Classifications

• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
  • G06F1/16—Constructional details or arrangements
  • G06F1/20—Cooling means
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
  • H01L23/427—Cooling by change of state, e.g. use of heat pipes
  • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

• the present invention relates to the use of phase change materials in cooling devices.
• Heat exchangers are usually used for this. In the simplest case, they can only consist of a heat-conducting sheet that dissipates the heat and emits it into the ambient air, or it can also contain heat transfer agents that initially transport the heat from one place or medium to another.
• convection at the cooling fins is supported by fans.
• the maximum working temperature for CPUs is between 60 and 90 ° C depending on the design.
• Coolers are used for short-term replacement of energy dissipation to the environment and cannot (and need not) be used multiple times.
• Known storage media are, for example, water or stones / concrete to store sensible ("sensitive") heat or phase change materials (PCM) such as salts, salt hydrates or their mixtures or organic compounds (e.g. paraffin) for heat in the form of heat of fusion ( "latent" heat).
• sensitive sensitive
• PCM phase change materials
• a higher temperature is required for charging a heat store than can be obtained during unloading, since a temperature difference is required for the transport or flow of heat.
• the quality of the heat depends on the temperature at which it is available again: the higher the temperature, the better the heat can be dissipated. For this reason, it is desirable that the temperature level drop as little as possible during storage.
• latent heat storage In the case of sensitive heat storage (e.g. by heating water), the entry of heat is associated with constant heating of the storage material (and vice versa when discharging), while latent heat is only stored and discharged at the phase transition temperature of the PCM. Compared to sensitive heat storage, latent heat storage therefore has the advantage that the temperature loss is limited to the loss during heat transport from and to the storage.
• paraffins as a storage medium in latent heat stores is known from the literature.
• shoe soles are described in which PCM-containing Microcapsules are included.
• the application WO 93/24241 describes fabrics which are coated with a coating which contains such microcapsules and binders.
• Paraffinic hydrocarbons having 13 to 28 carbon atoms are preferably used here as PCM.
• European patent EP-B-306 202 describes fibers with heat storage properties, the storage medium being a paraffinic hydrocarbon or a crystalline plastic and the storage material in the form of microcapsules being integrated into the fiber base material.
• US Pat. No. 5,728,316 recommends salt mixtures based on magnesium and lithium nitrate for the storage and use of thermal energy. The heat is stored in the melt above the melting temperature of 75 ° C.
• Phase change materials Since these substances remain solid during the entire temperature range of the application, the encapsulation is not required. Loss of the storage medium or contamination of the surroundings by the melt of the storage medium in latent heat stores can thus be excluded. This group of phase change materials opens up many new areas of application.
• US 5831831A, JP 10135381A and SU 570131A describe the use of similar PCM coolers in non-military use. What the inventions have in common is the absence of conventional coolers (eg with cooling fins and fans).
• PCM coolers described above are not suitable for intercepting the peak performance of components with an irregular performance profile, since they do not guarantee optimized discharge of the PCM or absorb the base load.
• Figure 2 proposes to buffer the power peaks of an electrical or electronic component using phase change materials (PCM), the device for cooling heat-generating electrical and electronic components (2) having an uneven power profile essentially consists of a heat-conducting unit (1) and a heat-absorbing unit (4), which contains a phase change material (PCM).
• PCM phase change material
• the object of the present invention is to cool heat-generating components more effectively and to absorb temperature peaks.
• a device for cooling heat-generating components with an uneven performance profile consisting essentially of a heat-dissipating unit (1) and a heat-absorbing unit (4), which contains at least one phase change material (PCM) according to the main claim.
• PCM phase change material
• the invention is characterized in that the at least one PCM is arranged in the cooling device in such a way that its phase change temperature (T PC ) corresponds to the ambient temperature in the cooling device, which is present according to the temperature gradient at the temperature of the heat-generating unit (2) to be buffered ,
• the invention is preferably characterized in that it has at least two PCMs with different phase change temperatures (T PC ).
• the PCMs are arranged with respect to one another such that the PCM with the higher Tpc is located in the warmer area of the cooling device.
• the Tpc are each below the critical maximum temperature of the heat-generating component (2) where this component would overheat.
• the critical maximum temperature is the temperature of the heat-generating component, which must not be exceeded.
• MPU microprocessors
• cooling devices can also be used, e.g. in motors for lifts, substations or internal combustion engines.
• Devices for cooling according to the invention are, for example, coolers.
