EP1579528B1 - Übergang von einem rechteckigen hohlleiter auf eine mikrostreifenleitung - Google Patents
Übergang von einem rechteckigen hohlleiter auf eine mikrostreifenleitung Download PDFInfo
- Publication number
- EP1579528B1 EP1579528B1 EP03810852A EP03810852A EP1579528B1 EP 1579528 B1 EP1579528 B1 EP 1579528B1 EP 03810852 A EP03810852 A EP 03810852A EP 03810852 A EP03810852 A EP 03810852A EP 1579528 B1 EP1579528 B1 EP 1579528B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- microstrip line
- waveguide
- substrate
- transition
- rib
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000007704 transition Effects 0.000 title claims description 28
- 239000000758 substrate Substances 0.000 claims description 29
- 239000006260 foam Substances 0.000 claims description 17
- 238000001465 metallisation Methods 0.000 claims description 7
- 229920002994 synthetic fiber Polymers 0.000 claims description 6
- 150000003949 imides Chemical class 0.000 claims description 3
- 229920000193 polymethacrylate Polymers 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 5
- 241000195940 Bryophyta Species 0.000 description 4
- 235000011929 mousse Nutrition 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000013012 foaming technology Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000002984 plastic foam Substances 0.000 description 1
- 229920007790 polymethacrylimide foam Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
Definitions
- the invention relates to a transition between a rectangular waveguide and a microstrip line.
- the waveguide structures are often well suited for the realization of passive functions with low losses and high performance (antenna source such as corrugated cones, polarizers, filters, diplexers) more particularly at very high frequencies (centimetric bands and millimeter).
- the planar structures are on their side very well adapted for the low cost and large volume production of devices incorporating passive and active functions using conventional printed circuit manufacturing processes at frequencies up to the millimetric bands.
- the antenna source, the filter and the polarizer, if any are made in waveguide technology while the rest of the signal processing functions (weak amplification noise, mixing and intermediate filtering) are performed in conventional printed circuit technology.
- European Patent No. 0350324 discloses a transition between a waveguide structure and a microstrip transmission line in which a conductive line is supported within the waveguide perpendicularly to its axis and the microstrip transmission line. extends transversely across the wall of the waveguide in a position producing an energy coupling between the microstrip transmission line and the conductive line.
- a guided structure is formed on a microwave substrate.
- the rectangular waveguide is made by a double-sided metallization of the microwave substrate associated with metallized holes to make the lateral faces of the rectangular waveguide.
- the object of the invention is to propose a transition between a rectangular waveguide and a microstrip line that can be manufactured at low cost without assembling several parts.
- the transition is characterized in that it consists of a ribbed rectangular waveguide made in a bar of synthetic material whose metallized base under the rib is extended in the form of a plate of synthetic material constituting a substrate for the microstrip line, the rib having a bottom extending between the upper plane of the ribbed waveguide and the upper plane of the substrate and the microstrip line being disposed on the upper plane of the substrate in the extension of the bottom of the rib.
- FIG. 1 shows a block diagram of a transition according to the invention between a rectangular waveguide and a microstrip line.
- Figures 2 to 4 illustrate the process of manufacturing a transition according to the invention.
- a transition between a rectangular waveguide and a microstrip line is constituted by a ribbed rectangular waveguide G made in a plastic foam bar which also serves as a substrate for the microstrip line.
- the foam bar made of synthetic material, for example a polymethacryl imide foam known for its electrical characteristics close to those of air, for its mechanical characteristics of rigidity and lightness and for its weakness. cost, extends in a longitudinal direction A between two ends 1.2 between which is formed a shoulder 3 which extends perpendicular to the longitudinal direction A.
- This shoulder 3 defines an upper plane 4 of the ribbed waveguide and a top plane 5 of the substrate.
- the upper plane 5 of the substrate is offset perpendicularly to the longitudinal direction of the bar with a height H relative to the upper plane 4 of the ribbed waveguide, the height H corresponding to the height of the rib of the ribbed waveguide.
- the bottom of the rib 6 of the waveguide G extends between the upper plane 4 of the waveguide and the upper plane 5 of the substrate through the shoulder 3.
