EP1396003A1 - Composant de fusible - Google Patents

Composant de fusible

Info

Publication number
EP1396003A1
EP1396003A1 EP02743178A EP02743178A EP1396003A1 EP 1396003 A1 EP1396003 A1 EP 1396003A1 EP 02743178 A EP02743178 A EP 02743178A EP 02743178 A EP02743178 A EP 02743178A EP 1396003 A1 EP1396003 A1 EP 1396003A1
Authority
EP
European Patent Office
Prior art keywords
fuse
component according
fuse element
layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02743178A
Other languages
German (de)
English (en)
Inventor
Uwe RÖDER
André Jöllenbeck
Andreas Baus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wickmann Werke GmbH
Original Assignee
Wickmann Werke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wickmann Werke GmbH filed Critical Wickmann Werke GmbH
Publication of EP1396003A1 publication Critical patent/EP1396003A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/0039—Means for influencing the rupture process of the fusible element
    • H01H85/0047—Heating means
    • H01H85/0056—Heat conducting or heat absorbing means associated with the fusible member, e.g. for providing time delay

Definitions

  • the invention relates to a fuse component, in which a thick-film fuse element is applied to an upper side of an electrically insulating substrate, and to a method for producing such a fuse component.
  • a metallic thick-film fusible conductor is formed on a rectangular upper side of an insulating substrate, which consists for example of Al 2 O 3 , between two connection surfaces.
  • the connection areas are formed on mutually opposite edges of the upper side of the substrate and are constructed from several metal layers and are provided with a solderable coating for SMD assembly.
  • a spot composed of a layer which contains tin / lead is applied to a central section of the fusible conductor applied to the upper side of the substrate.
  • the arrangement is designed in such a way that given predetermined current flows of predetermined minimum durations, the fusible conductor and the stain applied to it are heated enough to soften or melt the material of the stain to such an extent that the tin / lead diffuses in Metal comes into the metal of the fuse element arranged below. This locally increases its electrical resistance, which results in an increased voltage drop, an increased local power loss, further heating and finally melting and / or evaporation of the material of the fuse element.
  • the current which leads to the fuse being cut is less than the current which leads to the melting of the fuse. conductor without an applied tin / lead stain would be required.
  • a considerably longer time for the current flow to cut is required; the security component becomes "sluggish".
  • CVD-SiO 2 or printed glass is covered, whereupon a second glass plate with an adhesive layer (epoxy) is glued on.
  • Time-lag fuses of small size are required, for example, in telecommunications devices, in particular to protect input or interface circuits that are coupled with long transmission lines. These transmission lines are exposed to the influence of electrical and magnetic fields, which originate from lightning conductors and nearby high-voltage cables. These influences can lead, among other things, to short-term current / voltage pulses of high peak values on the telecommunication signal transmission lines, which can possibly damage the devices connected to them, in particular their input circuits. For this reason, the input connections of the devices are protected against overvoltages and, with the help of fuse components, against overcurrents. These telecommunications devices and their fuse components are subject to complicated requirements, which are specified in a series of special tests.
  • the "telecommunications" fuse components should switch off reliably at given large currents within certain maximum current flow times (for example at 40 A within 1.5 s or at 7 A within 5 s) (ie no more current flow via an arc he- U ) 00 N) IV) I- 1
  • Electrical insulators generally have poor thermal conductivity compared to conductor materials (such as metals). "Good thermal conductivity" in the sense of the invention is therefore to be understood as meaning an above average level for an electrical insulator.
  • the specific thermal conductivity of the material of the cover layer should be greater than 2 W / mK, preferably greater than 4 W / mK.
  • the cover layer is e.g. produced by tempering from a paste applied by the screen printing process, the paste containing particles of at least one substance from a heat-conducting glass, group of substances comprising aluminum oxide, aluminum nitride and silicon nitride.
  • the cover layer is a glass-containing sintered thick layer which has been produced from a glass frit by tempering at a temperature between 700 ° C. and 950 ° C., preferably about 850 ° C.
  • the cover layer is preferably relatively thick, for example 10 ⁇ m-100 ⁇ m, preferably 20 ⁇ m-40 ⁇ m, thick.
  • the substrate is preferably a ceramic substrate with good thermal conductivity, for example a ceramic Al 2 0 3 substrate.
  • the substrate has an elongated, essentially rectangular upper side, the thick-film fusible conductor extending between two connecting surfaces arranged on the narrow sides of the upper side, the connecting surfaces not being covered by the cover layer.
  • the top has e.g. a width between 1 mm and 4 mm and a length between 6 mm and 15 mm.
  • the thick-film fuse element between the connection areas preferably has a width between 0.1 mm and 1.5 mm. o CO IV)) F 1
  • F- s F 1 3 d F EP ⁇ * * tr ⁇ H d F- ⁇ co F- P-
  • the fusible conductor and the layer applied thereon are heated, which is sufficient to allow the substance of the layer to act on the fusible conductor arranged below.
