EP1512316A1 - Systeme d'equipement et procede permettant d'equiper des substrats de composants - Google Patents

Systeme d'equipement et procede permettant d'equiper des substrats de composants

Info

Publication number
EP1512316A1
EP1512316A1 EP03704243A EP03704243A EP1512316A1 EP 1512316 A1 EP1512316 A1 EP 1512316A1 EP 03704243 A EP03704243 A EP 03704243A EP 03704243 A EP03704243 A EP 03704243A EP 1512316 A1 EP1512316 A1 EP 1512316A1
Authority
EP
European Patent Office
Prior art keywords
substrates
transport
placement
loading device
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03704243A
Other languages
German (de)
English (en)
Inventor
Mohammad Mehdianpour
Harald Stanzl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1512316A1 publication Critical patent/EP1512316A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus

Definitions

  • the invention relates to an assembly system and a method for equipping substrates with components, in which the substrates can be fed on an essentially linear transport path, and at least one feed device for feeding components as well as at least one loading field with a handling device for loading to the side of the transport path of the supplied components is arranged on the substrates.
  • Pick and place systems are now widely used to populate substrates with components, particularly with SMD components.
  • the substrates are conventionally fed on a transport route. Placement fields are arranged along the transport route. If a substrate reaches an assembly field, its position is determined relative to a handling device, which is arranged in the assembly field for assembling the components onto these substrates. The components are then placed on the substrate using the handling device.
  • the invention is therefore based on the object of using a mounting system and a method for mounting substrates
  • the loading system enables a flexible delivery and delivery of substrates to the placement fields and a flexible forwarding of substrates along the transport path of the placement system past the placement fields by means of a loading device with at least two stacking areas for receiving and dispensing substrates.
  • the substrates fed along the transport path can be transferred into each of the receiving areas provided on the loading device. From the loading device, the substrates can either be transferred from the upper receiving area as well as from the lower receiving area to an assembly field, where they can be assembled, or to another sub-area of the transport route, from where they can be transported to another assembly system can be edited without being edited.
  • Assembly system can be assembled on a free assembly field.
  • the circuit boards can be transferred from the transport route into the upper receiving area of the loading device. From here, in the event that the incoming substrates are not to be processed in this placement system, it is possible to use the loading device lowering a vertical drive and from the lowered position to another part of the transport route for further transport to another assembly system. On the other hand, it is also possible to leave the loading device in its original vertical position and to transfer the incoming substrates to the placement fields.
  • these loaded substrates can be transferred to different transport routes. For example, it is possible to transfer the loaded substrates to a bypass transport route, from where they go directly to the
  • the already loaded substrates can also be transferred to an assembly transport line, which transports them to another assembly system, where they can be processed further.
  • the transport routes themselves can be constructed in two or more stories and, accordingly, to have two or more transport areas lying one above the other, for example a placement route and a bypass route for the substrates. This enables an even more flexible operation of the placement system.
  • the incoming substrates do not first have to be entered sequentially into the plurality of receiving areas of the loading device, but can at the same time move from the different transport areas of the transport path lying one above the other into the receiving areas arranged one above the other be handed over to the loading device.
  • the distance between the receiving areas of the loading device in the vertical direction is preferably substantially equal to the vertical distance of the transport areas of the transport route lying one above the other.
  • the transport route can be interrupted by the placement fields in the transport direction.
  • the loading device can be moved within the interruption in the transport direction in order to enable the interruption to be bridged.
  • the loading device can be moved within the interruption to a position at which the receiving areas of the loading device are aligned with corresponding receiving areas of the placement fields, so that substrates can be transferred to the placement areas for placement or loaded substrates can be transferred from the placement areas to the loading device.
