EP1468313A2 - Dispositif de fixation pour la mise en place d'un composant optique en amont d'une source de lumiere laser, systeme correspondant et procede pour realiser un systeme de ce type - Google Patents

Dispositif de fixation pour la mise en place d'un composant optique en amont d'une source de lumiere laser, systeme correspondant et procede pour realiser un systeme de ce type

Info

Publication number
EP1468313A2
EP1468313A2 EP02777348A EP02777348A EP1468313A2 EP 1468313 A2 EP1468313 A2 EP 1468313A2 EP 02777348 A EP02777348 A EP 02777348A EP 02777348 A EP02777348 A EP 02777348A EP 1468313 A2 EP1468313 A2 EP 1468313A2
Authority
EP
European Patent Office
Prior art keywords
holding
optical component
holding part
holding device
light source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP02777348A
Other languages
German (de)
English (en)
Inventor
Vitalij Lissotschenko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Focuslight Germany GmbH
Original Assignee
Hentze Lissotschenko Patentverwaltungs GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hentze Lissotschenko Patentverwaltungs GmbH and Co KG filed Critical Hentze Lissotschenko Patentverwaltungs GmbH and Co KG
Publication of EP1468313A2 publication Critical patent/EP1468313A2/fr
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/003—Alignment of optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar

Definitions

  • the present invention relates to a holding device for the arrangement of at least one optical component in front of a laser light source of a laser unit comprising a first holding part to which the at least one optical component is attached. Furthermore, the present invention relates to an arrangement of at least one optical component in front of a laser light source of a laser unit with such a holding device. Furthermore, the present invention relates to a method for producing such an arrangement.
  • the laser light source can be designed as a semiconductor laser, in particular as a laser diode bar.
  • the laser unit comprising these laser diode bars is generally designed such that the laser diode bar is attached to a heat sink.
  • the optical component to be arranged in front of the laser diode bar is usually designed as a fast-axis collimation lens, which must be positioned relatively exactly in front of the laser diode bar in order to achieve perfect beam quality.
  • a first holding part is glued to the heat sink, for example.
  • the optical component designed as a fast-axis collimation lens can be glued to this holding part at the corresponding predetermined position. In most cases, an adhesive is used that can be cured by UV radiation.
  • a disadvantage of such a holding device or of such an arrangement is that, before the adhesive has hardened, the optical component can be positioned very precisely in front of the laser diode bar, so that a beam of the desired quality results before the hardening. By curing the adhesive, however, the optical component becomes opposite the laser unit and thus slightly shifted relative to the laser light source, so that only with holding devices known from the prior art
  • Beam qualities of laser light sources can be achieved, which often do not meet the requirements.
  • Another disadvantage is the often different expansion coefficient of the heat sink, adhesive and holding device, so that the positioning of the optical component in front of the laser light source is also disturbed in the event of temperature changes.
  • the problem on which the present invention is based is the creation of a holding device and an arrangement of the type mentioned at the outset, which ensure a more precise and stable positioning of an optical component in front of a laser light source. Furthermore, the present invention is based on the problem of specifying a method for producing such an arrangement.
  • Claim 1 provides in its characterizing part that the holding device further comprises a second holding part which is fastened to a part of the laser unit, the first holding part being fastened to the second holding part. Due to the fact that two holding parts to be connected are used, different expansion coefficients of the materials used can be compensated for. Furthermore, the two holding parts connected to one another can be shaped and positioned in such a way that the displacements which occur during the hardening of connecting means such as adhesive or solder compensate for one another. With the method according to the invention, the first holding part can be connected to the first optical component in one step and the second holding part can be connected to part of the laser unit in a further step. Then the first holding part can be connected to the second holding part.
  • Such a method offers the advantage that the first holding part is glued to the optical component and the second holding part is glued to part of the laser unit, these glued connections being cured. Only then are the two holding parts connected to one another, the optical component being able to be positioned exactly in front of the laser light source before the adhesive, which connects these two holding parts, has hardened. Instead of adhesive connections, solder connections can also be used.
  • one of the holding parts has a connecting section which is at least partially surrounded by a receiving section of the other of the holding parts.
  • the second holding part can have a connecting section which is at least partially surrounded by a receiving section of the first holding part.
  • the connecting section can have an essentially cylindrical outer contour, the receiving section having an essentially hollow cylindrical inner contour, the connecting section at least partially into the receiving section is introduced.
  • the outer contour can choose between the outer contour and the
  • An inner space can be provided in the inner contour.
  • Intermediate space can preferably be at least partially filled with adhesive or solder. Due to the rotationally symmetrical coaxial design of the receiving section and
  • Connection section can be in the curing of the in the
  • Holding device can the optical component exactly in front of the
  • Laser light source are positioned that the beam quality of the light emerging from the laser light source is drastically improved.
  • the beam quality can be improved in such a way that the laser light is significantly better, for example with regard to its
  • the annular space which can be partially filled with adhesive or solder, can have a radial dimension of 10 ⁇ m to 200 ⁇ m, preferably of approximately 50 ⁇ m. This very small space further minimizes the displacements that are possible when the adhesive cures.
  • an intermediate layer is inserted between the part of the laser unit to which the second holding part is attached and a corresponding contact surface of the second holding part.
  • This intermediate layer can be heat-insulating, for example, so that the first and the second holding part are little influenced by heating up the laser unit.
  • the laser unit comprises a laser diode bar or a stack of laser diode bars as the laser light source.
  • the part to which the second holding part is attached can be a heat sink.
  • the first optical component can be designed as a fast-axis collimation lens.
  • a second optical component which is in particular designed as a slow-axis collimation lens, is held on the laser unit via lateral support elements.
  • the hollow cylindrical inner contour is applied to the cylindrical outer contour and glued or soldered to the latter.
  • the first optical component can be positioned in front of the laser light source, the adhesive connecting the outer contour and the inner contour being cured in a subsequent process step, this curing being able to take place, for example, by UV radiation. Due to the aforementioned coaxially rotationally symmetrical design of the inner contour and outer contour, after the optical component has been precisely positioned in front of the laser light source, only very slight displacements of the component relative to the laser light source will take place, because the forces occurring during curing are compensated for.
  • Fig. 1 is a perspective view of an inventive
  • FIG. 2 shows a further perspective view of the arrangement with holding device according to FIG. 1;
  • FIG. 3 shows a side view of the arrangement with holding device according to FIG. 1;
  • Figure 4 is a view according to arrow IV in Figure 3;
  • FIG. 5 shows a side view of a further embodiment of an arrangement according to the invention with a holding device according to the invention
  • FIG. 6 shows a detailed view according to arrow VI in FIG. 3;
  • FIG. 7 shows a detailed view according to arrow VII in FIG. 4.
  • FIG. 8 shows a view according to arrow VI I I in FIG. 5;
  • FIG. 9 shows a sectional view according to the arrows IX-IX in FIG. 8.
  • FIG. 10 is a detailed view according to arrow X in FIG. 9.
  • the arrangement shown in FIGS. 1 to 4 comprises a laser unit 1, a holding device 2 according to the invention and a first optical component 3 and a second optical component 4.
  • the laser unit 1 includes a laser light source 5, which is designed as a laser diode bar in the illustrated embodiment.
  • a laser light source 5 can also be designed as a stack of laser diode bars.
  • the laser diode bar serving as laser light source 5 5 is, as can be seen in particular from FIG. 6 and FIG. 10, fastened on a heat sink 6.
  • the first optical component 3 is designed as a fast-axis collimation lens.
  • second optical component 4 is designed in the illustrated embodiment as a slow-axis collimation lens.
  • This slow-axis collimation lens has, as can be seen in FIG. 1, FIG. 2 and FIG. 5, individual lens sections which, in the transverse direction of the laser light source, 5 separate emission centers of the
  • the second optical component 4 is held by lateral support elements 7, which are fastened to the heat sink 6 in the exemplary embodiment shown and extend from the outside thereof to the right in FIG. 3.
  • These two lateral support elements 7 form outer lateral supports on which the outer lower edges of the second optical component 4 rest. This is particularly clear from Figure 1, Figure 2 and Figure 7.
  • the lateral support elements 7 have been omitted in order to make the features associated with the holding device according to the invention clearer.
  • the holding device 2 comprises, as can be seen in particular from FIG. 10, a first holding part 8 that holds the first optical component 3, and furthermore a second holding part 9 that with a part of the laser unit 1, namely the Heatsink 6 is connected.
  • the second holding part 9 has one
  • connection surface that faces the heat sink 6 and is glued or soldered to the surface of the heat sink 6 facing the second holding part 9, for example.
  • an intermediate layer which consists, for example, of a heat-insulating material.
  • the second holding part 9 On its side facing away from the heat sink 6, the second holding part 9 has a cylindrical outer contour 10. In the connected state of the two holding parts 8, 9, this cylindrical outer contour 10 is surrounded by a hollow cylindrical inner contour 11 of the first holding part 8. Before the two holding parts 8, 9 are fixed to one another, there is an annular space 12 between the outer contour 10 and the inner contour 11, which can have a very small radial dimension of, for example, 50 ⁇ m.
  • the hollow cylindrical inner contour 11 is formed on the first holding part 8 in a leg 13 of the holding part 8, which extends below the first optical component 3 designed as a fast-axis collimation lens over its entire width. From this transverse leg 13, outer lateral vertical legs 14 extend upward in FIG. 5, which are connected to an upper contact leg 15, which extends over the width of the top of the first optical component 3. Another lower contact leg 16 is connected directly to the transverse leg 13.
  • the two contact legs 15, 16 allow the optically functional cylinder surfaces of the first optical component 3 to be between them over a large part of the width of the first optical component 3, which is designed as a fast-axis collimation lens free, so that the laser light emanating from the laser diode bar can be collimated with regard to its fast-axis divergence.
  • the arrangement according to the invention can be produced by attaching the second holding part 9 to the laser unit 1 in a first method step. This can be done by gluing or soldering the contact surface of the second holding part 9 to the heat sink 6. An intermediate layer can optionally be inserted between the heat sink 6 and the contact surface.
  • the first optical component 3 can be attached to the first holding part 8, for example by gluing. Then the hollow cylindrical inner contour 11 of the first holding part 8 is applied to the cylindrical outer contour 10 of the second holding part 9, wherein the cylindrical outer contour 10 can be covered beforehand with an adhesive. Then the first optical component 3 is positioned exactly in front of the laser light source 5. The adhesive can then be cured, for example, by illumination with UV light.
  • the intermediate space 12 can be filled with solder and the optical component 3 can be positioned exactly in front of the laser light source 5 before the solder solidifies and hardens.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)

