EP1467915A4 - APPARATUS AND METHOD FOR CONTROLLING AN ENVIRONMENT WITHIN A CONTAINER - Google Patents

APPARATUS AND METHOD FOR CONTROLLING AN ENVIRONMENT WITHIN A CONTAINER

Info

Publication number
EP1467915A4
EP1467915A4 EP02805681A EP02805681A EP1467915A4 EP 1467915 A4 EP1467915 A4 EP 1467915A4 EP 02805681 A EP02805681 A EP 02805681A EP 02805681 A EP02805681 A EP 02805681A EP 1467915 A4 EP1467915 A4 EP 1467915A4
Authority
EP
European Patent Office
Prior art keywords
container
monitoring environment
monitoring
environment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02805681A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1467915A2 (en
Inventor
Stephanie J Moehnke
James N L Pedersen
Wayne C Olson
William J Shaner
Connie E Shaner
Philip S Glynn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of EP1467915A2 publication Critical patent/EP1467915A2/en
Publication of EP1467915A4 publication Critical patent/EP1467915A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/02—Devices for withdrawing samples
    • G01N2001/021—Correlating sampling sites with geographical information, e.g. GPS

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
  • Recording Measured Values (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Sampling And Sample Adjustment (AREA)
EP02805681A 2001-12-20 2002-12-20 APPARATUS AND METHOD FOR CONTROLLING AN ENVIRONMENT WITHIN A CONTAINER Withdrawn EP1467915A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US26386 2001-12-20
US10/026,386 US20030115978A1 (en) 2001-12-20 2001-12-20 Apparatus and method for monitoring environment within a container
PCT/US2002/041307 WO2003053791A2 (en) 2001-12-20 2002-12-20 Apparatus and method for monitoring environment within a container

Publications (2)

Publication Number Publication Date
EP1467915A2 EP1467915A2 (en) 2004-10-20
EP1467915A4 true EP1467915A4 (en) 2005-09-07

Family

ID=21831546

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02805681A Withdrawn EP1467915A4 (en) 2001-12-20 2002-12-20 APPARATUS AND METHOD FOR CONTROLLING AN ENVIRONMENT WITHIN A CONTAINER

Country Status (7)

Country Link
US (2) US20030115978A1 (zh)
EP (1) EP1467915A4 (zh)
JP (1) JP2005513459A (zh)
KR (1) KR20040075896A (zh)
CN (1) CN1656368A (zh)
AU (1) AU2002357374A1 (zh)
WO (1) WO2003053791A2 (zh)