  • substrate carrier pairs can be provided, which are assigned to the assembly fields at least one of the two sides along the transport path. Each pair of substrate carriers can have two substrate carriers, each of which can be moved at an angle to the transport direction in one direction of movement.
  • the substrate carriers which can be moved transversely to the transport direction, allow flexible and fast, error-resistant handling of the substrates within the placement system.
  • the supplied along the transport path • substrates are transferred by means of the loading device to the substrate carrier and method thereof in the Be Industriesfelder, where they remain during loading on the substrate carrier within the assembly field.
  • the substrates are moved by means of the substrate carriers in the direction of movement of the substrate carriers to the transport path, where they can be transferred to a loading device.
  • the loaded substrates are moved by the loading device in the transport direction to the transport route and transferred to the latter for further transport.
  • the movement areas of the substrate carriers of each pair of substrate carriers can overlap in the region of the transport path, so that any position on the transport path can be assumed by means of each substrate carrier.
  • substrates can be fed from the transport path to the assembly fields of an assembly system, while at the same time, substrates can be transferred past the assembly fields to a further part of the transport route by means of the same loading device.
  • a correspondingly suitable further transport is ensured, in which the loaded substrates are transferred from the loading device into a corresponding transport area of the transport route become. Depending on the area If the substrates are transferred to the transport route, they can be passed directly past the placement fields of the next placement system or processed further in the placement fields of the closest placement system; become.
  • the transport route can be subdivided into an assembly route and a bypass route, which are arranged one above the other.
  • substrates are preferably fed to or removed from the assembly fields.
  • substrates are preferably channeled past the placement fields of a placement system.
  • FIG. 1 shows a schematic lateral section of a preferred embodiment of the invention
  • FIG. 2 shows a schematic section in plan view of a further preferred embodiment of the invention
  • Figures 3 and 4 show a schematic side section and a schematic section in plan view of a further preferred embodiment of the invention.
  • FIGS. 5a to 5g schematic representations of process steps of a method according to the invention.
  • a chassis 400 has an essentially rectangular plan. One runs along the longitudinal extent of the chassis 400
  • Transport route 310, 320 along the transport direction T.
  • the transport route 310, 320 has a multi-storey, for example two-storey, structure and has upper transport areas 350, 370 and lower transport areas 360, 380.
  • substrates preferably printed circuit boards L
  • Printed circuit boards L are fed to or removed from the assembly system.
  • Printed circuit boards L are preferably fed in se at the input station 310, which has one or more transfer positions 350, 360.
  • the input station 310 is provided, for example, with transport belts on which the substrates L can be transported lying. However, it is also possible to provide grippers which preferably grip and move the substrates L on their lateral areas.
  • a loading device 210 is arranged downstream of the input station 310 in the transport direction T and can be moved in the vertical direction H1 and in the transport direction T. Substrates L can be transferred from the input station 310 to the loading device 210.
  • the loading device 210 can have, for example, transport belts and / or grippers for transporting the substrates L, similar to the input station 310.
  • the loading device 210 is slidably mounted on a rod-like guide device 215, which is formed on the chassis 400 over the transport route and extending along the transport direction.
  • a measuring system 300 in particular a camera, can also be arranged on the rod-like guide device 215 and can be moved along the transport direction T.
  • Two guide devices 115 and 125 are arranged downstream or transversely to the transport direction T downstream of the loading device 210. Both guide devices 115, 125 are each provided with a pair of substrate carriers 110, 120, 130, 140. Each pair of substrate carriers has two substrate carriers 110 and 130 or 120 and 140.
  • the substrate carriers are each on the guide device
  • Each substrate carrier 110, 120, 130, and 140 can be moved between the transport path 310, 320 and the placement fields (not shown in FIG. 1) in order to direct substrates L, which are assigned to the substrate carrier by means of the loading device 210, to the placement fields move or this from to move the assembly fields back into alignment with the transport route 310, 320.