Abstract

La présente invention concerne un dispositif de fixation permettant la mise en place d'au moins un composant optique (3) en amont d'une source de lumière laser (5) d'une unité laser (1), comprenant une première partie de fixation (8) contre laquelle est/sont fixé(s) le(s) composant(s) optique(s) (3), le dispositif de fixation (2) comprenant également une seconde partie de fixation (9) qui est fixée à une partie de l'unité laser (1), la première partie de fixation (8) étant fixée à la seconde partie de fixation (9). L'invention a également pour objet un système comprenant le dispositif de fixation (2) de l'invention, et un procédé permettant la réalisation d'un système de ce type.
EP02777348A 2002-01-15 2002-11-08 Dispositif de fixation pour la mise en place d'un composant optique en amont d'une source de lumiere laser, systeme correspondant et procede pour realiser un systeme de ce type Ceased EP1468313A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10204799A DE10204799A1 (de) 2002-01-15 2002-01-15 Haltevorrichtung für die Anordnung eines optischen Bauteils vor einer Laserlichtquelle sowie eine derartige Anordnung und ein Verfahren zur Herstellung einer derartigen Anordnung
DE10204799 2002-01-15
PCT/EP2002/012463 WO2003060562A2 (fr) 2002-01-15 2002-11-08 Dispositif de fixation pour la mise en place d'un composant optique en amont d'une source de lumiere laser, systeme correspondant et procede pour realiser un systeme de ce type

Publications (1)

