EP1437209B1 - Drahtsägevorrichtung - Google Patents

Drahtsägevorrichtung Download PDF

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Publication number
EP1437209B1
EP1437209B1 EP20030029548 EP03029548A EP1437209B1 EP 1437209 B1 EP1437209 B1 EP 1437209B1 EP 20030029548 EP20030029548 EP 20030029548 EP 03029548 A EP03029548 A EP 03029548A EP 1437209 B1 EP1437209 B1 EP 1437209B1
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EP
European Patent Office
Prior art keywords
sawing
slices
fact
sawed
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP20030029548
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English (en)
French (fr)
Other versions
EP1437209A1 (de
Inventor
Andreas Muller
Alexander Bortnikov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Switzerland SARL
Original Assignee
HCT Shaping Systems SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH00043/03A external-priority patent/CH696159A5/fr
Application filed by HCT Shaping Systems SA filed Critical HCT Shaping Systems SA
Publication of EP1437209A1 publication Critical patent/EP1437209A1/de
Application granted granted Critical
Publication of EP1437209B1 publication Critical patent/EP1437209B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/748—With work immobilizer
    • Y10T83/7487—Means to clamp work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/748—With work immobilizer
    • Y10T83/7487—Means to clamp work
    • Y10T83/7533—With biasing or counterbalancing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/748—With work immobilizer
    • Y10T83/7487—Means to clamp work
    • Y10T83/754—Clamp driven by yieldable means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9292—Wire tool

