EP1597764A1 - Composant optoelectronique comprenant un corps de boitier a metallisation structuree, son procede de production et procede pour la metallisation structuree d'un corps contenant du plastique - Google Patents

Composant optoelectronique comprenant un corps de boitier a metallisation structuree, son procede de production et procede pour la metallisation structuree d'un corps contenant du plastique

Info

Publication number
EP1597764A1
EP1597764A1 EP03808252A EP03808252A EP1597764A1 EP 1597764 A1 EP1597764 A1 EP 1597764A1 EP 03808252 A EP03808252 A EP 03808252A EP 03808252 A EP03808252 A EP 03808252A EP 1597764 A1 EP1597764 A1 EP 1597764A1
Authority
EP
European Patent Office
Prior art keywords
optoelectronic component
metallization
housing body
component according
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03808252A
Other languages
German (de)
English (en)
Inventor
Herbert Brunner
Thomas Höfer
Frank Möllmer
Rainer Sewald
Günter Waitl
Markus Zeiler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2003108917 external-priority patent/DE10308917A1/de
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of EP1597764A1 publication Critical patent/EP1597764A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Definitions

  • Optoelectronic component with structured metallized housing body method for producing such a component and method for structured metallization of a body containing plastic
  • the present invention relates to an optoelectronic component, in particular to a surface-mountable optoelectronic component, according to the preamble of claim 1 or of claim 10, to a method for structured metallization of a plastic-containing body according to the preamble of claim 37 and a method for producing a optoelectronic component according to the preamble of claim 41.
  • a pre-housed component is often first produced by overmoulding a prefabricated semiconductor frame (leadframe) with a suitable plastic material which forms at least part of the housing of the component.
  • This component has, for example, a recess on the top, into which leadframe connections are introduced from two opposite sides, a semiconductor chip such as an LED chip being glued and electrically contacted on one. Transparent potting compound is then usually filled into this recess.
  • This basic form of surface-mountable optoelectronic components is known, for example, from the article "Siemens SMT-TOPLED for surface mounting" by "F. Möllmer and G. Waitl, Siemens Components 29 (1991), No.
  • Components of this type are used as transmitters and receivers, for example in remote controls, light barriers or for data transmission between a mobile phone and a computer.
  • the optoelectronic component forms as a transmitter, it is often desirable to have the most homogeneous, narrow-angle radiation characteristic possible. This can also be the case with a component designed as a receiver. In conventional SMT designs, this radiation characteristic is often achieved by means of a lens, for example placed on the component.
  • the diffuse plastic reflector is disadvantageous when imaging the light source via the lens.
  • the overall height of the optoelectronic component increases. In addition to an increased space requirement, there is the disadvantage that the component surface is not flat, so that the “pick and place” method can only be used with difficulty for the circuit board assembly.
  • MID Molded Interconnect Devices
  • An optoelectronic component comprises a housing body and at least one semiconductor chip arranged on the housing body, wherein a surface of the housing body has a metallized partial area and a non-metallized partial area and the housing body comprises at least two different plastics, one of the plastics being non-metallizable and this determines the non-metallized section.
  • the metallized and the non-metallized subarea are not together on a flat surface, like a side surface of the housing body, but rather the entire surface of the housing body can have a metallized and a non-metallized portion.
  • Another plastic, which the housing body contains, is preferably designed to be metallizable.
  • This metallizable plastic particularly preferably determines the metallized portion of the surface of the housing body.
  • Suitable plastics are, for example, liquid crystal polymers (LCPs) or polybutylene terephthalates (PBTs).
  • LCPs liquid crystal polymers
  • PBTs polybutylene terephthalates
  • the plastics are preferably designed to be electrically insulating and can be designed particularly preferably, for example by adding an additive such as palladium, to be metallizable or non-metallizable.
  • Such an optoelectronic component has the advantage that a metallization does not have to be structured in a complex manner after it has been applied to the housing body, but rather, due to the non-metallizable and the metallizable plastic, the structure of the metallization during the manufacture of the housing body, which is used, for example, in the two-component injection molding process of these plastics takes place, can be determined.
  • the metallization thus preferably structures itself during the application.
  • the plastics mentioned above as examples can be processed in such an injection molding process.
  • a housing of the optoelectronic component which comprises the housing body, has at least one recess, which can be formed, for example, in the housing body.
  • the semiconductor chip is preferably arranged in the recess.
  • the walls delimiting the recess preferably form a reflector for electromagnetic radiation emitted by the semiconductor chip and can be provided with a metallization, which at the same time is designed to be reflective and can function as an electrical connecting conductor of the component.
  • the reflector is also particularly preferably designed to be reflective for radiation to be received by the semiconductor chip.
  • An optoelectronic component has a housing with at least one recess. At least one semiconductor chip is arranged in the recess. The walls delimiting the recess form a reflector for electromagnetic radiation emitted by the semiconductor chip and are provided with a metallization, which at the same time function as the electrical connecting conductor of the component.