- the bottom and the lateral walls of the rib 6 are metallized, the metallization of the bottom of the rib 6 continuing on the upper plane 5 of the substrate to form the microstrip line 7.
- the metallized base 8 of the ribbed waveguide which extends under the rib 6 thus extends in the form of a foam plate constituting the substrate for the microstrip line.
- This metallized base thus serves as a ground plane for the microstrip line 7.
- the lateral faces 9 and 10 of the foam bar defining the ribbed rectangular waveguide are also metallized to the limit of the shoulder 3, although the metallization of the lateral flanks of the plate constituting the substrate of the microstrip line may not not degrade the electrical behavior of the microstrip line.
- the bottom of the rib 6, at the junction with the microstrip line 7, is at a distance E from the ground plane of the microstrip line, this distance E corresponding to the thickness of the substrate at the junction with the ribbed waveguide.
- the bottom of the rib 6 has a linear profile which allows to achieve simply by machining, stamping, hot pressing or cutting the foam bar.
- the rib 6 is centered in the width of the foam bar and its dimensions can be adjusted according to the desired working frequency range by ensuring an adequate stepwise transition from the quasi-TEM propagation mode of the microstrip line to the fundamental mode of the microstrip. guide. Such a gradual transition is made according to a given profile, linear, exponential or otherwise. And as a general rule, the minimum length of the profile obtained to ensure correct adaptation over the entire operating range must be of the order of a fraction of the wavelength (for example a quarter of the wavelength) corresponding to the lowest frequency.
- the microstrip line 7 may have a width identical to that of the rib or larger but it is well known that the width of a microstrip line depends on the thickness of the substrate on which it is arranged as well as its permittivity. Thus, it is possible to adjust the height of the substrate in the junction plane so as to obtain an identical width, or as close as possible to that of the rib. Then, to return to the thickness of the most suitable substrate, for the microstrip line 7, it is sufficient to gradually vary the thickness of the foam plate constituting the substrate in the longitudinal direction A.
- This thickness variation is made at quasi-constant characteristic impedance simultaneously modifying the width of the microstrip line which avoids passing through quarter-wave-type impedance transformers with discontinuous variation of line width which are at the origin of performance degradations ( losses, reduction of bandwidth).
- the impedance matching of the microstrip line is illustrated by a continuous linear decrease (represented in dashed line by 11) of the thickness of the substrate in the direction A and by a continuous linear decrease (represented as a line interrupted by 12) the width of the microstrip line over a certain length L of the microstrip line.
- Figures 2 to 4 illustrate a method of manufacturing the transition according to the invention in foam technology.
- a foam bar 20 is previously formed into a rectangular cross-sectional shape with dimensions that correspond to the inner dimensions of a rectangular waveguide for mono modal prior operation in the desired frequency range. Then, the foam bar is worked by machining, thermoforming, stamping or other to form the rib 6. The delimiting operation of the rib 6 in the section of the waveguide G can be extended at the section of the microstrip line 7.
- a complete metallization of the foam block 20 can then to be carried out, the metallization of the rib and the formation of the microstrip line being done simultaneously. Non-directive metallization by projection or brushing may be used.
- the foam block is cut transversely at the end of the rib 6 to form the plate-like substrate 5 of the microstrip line.
- the transition according to the invention is therefore carried out in one piece using a material of low permittivity, generating low losses and having good mechanical strength which contributes to obtaining a microstrip line whose dimensions are in agreement with those of the waveguide section. Furthermore, the realization of the transition according to the invention makes it possible to obtain an electrical and physical continuity between the waveguide and the microstrip line without the use of impedance transformers of the discontinuous change in line width type.
