EP1346441B1 - Antennenanordnung - Google Patents

Antennenanordnung Download PDF

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Publication number
EP1346441B1
EP1346441B1 EP01995605A EP01995605A EP1346441B1 EP 1346441 B1 EP1346441 B1 EP 1346441B1 EP 01995605 A EP01995605 A EP 01995605A EP 01995605 A EP01995605 A EP 01995605A EP 1346441 B1 EP1346441 B1 EP 1346441B1
Authority
EP
European Patent Office
Prior art keywords
arrangement according
antenna arrangement
supply lines
antenna
earth plane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP01995605A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1346441A1 (de
Inventor
Frank Gottwald
Klaus Voigtlaender
Tore Toennesen
Andreas Moeller
Jens Haensel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP1346441A1 publication Critical patent/EP1346441A1/de
Application granted granted Critical
Publication of EP1346441B1 publication Critical patent/EP1346441B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means
    • H01Q9/0457—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means electromagnetically coupled to the feed line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/32—Adaptation for use in or on road or rail vehicles
    • H01Q1/3208—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used
    • H01Q1/3233—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • H01Q1/523—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between antennas of an array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means

Definitions

  • the present invention relates to an antenna arrangement, and more particularly to a slot-coupled antenna arrangement for distance or velocity detection between motor vehicles.
  • Such an arrangement having radiator surfaces for transmitting or receiving signal waves and having a multilayer dielectric support disposed below the radiator surfaces at a predetermined pitch Kamogawa et al., "A Novel Microstrip Antenna Using Alumina-Ceramic / Polyimide Multilayer Dielectric Substrates", 1996 IEEE MTT-S International Microwave Symposium Digest, New York, IEEE , UI, Vol. 1, June 17, 1996, pages 71-74.
  • antenna assemblies are known, which are made according to a so-called. Triplate technology, wherein electrical connection portions are arranged between two metallizations.
  • Such antenna arrangements consist, for example, of individual perforated metal plates, foils with antenna structures or supply lines and of foam interlayers. The individual layers are assembled, for example by screwing and secured against slipping. Due to its rather complicated training and the required complex manufacturing process such antenna arrangements are quite expensive.
  • the applicant known antenna assembly is constructed on a laminated circuit board consisting of, for example, a FR4 substrate.
  • a so-called soft board is laminated over the printed circuit board, wherein coupling slots are provided on one side of the softboard. It is milled out of a surface of the FR4 substrate, a foam material inserted in this milled surface and the metallic radiator surfaces or patches attached thereto, for example by means of a film.
  • This approach has the disadvantage that a complex manufacturing process is necessary because holes must be milled out and foams must be used.
  • interference radiations occur in all known arrangements by, for example, processor clocks, radiation of components, etc. outside the useful frequency and these can be difficult to prevent.
  • substantial portions of the electromagnetic useful radiation in undesired directions for example in the direction of the motor vehicle frame or motor, radiated by, for example, supply lines and can unfavorably act on there existing components.
  • the problem underlying the present invention is therefore generally to provide an antenna arrangement which has a compact design and reduces electromagnetic radiation in undesired directions.
  • the antenna arrangement according to the invention with the features of claim 1 has the advantage over the known approaches that facilitates the manufacturing process, a more compact sensor and a good shielding of the electromagnetic energy or waves in undesired radiation directions is created.
  • At least one layer of the dielectric carrier is arranged between the coupling slots and the feed lines.
  • At least one layer of the dielectric carrier is provided between the feed lines and the second ground plane.
  • the at least one layer of the dielectric carrier has a smaller thickness between the coupling slots and the feed lines as the at least one layer between the feed lines and the second ground plane.
  • the at least one layer of the dielectric carrier between the coupling slots and the feed lines about half or a third of the thickness of the at least one layer between the feed lines and the second ground plane. Since manufacturing technology advantageous layers are made with a thickness of about 150 microns, and these dimensions have a favorable effect on the resonance behavior of the arrangement, the dielectric support can be made of individual layers of this thickness. However, the layer thicknesses and the number of individual layers are not limited thereto and can be modified in a variety of ways.
  • the transmitting and / or receiving devices are designed as rectangular radiator surfaces (patches). These patches form an advantageous and easy-to-manufacture resonator.
  • the multilayer dielectric support consists of a low-temperature ceramic (LTCC).
  • LTCC low-temperature ceramic
  • This ceramic has a high dielectric constant, forming compact sensors consisting of a single material system.
  • LTCC is also adapted to the expansion of silicon and even at low temperatures (about 900 ° C) several layers with corresponding structures can be burned compactly on it.
  • the radiator device are spaced apart in rows at a certain distance.