  • the optoelectronic component designed in this way makes it possible to dispense with a lens and to achieve a preferably narrow-angle, homogeneous radiation or reception characteristic.
  • the radiation or reception characteristic is advantageously obtained solely from the design of the reflector, which is designed, for example, as a cone, paraboloid, hyperboloid, ellipsoid, spherical reflector or as a segment of these bodies, such as in the form of a truncated cone.
  • any shape of the recess, ie the reflector is possible.
  • the shape is limited only by the method used to apply the metallization or the manufacturing method of the housing body.
  • the above exemplary configurations of the recess are therefore not to be regarded as a limitation.
  • Preferred methods of metallizing the plastic-containing housing are a two-component injection molding method, additive or subtractive laser structuring, masking and structuring of the surfaces which are initially metallized over the entire surface, or selective vapor deposition of the reflector using masking techniques.
  • Subtractive laser structuring here means structuring an already existing metallization by means of a laser-assisted method, whereas in the case of additive laser structuring, the areas to be metallized are defined by means of a laser-assisted method.
  • a two-component injection molding process is used for the production of the housing body, the one component comprising at least one non-metallizable plastic and the other component comprising at least one metallizable plastic and the metallization of the recess of the metallizable and / or the non-metallizable plastic is determined.
  • the structure of the metallization can thus advantageously already be determined via the configuration of the housing body.
  • a comparatively complex structuring of an applied metallization can be avoided in the same way as the structured application of a metallization, such as through complex additive laser structuring.
  • the metallization of the recess enables a high yield of the semiconductor chip, for example in the form of an LED chip.
  • the efficiency of such a component can be be significantly improved over a conventional optoelectronic component.
  • Dispensing with the lens also enables an essentially flat component surface and a low overall height. As a result, the component can be mounted on a printed circuit board in a technically simple and inexpensive manner using a pick-and-place method.
  • the metallization is divided into at least two areas that are electrically separated from one another by an insulating web (or better, an insulating gap in the metallization).
  • an insulating web or better, an insulating gap in the metallization.
  • the insulating web is advantageously arranged in the region of the surfaces delimiting the recess, and the electrical connection between the semiconductor chip and the second region is established in the recess.
  • the insulating web is preferably provided in the interior of the recess or of the reflector.
  • the insulating web is particularly preferably determined by the non-metallizable plastic of the housing body.
  • this runs through the bottom surface of the recess and an electrical connection is made between the semiconductor chip and the second region of the metallization at the bottom of the recess.
  • a greater reflector height can advantageously be achieved without increasing the height of the component enlarge.
  • an often desired narrow-angle and homogeneous radiation or reception characteristic can be produced in a simple manner, since the bond between the semiconductor chip and the metallization takes place in the interior of the recess or of the reflector.
  • the arch of the bonding wire is preferably located in the space enclosed by the recess or the reflector. It is particularly preferably not guided over the edge of the recess or the reflector.
  • the insulating web crosses the recess in such a way that it extends at least partially in the extension of at least one surface diagonal of the semiconductor chip (seen in plan view) out of the recess via the reflector walls. This enables a higher reflector efficiency to be achieved.
  • the largest portion of the radiation emerging laterally from the semiconductor chip emerges through its side faces and not via the vertical chip corners. Only a small part of the radiation emerges at the vertical chip corners.
  • the non-reflecting or only slightly reflecting insulating web is therefore preferably in the diagonal extension with respect to the corners of the semiconductor chip.
  • the insulating web it is arranged in the region of an indentation or bulge of the recess.
  • the insulating web or the indentation or bulge is preferably arranged in such a way that only the smallest possible part of the radiation generated by the semiconductor chip strikes it and the reflector efficiency is thus advantageously increased.
  • the indentation or bulge is preferably provided in a wall of the recess.
  • the reflector area is particularly preferably reduced as little as possible. This also has the advantage that the bond connection can take place in the region of the indentation or bulge of the wall of the recess and not on the bottom thereof.
  • the bottom of the recess can thus advantageously be reduced in size, which can have an advantageous effect on the component size.
  • the area occupied by the insulating web is as small as possible compared to the metallized area in the recess. This means nothing else than that the insulating web is made as narrow as possible, since - in contrast to metallization - it often does not have good reflective properties.
  • the insulating web can be produced by simply interrupting the metallization, for example caused by a non-metallizable plastic on the surface of the housing body, which is just large enough to avoid a short circuit between the separate metallization areas.
  • the housing consists of a plastic made of two components, it being possible to apply metallization to only one of the two components.
  • the housing consists of a two-component injection molding, whereby the surfaces and structures to be metallized are already defined by the injection molding tool. In particular, this preferably applies to the insulating web. Because the housing consists of two plastics, the manufacture of such a housing can be simplified, since advantageously only two different injection molding tools - one per plastic - are used in injection molding.
  • the outlay for producing the housing or the housing body can thereby advantageously be kept low.
  • the housing body it comprises a first housing body piece which contains the metallizable plastic and at least one further housing body piece which contains the non-metallizable plastic.