  • an unloading device 220 is optionally arranged downstream in the transport direction T, which can be moved in a vertical direction H2 and in the transport direction T and has at least two receiving regions 250, 260 for substrates L arranged one above the other.
  • the unloading device 220 is constructed analogously to the loading device 210 and is likewise guided on the rod-like guide device 215 of the chassis 400.
  • the unloading device 220 can also be moved from its rest position in the entire central area between the input station 310, the substrate carriers 110, 120, 130 and 140 and an output station 320 along the transport direction T.
  • the output station 320 is constructed analogously to the input station 310.
  • FIG. 2 A further preferred embodiment of the placement system according to the invention can be seen from FIG. Different from the placement system according to the preferred embodiment according to FIG. 1 is that two transport sections 310-1, 310-2, 320-1, 320-2 arranged next to one another, corresponding loading devices 210-1, 210-2 arranged next to one another and next to one another arranged unloading devices 220-1, 220-2 are provided. Otherwise, the embodiment according to FIG. 2 corresponds to the embodiment according to FIG. 1. It is advantageous in the further embodiment of the invention according to FIG. 2 that a higher throughput of substrates through the placement system is possible by means of the two transport routes arranged in parallel.
  • a substrate L delivered along the transport path can arrive either in the upper transport region 350 (placement path) or in the lower transport region 360 (bypass path) of the input station 310. From this position, the substrate can be transferred to the upper receiving area 250 or to the lower receiving area 260 of the loading device 210 by means of the loading device 210. For this purpose, the loading device 210 may have to be moved in the vertical direction HI before the transfer into the corresponding receiving area 250, 260 can take place. It is also possible to simultaneously transfer a maximum of two or more substrates L from the input station 310 to the loading device 210, corresponding to the corresponding number of receiving areas of the loading device and of transportation areas of the transport route.
  • a substrate L can be transferred either from the upper receiving area 250 or from the lower receiving area 260 to a substrate carrier 110, 120, 130, 140, from which it can be moved to an assembly field 500, 550, to be edited there.
  • the loading device 210 can be moved over the two guide devices 115 or 125 to the delivery station 320 in order to transfer the substrates L there.
  • a parallel transfer of two or more substrates depending on the number of receiving areas or transport areas is also possible.
  • finished substrates that have been processed within a placement field 550 or 500 in the placement system according to the invention are to be transported on to the Transport route are handed over, these can be handed over to the loading device 210 or to an unloading device 220 constructed in the same way as the loading device, with corresponding receiving areas 270 and 280, after the substrate carrier has entered the central region in alignment with the transport route.
  • the substrates L can be transferred from the loading device 210 or the unloading device 220 to the output station 320 for further transport, as described above.
  • the substrate carriers In order to transfer substrates between the loading devices 210 or 220 and the substrate carriers 110, 120, 130, 140, the substrate carriers must each be moved in the direction B1 or the direction B2 into an area in alignment with the transport path, so that the printed circuit boards are separated from the loading device 210 or the unloading device 220 can be transferred to the substrate carriers 110, 120, 130 and 140. The same applies to the transfer of substrates L from the substrate carriers 110, 120, 130 and 140 to the loading device 210 or the unloading device 220.
  • the loading device 210 and the unloading device 220 can each be inserted into the
  • a chassis 400 has an essentially rectangular plan.
  • a transport path runs along the longitudinal direction of the chassis 400 along the transport direction T.
  • the transport path has an input station 310 upstream in the transport direction for feeding in printed circuit boards L.
  • the input station 310 is formed in one storey and has a transfer position for printed circuit boards L.
  • the input station 310 is provided, for example, with transport belts on which the substrates L can be transported lying.
  • grippers which preferably grip and move the substrates L on their lateral areas.
  • the input station 310 is provided with a pair of substrate carriers 110, 130.
  • the pair of substrate carriers is mounted on a guide device 115.