Definitions

  • the present invention relates to a wire sawing device according to the preamble of claim 1.
  • JP 9 272 122 A Such a device is described by JP 9 272 122 A.
  • Thread sawing devices of the aforementioned type with displacement of the yarns of the sheet of yarn or of the part to be sawn are already known, especially in the industry of electronic components of ferrites, quartz and silicas, for slicing.
  • fine materials such as poly- or monocrystalline silicon or new materials such as GaAs, InP, GGG or also quartz, synthetic sapphire, ceramic materials.
  • the high price of these materials makes wire sawing more attractive compared to other techniques such as diamond sawing.
  • the sawing zone consists of a set of at least two cylinders placed in parallel. These cylinders, called son-guides, are engraved with grooves defining the interval between the threads of the web, ie the thickness of the slices.
  • the piece to be sawn is fixed on a support table which moves perpendicularly to the sheet of threads. The speed of movement defines the cutting speed.
  • the renewal of the yarn and the control of its tension is done in a part called yarn management area located outside the actual sawing area.
  • the agent that will govern the cutting is either an abrasive attached to the wire, or a free abrasive brought as a slurry.
  • the wire only acts as a carrier. When cutting in thin slices of the workpiece, the tensioned wire is both guided and pulled by the wire guide cylinders.
  • sawn slices or wafers are very thin relative to the diameter of the workpiece.
  • the sawn slices thus have considerable flexibility and can flex and bend to contact adjacent slices. These deflections are detrimental to the precision and flatness of the cut and can induce undesirable corrugations, streaks and irregularities on the surface of sawn slices. These irregularities, even a few micrometers are enough to make unusable slices for certain applications, such as silicon for the solar industry and semiconductors.
  • the deformations of the slices can even induce microcassures and breaks, especially near the fixing of the slices to their support.
  • JP 9272122 A and its English abstract disclose a sawing device of the aforementioned type which comprises a pressure plate mounted on a support plate which can be moved vertically by means of a jack actuation mechanism. A workpiece is cut an initial distance by a sheet of son and then brought into contact with the pressure plate which is pressed against the workpiece during sawing to prevent the appearance of cracks on sawn slices.
  • the present invention aims to obtain a sawing device to further increase the quality and operation of the sawing and the sawing device according to the invention comprises for this purpose the features of the independent claim.
  • the wire is also used regularly, so it is less subject to breakage.
  • the device according to the invention can also contribute to easy repair of the wire and a replacement of the wire in the sawing gaps, thus to avoid the rejection of the workpiece following a break in the thread.
  • the holding device allows a particularly efficient and reliable operation and a simple and inexpensive construction.
  • the holding members comprise a thick liquid or a gel of a higher density than the machining liquid used, the thick liquid or the gel being contained in a tank maintained in the active position of such that said portion of the slices is at least partially immersed in the thick liquid or gel so that the slices are immobilized.
  • the holding device can also comprise, as holding members, separating elements intended to be introduced at least partially into the sawing gaps between the slices in order to maintain the latter, these separating elements being mounted on at least a support.
  • the gap between the slices can be kept constant very precisely, even in the event of external forces acting on the slices being sawn.
  • the separation elements are constituted by son, strips, blades or walls of a suitable thickness to be introduced into said sawing gaps.
  • said at least one support is arranged in at least one tray mounted on said frame.
  • the sawing device comprises a frame 10 and wire guide cylinders 11, 12, here two in number, mounted on this frame with their axes arranged in parallel, being of course that the device could have more than two cylinders guide son.
  • the yarn 14 is unwound from a delivery reel, not shown, and then wound around the yarn guide rolls in any possible winding mode to form at least one web of parallel yarns in a sawing zone.
  • the yarn is then recovered in a suitable device, not illustrated, such as a take-up reel or a recovery tank.
  • One, two or more workpieces 17, such as ingots of hard material, are mounted on a support table 18 via a temporary support 19.
  • This support table 18 can be moved vertically in the Z direction by a column 21 and a motor 20 to support the workpieces 17 against the sheet of son 15.
