EP1368821A1 - Ensemble et procede de mise en contact cote arriere d'un substrat semi-conducteur - Google Patents

Ensemble et procede de mise en contact cote arriere d'un substrat semi-conducteur

Info

Publication number
EP1368821A1
EP1368821A1 EP02714062A EP02714062A EP1368821A1 EP 1368821 A1 EP1368821 A1 EP 1368821A1 EP 02714062 A EP02714062 A EP 02714062A EP 02714062 A EP02714062 A EP 02714062A EP 1368821 A1 EP1368821 A1 EP 1368821A1
Authority
EP
European Patent Office
Prior art keywords
sealing ring
base body
substrate
opening
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02714062A
Other languages
German (de)
English (en)
Inventor
Albrecht Birner
Martin Franosch
Matthias Goldbach
Volker Lehmann
Jörn LÜTZEN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of EP1368821A1 publication Critical patent/EP1368821A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an arrangement and a method for contacting a semiconductor substrate from the rear.
  • process steps are used which require electrical contact to the substrate to be processed. This is the case, for example, with electrical or electrochemical process steps.
  • electrical or electrochemical process steps In order to be able to produce a large number of identical components in parallel on a semiconductor substrate, it is necessary for the substrate to be processed uniformly by the process step. This requires contacting methods which produce an electrical contact that is as homogeneous as possible with respect to the substrate. If no homogeneous electrical contact is guaranteed, there is a variation in the electrical potential across the substrate, which can be noticeable in an inhomogeneous process control and prevents a uniform execution of the process step. The fluctuation leads to an uneven galvanic deposition with a negative substrate potential and to an uneven anodic resolution with a positive substrate potential.
  • pores form at a low anodic potential and electropolished surfaces at a high anodic potential.
  • the formation of pores in silicon is of interest, for example, for the production of trench capacitors, since a substantial increase in surface area and the associated increase in capacitance can be achieved through the formation of pores.
  • So-called mesopores with a pore diameter in the range from 2 to 10 nanometers (nm) are particularly suitable as pores. Since - as already mentioned above - the formation of pores depends on the electrical potential, it is very important to apply this potential to the substrate as evenly as possible distributed over the substrate.
  • a known method for producing a uniform, full-area rear-side contact with a semiconductor substrate is shown, for example, in US Pat. No. 5,209,833.
  • An electrolyte contact is made to the back of the substrate, which ensures a very slight fluctuation in the contact resistance between the substrate and the electrolyte.
  • P- 0 for P- tr P ⁇ fi CQ P- ü SD ⁇ ⁇ 4 tr P ⁇ P- P- s: CQ 0 fi Pi fi tr ⁇ P- P, P- P 4 P 4
  • the barrier layer can have a diffusion barrier effect, for example. Furthermore, it can advantageously serve as an adhesion promoter for the conductive layer. It is also provided that the barrier layer is conductive.
  • a further method step provides that the insulation layer comprises silicon nitride or silicon oxide and is etched with an etchant which comprises hydrofluoric acid or nitric acid, as a result of which the conductive layer is exposed.
  • a further method step provides that the insulation layer is removed by means of a dry etching process which uses an etching mask applied to the substrate.
  • Figure 1 is a plan view of a base body with sealing rings which is suitable for receiving a semiconductor substrate
  • Figure 2 shows a section through the basic body shown in Figure 1 along the section line II;
  • FIG. 3 shows a section through the base body shown in Figure 1 along the section line III;
  • Figure 4 shows a substrate with a conductive layer applied to the back of the substrate.
  • TJ PP 4 CQ CQ $. ⁇ ⁇ ⁇ CQ ⁇ fi £ ⁇ ⁇ P- fi P ⁇ ! P to P- fi P l ⁇ ) ⁇ 0 fi o et 0 ⁇ t ⁇ fi fi P ⁇
  • P- P- et> P- SD rr P- rr fi CQ et tr rr P ⁇ CQ Si fi P su P "tr ⁇ P ⁇ P Hl O P
  • the cavity 25 can be cleaned and rinsed, for example, with deionized water before the electrolyte is filled in.
  • the electrolyte can be removed from the cavity 25, a subsequent rinsing with deionized water can be carried out and then drying with nitrogen can be carried out.
  • the conductive layer 5 can be formed, for example, from metals or suicides. Tungsten is suitable as the metal, for example, and tungsten silicide is suitable as the silicide. It is also possible to form the conductive layer from tungsten nitride.
  • the barrier layer 4 can, for example, also be formed from tungsten nitride.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