  • the first housing body piece is preferably formed in at least two partial areas which are mechanically connected to one another via a connecting device, such as connecting webs, which preferably have a smaller spatial expansion compared to the partial areas of the housing body and which can advantageously mechanically stabilize the housing body piece.
  • a connecting device such as connecting webs
  • the further housing body piece is preferably arranged such that it at least partially deforms the connecting device.
  • the mechanical stability of the housing body can advantageously be increased. This applies in particular if the housing body pieces or the plastics which contain the housing body pieces are essentially not chemically bonded to one another or essentially do not form a chemical bond with one another.
  • At least one intermediate space is arranged between the first and the further housing body piece, which can be caused, for example, by a lack of chemical bonding between the housing body pieces in the area of the intermediate space.
  • the intermediate space advantageously forms a suspension which can substantially compensate or at least reduce mechanical, in particular thermally caused, tensions in the housing body, as can occur, for example, when the temperature changes between the housing body parts.
  • the design of the component according to the invention brings part of the fact that the plastic of the housing can be colored in any color.
  • conventional optoelectronic components which have no metallization of the reflector, the use of a bright plastic is customary on account of its reflective properties in order to achieve high component efficiency.
  • Such plastics however, often show signs of aging when exposed to UV radiation.
  • the metal coating according to the invention largely protects the surface of the plastic from UV radiation. Discoloration of the reflector walls is thus significantly reduced, which also increases the reliability of the component. Discolouration can only occur in the area of the insulating web.
  • a second plastic component enables the components to be colored to increase the contrast.
  • black plastic could be used for the entire component.
  • the optoelectronic component according to the invention is a molded interconnect device (MID).
  • MID molded interconnect device
  • Another advantage is that two adjacent surfaces can be arranged at any angle to one another.
  • the later component orientation is already in the manufacture of the housing adjustable by adjusting the inclination of the component base in relation to the reflector base.
  • This different design can be easily achieved by changing the tool inserts during injection molding.
  • the procedure according to the invention enables a particularly robust and easily assembled design. Problems with regard to production and tolerances, in particular up to now, can thereby be reduced.
  • the metallization in particular that of the reflector, preferably also performs electrical functions, for example as a connecting conductor for the semiconductor chip, makes it possible to form particularly small components. No additional areas have to be provided for the formation and routing of the electrical connections.
  • At least two electrical connections are provided, preferably on at least two surfaces of the housing. Due to the subsequent application of the metallization to the preformed housing, the electrical connections can advantageously be arranged as desired on the surfaces of the housing. This allows the size of the component to be minimized, especially if more than four electrical connections are required, as is usually the case with optoelectronic components with multiple semiconductor chips.
  • the configuration of the electrical connections is particularly preferably determined by the metallizable plastic and / or the non-metallizable plastic. Furthermore, the number of connections can be determined by the course of the insulating web or the Design of the non-metallizable plastic of the housing body can be determined.
  • the housing is provided with metal particles, a heat sink or a thermal via.
  • the present invention is not only applicable to optoelectronic components that are manufactured according to the MID principle, but can also be used in components with a lead frame.
  • an area of the reflector metallization is formed by a metallic lead frame (leadframe).
  • the lead frame forms, for example, at least partially the bottom of the recess, while the walls of the recess are metallized according to the invention.
  • the properties of conventional SMT components can be easily improved by metallizing the reflector.
  • the metallization is preferably determined by the metallizable plastic and / or the non-metallizable plastic.
  • the semiconductor chips integrated in the optoelectronic component can include both optoelectronic semiconductor chips such as light-emitting diodes and detectors as well as electronic semiconductor chips with integrated control circuits.
  • the body is produced by means of a two-component injection molding process with at least two plastics, one of which cannot be metallized, and the body is subsequently metallized in such a way that a metallized and a non-metallized area is formed, the non-metallized area being determined by the non-metallizable plastic ,
  • the metallized area is preferably determined by a metallizable plastic.
  • the two components of the injection molding process are thus particularly preferably formed from non-metallizable and metallizable plastics.
  • the metallization is preferably carried out at least partially on the surface of the body, which is at least partially formed by the metallizable and the non-metallizable plastic.
  • the metallization can be produced by chemical and / or galvanic treatment of the body.
  • the chemical treatment is preferably carried out before the galvanic treatment.
  • the structure of the metallization is already determined during the manufacture of the body.
  • Subsequent structuring measures such as laser structuring, can advantageously be dispensed with.
  • This method is preferably used for the structured metallization of a body, which acts as a housing body for a electronic, in particular micro- or optoelectronic, component is formed.
  • the housing body is first produced by means of injection molding with at least two different plastics, one of the plastics being non-metallizable.
  • the housing body is subsequently metallized in such a way that a metallized and a non-metallized partial area of the housing body is produced, the non-metallized partial area being determined by the non-metallizable plastic, and the metallized partial area of the housing body is preferably determined by a metallizable plastic.