  • the individual substrate carriers 110, 130 can each be moved along the guide device 115 at an angle to the transport direction T in the direction B1.
  • Each substrate carrier 110, 130 can be moved between the transport route, in particular its input station 310 and the placement fields 20 or 40 in FIG. 4, around substrates L, which are transferred to the substrate carriers 110, 130 by means of the input station 310 To move assembly fields or to move them from the assembly fields back into the flight
  • an unloading device 220 Arranged downstream of the substrate carriers 110 and 130 in the transport direction T is an unloading device 220, which can be moved in a vertical direction H2 and has at least two receiving regions 270, 280 for substrates L arranged one above the other.
  • the unloader 220 can also be designed to be movable in the transport direction T, so that it can be moved within the areas 10, 50 and 30 of the system according to the invention, in order to be able to take over substrates from the input station 310 and to transfer them to the transport route in the transport direction T to pass downstream.
  • the unloading device 220 is also provided with transport belts at its receiving areas 270 and 280.
  • a single transport route in the transport direction T and also a plurality of transport routes can be arranged parallel to one another in the direction T.
  • a second pair of substrate carriers 120, 140 can also be provided such that they can be moved transversely to the transport direction T.
  • FIGS. 5a to 5h show the moving elements of the placement system according to the invention in accordance with the further embodiment, a schematic side view of the moving elements of the placement system according to the invention in the left part of the figure and a top view of the different areas 10 in the right part of the figure , 20, 30, 40 and 50 of the placement system according to the invention, to which the substrates L can be moved.
  • a first substrate L1 is arranged in the input station 310 in a first step of the method according to the invention.
  • a second substrate L2 is located on the substrate carrier 110.
  • the unloading station 220 is upwards in the vertical direction H2
  • the substrate L1 is located in the area 10 and the substrate L2 in the area 40, the second placement field of the placement system. Furthermore, the desired movement sequences of the substrates L1 and L2 can be seen from the right part of FIG. 5a.
  • substrate L1 is to be moved into area 20, ie a first assembly field, and substrate L2 from second assembly field 40 into position 30, from where it can be transferred to the transport route.
  • the unloading device is first moved from its upper position to its lower position in the vertical direction H2, so that the receiving region 270 is aligned horizontally with the transport path in the transport direction T.
  • the substrate L1 can then be transferred to the upper receiving area 270 of the unloading device 220 by means of the substrate carrier 130, which has moved into the area 50 of the placement system.
  • the unloading device 220 is in its lower position in the vertical direction H2 and the first substrate L1 is in the upper receiving region 270 of the unloading device 220.
  • the second substrate L2 is in FIG the lower receiving area 280. Both substrates are therefore arranged one above the other in the area 30 of the placement system.
  • the first substrate L1 which is, for example, a fully assembled substrate, can be transferred from the unloading device 220 to the transport route in the transport direction T and thus leaves the region 30 of the placement system in the transport direction.
  • the unloading device 220 is first moved to its upper position in the vertical direction H2, so that the lower receiving area 280 of the unloading device 220 is horizontally aligned with the transport path of the placement system.
  • the second substrate L2 is transferred from the lower receiving area 280 of the unloading device 220 to the substrate carrier 130 and is moved by the latter in the direction B1 into the first assembly field 20.
  • the second substrate L2 which was previously partially assembled in the second assembly field 40, can be completely assembled with further different components.
  • the unloading device 220 is moved upstream against the transport direction T in the case of the substrate carriers 130 and 110 located in the respective assembly fields 20 and 40, until a transfer of substrates from the input station 310 to the unloading device 220 is possible. After the transfer of the substrate, the unloading device 220 is again moved into its starting position in the region 30 near the edge region of the placement system seen in the transport direction T and from there the substrate to be passed through is transferred to the transport path.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Intermediate Stations On Conveyors (AREA)
  • Automatic Assembly (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