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US7151366B2 (en) * 2002-12-03 2006-12-19 Sensarray Corporation Integrated process condition sensing wafer and data analysis system
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KR100669070B1 (ko) * 2005-05-27 2007-01-15 건양대학교산학협력단 구조물의 모니터링을 위한 동적응답측정용 무선계측 시스템
US7321299B2 (en) * 2005-06-08 2008-01-22 Axcelis Technologies, Inc. Workpiece handling alignment system
US20080111674A1 (en) * 2006-11-15 2008-05-15 Pitney Bowes Incorporated Tracking condition of mail in transit
US8138913B2 (en) * 2007-01-19 2012-03-20 System Planning Corporation Panel system and method with embedded electronics
JP4644871B2 (ja) * 2007-11-05 2011-03-09 独立行政法人 日本原子力研究開発機構 気密容器内の物理量測定装置および測定方法
JP4730384B2 (ja) * 2008-02-21 2011-07-20 Ｔｄｋ株式会社 密閉容器及び当該容器の管理システム
US9633327B2 (en) 2009-09-25 2017-04-25 Fedex Corporate Services, Inc. Sensor zone management
US8239169B2 (en) 2009-09-25 2012-08-07 Gregory Timothy L Portable computing device and method for asset management in a logistics system
US8299920B2 (en) 2009-09-25 2012-10-30 Fedex Corporate Services, Inc. Sensor based logistics system
JP5830818B2 (ja) * 2011-02-15 2015-12-09 イマジニアリング株式会社 内燃機関の計測装置
EP2727137B1 (en) 2011-06-28 2022-04-20 Brooks Automation (Germany) GmbH Semiconductor stocker systems and methods.
US8726721B2 (en) 2011-08-03 2014-05-20 Charles Mitchell Minges Apparatus and method for monitoring and sampling air quality in an interior space of a wall
KR102081584B1 (ko) * 2012-11-02 2020-02-26 삼성전자 주식회사 메모리 장치 구동 방법 및 메모리 시스템
KR20140066858A (ko) * 2012-11-13 2014-06-03 삼성전자주식회사 보조 기억 장치 및 그를 채용한 전자 시스템
US9239997B2 (en) * 2013-03-15 2016-01-19 The United States Of America As Represented By The Secretary Of The Navy Remote environmental and condition monitoring system
CN104716069B (zh) * 2015-03-23 2017-10-17 上海华力微电子有限公司 晶圆可接受性测试机台内部环境的监测方法和监测装置
US11569138B2 (en) * 2015-06-16 2023-01-31 Kla Corporation System and method for monitoring parameters of a semiconductor factory automation system
EP3323018B1 (en) 2015-07-16 2020-09-02 ASML Netherlands B.V. Inspection substrate and inspection method
US10067070B2 (en) * 2015-11-06 2018-09-04 Applied Materials, Inc. Particle monitoring device
JP6630142B2 (ja) * 2015-12-18 2020-01-15 株式会社ディスコ 静電気検出装置
US10818561B2 (en) 2016-01-28 2020-10-27 Applied Materials, Inc. Process monitor device having a plurality of sensors arranged in concentric circles
US11150140B2 (en) * 2016-02-02 2021-10-19 Kla Corporation Instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
CN105737892B (zh) * 2016-03-01 2018-10-12 深圳市北鼎科技有限公司 具有环境检测显示及无线传输功能的家用储物器具
EP3439786A4 (en) * 2016-04-05 2019-12-18 The Government of the United States of America, as represented by the Secretary of the Navy PROCESSING PARTICLES WITH A FIXED MICROMETER SIZE FOR FAST DEPOSITION ON SUBSTRATE SURFACES WITH EVEN PARTICLE DISTRIBUTION
US10543988B2 (en) * 2016-04-29 2020-01-28 TricornTech Taiwan Real-time mobile carrier system for facility monitoring and control
JP6689673B2 (ja) * 2016-05-25 2020-04-28 信越ポリマー株式会社 基板収納容器の管理システム
JP6689672B2 (ja) * 2016-05-25 2020-04-28 信越ポリマー株式会社 基板収納容器及びその管理システム並びに基板収納容器の管理方法
US9725302B1 (en) * 2016-08-25 2017-08-08 Applied Materials, Inc. Wafer processing equipment having exposable sensing layers
KR102671467B1 (ko) 2016-09-28 2024-06-03 삼성전자주식회사 반도체 패키지를 포함하는 반도체 모듈 및 반도체 패키지
JP6855774B2 (ja) * 2016-12-13 2021-04-07 Tdk株式会社 ウエハ搬送容器内雰囲気計測装置、ウエハ搬送容器、ウエハ搬送容器内清浄化装置及びウエハ搬送容器内清浄化方法
JP6638671B2 (ja) * 2017-02-27 2020-01-29 株式会社ダイフク 収納容器
JP6282770B1 (ja) * 2017-06-02 2018-02-21 株式会社マクニカ センサ装置セット及びセンサシステム
JP6916685B2 (ja) * 2017-08-03 2021-08-11 信越ポリマー株式会社 基板収納容器及びその取扱い方法
US10621674B2 (en) 2017-10-13 2020-04-14 Munich Reinsurance Company Computer-based systems employing a network of sensors to support the storage and/or transport of various goods and methods of use thereof to manage losses from quality shortfall
US11342210B2 (en) * 2018-09-04 2022-05-24 Applied Materials, Inc. Method and apparatus for measuring wafer movement and placement using vibration data
KR102633264B1 (ko) * 2018-12-03 2024-02-02 램 리써치 코포레이션 핀-리프터 (pin-lifter) 테스트 기판
KR102276821B1 (ko) * 2019-08-01 2021-07-13 주식회사 유타렉스 풉 관리 시스템
US11651982B2 (en) * 2019-10-11 2023-05-16 Winbond Electronics Corp. Drying block structure and storage device
FI20206153A1 (en) * 2020-11-13 2022-05-14 Ilmaturva Oy Storage device
US20220310461A1 (en) * 2021-03-24 2022-09-29 Alfasemi Inc. In-wafer testing device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5444637A (en) * 1993-09-28 1995-08-22 Advanced Micro Devices, Inc. Programmable semiconductor wafer for sensing, recording and retrieving fabrication process conditions to which the wafer is exposed
US6244121B1 (en) * 1998-03-06 2001-06-12 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system

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US7035856B1 (en) * 2000-09-28 2006-04-25 Nobuyoshi Morimoto System and method for tracking and routing shipped items
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Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
US5444637A (en) * 1993-09-28 1995-08-22 Advanced Micro Devices, Inc. Programmable semiconductor wafer for sensing, recording and retrieving fabrication process conditions to which the wafer is exposed
US6244121B1 (en) * 1998-03-06 2001-06-12 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system

Also Published As

Publication number Publication date
WO2003053791A3 (en) 2004-01-29
JP2005513459A (ja) 2005-05-12
KR20040075896A (ko) 2004-08-30
EP1467915A2 (en) 2004-10-20
WO2003053791A2 (en) 2003-07-03
AU2002357374A1 (en) 2003-07-09
US20030115956A1 (en) 2003-06-26
US20030115978A1 (en) 2003-06-26
AU2002357374A8 (en) 2003-07-09
WO2003053791B1 (en) 2004-04-08
CN1656368A (zh) 2005-08-17

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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AX Request for extension of the european patent

Extension state: AL LT LV MK RO

RIN1 Information on inventor provided before grant (corrected)

Inventor name: GLYNN, PHILIP, S.

Inventor name: SHANER, CONNIE, E.

Inventor name: SHANER, WILLIAM, J.

Inventor name: OLSON, WAYNE, C.

Inventor name: PEDERSEN, JAMES, N., L.

Inventor name: MOEHNKE, STEPHANIE, J.

A4 Supplementary search report drawn up and despatched

Effective date: 20050727

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Ipc: 7H 01L 21/00 B

Ipc: 7B 65D 1/00 A

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