  • the two components of the injection molding process are thus particularly preferably formed from non-metallizable and metallizable plastics.
  • the metallized area of the housing body is preferably arranged on its surface and can take on an electrical and / or reflective function.
  • the non-metallized region particularly preferably separates the metallized region into at least two regions which are electrically insulated from one another and which can form the connecting conductors for the semiconductor chip.
  • Such a method has the advantage that the arrangement or the structure of the metallization can be determined even during the manufacture of the housing body. This is done through the use of metallizable and non-metallizable plastics in the manufacture of the housing. se emotionss in the two-component injection molding process. Instead of an injection molding process, press molding or injection molding processes can also be used insofar as they are suitable for the production of a body containing plastic, in particular a housing body for an optoelectronic component of the type mentioned above.
  • FIGS. 1 a to e show a schematic illustration of a first exemplary embodiment with a semiconductor chip in a top view from above, two sectional views, a side view and a top view from below,
  • 2a to f show a schematic illustration of a second exemplary embodiment with a semiconductor chip in a top view from above, a section, a side view, a top view from below and two perspective views
  • 3 a, b show a schematic illustration of a third exemplary embodiment with a semiconductor chip and with a lead frame in a plan view and a sectional view
  • FIGS. 4 a, b are schematic perspective representations of two exemplary embodiments, each with four semiconductor chips, and
  • Figure 5 is a schematic representation of a perspective view of an embodiment with a plurality of recesses, in each of which a semiconductor chip is arranged.
  • Figure 6a to 6c is a schematic representation of an embodiment with a semiconductor chip in a perspective oblique view, a sectional view, and a further simplified oblique view.
  • FIG. 7a to 7f show a schematic illustration of an exemplary embodiment of a method sequence according to the invention using four intermediate steps.
  • the component according to the first exemplary embodiment is a surface-mountable optoelectronic component in which a recess 12 is provided in a housing 10 (cf. FIG. 1 a).
  • the recess 12 has the shape of a truncated cone.
  • the reference number 13 denotes a wall of the recess 12 and the reference number 14 the bottom of the recess 12.
  • a semiconductor chip 50 for example an LED chip, is arranged in the center region of the base 14.
  • the surface of the housing 10 and areas of the recess 12 are provided with a metallization 15.
  • the metallization 15 is divided into two areas 16, 18, which are electrically separated from one another by means of an insulating web 20 (or better insulating slot).
  • the area 16 of the metallization 15 extends from the bottom 14 of the recess 12 via its wall 13 onto a surface 30 of the housing 10.
  • the semiconductor chip 50 is placed on this area 16 of the metallization 15 and is electrically connected to it.
  • the semiconductor chip 50 is connected to the further region 18 of the metallization 15 via a bond wire 52.
  • the region 18 of the metallization 15 likewise extends from the floor 14 via the wall 13 to the surface 30 of the housing 10.
  • the metallization 18 is electrically isolated from the region 16 of the metallization 15 on all surfaces.
  • the area occupied by the metallization 15 is as large as possible in relation to the area occupied by the insulating web 20 within the reflector. Since the reflection of the light emitted by the semiconductor chip is significantly lower in the region of the insulating web 20 compared to the metallized region, the insulating web crosses the recess 12 such that it lies in the extension of the surface diagonal of the semiconductor chip 50. In the present figure, the insulating web in the extension of the front diagonals of the chip is led out of the recess 12 at an angle 35 along the bottom 14 and the walls 13. This design allows a high reflector efficiency to be achieved, since the largest part of the radiation from the semiconductor Chips 50 emerges on the side surfaces and not at the vertically oriented corners.
  • the section shown in FIG. 1b through the optoelectronic component according to FIG. 1 a along the line AA drawn in FIG. 1 a illustrates the frustoconical shape of the recess 12 or the reflector and the division of the metallization 15 into the areas 16, 18.
  • the semiconductor chip 50 is open the bottom 14 of the recess 12 is arranged.
  • the bond wire 52 crosses the insulating web 20 and connects the side of the semiconductor chip 50 facing away from the bottom 14 to the metallization 18. It can be clearly seen from FIG. 1b that the insulating web 20 extends from the bottom 14 along the wall 13 to the surface 30.
  • Figure lc shows a sectional view along the line B-B drawn in Figure la. This view shows that the visible area of the wall 13 of the reflector is provided with the area 16 of the metallization 15 throughout.
  • FIGS. 1d and 1e show that regions 16, 18 of metallization 15 also extend along surface 28 to the rear of the housing and form external electrical connections 38, 40.
  • the arrangement of the electrical connections 38, 40 both on the lateral surfaces 28, 22 and on the surface 24 which forms the rear side means that the optoelectronic component can be used both as a top looker and as a side looker.
  • the optoelectronic component shown in FIGS. La to le is a molded interconnect device (MID).
  • MID molded interconnect device
  • a two-component injection molding process is preferably used here. In this method, at least two different plastics are used, wherein metallization is only possible on one of the plastics. Already during the injection molding process it is advantageously determined at which locations metallization can take place. The metallization is subsequently produced, for example, by means of chemical and / or galvanic treatment.