  • the current intensity which leads to the fuse element being cut in the manner mentioned is less than the current intensity which would be required to melt the fuse element without the layer applied in the window.
  • a considerably longer time for the current flow to cut (switch off) is required; the fuse component becomes sluggish.
  • the layer containing the metal preferably has good thermal conductivity. This creates the possibility of quickly dissipating heat that is generated in the fuse element below as a result of brief current pulses.
  • the layer takes on a function of the covering layer missing in the window.
  • the entire section of the fuse element lying in the window is preferably covered by the layer, so that the entire fuse element of the fuse component is covered either by the heat-dissipating covering layer or by the layer applied in the window.
  • the layer can also overlap the edge of the window to compensate for technological tolerances.
  • the thick-film fusible conductor runs at least in a central section between the connection surfaces in a meandering manner with alternating straight and curved sections on the upper side of the substrate.
  • the window of the cover layer is over an arcuate section and parts of the two adjacent co CO N3> I- 1 c ⁇ o C ⁇ o C ⁇ o C ⁇
  • the cover layer is printed so that at least one window is formed in the cover layer over a portion of the fuse element.
  • a layer is applied in the window at least over part of the section of the fusible conductor, which contains a substance which, when heated, can act on the fusible conductor below such that the resistance of the section of the fusible conductor increases.
  • a layer containing a solder is printed in the window and then briefly melted.
  • a solder layer with a thickness between 70 ⁇ m and 130 ⁇ m is preferably printed on using a stencil. This relatively thick solder layer creates a good local heat absorption buffer and an excess of the metals diffusing into the fuse element.
  • Figure 1 is a schematic plan view of a first embodiment of a fuse component according to the invention with partially cut-off cover layers;
  • Figure la is a sectional view of the fuse component according to Figure 1 along the line A-A;
  • Figure lb is a sectional view of the fuse device of Figure 1 along the line B-B;
  • FIGS. 2a-2d show schematic representations of a substrate with layers applied thereon, which illustrate method steps in the production of the fuse component according to FIG. 1;
  • FIGS. 3a-3d show schematic representations of a substrate with layers applied thereon, the process steps in the production of an alternative embodiment. illustrate the shape of the fuse component according to the invention.
  • FIG. 1 shows a schematic plan view of a fuse component 10 according to the invention, the layers arranged above being partially cut away for reasons of illustration.
  • Figures la and lb show sectional views of the fuse component 10 shown in Figure 1, wherein was cut along the lines AA and BB.
  • the fuse component 10 is produced on a substrate 12.
  • the substrate consists of an Al0 3 ceramic with a thickness between 0.5 mm and 0.7 mm, for example 0.63 mm.
  • the substrate 12 of the preferred exemplary embodiment shown in FIG. 1 is approximately 10 mm long and 2.5 mm wide.
  • the substrate chip shown is preferably cut out of a larger substrate wafer, a large number of fuse component chips arranged in rows and columns being able to be produced on the substrate wafer at the same time.
  • a thick-film fuse element 14 is applied to the upper side of the substrate 12 shown in FIG.
  • the fusible conductor 14 consists of a sintered layer of adjoining silver particles applied and sintered using the screen printing method and preferably has a thickness of approximately 20 ⁇ m. Such a thickness results, for example, from the successive printing of two layers, each 10 ⁇ m thick, with the first layer being baked after the first layer has been printed before the second layer is printed.
  • the thick-film fusible conductor 14 has a meandering shape, the width of the
  • Fusible conductor in the meandering area is about 0.2 mm. In the vicinity of the narrow sides of the substrate 12, the fusible conductor 14 borders on contact areas 16. The contact areas 16 can likewise be produced from the layer of the fusible conductor 14 and / or from further layers.
  • Fuse component 10 arranged. With an approximately symmetrical design of the meandering fusible conductor 14, the area of greatest heating results in the middle of the fuse component 10.
  • a layer 22 is applied in the window 20 over the arcuate portion of the portion of the fusible conductor exposed in the window, the layer 22 being produced by printing on a solder paste with the aid of a printing stencil and then heating until the solder components melt briefly is.
  • Layer has a thickness of approximately 100 ⁇ m, for example. After the brief melting, due to the surface tension of the melt, a drop-like shape remains after cooling, which is shown, for example, in FIG.
  • the solder material contained in layer 22 is, for example, a tin / lead alloy. In addition to tin and lead, other metals can be contained in the alloy.
  • the window 20 extends 1 mm in the longitudinal direction of the substrate 12 and is approximately 1.5 mm wide.
  • the layer applied in the window is about 0.7 mm wide and extends essentially over the entire length of the window.
  • the entire structure of fuse element 14, cover layer 18 and layer 22 applied in the window 20 is covered by a protective layer 24.
  • the protective layer 24 consists for example of an epoxy resin, preferably a self-extinguishing epoxy resin.
  • DJ PJ rt ⁇ H ⁇ F- d
  • DJ DJ ⁇ • 3 rt ⁇ a DJ: ⁇ ⁇ a DJ H P- ⁇ ⁇ rt DJ 3 tr F ⁇

