Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0237—High frequency adaptations
  • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
  • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
  • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
  • H05K3/061—Etching masks
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
  • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
  • H05K3/061—Etching masks
  • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
  • H05K1/0298—Multilayer circuits
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
  • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/01—Dielectrics
  • H05K2201/0137—Materials
  • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
  • H05K2203/107—Using laser light
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0011—Working of insulating substrates or insulating layers
  • H05K3/0017—Etching of the substrate by chemical or physical means
  • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
  • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
  • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
  • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles

Definitions

• the invention relates to a method for producing high-frequency electrical line structures on a line structure carrier.
• Chemical tin can be applied in a thickness of approx. 1 ⁇ m.
• An amorphous resist can even be applied in a thickness of significantly less than 20 ⁇ m.
• Previous resists had a layer thickness of significantly greater than 20 ⁇ m.
• the much thinner resists enable lasering in a much more precise way. With an optimized manufacturing process, structures down to the 20 or 10 ⁇ m range are possible. These fine structures enable the formation of electrical line structures that can be used by high-frequency technology and replace the otherwise required conventional components with the corresponding disadvantages.
• the line structures are designed in such a way that they form capacitors, coils and resistors that are effective in terms of high-frequency technology, each with the desired values in the smallest space.
• the laser structuring method allows structuring z. B. compared to photo-technical processes in a relatively simple manner and still at high speed.
• the combination of a laser structuring method with an etching method has the further advantage that entire areas can be removed simultaneously with the removal of other areas. This saves time, but is also often necessary so that the electrical line structures used in high-frequency technology are not negatively influenced by the electrical voltage fields that may be present through the full-area areas.
• this method enables structured conductor tracks with small tolerances to be realized on the inner layers or on the outer layers of a printed circuit board as a microstrip conductor with almost any function over the entire production benefit.
• the width of the conductor tracks can be narrowed down almost as desired. Tolerances of ⁇ +/- 5 ⁇ m are already possible today. In the past, typical tolerances were in the range of sizes of +/- 25 ⁇ m.
• FR 4 carrier material is then used as a line structure carrier. This material is well known and inexpensive.
• FIG. 1 shows a basic process sequence of the method according to the invention
• Figure 2 shows a part of a larger produced by the method according to the Figure 1 circuit board structure in cross-section with a high frequency can be used industrially and a non-high-frequency-technologically usable line structure
• Figure 3 is a ⁇ size comparison between a line structure according to the invention and according to an appropriate conventional technique
• Figures 4 to 7 a step-by-step realization of a coil produced according to the invention
• Figures 8 to 10 a side view of three finished
• Figures 11 and 12 further applications according to the invention, Figures 13 to 16 application examples according to the invention with respect to a capacitor, a coil, a resistor and a moisture sensor.
• the partial laser structured conductor pattern shown in FIG. 1 shows a line structure carrier 1 (substrate, for example an FR4 circuit board), the surface of which is pretreated in an initial coating phase in such a way that a thin layer chemical copper can be applied.
• a further copper layer in the present exemplary embodiment with a total layer thickness of up to 20 ⁇ m, is then applied in a subsequent electrolytic coating.
• ne thin resist layer here consisting of chemical tin with a layer thickness of approx. 1 ⁇ m, applied.
• a structuring phase follows the coating phase.
• the structuring is carried out according to FIG. 1 with a laser.
• the chemical tin layer is milled away at the points at which the copper layer below the chemical tin layer is to be removed later.
• the exposed copper layer is etched away. Finally, the chemical tin layer still present is stripped away.
• FIG. 2 a line structure according to the invention is shown in the top left area, while a conventional line structure is shown in the middle area.
• FIG. 3 shows size relationships when a predetermined line structure is implemented in accordance with the invention and in accordance with a conventional technique.
• FIGS. 4 to 7 show the step-by-step realization of a coil realized with a microstrip line according to the invention.
• a copper surface with an edge length of 1 mm is shown in FIG.
• the copper surface is structured with a laser in the individual production steps.
• a coil in the form of a worm can already be seen in FIG. In FIG. 6, the disruptive corner surfaces have been removed. In Figure 7 the coil is finished.
• FIGS. 8 to 10 finished applications based on coils are shown in a respective side view.
• the shape and size of the figures can be chosen freely. In the illustrated embodiment, the most compact form was chosen.
• FIG. 11 shows a possible application within the circuit board below a component. In the form shown, no assembly area of the circuit board is required. The coil could also be placed anywhere in the layout.
• FIG. 12 shows an application as capacitors below a pad (pad).
• Layer thicknesses down z. B. up to 25 microns can capacitors in the range up to z. B. 20 pF can be realized in the smallest space. These capacitors have the additional advantage that they hardly have an inductive effect.
• FIG. 13 shows an application with respect to an RF capacitor.
• FIG. 14 shows an application with respect to an RF coil.
• FIG. 15 shows an application with respect to an RF resistor and
• FIG. 16 shows an application with regard to a moisture sensor.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Metallurgy (AREA)
• Parts Printed On Printed Circuit Boards (AREA)
• Manufacturing Of Printed Circuit Boards (AREA)

Applications Claiming Priority (3)

Publications (1)

Family

ID=30469613

Family Applications (1)

Country Status (6)

Families Citing this family (4)

Family Cites Families (5)

• 2002
  • 2002-08-08 DE DE10236466A patent/DE10236466A1/de not_active Withdrawn
• 2003
  • 2003-07-03 JP JP2004529701A patent/JP2005535146A/ja active Pending
  • 2003-07-03 WO PCT/DE2003/002227 patent/WO2004019665A1/de not_active Application Discontinuation
  • 2003-07-03 KR KR1020057002065A patent/KR20050059055A/ko not_active Application Discontinuation
  • 2003-07-03 EP EP03792118A patent/EP1527659A1/de not_active Withdrawn
  • 2003-08-04 TW TW092121277A patent/TW200406950A/zh unknown

Non-Patent Citations (1)

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