  • the advantage of the optoelectronic component according to the invention shown in FIG. 1 is that the metallization of the recess 12 designed as a reflector achieves a higher degree of efficiency than conventional components. Due to the reflection on the reflector walls (analog to radial components with metal reflectors), narrow-angle, homogeneous radiation characteristics can be generated if the reflector geometry is adjusted accordingly.
  • the geometry of the reflector can be determined by the injection molding process. In contrast to the illustration, the reflector could be in the form of a paraboloid, a spherical reflector or some other suitable shape.
  • FIG. 1 shows a lens to be dispensed with, as a result of which a flat surface and a small overall height are achieved. Because the electrical connection of the semiconductor chip is carried out inside the reflector, the overall height of the optoelectronic component can be further reduced.
  • FIG. 2b shows a side view along the section BB drawn in FIG. 2a. It can be clearly seen from this illustration that the surfaces 22, 24 and 26, 28 of the component are not arranged orthogonally to one another, but that the surface 24 is inclined at an angle 36 with respect to the surface 22. The surfaces 24 and 26 are arranged at right angles to one another merely by way of example. Depending on the surface with which the optoelectronic component is fastened on a subrack, there is an inclination of the reflector base 14 with respect to the component base 24 or 26. The component orientation can be freely selected by varying the angle 36.
  • the metallizations 16, 18 extend from the recess over the surface 30 (the upper side of the component) along the side surfaces 22 and 28 to the surfaces 24 and 26.
  • FIGS. 2e and 2f each show the second exemplary embodiment in a perspective illustration, specifically FIG. 2e an oblique view from above and FIG. 2f an oblique view from below.
  • a surface-mountable component (SMT component) is equipped with a lead frame 42, 44.
  • Figure 3a shows a top view of the SMT component
  • Figure 3b shows the side view of a section along the line A-A drawn in Figure 3a.
  • a metallization of the wall 13 of the recess 12 is provided according to the invention, the metallization of the wall 13 being can be determined for example by a metallizable and / or non-metallizable plastic.
  • the optical properties of the component can be significantly improved by the metallization.
  • the semiconductor chip 50 is arranged on an electrically conductive heat sink 46, which is electrically connected to the leadframe connection 42.
  • the semiconductor chip 50 is electrically connected to the second leadframe connection 44 via a bond wire 52. There is no electrical contact between the electrically conductive heat sink and the metallization on the wall 13 of the recess 12 in order to avoid a short circuit.
  • FIGS. 4a and 4b show very schematically surface-mountable optoelectronic components, each of which has four semiconductor chips 50a, 50b, 50c, 50d by way of example.
  • each semiconductor chip 50a, 50b, 50c, 50d is arranged in each recess 12a, 12b, 12c, 12d.
  • Each of the recesses 12a, 12b, 12c, 12d is provided with a metallization as described in the exemplary embodiments explained above. The metallizations have been omitted from the figure for the sake of clarity.
  • Each of the metallizations in the recesses 12a, 12b, 12c, 12d is divided into two electrically separated areas by an insulating web, which can be arranged, for example, in the area of a non-metallizable plastic and is not shown in this figure.
  • One of the areas the respective semiconductor chip is arranged and has a bond connection to the other region of the metallization.
  • Each of the areas of the metallization is connected to electrical connections 38a, 38b, 38c, 38d and 40a, 40b, 40c, 40d via conductor tracks.
  • Two electric each Connections are arranged on the four side surfaces of the component. Electrical connections can also be arranged on the rear side of the component, which is not visible in the figure.
  • the semiconductor chips 50a, 50b, 50c, 50d can be controlled independently of one another.
  • the semiconductor chips 50a, 50b, 50c, 50d are electrically connected to one another by means of a metallization located both in the recesses and on the surface of the component.
  • FIG. 4b shows a similar arrangement, in which, however, the four semiconductor chips 50a, 50b, ..., 50h are arranged in a single recess 12.
  • the regions of the metallization on the envelope surface of the recess can be designed such that no electrical contact is produced between the semiconductor chips 50a, 50b, ..., 50h. If the metallization is designed accordingly, an electrical connection is quite conceivable.
  • this figure also does not show the course of the metallization, the structure of which can be determined, for example, by a non-metallizable and / or a metallizable plastic. Electrical connections 38a, 38b, ..., 38h or 40a, 40b, ..., 40h are also present on all four side surfaces of the component, with two electrical connections being arranged on one surface.
  • each reflector is equipped with a semiconductor chip 50a, 50b, ..., 50h.
  • the arrangement of the metallization which can be determined, for example, by a non-metallizable and / or a metallizable plastic of the housing body, has been omitted in the figure for reasons of clarity, but can be carried out as shown in FIG. 1 or 2.
  • Electrical connections 38a, 38b, ..., 38h and 40a, 40b, ..., 40h are arranged on the two opposite side surfaces, each of which has an electrical connection to a region of the metallization.