Landscapes

  • Fuses (AREA)

Abstract

L'invention concerne un composant de fusible (10) comportant un substrat (12) d'une face supérieure, à isolation électrique, un fil fusible à couche épaisse (14), appliqué sur la face supérieure du substrat (12) et une couche de recouvrement (18) consistant en un matériau à isolation électrique de bonne conduction thermique, appliquée directement sur le fil fusible à couche épaisse (14) et les zones adjacentes de la face supérieure du substrat (12). La couche de recouvrement contient de préférence un verre de conduction thermique spécifique > 2W/mK. La couche de recouvrement (18) présente de préférence une fenêtre (20) aménagée sur une section du fil fusible (14). La section de fil fusible (14) se trouvant dans la fenêtre (20) est recouverte au moins en partie d'une couche contenant du métal d'apport de brasage (22).
EP02743178A 2001-06-11 2002-06-11 Composant de fusible Withdrawn EP1396003A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10128108 2001-06-11
DE10128108 2001-06-11
PCT/EP2002/006392 WO2002103735A1 (fr) 2001-06-11 2002-06-11 Composant de fusible

Publications (1)

Publication Number Publication Date
EP1396003A1 true EP1396003A1 (fr) 2004-03-10

Family

ID=7687801

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02743178A Withdrawn EP1396003A1 (fr) 2001-06-11 2002-06-11 Composant de fusible

Country Status (4)