• Conventional coolers can be improved by using PCM.
• the heat flow from the heat-generating component to the cooler should not be interrupted, ie the heat flow should first take place through the heat-dissipating unit, for example the cooler, and not to the PCM.
• An interruption in this sense would exist if, due to the design of the cooler, the PCM would first have to absorb the heat before the heat could be dissipated via the cooling fins - which would lead to a deterioration in the performance of the cooler for a given design.
• the PCMs are therefore preferably arranged in or on the cooling device in such a way that the classic cooling output of the heat-dissipating unit is not impaired as far as possible and that a significant heat flow to the PCM only takes place when the Heat dissipating unit exceeds the phase change temperature Tp C of the respective PCM.
• Tp C phase change temperature
• the cooling device When the critical maximum temperature of the heat-generating component is reached, the cooling device according to the invention has a defined temperature gradient between the heat-generating unit and the opposite end of the heat-dissipating unit. It has been found that PCMs are particularly suitable, their
• Phase change temperatures TPC are suitably below the critical maximum temperature for the heat generating unit.
• the PCMs used according to the invention are therefore preferably selected in this way and in the
• Cooling device arranged that their T P c are matched as precisely as possible to this defined critical temperature gradient, ie that the phase changes take place almost simultaneously and / or just below this temperature gradient.
• TPC for the PCM which is closest to the heat-generating unit are, for example in the case of the microprocessor, about 10 to 15 ° C. below the maximum temperature critical for the heat-generating component.
• the more distant PCMs have correspondingly lower Tpc.
• the different T P c are then preferably achieved approximately simultaneously in the arrangement according to the invention with at least two PCMs, so that the increase in performance of the cooling device is significantly increased and a “booster” effect of the PCMs is conspicuously apparent.
• the significant heat flow to the PCM should advantageously only start at the highest possible temperatures.
• the cooling device according to the invention operates largely conventionally up to its critical maximum temperature gradient, thus ensuring a maximum classic cooling capacity. Only when the TPC is reached is the cooling capacity supplemented by the heat absorption of the PCM. As a result, the performance of the cooling device increases suddenly and a "booster" effect of the PCM is noticeable. This ensures that the heat-generating component is not overheated.
• cooling devices with a lower cooling capacity can be used, since the extreme heat peaks do not have to be dissipated, but rather are buffered.
• PCMs are suitable for the device according to the invention.
• Encapsulated materials, solid-solid PCM, PCM in matrices, solid-liquid PCM in cavities or a mixture of the forms mentioned are suitable for the use of PCM.
• the matrix for solid-solid or solid-liquid PCM is in particular polymers, graphite, e.g. expanded graphite (e.g. Sigri ⁇ from SGL), or porous inorganic materials such as Silica gel and zeolites, suitable.
• At least one PCM used according to the invention is preferably a fixed / fixed PCM.
• PCM can be used with a phase change temperature between -100 ° C and 150 ° C.
• PCM in the range from ambient temperature to 95 ° C are preferred for use in electrical and electronic components.
• the materials can be selected from the group of paraffins (C 2 oC 45 ), inorganic salts, salt hydrates and their mixtures, carboxylic acids or sugar alcohols. A non-limiting selection is summarized in Table 1.
• PCMs selected from the group of the di-n-alkylammonium salts, optionally with different alkyl groups, and mixtures thereof are suitable.
• PCM whose T P c is between ambient temperature and 95 ° C are particularly suitable for use in electrical and electronic components, such as diexylammonium bromide, dioctylammonium bromide, dioctylammonium chloride, dioctylammonium acetate, dioctylammonium nitrate, dioctylammonium formium, didecylonium ammonium, didecylonium ammonium, didecylonium ammonium, didecylonium ammonium, didecylonium ammonium, didecylonium ammonium, didecylonium ammonium, didecylonium ammonium, didecylonium ammonium, didecylonium ammonium, didecylonium ammonium, didecylonium ammonium, did
• the PCMs contain at least one aid in addition to the actual heat storage material.
• the heat storage material and the at least one auxiliary agent are present in a mixture, preferably in an intimate mixture.
• the auxiliary is preferably a substance or preparation with good thermal conductivity, in particular a metal powder or granulate (for example aluminum, copper) or graphite. These aids ensure good heat transfer.
• the at least one auxiliary which is contained in the PCM in addition to the actual heat storage material can be a binder, in particular a polymeric binder.
• the particles of the heat storage material are preferably present in fine distribution in the binder.
• Such binders are used in particular when the PCM is to be kept in shape.
• the binders make intimate contact during use, i.e. good wetting, between the means for storing heat and the surface of the heat-dissipating unit.
• latent heat storage devices for cooling electronic components can be installed precisely. The binder displaces air at the contact surfaces and thus ensures close contact between the heat storage material and the component.