  • the periphery of the wire guide rolls 11, 12 is etched with grooves which define the gap between the adjacent son of the son sheet 15, thus the thickness of the sawn slices. These are separated from each other by slots or sawing gaps.
  • the wire 14 is stretched and both guided and pulled by the wire guide cylinders to reciprocate reciprocally or continuously.
  • This wire is favorably constituted of spring steel with a diameter of between 0.1 and 0.2 mm in order to saw blocks of hard materials or of a more particular composition, such as silicon, ceramic, compounds of the elements of groups III -V and II-VI, GGG (Gadolinium-Gallium Garnet), sapphire, etc., in slices of about 0.1 to 5 mm thick.
  • the abrasive agent is a commercial product and can be diamond, silicon carbide, alumina, etc., in a form fixed to the wire or in free form suspended in a liquid which serves as a carrier for the particles of the 'abrasive.
  • the sawing device is, according to the invention, provided with a holding device 22 arranged so as to maintain, during sawing, the slices 23 partially or entirely sawn apart substantially parallel to each other and so that the width gaps of sawn timber 24 is kept substantially constant during the sawing of the slices.
  • the holding device 22 comprises for this purpose holding members 25 capable of cooperating with at least a portion 26 of the slices being sawed. This portion 26 is here opposite the portion 27 of the workpiece 17 by which the latter is fixed to the support table 18.
  • These holding members 25 comprise, in the embodiment of FIGS. 1 to 3, a longitudinal bar 30 per sawing pieces extending along the latter in a direction substantially perpendicular to the son of the ply of threads 15.
  • the bars 30 are provided with coatings 31 made of elastomer to be applied against the edges of the workpieces.
  • Each bar 30 is pivotally mounted along a pivot axis 32 parallel to the wire guide cylinders 11, 12 on crosspieces 33.
  • the coatings 31 can optimally adapt to the workpiece 17.
  • the cross members 33 slide on rods 34 acting as guiding elements integral with the support table 18.
  • Elastic means in the form of coil springs 35 urge the crosspieces 33 and the longitudinal bars 30 towards the part of the parts to be sawed 17 and other part of stationary stops 40 integral with the frame 10.
  • These sawing pieces 17 are for sawing lowered to come into contact with the ply of threads 15. After sawing a minimum distance of, for example, one centimeter, the elastomer coatings 31 come into contact with the workpieces to be cut. and maintain in this active position the slices sawn firmly in place by the action of the springs 35, the stationary stops 40 then being separated from the crosspieces 33. Adjusting screws 41 provided on these stationary stops 40 make it possible to determine exactly the position in which, the holding members 25 come into action.
  • the sawing can then continue to the opposite end of the workpiece, while the sawn slices 23 are held in position, to avoid undulations, striations and other irregularities due to transverse displacements of the slices.
  • the slots or sawing gaps 24 have a constant width allowing a regular supply of abrasive particles and a constant sawing speed.
  • FIG 4 The embodiment shown in Figure 4 is similar to that of Figures 1 to 3, except that the holding device 22 is of a different type.
  • the holding members 25 comprise in this case a thick liquid or a gel 45 higher density than the machining fluid used.
  • This thick liquid or gel is contained in a tank 46 which is fixed on the sleepers 33 mounted sliding on the rods 34. It may for example be used silicones of adequate viscosity.
  • the crosspieces 33 are subjected to the action of the coil springs 35 and locked in the active position by locking washers 47 so that the lower portion 26 of the slices is at least partially immersed in the thick liquid or the gel which penetrates partially in the sawing gaps 24 and thus immobilizes the slices sawed in parallel position.
  • a third embodiment illustrated in FIGS. 5 and 6 comprises as holding member 25 separating elements intended to be introduced at least partially into the interstices 24 between the slices 23 to hold the latter.
  • a series of son 50 is stretched on a frame 51 and arranged parallel to the son of the sheet of son 15. In active position, these son 50 are introduced into the sawing gaps 24 between the slices 23 to maintain exactly the gap between them.
  • the frame 51 cooperates in an inactive position with the stationary stops 40 to separate the wires 50 from the workpiece against the effect of the springs 35.
  • the frame 51 rests on the washers 47 provided on the rods 34 and thus remains in a fixed position relative to the workpiece 17 to cooperate with the lower portion 26 pieces to be sawed.
  • the son 50 may also be replaced by blades, ribbons, strips, walls of a suitable thickness to be introduced into the sawing gaps 24 slices which are thus held in position without touching each other.