Country Link
US (1) US7489229B2 (fr)
EP (1) EP1396003A1 (fr)
CN (1) CN1327467C (fr)
WO (1) WO2002103735A1 (fr)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006511930A (ja) * 2002-06-21 2006-04-06 コンティネンタル・テーベス・アクチエンゲゼルシヤフト・ウント・コンパニー・オッフェネ・ハンデルスゲゼルシヤフト 電子式自動車制御装置用のプリント回路基板
CN100562949C (zh) * 2003-05-08 2009-11-25 松下电器产业株式会社 电子部件及其制造方法
DE102004033251B3 (de) * 2004-07-08 2006-03-09 Vishay Bccomponents Beyschlag Gmbh Schmelzsicherung für einem Chip
DE102005024347B8 (de) * 2005-05-27 2010-07-08 Infineon Technologies Ag Elektrisches Bauteil mit abgesichertem Stromzuführungsanschluss
JP4896630B2 (ja) * 2006-08-28 2012-03-14 矢崎総業株式会社 ヒューズエレメント及びヒューズエレメントの製造方法
TWI323906B (en) * 2007-02-14 2010-04-21 Besdon Technology Corp Chip-type fuse and method of manufacturing the same
US20090009281A1 (en) * 2007-07-06 2009-01-08 Cyntec Company Fuse element and manufacturing method thereof
JP5287154B2 (ja) * 2007-11-08 2013-09-11 パナソニック株式会社 回路保護素子およびその製造方法
US9190235B2 (en) * 2007-12-29 2015-11-17 Cooper Technologies Company Manufacturability of SMD and through-hole fuses using laser process
US8525633B2 (en) * 2008-04-21 2013-09-03 Littelfuse, Inc. Fusible substrate
US8659384B2 (en) * 2009-09-16 2014-02-25 Littelfuse, Inc. Metal film surface mount fuse
JP2011192972A (ja) * 2010-02-18 2011-09-29 Oki Semiconductor Co Ltd 基板端子間電圧検知回路
KR101678054B1 (ko) * 2010-06-28 2016-11-22 삼성전자 주식회사 반도체 패키지 및 그 반도체 패키지 제조방법
DE102010063832B4 (de) * 2010-12-22 2020-08-13 Tridonic Gmbh & Co Kg Leiterbahnsicherung, Leiterplatte und Betriebsschaltung für Leuchtmittel mit der Leiterbahnsicherung
EP2639813B1 (fr) * 2012-03-12 2014-11-19 GE Energy Power Conversion Technology Limited Fusibles
DE102012102500B4 (de) * 2012-03-23 2024-02-08 Conquer Electronics Co., Ltd. Schmelzsicherungen
EP2850633B1 (fr) * 2012-05-16 2018-01-31 Littelfuse, Inc. Procédé d'emboutissage de fusible à faible courant
US9852868B2 (en) * 2012-09-28 2017-12-26 Kamaya Electric Co., Ltd. Chip fuse and manufacturing method therefor
US20150200067A1 (en) * 2014-01-10 2015-07-16 Littelfuse, Inc. Ceramic chip fuse with offset fuse element
JP6294165B2 (ja) * 2014-06-19 2018-03-14 Koa株式会社 チップ型ヒューズ
DE102014115588B4 (de) 2014-10-27 2022-04-28 Lisa Dräxlmaier GmbH Sicherungseinrichtung und Verfahren zum Herstellen einer Sicherungseinrichtung
JP6105727B2 (ja) * 2014-11-13 2017-06-28 エス・オー・シー株式会社 チップヒューズの製造方法及びチップヒューズ
CN106404213B (zh) * 2016-08-24 2019-03-19 中国人民解放军第三军医大学第三附属医院 测试爆炸温度的装置
CN106683954B (zh) * 2016-11-08 2019-08-16 电安科技（嘉兴）有限公司 保险丝组件、其单体制法及包括其单体的绕线式保险装置
US10158203B2 (en) * 2017-03-31 2018-12-18 Rockwell Automation Technologies, Inc. Power bus connection system with fusible conductive material
CN107610988B (zh) * 2017-10-30 2021-01-01 Aem科技(苏州)股份有限公司 一种微型超级表面贴装熔断器及其制造方法
KR102469361B1 (ko) * 2017-12-28 2022-11-23 에이치엘만도 주식회사 온도퓨즈의 체결구조
US11729906B2 (en) * 2018-12-12 2023-08-15 Eaton Intelligent Power Limited Printed circuit board with integrated fusing and arc suppression
JP7368144B2 (ja) * 2019-08-27 2023-10-24 Koa株式会社 チップ型電流ヒューズ
US11636993B2 (en) 2019-09-06 2023-04-25 Eaton Intelligent Power Limited Fabrication of printed fuse
EP4008018A1 (fr) * 2019-09-13 2022-06-08 Tridonic GmbH & Co. KG Fusible à piste conductrice
JP2024504661A (ja) * 2021-10-28 2024-02-01 エルジー エナジー ソリューション リミテッド パターンヒューズ及びその製造方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3538479A (en) * 1968-06-11 1970-11-03 Mc Graw Edison Co Protector for electric circuits
US4626818A (en) * 1983-11-28 1986-12-02 Centralab, Inc. Device for programmable thick film networks
DE8608325U1 (fr) * 1986-03-26 1987-07-23 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
JPH0831303B2 (ja) * 1986-12-01 1996-03-27 オムロン株式会社 チツプ型ヒユ−ズ
US4749980A (en) * 1987-01-22 1988-06-07 Morrill Glasstek, Inc. Sub-miniature fuse
US4988969A (en) * 1990-04-23 1991-01-29 Cooper Industries, Inc. Higher current carrying capacity 250V subminiature fuse
US5169465A (en) * 1991-01-28 1992-12-08 Spectrol Electronics Corporation Thick-film circuit element on a ceramic substrate
US5166656A (en) * 1992-02-28 1992-11-24 Avx Corporation Thin film surface mount fuses
US5479147A (en) * 1993-11-04 1995-12-26 Mepcopal Company High voltage thick film fuse assembly
US5432378A (en) * 1993-12-15 1995-07-11 Cooper Industries, Inc. Subminiature surface mounted circuit protector
US5453726A (en) * 1993-12-29 1995-09-26 Aem (Holdings), Inc. High reliability thick film surface mount fuse assembly
US5949465A (en) * 1994-06-21 1999-09-07 Rohm Co., Ltd. Thermal printhead, substrate for the same and method for making the substrate
JPH08102244A (ja) 1994-09-29 1996-04-16 Kyocera Corp チップヒューズ
US5914648A (en) * 1995-03-07 1999-06-22 Caddock Electronics, Inc. Fault current fusing resistor and method
CA2224070A1 (fr) * 1995-06-07 1996-12-19 Littelfuse, Inc. Procede et appareil perfectionnes pour un dispositif fusible monte en surface
US5907272A (en) * 1996-01-22 1999-05-25 Littelfuse, Inc. Surface mountable electrical device comprising a PTC element and a fusible link
JP2744938B2 (ja) * 1996-01-30 1998-04-28 工業技術院長 多孔質高強度低熱伝導窒化ケイ素質セラミックス及びその製造方法
JP3826961B2 (ja) * 1996-03-25 2006-09-27 ローム株式会社 加熱体およびその製造方法
US5652562A (en) * 1996-05-21 1997-07-29 Spectrol Electronics Corporation Thermally fused resistor having a portion of a solder loop thermally connected to an electrically insulated portion of an outer surface of the resistor
US5977860A (en) * 1996-06-07 1999-11-02 Littelfuse, Inc. Surface-mount fuse and the manufacture thereof
JP4396787B2 (ja) * 1998-06-11 2010-01-13 内橋エステック株式会社 薄型温度ヒュ−ズ及び薄型温度ヒュ−ズの製造方法
US5949323A (en) * 1998-06-30 1999-09-07 Clear Logic, Inc. Non-uniform width configurable fuse structure
GB0001573D0 (en) * 2000-01-24 2000-03-15 Welwyn Components Ltd Printed circuit board with fuse
DE10005836B4 (de) * 2000-02-10 2006-10-12 Vossloh-Schwabe Elektronik Gmbh Leiterplattensicherung mit erhöhter Sicherheit
JP2002025752A (ja) * 2000-07-10 2002-01-25 Canon Inc ヒーター、加熱装置および画像形成装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO02103735A1 *