  • a desired directional characteristic or radiation direction, power, etc. can be achieved.
  • the coupling slots are advantageously formed by etching the first ground plane and in each case arranged centrally below a beam surface, wherein they each extend approximately over the broad side of a radiator surface.
  • the interpretations of the corresponding mass are to be adapted to the desired resonance behavior.
  • the supply lines are formed perpendicular to the coupling slots in a carrier plane.
  • the coupling slots can also be arranged between different carrier planes be, whereby interference with each other can be reduced.
  • the antenna arrangement comprises plated-through holes for shielding electromagnetic radiation into a specific area, wherein the plated-through holes are arranged parallel to one another and perpendicular to the plane of the dielectric carrier, in particular between two ground planes.
  • the plated-through holes are furthermore advantageously spaced apart from one another at a smaller distance than the wavelength of the radiation to be shielded in order to form shielding chambers.
  • the radiator devices are mounted on a suitable foam material.
  • the radiator devices are attached to a housing cover of the arrangement. This results in a compact antenna arrangement of only two parts, a support plate and a lid on which the radiator devices are mounted.
  • the supply lines are each electrically connected by at least one contact device with a feed network device arranged on a surface of the carrier.
  • Feed lines between layers of the carrier are driven by a common easily applied feed network device.
  • the feed network device does not necessarily have to be mounted on the surface.
  • the radiator devices, the potential surfaces, the connecting sections, the plated-through holes and the contact devices consist of an electrically conductive material, for example gold, silver, copper or aluminum.
  • the connecting sections and / or contact devices are formed by means of microstrip and / or coplanar technology. This results in a compact sensor with large area for a shield advantageous potential surfaces or ground planes.
  • the coupling slots can assume any shape.
  • FIG. 1 and 2 schematically show the arrangement of electrical connection sections 7 in the form of supply lines 7, coupling devices 3 in the form of coupling slots 3 and transmitting and / or receiving devices 2 in the form of radiator surfaces (so-called patches) 2.
  • patches radiator surfaces
  • Such an arrangement is referred to as a slot-coupled patch antenna.
  • radiator surfaces 2 are either applied to a foam material or advantageously attached to a housing cover of the arrangement (not shown).
  • the supply lines 7 are supplied with electromagnetic energy by a feed network device (not shown).
  • the feed lines 7 are located below corresponding coupling slots 3 such that electromagnetic energy is transmitted from the feed lines 7 to the coupling slots 3.
  • the radiator surfaces 2 located above the coupling slots 3 absorb the energy radiated from the coupling slots 3 and are thus brought into resonance with a corresponding arrangement and expansion.
  • the radiator surfaces 2 thus radiate with a specific Goodness this energy again and it can be created by the arrangement of a structure that can be optimized exactly within a frequency band.
  • radiator surfaces 2 are fixedly mounted, for example, in a housing cover (not shown) above the dielectric support 5.
  • the carrier 5 consists of a dielectric substrate, which advantageously consists of an LTCC (Low Temperature Cofired Ceramic) ceramic.
  • This LTCC ceramic is a high frequency suitable glass ceramic, which is manufactured in multi-layer technology. Thus, it is particularly suitable for use in distance and / or speed measurements in the automotive sector by means of radar in the gigahertz range.
  • the ceramic can be produced in several layers with, for example, a layer thickness of about 150 .mu.m and several layers stacked on top of each other, whereby the overall structure can burn together optimally even at relatively low temperatures without a change in geometry with the support plane (xy plane).
  • This glass ceramic shrinks under high pressure only in the direction of the support axis (z-direction). This results in a compact layer system that can be positioned with high accuracy.
  • the arrangement further has a first ground plane 4, which on the surface of the radiator surfaces 2 facing the dielectric carrier 5 is arranged.
  • a coupling slot 3 is advantageously arranged at a certain distance below the radiator surface 2, which is advantageously rectangular.
  • the coupling slots 3 are advantageously formed by etching the first ground plane 4. In addition, they each extend centrally below a radiator surface 2 approximately over its broad side, as shown in FIG.
  • the coupling slots 3 are advantageously arranged such that the upper ground plane 4 is interrupted in each case at a distance of about one quarter of the wavelength of the electromagnetic radiation.
  • An excitation of the coupling slots 3 is provided by electrical supply lines 7, which are arranged according to the invention in each case below a coupling slot 3, wherein a dielectric layer 51 is arranged with a thickness of about 150 microns of the carrier 5 between the coupling slots 3 and the feed lines 7.
  • the supply lines 7 are connected via contact devices 13 to a feed network device 14, ie the high-frequency circuit part of the antenna sensor, for their control.
  • the multi-layer technology allows the leadership of the supply lines 7 for a better insulation in different Levels, thereby largely eliminating unwanted coupling effects.