L'invention concerne un système d'équipement et un procédé permettant d'équiper des substrats de composants. Des dispositifs de chargement (210, 220), placés le long d'un trajet de transport (310, 320) dans un dispositif de transport (T), présentent au moins deux zones de réception (250, 260, 270, 280) superposées de telle manière que des substrats (L) livrés le long du trajet de transport peuvent être délivrés à la zone de réception supérieure (250, 270) ou à la zone de réception inférieure (260, 280). Cela permet de simultanément alimenter en champs d'équipement (500, 550) en substrats (L) et faire passer des substrats (L) devant les champs d'équipement (500, 550). On obtient ainsi un très grande rendement surfacique du système d'équipement ainsi qu'une très grande flexibilité pour un traitement sélectif des substrats (L).
EP03704243A 2002-06-07 2003-01-23 Systeme d'equipement et procede permettant d'equiper des substrats de composants Withdrawn EP1512316A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10225430 2002-06-07
DE10225430A DE10225430A1 (de) 2002-06-07 2002-06-07 Bestücksystem und Verfahren zum Bestücken von Substraten mit Bauelementen
PCT/DE2003/000175 WO2003105555A1 (fr) 2002-06-07 2003-01-23 Systeme d'equipement et procede permettant d'equiper des substrats de composants

Publications (1)

Publication Number Publication Date
EP1512316A1 true EP1512316A1 (fr) 2005-03-09

Family

ID=29594330

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03704243A Withdrawn EP1512316A1 (fr) 2002-06-07 2003-01-23 Systeme d'equipement et procede permettant d'equiper des substrats de composants

Country Status (7)

Country Link
US (1) US20030226251A1 (fr)
EP (1) EP1512316A1 (fr)
JP (1) JP2005531921A (fr)
KR (1) KR20050013122A (fr)
CN (1) CN1659943A (fr)
DE (1) DE10225430A1 (fr)
WO (1) WO2003105555A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006025170B3 (de) * 2006-05-30 2007-12-06 Siemens Ag Verfahren zum Transportieren von Substraten in Bestückautomaten und Transportsystemen
JP4995671B2 (ja) * 2007-08-30 2012-08-08 株式会社日立ハイテクインスツルメンツ 基板作業装置及び電子部品装着装置
US8413577B2 (en) * 2008-11-19 2013-04-09 Illinois Tool Works Inc. Vertically separated pass through conveyor system and method in surface mount technology process equipment
JP5309964B2 (ja) * 2008-12-19 2013-10-09 パナソニック株式会社 電子部品実装ライン及び電子部品実装ラインによる作業方法
CN104044908B (zh) * 2013-03-15 2016-03-02 纬创资通(昆山)有限公司 用来自动卸载电路板的卸载系统
CN103170823B (zh) * 2013-03-29 2015-06-03 中国科学院自动化研究所 一种单目显微视觉引导下微管插入微孔的控制装置及方法
WO2019040629A1 (fr) * 2017-08-22 2019-02-28 Universal Instruments Corporation Transport amélioré de carte de circuit imprimé
DE112022005565T5 (de) * 2022-02-25 2024-09-05 Yamaha Hatsudoki Kabushiki Kaisha Abzweigungstransportvorrichtung, Fördertischtransportsystem und Fördertischtransportverfahren

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1234924A (fr) * 1984-01-21 1988-04-05 Hideo Sakamoto Systeme de chargement-dechargement de cartes de circuits imprimes avec voie de contournement
US5084952A (en) * 1989-11-07 1992-02-04 Cencorp, Inc. Method and apparatus for increasing a substrate processing area without increasing the length of a manufacturing line
JP2841856B2 (ja) * 1990-11-29 1998-12-24 松下電器産業株式会社 電子部品実装装置
US5452509A (en) * 1992-01-21 1995-09-26 Yamaha Hatsudoki Kabushiki Kaisha Surface mounter
KR100391534B1 (ko) * 1995-11-27 2003-08-19 마쯔시다덴기산교 가부시키가이샤 전자부품장착장치및전자부품장착방법
US6272737B1 (en) * 1997-02-24 2001-08-14 Fuji Machine Mfg. Co., Ltd. Circuit component mounting system
JP2002515655A (ja) * 1998-05-11 2002-05-28 シーメンス アクチエンゲゼルシヤフト 素子支持体に電子素子を実装するための装置
JP3659003B2 (ja) * 1998-07-03 2005-06-15 松下電器産業株式会社 電子部品実装方法
US6643917B1 (en) * 2000-01-19 2003-11-11 Delaware Capital Formation Redundant system for assembly of electronic components to substrates
KR100363903B1 (ko) * 2000-11-24 2002-12-11 미래산업 주식회사 표면실장장치 및 그 방법
KR100363898B1 (ko) * 2000-11-24 2002-12-11 미래산업 주식회사 표면실장장치 및 그 방법