Landscapes
- Waveguides (AREA)
- Waveguide Aerials (AREA)
Claims (5)
- Übergang von einem rechteckigen Hohlleiter auf eine Mikrostreifenleitung, dadurch gekennzeichnet, dass er aus einem Stab (20) aus Kunststoff besteht, der einen ersten Teil, dessen Seitenflächen metallisiert sind, um einen Hohlleiter (G) zu bilden, und einen zweiten Teil umfasst, der den ersten Teil verlängert und ein Substrat für eine Mikrostreifenleitung bildet, wobei der Stab zwischen dem den Hohlleiter bildenden Teil und dem das Substrat bildenden Teil einen Absatz (3) aufweist, der eine obere Ebene (4) des den Hohlleiter bildenden Teils und eine obere Ebene (5) des das Substrat bildenden Teils definiert, und wobei der Stab zwischen den zwei oberen Ebenen eine Rippe (6) mit einem metallisierten Boden und mit metallisierten wänden aufweist, wobei sich der Boden zwischen den zwei oberen Ebenen erstreckt, wobei die Metallisierung des Bodens durch die auf dem Substrat realisierte Mikrostreifenleitung (7) verlängert wird, wobei die gemeinsame Basis (8) des ersten und des zweiten Teils vollständig metallisiert ist.
- Übergang nach Anspruch 1, bei dem der Boden der Rippe (6) ein lineares Profil aufweist.
- Übergang nach Anspruch 1 oder 2, bei dem der zweite, das Substrat bildender Teil eine Dicke aufweist, die in einer den ersten Teil verlängernden Richtung variiert, um die Breite der Mikrostreifenleitung (7) zu verändern und dabei deren charakteristische Impedanz quasi konstant zu halten.
- Übergang nach einem der Ansprüche 1 bis 3, bei dem der Kunststoff ein dielektrischer Schaum ist.
- Übergang nach Anspruch 4, bei dem der dielektrische Schaum ein Polymetacrylat-Imid-Schaum ist.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0300045 | 2003-01-03 | ||
| FR0300045A FR2849720B1 (fr) | 2003-01-03 | 2003-01-03 | Transition entre un guide d'onde rectangulaire et une ligne microruban |
| PCT/FR2003/050201 WO2004066432A1 (fr) | 2003-01-03 | 2003-12-22 | Transition entre un guide d'onde rectangulaire et une ligne microruban |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1579528A1 EP1579528A1 (de) | 2005-09-28 |
| EP1579528B1 true EP1579528B1 (de) | 2006-05-17 |
Family
ID=32524679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP03810852A Expired - Lifetime EP1579528B1 (de) | 2003-01-03 | 2003-12-22 | Übergang von einem rechteckigen hohlleiter auf eine mikrostreifenleitung |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US7382212B2 (de) |
| EP (1) | EP1579528B1 (de) |
| JP (1) | JP4263176B2 (de) |
| KR (1) | KR100998207B1 (de) |
| CN (1) | CN1322628C (de) |
| AU (1) | AU2003302294A1 (de) |
| BR (1) | BR0317729A (de) |
| DE (1) | DE60305349T2 (de) |
| FR (1) | FR2849720B1 (de) |
| MX (1) | MXPA05007249A (de) |
| WO (1) | WO2004066432A1 (de) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8305280B2 (en) * | 2009-11-04 | 2012-11-06 | Raytheon Company | Low loss broadband planar transmission line to waveguide transition |
| KR101902558B1 (ko) | 2010-07-02 | 2018-10-01 | 누보트로닉스, 인크. | 3차원 마이크로구조체 |
| US8552813B2 (en) | 2011-11-23 | 2013-10-08 | Raytheon Company | High frequency, high bandwidth, low loss microstrip to waveguide transition |
| US9065163B1 (en) | 2011-12-23 | 2015-06-23 | Nuvotronics, Llc | High frequency power combiner/divider |
| US9405064B2 (en) * | 2012-04-04 | 2016-08-02 | Texas Instruments Incorporated | Microstrip line of different widths, ground planes of different distances |