  • the electrical connections 38a, 38b, ..., 38h or 40a, 40b, ..., 40h are also arranged on the back of the component designed as a "bar" and can be divided into individual components by sawing if desired.
  • FIGS. 4a, b and 5 can be arranged on a module both as a top looker and as a side looker.
  • FIGS. 6a, 6b and 6c show a schematic illustration of a further exemplary embodiment of an optoelectronic component according to the invention on the basis of different views.
  • FIG. 6a schematically shows an oblique perspective view of the optoelectronic component.
  • a housing body 57 of the optoelectronic component which comprises a housing 10, has a recess 12 with a wall 13 and a bottom 14, on which a semiconductor chip 50 is arranged.
  • a surface 30 of the housing body 57 has a metallization 15, which is insulated by an insulating web 20 two electrically isolated partial areas 16, 18 are divided, which form electrical connections 38, 40 for contacting the semiconductor chip 50 on the surfaces 32 and 24, or 33 and 24.
  • the semiconductor chip 50 is electrically conductively connected to the connection 38 via the metallization 16 on the bottom 14 of the recess 13 and to the connection 40 via the bond wire 52.
  • the metallization 15 assumes an electrical function and is designed to be reflective for the radiation generated by the semiconductor chip 50 and / or for radiation incident on the semiconductor chip.
  • a metallization contains Au.
  • the structure of the metallization, in particular the metallization 15 on the surface 30, and the connections 38, 40 is determined in this exemplary embodiment by a non-metallizable plastic 54 and a metallizable plastic 53, using which the housing body is produced, for example, in a two-component injection molding process.
  • the plastics 53 and 54 contain an LCP material, wherein the metallizable plastic 53 is preferably provided with an additive, such as an additive in the form of particles and, for example, an additive containing a metal such as palladium, which advantageously facilitates the metallization of this plastic ,
  • non-metallizable plastic can be understood in the context of the invention in such a way that a metallization of this plastic - at least with the metallic material for the structured metallization - compared to the metal talliseable plastic is not possible only with considerable additional effort or difficult.
  • the insulating web 20 is arranged in the region of the surface 30 of the housing body 57 in which it is formed by the non-metallizable plastic 54.
  • the surfaces 22 and 28 are free of metallization in this example, since this has advantages in the production of such components, in particular in large numbers (see FIG. 7).
  • the structure of a subsequently applied metallization 15 can thus be determined.
  • the insulating web 20 runs in the region of a bulge 58 of the wall 13 of the recess 12, which is otherwise essentially parabolic in cross-section. This has the advantage that only a very small part of the radiation emanating from the semiconductor chip 50 does not reach the radiation or is worse compared to the metallization 16 reflective plastic 54 hits. As a result, the efficiency of the optoelectronic component, in particular of the reflector, which is essentially formed by the metallization 16 of the recess, can be increased.
  • the semiconductor chip 50 is preferably arranged in the area of the focus of a paraboloid encompassing the wall 13 of the recess and can be designed, for example, as a transmitter or receiver, such as an LED chip, a laser diode chip, a photodiode chip or as another, in particular optoelectronic, semiconductor chip.
  • FIG. 6b shows a schematic sectional view of the component from FIG. 6a along a plane which comprises the bond wire 52.
  • the essentially parabolic configuration of the wall 13 of the recess 12 and a casing 56 arranged in the recess, which at least partially surrounds the chip 50 and advantageously protects against harmful external influences, can be seen.
  • the surface of the casing 56 is particularly advantageously curved toward the semiconductor chip 50 and / or does not protrude beyond the surface 30. As a result, the height of the component can advantageously be kept low.
  • the bond wire 52 is also not led beyond the surface 30 and is covered by the sheath 56.
  • the structure of the housing body 57 with the metallizable 53 and the non-metallizable plastic 54 can be seen, the shape of the metallizations 16, 18 and thus the course of the insulating web 20, which is formed in the area of the non-metallizable plastic, and the connections 38, 40 determined on the surfaces 24, 30, 32 or 33 of the housing body 57.
  • the optoelectronic component is designed as a top looker, with the connections 38 and 40 on the surface 24 opposite the surface 30.
  • the 33 can, for example, be soldered to the conductor tracks of a printed circuit board.
  • the component can be exposed to high temperatures during soldering. In particular, this applies to the area of the connections 38 and 40 and the adjacent metallizable 53 and non-metallizable 54 plastics of the housing body 57 if the surface 24 is soldered.
  • Different thermal expansions of the plastics and the metallization can consequently lead to a high mechanical load on the component and this in turn can lead to malfunctions or even failures.
  • the soldering can lead to fatigue of the metallization 15 in the region of the connections 38, 40, which can result in a deterioration in the electrical contact with the printed circuit board.
  • Such slots 55 in the housing body 57 can advantageously already be formed during the two-component injection molding process, for example by using plastics 53, 54 which are essentially chemically inert to one another and thus only difficult to form a chemical bond with one another, such as suitably designed LCPs which can contain the plastics 53, 54.