  • the variant illustrated in Figure 7 is a combination of the holding devices 22 according to the first and third embodiment.
  • This variant comprises as holding members 25 on the one hand, two longitudinal bars 30 with elastomeric coatings 31 solicited against the parts to be sawed 17 thanks to the springs 35, and secondly, a frame 51 with son 50 which are arranged inside the sawing gaps 24.
  • the frame 51 is fixed by means of intermediate pieces 52 on the sleepers 33 which cooperate with the springs 35 and the stationary stops 40.
  • This variant is particularly effective since it ensures a double maintenance of sawn slices by external support and son intercalation.
  • the fourth embodiment illustrated in FIGS. 8 and 9 comprises a holding device 22 comprising a frame 60 in the shape of a U.
  • the longitudinal branches 61 of this frame are intended to be applied laterally against the sawed slices 23 of the workpiece. sawing 17 by means of elastic pieces 62.
  • the application and holding force can be obtained by means of a pneumatic device 63 comprising an inlet duct 64 and internal ducts 65 make it possible to inflate the elastic pieces 62.
  • the force application can also be obtained by other means, such as mechanical clamping of the longitudinal legs 61 towards each other by means of a mechanical, pneumatic or hydraulic.
  • the frame 60 can be easily implemented by the handle 66 and then blocked by applying the clamping.
  • the latter After repair of the wire, the latter can be disposed in the sawing gaps 24, since the width of the latter has remained constant. After removal of the frames 60, the sawing can be continued. Without the holding device 22, it would be impossible to re-thread the wire into the sawing gaps and the workpiece should be discarded.
  • FIG. 10 to 13 A fifth embodiment is illustrated in Figures 10 to 13.
  • the holding device 22 is mounted on the frame 10 of the sawing device and comprises a tray 70 whose bottom and / or walls can be perforated or provided with a flow so that the sawing liquid and the abrasive can be evacuated from the ferry.
  • This tray is maintained by means of fasteners 71 on the frame 10 and provided with separating elements 72 intended to be introduced into the sawing gaps 24 between the sawed slices 23 to maintain exactly the gap between them.
  • the separation elements 72 consist of a series of wires 73 stretched over a frame 74.
  • the embodiment shown has two superposed frames 74, but any other number of frames 1 to 5 can be mounted in the bin 70.
  • the sawing can be carried out up to the temporary support 19 (FIG. 13), whereas the sawn slices 23 are maintained with a regular spacing, which ensures a high quality of the product without undulations, striations and irregularities.
  • the sawn slices are already separated from each other, which allows further processing and further conditioning.
  • These slices may, for example, be removed from the sawing device directly in the tray 70.
  • two drawers 81, 82 may be slidably housed in a tray 80 fixed to the frame 10.
  • Each of the drawers contains a holding device 22 for the slices of one or the other of the sawed ingots 17.
  • the bottom and the side walls of these drawers 81, 82 may be perforated for the flow of the sawing liquid.
  • the latter may be retained in the tank 80 and discharged by a flow 84 with a valve 85.
  • the holding device 22 also comprises separating elements 72 intended to be introduced into the sawing gaps. These separating elements may consist of horizontal, oblique and / or diagonal son stretched on one, two or more frames 86. The son can thus constitute two crossed son plies.
  • the separating elements may also be constituted by vertical walls attached to the side walls of the drawers. After sawing, the drawers 81, 82 with sawn slices of each ingot may be removed from the sawing device.
  • support 18 may support one or more pieces to be sawed 17.
  • the relative movement between the support table or tables 18 and the sheet of son 15 may also be achieved by moving the sheet of son and any suitable mechanical, pneumatic, hydraulic means.
  • the sawing movement can also be achieved in any other spatial direction than the vertical.
  • the first embodiment of Figures 1 to 3 may also include lateral clamping means instead of the vertical means.
  • the holding device 22 may be adapted to the shape of the workpiece.
  • the maintenance can be obtained by a bar 30 fitting to the cylindrical surface.
  • the control of the application force can be achieved by any mechanical, pneumatic and hydraulic means with or without stationary stops.
  • the frame 51 of Figure 6 with its son or bands may also be mounted above Figure 4 of the tray 46, combining the second and third embodiments.
  • the separating elements 72 provided in the tray 70 or in the drawers 80 may be of any type horizontal son, oblique, diagonal, complete or partial walls, transverse bands, etc.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Surgical Instruments (AREA)