Publication Number Publication Date
EP1468313A2 true EP1468313A2 (fr) 2004-10-20

Family

ID=7713730

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02777348A Ceased EP1468313A2 (fr) 2002-01-15 2002-11-08 Dispositif de fixation pour la mise en place d'un composant optique en amont d'une source de lumiere laser, systeme correspondant et procede pour realiser un systeme de ce type

Country Status (8)

Country Link
US (1) US20050128606A1 (fr)
EP (1) EP1468313A2 (fr)
JP (1) JP2005515621A (fr)
KR (1) KR20040072724A (fr)
CN (1) CN1620742A (fr)
AU (1) AU2002338940A1 (fr)
DE (1) DE10204799A1 (fr)
WO (1) WO2003060562A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004057454B4 (de) 2004-11-25 2009-10-22 Jenoptik Laserdiode Gmbh Diodenlasermodul und Verfahren zu dessen Herstellung
DE102006045637A1 (de) * 2006-09-27 2008-04-03 Osram Opto Semiconductors Gmbh Optische Vorrichtung
DE102008061309A1 (de) * 2008-12-11 2010-06-24 Trumpf Laser Gmbh + Co. Kg Diodenlaserbauelement
DE102009055225B4 (de) 2009-12-23 2013-09-19 Osram Gmbh Verfahren zur Herstellung einer Laservorrichtung
JP7269140B2 (ja) * 2019-09-10 2023-05-08 パナソニックホールディングス株式会社 半導体レーザ装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2954697C2 (de) * 1978-06-03 2000-03-09 Canon Kk Lasereinheit
US4730335A (en) * 1986-06-26 1988-03-08 Amoco Corporation Solid state laser and method of making
DE3728688C1 (de) * 1987-08-27 1989-04-27 Rodenstock Optik G Aus wenigstens zwei Teilsystemen bestehendes optisches System
JPH06289266A (ja) * 1993-04-05 1994-10-18 Ando Electric Co Ltd セルフォックレンズアレイの保持機構
JPH07140363A (ja) * 1993-11-20 1995-06-02 Sankyo Seiki Mfg Co Ltd レーザー光源装置
JPH07306348A (ja) * 1994-05-11 1995-11-21 Canon Inc 光走査装置
JP3245300B2 (ja) * 1994-05-31 2002-01-07 キヤノン株式会社 光源装置
JPH09113832A (ja) * 1995-08-11 1997-05-02 Hitachi Koki Co Ltd 光走査装置
GB2308463A (en) * 1995-12-22 1997-06-25 Eastman Kodak Co Thermally stabilised laser print head with cylinder lens
JPH09226168A (ja) * 1996-02-22 1997-09-02 Canon Inc 光プリントヘッドの製造方法及び光プリントヘッド並びに該光プリントヘッドを用いた画像記録装置
DE19702573C2 (de) * 1997-01-24 2003-11-13 Sick Ag Optische Einrichtung mit einer justierbaren Haltevorrichtung
JPH11340567A (ja) * 1998-05-21 1999-12-10 Canon Inc 光源装置
DE19939750C2 (de) * 1999-08-21 2001-08-23 Laserline Ges Fuer Entwicklung Optische Anordnung zur Verwendung bei einer Laserdiodenanordnung sowie Laserdiodenanordnung mit einer solchen optischen Anordnung
US6478452B1 (en) * 2000-01-19 2002-11-12 Coherent, Inc. Diode-laser line-illuminating system
DE10007123A1 (de) * 2000-02-17 2001-09-13 Laserline Ges Fuer Entwicklung Optische Anordnung zur Verwendung bei einer Laserdiodenanordnung sowie Laserdiodenanordnung mit einer solchen Anordnung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO03060562A2 *

Also Published As

Publication number Publication date
US20050128606A1 (en) 2005-06-16
AU2002338940A8 (en) 2003-07-30
CN1620742A (zh) 2005-05-25
WO2003060562A3 (fr) 2004-04-29
JP2005515621A (ja) 2005-05-26
AU2002338940A1 (en) 2003-07-30
DE10204799A1 (de) 2003-09-18
KR20040072724A (ko) 2004-08-18
WO2003060562A2 (fr) 2003-07-24

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