  • slots 55 can also be provided after the injection molding process by means of known, for example mechanical, structuring methods.
  • At least a part of the housing body 57 is preferably formed in one piece. This is preferably achieved, as shown in FIG. 6c, by connecting webs 59, which are formed in the region of the housing body 57, which comprises the non-metallizable plastic. These ensure a mechanical connection between the partial areas 60 and 61 of the housing body 57. Such connections can also be provided in the exemplary embodiments in FIGS. 1 to 5.
  • FIG. 6c schematically shows a perspective view of the housing body 57 from FIG. 6a without the non-metallizable one Plastic 54, which is not shown for the sake of clarity.
  • the connecting webs are separated by a space 62.
  • This space allows a high penetration of the piece of the housing body shown here with the non-metallizable plastic 54.
  • This increases the stability of the housing body, as shown in FIG. 6b, as does the substantially L-shaped cross section of the area of the non-metallizable plastic 54. This applies in particular if the plastics 53, 54 form essentially no chemical bond with one another.
  • MID Molded Interconnect Device
  • housings of any design and reflectors of any design can be produced in a simple manner.
  • the metallization can be applied in the abovementioned two-component injection molding process, by means of a laser structuring or a masking process.
  • the two-component injection molding process allows the greatest degrees of freedom with regard to the design of the housing body, the formation of the metallization and / or the connections.
  • FIG. 7 is a schematic illustration of an exemplary embodiment of a method for producing Position of an optoelectronic component shown using intermediate steps shown in Figures 7a to 7f.
  • FIG. 7a shows a top view of a first piece 57a of a housing body of the optoelectronic component produced in a first method step by means of an injection molding process with a metallizable plastic 53.
  • the shape of the housing body piece 57a is determined by a suitable tool during injection molding.
  • the metallizable plastic 53 preferably contains an LCP or PBT, and particularly preferably contains an additive, for example a metal, such as palladium.
  • the additive advantageously facilitates later metallization of the metallizable plastic 53.
  • the housing piece 57a is formed in one piece in this exemplary embodiment.
  • the areas 60, 61 of the housing piece 57a are mechanically connected to one another via connecting webs 59.
  • a plurality of recesses 12 are formed with a wall 13 and a base 14, which are preferably arranged at a minimum lateral distance from one another in order to advantageously make the number of the recesses 12 in the region 60 high and thus increase the efficiency of the manufacturing process optimize. It should be noted here that the distance is large enough that it allows later separation into components in this area.
  • the recess 12, like the base 14 in this exemplary embodiment, is essentially circular in plan view. det.
  • a bulge 58 is provided in the wall 13 of the recess 12, which bulge is formed in the regions 60 and 61 of the housing body piece 57a and extends over the region of the connecting webs 59.
  • the connecting webs 59 are separated from one another in the region of the recesses by spaces 62.
  • FIG. 7b shows a side view of the housing body piece 57a, which contains the metallizable plastic 53 and comprises the areas 60, 61 which are mechanically connected to one another via the connecting webs 59.
  • the connecting webs 59 advantageously connect the regions 60 and 61 of the housing body part 57a in a mechanically stable manner, so that the handling of the housing body part 57a is facilitated in the further processing.
  • a further housing body piece 57b is produced in a further injection molding process with a non-metallizable plastic 54, which is arranged in the region of the connecting webs 59.
  • the non-metallizable plastic 54 preferably contains an LCP and, in contrast to the metallizable plastic 53, is particularly preferably essentially free of the additive.
  • the structure resulting from this injection molding process is shown in a top view in FIG. 7c.
  • the housing body piece 57b containing the non-metallizable plastic 54 is in this case arranged between the regions 60, 61 of the housing body piece 57a connected via the connecting webs.
  • the non-metallizable plastic in this embodiment in the spaces 62 between the connecting webs 59.
  • the mechanical stability of the housing body 57 comprising the housing body parts 57a and 57b can be increased. This is particularly the case if the metallizable 53 and the non-metallizable plastic 54 do not form a chemical bond or only do so with difficulty, so that the stability of the housing body 57 is essentially ensured by mechanical means such as the connecting webs 59.
  • the surface of the housing body 57 has, at least in some areas, a metallizable 53 and a non-metallizable 54 plastic, which the two components of the two-component injection molding process schematically shown in FIGS. 7a to 7d for the production of a plastic-containing body, in particular a housing body 57 for intermediate steps an optoelectronic component.
  • the housing body 57 is subsequently metallized in a structured manner such that a metallization 15 is formed in the regions 60, 61 in which the surface of the housing body is formed by the metallizable plastic 53.
  • the housing body 57 is exposed, preferably at least on the side of the surface 30, to an etching process which acts on the plastics but leaves the additive in the metallizable plastic essentially unchanged.
  • This increases the density of the additive, for example palladium in the form of particles, on the part of the surface of the housing body in which it is formed by the metallizable plastic 53.