Claims (9)

  1. Drahtsägevorrichtung mit zumindest einer Drahtschicht (15), die zwischen zumindest zwei Drahtführungszylindern (11, 12) aufgespannt und in ihrer Lage durch Rillen gehalten wird, die auf der Oberfläche der Drahtführungszylinder (11, 12) angebracht sind und den Abstand zwischen den Drähten der Drahtschicht und somit die Dicke der gesägten Scheiben (23) definieren, die voneinander durch Sägespalte (24) getrennt sind, wobei die Drähte einer Hin- und Her- oder einer kontinuierlichen Bewegung folgend und an das zumindest eine zu sägende Werkstück (17) angedrückt bewegt werden können, das auf einem Auflagetisch (18) befestigt ist, Mittel (20, 21) vorgesehen sind, um eine relative Vorschubbewegung zwischen dem zu sägenden Werkstück (17) und der Drahtschicht (15) zu bewirken, die Sägevorrichtung eine Haltevorrichtung (22) mit Halteorganen (25) umfasst, die in der Lage sind, mit zumindest einem Abschnitt der im Sägen begriffenen Scheiben zusammenzuwirken, um während des Sägens die teilweise oder ganz gesägten Scheiben (23) parallel zueinander zu halten, Führungselemente (34) auf dem Auflagetisch (18) angeordnet und die Halteorgane (25) beweglich auf diesen Führungselementen (34) angebracht sind, um von einer passiven Position zu einer aktiven Position verschoben zu werden, in der sie mit den beim Sägen befindlichen Scheiben (23) zusammenwirken, und umgekehrt, und die Halteorgane (25) durch federnde Elemente (35) zu stationären Anschlägen (40) hin gedrückt werden, dadurch gekennzeichnet, dass die Halteorgane (25) einerseits an den stationären Anschlägen (40) ruhen, wenn sie sich in der passiven Position befinden, und andererseits von den stationären Anschlägen (40) weggespreizt sind, um mit dem oder den zu sägenden Werkstücken (17) zusammenzuwirken, wenn sie sich in der aktiven Position befinden, dadurch, dass die Halteorgane (25) zumindest einen Stab (30) umfassen, der sich in einer zu den Drahtführungszylindern (11, 12) im Wesentlichen parallelen Richtung dem zu sägenden Werkstück (17) entlang erstreckt, wobei dieser Stab (30) mit zumindest einer Elastomerbeschichtung (31) versehen ist, die dafür bestimmt ist, gegen die Scheiben (23) des zu sägenden Werkstücks gedrückt zu werden, und dadurch, dass der Stab (30) schwenkbar um eine zu den Drahtführungszylindern (11, 12) parallele Schwenkachse (32) auf Querträger (33) montiert ist, die gleitend auf die Führungselemente (34) montiert sind.
  2. Sägevorrichtung nach Anspruch 1, dadurch gekennzeichnet, dass die Halteorgane (25) eine dicke Flüssigkeit oder ein Gel (45) einer Dichte umfassen, die höher als die der verwendeten Verarbeitungsflüssigkeit ist, wobei die dicke Flüssigkeit bzw. das Gel (45) in einem Gefäss (46) enthalten ist, das in der aktiven Position so gehalten wird, dass der benannte Abschnitt (26) der Scheiben zumindest teilweise in die dicke Flüssigkeit bzw. das Gel (45) eintaucht, so dass die Scheiben (23) immobilisiert werden.
  3. Sägevorrichtung nach Anspruch 1, dadurch gekennzeichnet, dass die Haltevorrichtung (22) als Halteorgane (25) Trennelemente (50, 72) umfasst, die dafür bestimmt sind, zumindest teilweise in die Sägespalte (24) zwischen den Scheiben (23) eingeführt zu werden, um letztere zu halten, wobei diese Trennelemente auf zumindest einen Halter (51, 74, 86) montiert sind, dadurch, dass die Trennelemente aus Drähten (50, 73), Bändern, dünnen Platten oder Wänden einer Dicke bestehen, die angemessen ist, damit sie in die Sägespalte (24) eingeführt werden können, und dadurch, dass der zumindest eine Träger (51) auf den Auflagetisch (18) montiert ist und von der passiven zur aktiven Position bewegt werden kann.
  4. Sägevorrichtung nach Anspruch 3, dadurch gekennzeichnet, dass der zumindest eine Träger (51) über dem Stab (30) angebracht ist.
  5. Sägevorrichtung nach Ansprüchen 2 und 3, dadurch gekennzeichnet, dass der zumindest eine Träger (51) über dem Gefäss (46) angebracht ist.
  6. Sägevorrichtung nach Anspruch 3, dadurch gekennzeichnet, dass der zumindest eine Träger (51, 74, 86) in zumindest einem Gefäss (70, 80) angeordnet ist, das auf den Rahmen (10) montiert ist.
  7. Sägevorrichtung nach Anspruch 6, dadurch gekennzeichnet, dass sie zumindest zwei Träger (86) umfasst, die in zumindest zwei Schubfächern (81) angeordnet sind, die gleitend im Gefäss (80) angebracht sind.
  8. Vorrichtung nach Anspruch 3, dadurch gekennzeichnet, dass die Drähte (50, 73) in horizontalen und/oder schrägen Richtungen auf dem Träger (74, 86) aufgespannt sind, um sich kreuzende Drahtschichten zu bilden.
  9. Sägevorrichtung nach Anspruch 1, dadurch gekennzeichnet, dass die Haltevorrichtung (22) einen U-förmigen Rahmen (60) umfasst, dessen Längsarme (61) dafür bestimmt sind, über federnde Teile (62) seitlich gegen die gesägten Scheiben (23) gedrückt zu werden.
EP20030029548 2003-01-13 2003-12-22 Drahtsägevorrichtung Expired - Lifetime EP1437209B1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH00043/03A CH696159A5 (fr) 2003-01-13 2003-01-13 Dispositif de sciage par fil.
CH432003 2003-01-13
CH01263/03A CH696807A5 (fr) 2003-01-13 2003-07-18 Dispositif de sciage par fil.
CH12632003 2003-07-18

