less than 250 microns thick is more than three times faster in an SF 6 environment than in air.
  • FIG. 2 shows plots, for saw-cut die 21, laser machined die using an air environment 22 and laser machined die using a SF 6 environment 23, of the probability of survival vs. the pressure applied to break the die.
  • the die strength for laser machined die in an air environment, plot 22, is less than the strength of traditional saw-cut die, plot 21, whereas the strength of die laser machined in a SF 6 environment, plot 23, is greater than that of saw-cut die, plot 21.
  • the die strength of laser-machined components is up to 4.8 times stronger than that of components machined without the use of gas assist.
  • die cut in SF 6 gas were 1.65 times stronger than die cut using a saw cutting technique.
  • laser machining with SF 6 as an active assist gas resulted in average die strength value 31 in excess of 300MPa compared to a value 32 of 185MPa for a conventional saw cutting technique and a value 33 of 65MPa for laser machining in the absence of an assist gas.
  • the top layers of the wafer may be photosensitive, so that it is not practical to use a scanning laser beam on the top surface of the wafer. In this case it is possible to process the wafer from a backside of the wafer.
  • the wafer may be mounted face downward on a tape.
  • the tape is transparent to visible radiation.
  • the laser beam can be delivered to a back surface of the wafer. This ensures all debris generated is on the back of the wafer.
  • the wafer may be laser cleaned ( dry) or washed, without components on the front of the wafer being contacted by water.
  • the wafer is enclosed in a closed chamber.
  • Gas flow into and out of the chamber is regulated to ensure efficient machining and control of gas usage.
  • a valve system may also be used to ensure gas flow into the chamber is controlled so that sufficient gas is delivered during the laser "ON" period.
  • apparatus to remove and recirculate gas not consumed in the reaction may include facilities for extraction and filtering of reaction by-products and for returning un-reacted gas to the reaction area.
  • the invention provides the advantages, in the use of UV lasers, operating particularly in the range of 366nm or 355nm, for dicing and machining silicon, and other semiconductors, with high pulse repetition frequency and using multiple passes, as described, for example, in WO 02/34455 , where the assist gas is used to enhance the dicing or machining process such that the speed of the process is improved, the nature of the debris is modified to enable more efficient cleaning and where the process itself, using the assist gas, provides die with higher die strength than that achievable without the use of assist gas.
  • Typical examples of where the invention provides a major advantage are in the manufacture of, for example, smart cards, stacked integrated circuits and integrated circuits.
  • die strength is critical to short and long term reliability of the diced component.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Drying Of Semiconductors (AREA)
  • Dicing (AREA)
EP04716586A 2003-03-04 2004-03-03 Laser machining using an active assist gas Expired - Lifetime EP1620883B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0304900A GB2399311B (en) 2003-03-04 2003-03-04 Laser machining using an active assist gas
PCT/EP2004/002149 WO2004079810A1 (en) 2003-03-04 2004-03-03 Laser machining using an active assist gas

Publications (2)

Publication Number Publication Date
EP1620883A1 EP1620883A1 (en) 2006-02-01
EP1620883B1 true EP1620883B1 (en) 2008-10-08

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EP04716586A Expired - Lifetime EP1620883B1 (en) 2003-03-04 2004-03-03 Laser machining using an active assist gas

Country Status (11)

Country Link
US (1) US20060249480A1 (zh)
EP (1) EP1620883B1 (zh)
JP (1) JP4818904B2 (zh)
KR (1) KR101058465B1 (zh)
CN (1) CN100362631C (zh)
AT (1) ATE410785T1 (zh)
DE (1) DE602004016984D1 (zh)
GB (1) GB2399311B (zh)
MY (1) MY135807A (zh)
TW (1) TWI270134B (zh)
WO (1) WO2004079810A1 (zh)

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CN103394805B (zh) * 2013-08-05 2016-09-14 大族激光科技产业集团股份有限公司 激光切割打孔装置及切割打孔方法

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GB2399311A (en) 2004-09-15
WO2004079810A1 (en) 2004-09-16
JP2006520534A (ja) 2006-09-07
JP4818904B2 (ja) 2011-11-16
TW200507094A (en) 2005-02-16
CN1757100A (zh) 2006-04-05
TWI270134B (en) 2007-01-01
CN100362631C (zh) 2008-01-16
MY135807A (en) 2008-07-31
EP1620883A1 (en) 2006-02-01
KR101058465B1 (ko) 2011-08-24
DE602004016984D1 (de) 2008-11-20
US20060249480A1 (en) 2006-11-09

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