  • a metal such as Cu, which essentially only attaches to the additive.
  • the area of the non-metallizable plastic 54 is thus essentially free of Cu atoms and additive, whereas the area of the metallizable plastic 53 is essentially covered over the entire area with a, for example, 1-2 ⁇ m thick Cu layer, which results from the accumulation of the Cu on the Additive emerges, the density of which was advantageously increased on the surface of the metallizable plastic 53 by means of the etching process.
  • further metals such as Ni and / or Au, can be applied to the region of the metallizable plastic 53 provided with Cu by means of further chemical and / or galvanic processes.
  • the Au preferably forms at least partially the surface of the resulting metallization 15.
  • the housing body 57 is provided in the areas 60, 61 of the metallizable plastic 53 with the preferably full-area metallization 15, for example containing Au, which is separated by the insulating web 20 arranged in the area of the non-metallizable plastic 54 into preferably two electrically isolated partial areas 16, 18 becomes.
  • the floors 14 and the walls 13 of the recesses 12 are provided with the metallization 16.
  • a plastic-containing body in particular a housing body for an optoelectronic component, can be provided with a structured metallization, the structure of which can be determined during the manufacture of the body by the formation of the two plastic components.
  • several different plastics, in particular metallizable plastics can also be used. It can thereby be achieved that the different plastics have different metallizations, for example containing Ag, Au or Al.
  • the metallized areas 16, 18 preferably form the connection conductors for a semiconductor chip 50, which is subsequently attached to the bases 14 of the recesses 12, for example by means of a solder.
  • the semiconductor chip 50 is preferably connected to the metallization 16 in an electrically conductive manner, for example via the solder.
  • the semiconductor chips 50 are subsequently connected in an electrically conductive manner to the region 18 of the metallization 15 via bond wires 52, whereupon a sheath 56, for example an epoxy, acrylic or silicone resin, can be introduced into the recess, which protects the semiconductor chips 50 against damaging external influences , This is shown in a top view in FIG. 7f.
  • a sheath 56 for example an epoxy, acrylic or silicone resin
  • the metallization 16 of the recess 12 preferably acts simultaneously as an electrical connecting conductor for the semiconductor chip 50 and as a reflector for radiation generated or to be received by the semiconductor chip.
  • the plastics 53, 54 thus advantageously determine the structure of this metallization and thus the subsequent electrical connections 38, 40 of an optoelectronic component, which can emerge from the structure shown in FIG. 7e by separating, even before the metallization of the housing body 57.
  • a method for manufacturing suitable for large quantities of optoelectronic components.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un composant optoélectronique qui comprend un corps de boîtier (57) et au moins une puce semi-conductrice (50) placée sur le corps de boîtier (57). Le composant optoélectronique selon l'invention est caractérisé en ce que la surface du corps de boîtier (57) présente une zone partielle métallisée (15) et une zone partielle non métallisée (20) et que le corps de boîtier (57) comprend au moins deux plastiques différents (53, 54), l'un des plastiques n'étant pas métallisable (54) et définissant la zone partielle non métallisée (20). L'invention concerne également un procédé pour la production de tels composants ainsi qu'un procédé pour la métallisation structurée d'un corps contenant du plastique.
EP03808252A 2003-02-28 2003-12-30 Composant optoelectronique comprenant un corps de boitier a metallisation structuree, son procede de production et procede pour la metallisation structuree d'un corps contenant du plastique Withdrawn EP1597764A1 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE2003108917 DE10308917A1 (de) 2003-02-28 2003-02-28 Optoelektronisches Bauteil mit metallisiertem Reflektor
DE10308917 2003-02-28
DE20314966U DE20314966U1 (de) 2003-02-28 2003-09-26 Optoelektronisches Bauteil mit metallisiertem Reflektor
DE20314966U 2003-09-26
PCT/DE2003/004291 WO2004077558A1 (fr) 2003-02-28 2003-12-30 Composant optoelectronique comprenant un corps de boitier a metallisation structuree, son procede de production et procede pour la metallisation structuree d'un corps contenant du plastique

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EP1597764A1 true EP1597764A1 (fr) 2005-11-23

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EP03808252A Withdrawn EP1597764A1 (fr) 2003-02-28 2003-12-30 Composant optoelectronique comprenant un corps de boitier a metallisation structuree, son procede de production et procede pour la metallisation structuree d'un corps contenant du plastique

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US (1) US7247940B2 (fr)
EP (1) EP1597764A1 (fr)
JP (1) JP4603368B2 (fr)
KR (1) KR101025234B1 (fr)
TW (1) TWI250665B (fr)
WO (1) WO2004077558A1 (fr)

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JP4603368B2 (ja) 2010-12-22
US20040232435A1 (en) 2004-11-25
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WO2004077558A1 (fr) 2004-09-10
US7247940B2 (en) 2007-07-24
KR101025234B1 (ko) 2011-04-01
TW200419830A (en) 2004-10-01
JP2006514434A (ja) 2006-04-27

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