Publications (2)

Publication Number Publication Date
EP1437209A1 EP1437209A1 (de) 2004-07-14
EP1437209B1 true EP1437209B1 (de) 2006-08-16

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Country Status (7)

Country Link
US (1) US7114424B2 (de)
EP (1) EP1437209B1 (de)
JP (1) JP4510473B2 (de)
AT (1) ATE336349T1 (de)
CH (1) CH696807A5 (de)
DE (1) DE60307588T2 (de)
ES (1) ES2269905T3 (de)

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EP2711978A1 (de) 2012-09-24 2014-03-26 Meyer Burger AG Verfahren zur Herstellung von Wafern
EP2944444A1 (de) 2014-05-16 2015-11-18 Meyer Burger AG Waferverarbeitungsverfahren

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US20100126488A1 (en) * 2008-11-25 2010-05-27 Abhaya Kumar Bakshi Method and apparatus for cutting wafers by wire sawing
CN102049818B (zh) * 2009-10-28 2013-09-11 上海日进机床有限公司 晶体硅锭的切割方法
US20110265621A1 (en) * 2010-04-29 2011-11-03 Schmidt Richard F Profile Loaf Cutting System for Food Products
DE102010031364A1 (de) * 2010-07-15 2012-01-19 Gebr. Schmid Gmbh & Co. Träger für einen Siliziumblock, Trägeranordnung mit einem solchen Träger und Verfahren zur Herstellung einer solchen Trägeranordnung
JP5185419B2 (ja) * 2011-08-22 2013-04-17 コマツＮｔｃ株式会社 ワイヤソー
DE102011090053A1 (de) * 2011-12-28 2013-07-04 Robert Bosch Gmbh Vereinzelungsvorrichtung und Verfahren zum Vereinzeln eines metallischen oder keramischen Rohteiles
KR101841551B1 (ko) * 2016-11-23 2018-03-23 에스케이실트론 주식회사 잉곳 가압 장치 및 이를 포함하는 잉곳 절단 장치
JP6926864B2 (ja) * 2017-09-12 2021-08-25 住友金属鉱山株式会社 単結晶の切断方法、固定冶具、及び、単結晶基板の製造方法
NL2021522B1 (en) * 2018-08-30 2020-04-24 Sdd Holding B V Cutting device and method for cutting paper
KR102097585B1 (ko) * 2018-11-19 2020-04-06 이충석 수직형 멀티 와이어 쏘우용 잉곳 로딩언로딩 장치
JP7302213B2 (ja) * 2019-03-19 2023-07-04 住友金属鉱山株式会社 単結晶の押さえ治具、ワイヤソー装置、及び、単結晶の切断方法

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JPH03281309A (ja) * 1990-03-30 1991-12-12 Osaka Titanium Co Ltd マルチワイヤソーによる加工方法
EP0716910B1 (de) * 1994-12-15 2002-03-27 Sharp Kabushiki Kaisha Drahtgittersäge und Sägeverfahren
JP3427956B2 (ja) * 1995-04-14 2003-07-22 信越半導体株式会社 ワイヤーソー装置
JPH09272122A (ja) * 1996-04-05 1997-10-21 Sumitomo Metal Ind Ltd マルチワイヤソーによる切断方法
JPH11198017A (ja) * 1998-01-14 1999-07-27 Tokyo Seiko Co Ltd ワイヤ式切断加工装置におけるウエハの隙間維持装置および方法
US6119673A (en) * 1998-12-02 2000-09-19 Tokyo Seimitsu Co., Ltd. Wafer retrieval method in multiple slicing wire saw
JP3767382B2 (ja) * 2001-01-09 2006-04-19 株式会社デンソー ワイヤソーによる切断方法およびそれに用いる切断装置
US6832606B2 (en) * 2001-11-30 2004-12-21 Dowa Mining Co., Ltd. Wire saw and cutting method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2711978A1 (de) 2012-09-24 2014-03-26 Meyer Burger AG Verfahren zur Herstellung von Wafern
EP2944444A1 (de) 2014-05-16 2015-11-18 Meyer Burger AG Waferverarbeitungsverfahren
WO2015173739A1 (en) 2014-05-16 2015-11-19 Meyer Burger Ag Wafer processing method

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JP4510473B2 (ja) 2010-07-21
CH696807A5 (fr) 2007-12-14
DE60307588T2 (de) 2007-08-16
JP2004216549A (ja) 2004-08-05
US20040159316A1 (en) 2004-08-19
EP1437209A1 (de) 2004-07-14
US7114424B2 (en) 2006-10-03
ES2269905T3 (es) 2007-04-01
DE60307588D1 (de) 2006-09-28
ATE336349T1 (de) 2006-09-15

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