L'invention concerne un corps de base (21), sur lequel une première bague d'étanchéité (23) et une deuxième bague d'étanchéité (24) sont agencées. Un substrat (1) est placé sur ces bagues d'étanchéité, de sorte qu'une cavité (25) est formée entre la première bague d'étanchéité (23), la deuxième bague d'étanchéité (24), le corps de base (21) et le substrat (1). Une substance d'attaque peut être introduite dans cette cavité (25) pour la gravure d'une couche conductrice appliquée sur le substrat (1). Si une couche conductrice (5), appliquée côté arrière du substrat, est exposée, ladite cavité (25) peut être remplie d'un électrolyte établissant un contact entre cette couche conductrice (5) et le côté arrière du substrat.
EP02714062A 2001-03-12 2002-02-22 Ensemble et procede de mise en contact cote arriere d'un substrat semi-conducteur Withdrawn EP1368821A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10111761 2001-03-12
DE10111761A DE10111761A1 (de) 2001-03-12 2001-03-12 Anordnung und Verfahren zum rückseitigen Kontaktieren eines Halbleitersubstrats
PCT/DE2002/000670 WO2002073663A1 (fr) 2001-03-12 2002-02-22 Ensemble et procede de mise en contact cote arriere d'un substrat semi-conducteur

Publications (1)

Publication Number Publication Date
EP1368821A1 true EP1368821A1 (fr) 2003-12-10

Family

ID=7677114

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02714062A Withdrawn EP1368821A1 (fr) 2001-03-12 2002-02-22 Ensemble et procede de mise en contact cote arriere d'un substrat semi-conducteur

Country Status (5)

Country Link
US (1) US6863769B2 (fr)
EP (1) EP1368821A1 (fr)
DE (1) DE10111761A1 (fr)
TW (1) TW550708B (fr)
WO (1) WO2002073663A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10143936A1 (de) 2001-09-07 2003-01-09 Infineon Technologies Ag Verfahren zur Bildung eines SOI-Substrats, vertikaler Transistor und Speicherzelle mit vertikalem Transistor
KR20130061513A (ko) * 2011-12-01 2013-06-11 삼성전자주식회사 에칭용 지그 및 이를 포함하는 화학적 리프트 오프 장비
US10361097B2 (en) * 2012-12-31 2019-07-23 Globalwafers Co., Ltd. Apparatus for stressing semiconductor substrates
FR3125356A1 (fr) 2021-07-19 2023-01-20 Commissariat à l'Energie Atomique et aux Energies Alternatives Dispositif et procédé de collecte d’éléments contaminants sur une plaque de matériau semi-conducteur

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0400387B1 (fr) 1989-05-31 1996-02-21 Siemens Aktiengesellschaft Procédé pour former un contact électrolytique de grande surface sur un corps semi-conducteur
DE4003472C2 (de) * 1989-09-22 1999-08-12 Bosch Gmbh Robert Verfahren zum anisotropen Ätzen von Siliziumplatten
US5071510A (en) 1989-09-22 1991-12-10 Robert Bosch Gmbh Process for anisotropic etching of silicon plates
DE4024576A1 (de) * 1990-08-02 1992-02-06 Bosch Gmbh Robert Vorrichtung zum einseitigen aetzen einer halbleiterscheibe
JPH06120204A (ja) 1992-10-07 1994-04-28 Toppan Printing Co Ltd バックエッチング装置
SE512515C2 (sv) * 1995-06-27 2000-03-27 Toolex Alpha Ab Anordning för elektroplätering av skivelement med användning av en sluten slinga av en elektriskt ledande kropp
DE19728962A1 (de) * 1997-06-30 1999-01-07 Siemens Ag Vorrichtung zum Ätzen einer Halbleiterscheibe
JPH11154662A (ja) * 1997-11-20 1999-06-08 Seiko Instruments Inc 半導体製造装置
US6251235B1 (en) * 1999-03-30 2001-06-26 Nutool, Inc. Apparatus for forming an electrical contact with a semiconductor substrate
US6444027B1 (en) * 2000-05-08 2002-09-03 Memc Electronic Materials, Inc. Modified susceptor for use in chemical vapor deposition process
US6579408B1 (en) * 2002-04-22 2003-06-17 Industrial Technology Research Institute Apparatus and method for etching wafer backside

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO02073663A1 *

Also Published As

Publication number Publication date
DE10111761A1 (de) 2002-10-02
US20040104402A1 (en) 2004-06-03
US6863769B2 (en) 2005-03-08
WO2002073663A1 (fr) 2002-09-19
TW550708B (en) 2003-09-01

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