| US8952752B1 (en) | 2012-12-12 | 2015-02-10 | Nuvotronics, Llc | Smart power combiner |
| FR3010835B1 (fr) | 2013-09-19 | 2015-09-11 | Inst Mines Telecom Telecom Bretagne | Dispositif de jonction entre une ligne de transmission imprimee et un guide d'ondes dielectrique |
| DE102015221142A1 (de) | 2014-10-31 | 2016-05-19 | Anritsu Corporation | Übertragungsleitungs-Umwandlungsstruktur für ein Millimeterwellenband |
| CN106024921B (zh) * | 2016-06-30 | 2017-09-15 | 浙江大学 | 悬挂型可见光及近红外波段硅基光波导集成光电探测器 |
| CN106061093B (zh) * | 2016-08-04 | 2019-08-23 | 同方威视技术股份有限公司 | 用于电子直线加速器的波导系统以及电子直线加速器 |
| KR102674456B1 (ko) | 2017-01-26 | 2024-06-13 | 주식회사 케이엠더블유 | 전송선로-도파관 전이 장치 |
| US11664568B2 (en) * | 2019-06-11 | 2023-05-30 | Intel Corporation | Waveguides including at least one ridge associated with at least one dielectric core and the waveguides are surrounded by a conductive shell |
| JP2024064072A (ja) * | 2022-10-27 | 2024-05-14 | 古野電気株式会社 | 高周波回路、および、レーダ装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2897461A (en) * | 1953-09-14 | 1959-07-28 | Boeing Co | Wave guide construction |
| US3265995A (en) * | 1964-03-18 | 1966-08-09 | Bell Telephone Labor Inc | Transmission line to waveguide junction |
| US3932823A (en) * | 1975-04-23 | 1976-01-13 | The United States Of America As Represented By The Secretary Of The Navy | Microstrip to waveguide adapter |
| JPH0435203A (ja) * | 1990-05-25 | 1992-02-06 | Sumitomo Electric Ind Ltd | マイクロ波デバイス |
| JPH05335816A (ja) * | 1992-06-03 | 1993-12-17 | Japan Radio Co Ltd | 導波管−マイクロストリップ線路変換器 |
| DE19636890C1 (de) * | 1996-09-11 | 1998-02-12 | Bosch Gmbh Robert | Übergang von einem Hohlleiter auf eine Streifenleitung |
| US6242984B1 (en) * | 1998-05-18 | 2001-06-05 | Trw Inc. | Monolithic 3D radial power combiner and splitter |
| DK1055264T3 (da) | 1998-12-10 | 2007-04-30 | Raytheon Co | Overgang fra bredbåndsmikrostrip til parallel-plade-bölgeleder |
-
2003
- 2003-01-03 FR FR0300045A patent/FR2849720B1/fr not_active Expired - Fee Related
- 2003-12-22 JP JP2004567029A patent/JP4263176B2/ja not_active Expired - Fee Related
- 2003-12-22 BR BR0317729-7A patent/BR0317729A/pt not_active IP Right Cessation
- 2003-12-22 CN CNB2003801081523A patent/CN1322628C/zh not_active Expired - Fee Related
- 2003-12-22 WO PCT/FR2003/050201 patent/WO2004066432A1/fr not_active Ceased
- 2003-12-22 KR KR1020057012057A patent/KR100998207B1/ko not_active Expired - Fee Related
- 2003-12-22 DE DE60305349T patent/DE60305349T2/de not_active Expired - Lifetime
- 2003-12-22 EP EP03810852A patent/EP1579528B1/de not_active Expired - Lifetime
- 2003-12-22 AU AU2003302294A patent/AU2003302294A1/en not_active Abandoned
- 2003-12-22 MX MXPA05007249A patent/MXPA05007249A/es active IP Right Grant
- 2003-12-22 US US10/540,642 patent/US7382212B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR100998207B1 (ko) | 2010-12-07 |
| AU2003302294A1 (en) | 2004-08-13 |
| CN1322628C (zh) | 2007-06-20 |
| BR0317729A (pt) | 2005-11-22 |
| FR2849720B1 (fr) | 2005-04-15 |
| FR2849720A1 (fr) | 2004-07-09 |
| US7382212B2 (en) | 2008-06-03 |
| MXPA05007249A (es) | 2005-09-08 |
| JP4263176B2 (ja) | 2009-05-13 |
| KR20050089078A (ko) | 2005-09-07 |
| DE60305349D1 (de) | 2006-06-22 |
| DE60305349T2 (de) | 2007-05-10 |
| CN1735995A (zh) | 2006-02-15 |
| WO2004066432A1 (fr) | 2004-08-05 |
| US20060152298A1 (en) | 2006-07-13 |
| JP2006513655A (ja) | 2006-04-20 |
| EP1579528A1 (de) | 2005-09-28 |
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