  • the antenna arrangement according to the invention has a second ground plane 10, which is arranged below the feed lines 7, wherein a plurality of layers 52, 53, 54 of thickness 150 ⁇ m of the dielectric carrier 5 are provided between the feed lines 7 and the second ground plane 10.
  • the arrangement 1 advantageously has continuous or partial plated-through holes 12, which are advantageously arranged for shielding electromagnetic radiation in a specific area, parallel to one another and vertically in the z-direction of the dielectric carrier 5.
  • the installation of partitions is an inexpensive electromagnetic Shielding created because the propagating in undesired directions radiation (xy plane) can not propagate in a harmful direction due to the chambers created by the vias, whereby side lobes are suppressed.
  • the feeding of the antenna arrangement 1 is effected, as already mentioned, by an asymmetrical triplate arrangement.
  • the feed lines 7 are arranged between individual layers, for example the first layer 51 and the second, third and fourth layer 52, 53, 54 of the dielectric carrier 5. Since the components are usually located on the outer sides of the carrier, the supply lines 7 can be attached by contact devices 13 to the corresponding surface of the carrier 5. There is advantageously further worked with a microstrip technology. However, the use of a coplanar technique, as shown in FIG. 5, also lends itself to the support of shielding measures.
  • matching networks and / or distribution networks 14 may also be buried within the carrier 5.
  • the radiator devices 2, the ground planes 4, 10, the feed lines 7, the plated-through holes 12 and the contact devices 13 are made of an electrically highly conductive material, for example gold, silver, copper or aluminum.
  • FIG. 4 shows a cross-sectional view of an antenna arrangement 1 according to a second embodiment of the present invention.
  • the feed network device 14 is arranged on the surface of the carrier 5 facing away from the radiator surfaces 2 and thus opposite to the desired radiation direction.
  • the coupling slots 3 and the feed network device 14 are located on opposite surfaces of the carrier 5.
  • the feed lines 7 are again guided by contact means 13 to the surface on which the feed network device 14 is arranged. As shown in FIG. 4, guidance of the supply lines 7 to the underside of the carrier 5 thus takes place.
  • the antenna arrangement is in turn designed as an asymmetric triplate line in an LTCC ceramic.
  • shielded chambers are again provided for additional shielding.
  • this second exemplary embodiment it is an advantage of this second exemplary embodiment that a surface reduction of the antenna arrangement is created, which however is associated with an increase in the thickness, since an additional layer 55 is required in comparison to the first exemplary embodiment in order to further avoid undesired resonance effects.
  • an increase in thickness of only about 150 microns due to the additional layer 55 achieves a length saving of about 1 to 2 cm, thus providing a much more compact antenna arrangement.
  • Another advantage of this reduced area construction is that the antennas emit in the opposite direction with respect to the components of the feed network device 14 and thus do not interfere with the operation of these.
  • the antenna side as shown in Figure 4 metallized over the entire surface and has only coupling slots 3. There are no other circuit parts on the antenna side and thus a very good shielding is achieved.
  • FIG. 6 shows a graph of the adaptation or return loss of an antenna arrangement according to the first exemplary embodiment of the present invention. At a center frequency of about 24 GHz results in an adjustment of about 20 dB and a bandwidth of about 3 GHz.
  • the present invention provides a compact sensor constructed with little different materials that has high performance in a predetermined frequency range, clean directional characteristics, and good suppression of unwanted radiation in certain directions. Due to the large-scale metallized ground planes on the top and bottom of the carrier in conjunction with the asymmetric triplate arrangement, the majority of the electromagnetic energy is forced to decouple over the coupling slots in the direction of the radiator surfaces. Due to further vias In addition, radiation in the direction of the carrier plane (xy plane) is prevented.
  • substrate technologies such as silicon, gallium arsenide (GaAs), softboard, FR4, multi-layered ceramics, etc. can be used.
  • GaAs gallium arsenide
  • FR4 FR4
  • multi-layered ceramics etc.
  • other layer thicknesses, frequency ranges or materials are conceivable.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Waveguide Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Details Of Aerials (AREA)
EP01995605A 2000-12-20 2001-12-18 Antennenanordnung Expired - Lifetime EP1346441B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10063437A DE10063437A1 (de) 2000-12-20 2000-12-20 Antennenanordnung
DE10063437 2000-12-20
PCT/DE2001/004726 WO2002050952A1 (de) 2000-12-20 2001-12-18 Antennenanordnung

Publications (2)

Publication Number Publication Date
EP1346441A1 EP1346441A1 (de) 2003-09-24
EP1346441B1 true EP1346441B1 (de) 2006-03-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP01995605A Expired - Lifetime EP1346441B1 (de) 2000-12-20 2001-12-18 Antennenanordnung

Country Status (5)

Country Link
US (1) US7012569B2 (ja)
EP (1) EP1346441B1 (ja)
JP (1) JP2004516734A (ja)
DE (2) DE10063437A1 (ja)
WO (1) WO2002050952A1 (ja)

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Also Published As

Publication number Publication date
US20040113840A1 (en) 2004-06-17
DE50109328D1 (de) 2006-05-11
EP1346441A1 (de) 2003-09-24
JP2004516734A (ja) 2004-06-03
WO2002050952A1 (de) 2002-06-27
DE10063437A1 (de) 2002-07-11
US7012569B2 (en) 2006-03-14

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