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO03105555A1 *

Also Published As

Publication number Publication date
KR20050013122A (ko) 2005-02-02
US20030226251A1 (en) 2003-12-11
DE10225430A1 (de) 2003-12-24
JP2005531921A (ja) 2005-10-20
WO2003105555A1 (fr) 2003-12-18
CN1659943A (zh) 2005-08-24

Similar Documents

Publication Publication Date Title
EP0752971B1 (fr) Installation modulaire de production en continu
DE19906805B4 (de) Vorrichtung und Verfahren zum Transportieren von zu bearbeitenden Substraten
EP1976664B1 (fr) Tiroir modulaire inserable dans une ligne de production
EP1084600B1 (fr) Installation pour equiper des supports de composants avec des composants electriques
EP0652698A1 (fr) Dispositif de transport de plaques à circuit imprimé
AT394019B (de) Foerdereinrichtung
DE60132908T2 (de) Prüfsystem in einer leiterplatten-herstellungslinie zum automatischen prüfen von leiterplatten
DE19757273C2 (de) Verfahren und Vorrichtung zum Testen von ICs
EP1181854B1 (fr) Procede pour equiper des substrats avec des composants
EP1512316A1 (fr) Systeme d'equipement et procede permettant d'equiper des substrats de composants
EP1389344B1 (fr) Systeme et procede pour equiper des substrat avec des composants
EP1281305B1 (fr) Chaine de production destinee a l'equipement unilateral ou bilateral de plaquettes de circuits imprimes
EP1308074B1 (fr) Procede permettant de faire fonctionner une installation d'implantation de composants, installation d'implantation de composants permettant la mise en oeuvre du procede, et dispositif de transfert destine a l'installation d'implantation de composants
CH677658A5 (fr)
DE2905499C2 (de) Vorrichtung zum Transport zu brennender bzw. gebrannter keramischer Ware auf Brennhilfsmitteln
WO2002094691A2 (fr) Dispositif de manipulation conçu pour deplacer des objets
DE102006025170B3 (de) Verfahren zum Transportieren von Substraten in Bestückautomaten und Transportsystemen
DE102021119314B3 (de) Bestückautomat und Bestücksystem mit einem Schienensystem zum zweidimensionalen Bewegen einer Robotervorrichtung zum Austauschen von Bauelement-Zuführeinrichtungen, Fertigungslinie und Fertigungsanlage zum Fertigen von elektronischen Baugruppen, Verfahren zum Bestücken von Bauelementeträgern
EP3370494B1 (fr) Dispositif destiné à équiper des substrats avec des composants électriques
DE102007026914A1 (de) Leiterplatten-Transportsystem mit Hubeinrichtung zum Anheben von Leiterplatten in eine Bestückebene
DE102022107782B4 (de) Vorrichtung und Verfahren zum Zuführen von Komponenten für einen Bestückautomaten, Bestücksystem
DE69010839T2 (de) Kreuzungssystem für Kabelbäume.
DE102006016620B4 (de) Vorrichtung zum Transportieren und Stapeln von Flachkörpern
DE3518953C2 (fr)
AT511699B1 (de) Zuführvorrichtung für bauelemente zu einem bestückautomaten zur bestückung von substraten mit den bauelementen

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20041110

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT SE SI SK TR

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

RBV Designated contracting states (corrected)

Designated state(s): CH DE FR GB IT LI NL

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20050909