Also Published As

Publication number Publication date
CN1327467C (zh) 2007-07-18
WO2002103735A1 (fr) 2002-12-27
US7489229B2 (en) 2009-02-10
CN1692463A (zh) 2005-11-02
US20040169578A1 (en) 2004-09-02

Similar Documents

Publication Publication Date Title
EP1396003A1 (fr) Composant de fusible
DE69818011T2 (de) Elektrische schmelzsicherung
DE3725438C2 (de) Sicherung
DE10208635B4 (de) Diffusionslotstelle, Verbund aus zwei über eine Diffusionslotstelle verbundenen Teilen und Verfahren zur Herstellung der Diffusionslotstelle
DE4444599B4 (de) Schaltungssicherung
DE3324933C2 (de) Keramische Mehrschicht-Leiterplatte
DE2132939A1 (de) Verfahren zum Herstellen von Dickfilm-Hybridschaltungen
DE69814880T2 (de) Elektrisches sicherungselement
DE3716391C2 (fr)
EP0301533A2 (fr) Fusible électrique et méthode de sa fabrication
WO2000031796A1 (fr) Procede de production d'un circuit integre traite sur ses deux faces
DE2447430A1 (de) Sicherungs-widerstand
DE102014115588A1 (de) Sicherungseinrichtung und Verfahren zum Herstellen einer Sicherungseinrichtung
DE19523977A1 (de) Microchip-Sicherung
EP2844414B1 (fr) Procédé de fabrication d'un substrat métallisé composé d'aluminium
EP0829897B1 (fr) Fusible électrique
DE112016006225T5 (de) Abstrahlungsplattenstruktur, Halbleitervorrichtung und Verfahren zum Herstellen einer Abstrahlungsplattenstruktur
DE10063714C2 (de) Leistungshalbleitermodul mit hoher Isolationsfestigkeit
DE3728489A1 (de) Elektrische schmelzsicherung
DE69634599T2 (de) Schmelzbarer widerstand für fehlerstrom und verfahren dafür
EP0772217A1 (fr) Fusible de surintensité
DE3731969C2 (fr)
EP0665560B1 (fr) Dispositif à circuit intégré hybride
DE3147790A1 (de) Leistungsmodul und verfahren zu seiner herstellung
EP0559035B1 (fr) Connexion soudée entre une couche électriquement conductrice cuite sur un vitrage et une borne d'amenée de courant

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20031127

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

RIN1 Information on inventor provided before grant (corrected)

Inventor name: JOELLENBECK, ANDRE

Inventor name: BAUS, ANDREAS

Inventor name: ROEDER, UWE

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20061024