• Such means are therefore preferably used in devices for cooling electronic components.
• the polymeric binder according to the invention can be any polymer which is suitable as a binder according to the application.
• the polymeric binder is preferably a curable polymer or a polymer precursor, in particular selected from the group consisting of polyurethanes, nitrile rubber, chloroprene, polyvinyl chloride, silicones, ethylene-vinyl acetate copolymers and
• nucleating agents such as e.g. Borax or various metal oxides are used.
• the entire material that is to say the PCM and, if appropriate, the auxiliaries, is preferably present either as a loose bed or as a shaped body.
• Shaped bodies are understood to mean in particular all structures which can be produced by compacting methods, such as pelletizing, tableting, roller compacting or extrusion.
• the shaped bodies can take on a wide variety of spatial shapes, such as spherical, cube or cuboid shapes.
• the PCM can be pressed in pure form, pressed after crushing (e.g. grinding), or pressed in a mixture with the auxiliary materials.
• the compacts can be easily stored, transported and used in a variety of ways.
• the compacts can be used directly in electronic components.
• the compacts are installed between the cooling fins so that they are in intimate contact with the surfaces of the cooling fins.
• the thickness of the compacts is chosen so that a non-positive connection is created between the ribs and the pressing.
• the compacts can also be inserted between cooling fins / heat exchangers before they are connected to form a stack.
• cooling devices according to the invention, the heat-dissipating unit (1) of which has surface-enlarging structures.
• the heat-dissipating unit (1) particularly preferably has cooling fins.
• the heat-dissipating unit (1) preferably also has a fan on the opposite side to the heat-generating unit (2) to support the cooling capacity.
• Another object of the present invention is a component (Z) which essentially consists of a cooling device according to the invention and a heat-generating unit (2).
• Heat-dissipating and heat-absorbing units (1) and (4) and the unit (2) are arranged with respect to one another in such a way that the heat flow between the heat-generating component (2) and the heat-dissipating unit (1) takes place in direct contact.
• the heat-generating unit (2) is preferably an electrical or electronic component, particularly preferably an MPU (micro processing unit), in particular a CPU (central processing unit), or a memory chip of a computer.
• MPU micro processing unit
• CPU central processing unit
• the PCMs (4a + 4b) are arranged in or on the cooler (1) in such a way that the heat flow first flows through the cooler and then through the PCM, ie a significant heat flow from the CPU (2) on the carrier (3) to the PCM (4a, 4b) only takes place when the corresponding cooler areas exceed the phase change temperature T P c of the neighboring PCM. This ensures that the PCM only absorbs the peak power.
• temperatures of 60-90 ° C (T1) are reached at the base of the cooler.
• phase change temperature of PCM1 (4a) to the temperature, which according to the temperature gradient at the critical maximum temperature of the CPU in the cooler is close to the CPU (T2 max ), and that of PCM2 (4b) to the more distant area of the Cooler on (T3 ma ⁇ )
• the phase change of both materials occurs almost simultaneously and when it is reached or just below the critical maximum temperature of the CPU (T1 ma ⁇ ), ie the supportive effect of the PCM is particularly efficient.
• Discharging the PCM is also more efficient in this way, since the entire phase change material is discharged almost simultaneously when the cooler cools. A higher conventional cooling capacity leads to a faster discharge of the PCM.
• a cooler For a processor with a maximum line of 90W, a cooler is designed as shown in Figure 3, which has a cooler output of 0.61 K / W at an ambient temperature of 30 ° C. Starting from a maximum operating temperature T1 max of 85 ° C, the temperatures in the middle and in the upper part of the cooling fins are T2m a x 65 ° C and T3 max 45 ° C. Didodecylammonium chloride (PCM1) with a TPC of 65 ° C and didecylammonium chloride (PCM2) with a T PC of 49 ° C are used as phase change materials.
• PCM1 a maximum operating temperature
• PCM2 didecylammonium chloride
• PCM2 didecylammonium chloride
• the coolers can be fine-tuned to the temperature gradient by using more than two PCMs.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Theoretical Computer Science (AREA)
• Human Computer Interaction (AREA)
• General Engineering & Computer Science (AREA)
• Cooling Or The Like Of Electrical Apparatus (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Applications Claiming Priority (3)

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• 2001
  • 2001-11-24 DE DE10157671A patent/DE10157671A1/de not_active Withdrawn
• 2002
  • 2002-09-27 CN CNA028228308A patent/CN1589496A/zh active Pending
  • 2002-09-27 JP JP2003548303A patent/JP2005510876A/ja active Pending
  • 2002-09-27 AU AU2002365430A patent/AU2002365430A1/en not_active Abandoned
  • 2002-09-27 KR KR10-2004-7007803A patent/KR20040058310A/ko not_active Application Discontinuation
  • 2002-09-27 US US10/496,566 patent/US20050007740A1/en not_active Abandoned
  • 2002-09-27 CA CA002468065A patent/CA2468065A1/en not_active Abandoned
  • 2002-09-27 WO PCT/EP2002/010865 patent/WO2003046982A1/de not_active Application Discontinuation
  • 2002-09-27 EP EP02803758A patent/EP1446833A1/de not_active Withdrawn
  • 2002-11-22 TW TW091134069A patent/TW200301814A/zh unknown

Non-Patent Citations (1)

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