EP1310012B1 - Highly integrated single substrate mmw multi-beam sensor - Google Patents

Highly integrated single substrate mmw multi-beam sensor Download PDF

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Publication number
EP1310012B1
EP1310012B1 EP01964092A EP01964092A EP1310012B1 EP 1310012 B1 EP1310012 B1 EP 1310012B1 EP 01964092 A EP01964092 A EP 01964092A EP 01964092 A EP01964092 A EP 01964092A EP 1310012 B1 EP1310012 B1 EP 1310012B1
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EP
European Patent Office
Prior art keywords
substrate
sensor according
disposed
antenna
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP01964092A
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German (de)
English (en)
French (fr)
Other versions
EP1310012A2 (en
Inventor
Luis M. Viana
Michael Joseph Delcheccolo
Joseph S. Pleva
Mark E. Russell
Walter Gordon Woodington
H. Barteld Van Rees
Stephen P. Leblanc
Delbert Lippert
Scott H. Schneider
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Raytheon Co
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Raytheon Co
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Publication of EP1310012A2 publication Critical patent/EP1310012A2/en
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Publication of EP1310012B1 publication Critical patent/EP1310012B1/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q9/00—Arrangement or adaptation of signal devices not provided for in one of main groups B60Q1/00 - B60Q7/00, e.g. haptic signalling
    • B60Q9/008—Arrangement or adaptation of signal devices not provided for in one of main groups B60Q1/00 - B60Q7/00, e.g. haptic signalling for anti-collision purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K31/00—Vehicle fittings, acting on a single sub-unit only, for automatically controlling vehicle speed, i.e. preventing speed from exceeding an arbitrarily established velocity or maintaining speed at a particular velocity, as selected by the vehicle operator
    • B60K31/0008—Vehicle fittings, acting on a single sub-unit only, for automatically controlling vehicle speed, i.e. preventing speed from exceeding an arbitrarily established velocity or maintaining speed at a particular velocity, as selected by the vehicle operator including means for detecting potential obstacles in vehicle path
    • G—PHYSICS
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    • G01S13/584—Velocity or trajectory determination systems; Sense-of-movement determination systems using transmission of continuous unmodulated waves, amplitude-, frequency-, or phase-modulated waves and based upon the Doppler effect resulting from movement of targets adapted for simultaneous range and velocity measurements
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    • B60—VEHICLES IN GENERAL
    • B60T—VEHICLE BRAKE CONTROL SYSTEMS OR PARTS THEREOF; BRAKE CONTROL SYSTEMS OR PARTS THEREOF, IN GENERAL; ARRANGEMENT OF BRAKING ELEMENTS ON VEHICLES IN GENERAL; PORTABLE DEVICES FOR PREVENTING UNWANTED MOVEMENT OF VEHICLES; VEHICLE MODIFICATIONS TO FACILITATE COOLING OF BRAKES
    • B60T2201/00—Particular use of vehicle brake systems; Special systems using also the brakes; Special software modules within the brake system controller
    • B60T2201/08—Lane monitoring; Lane Keeping Systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60T—VEHICLE BRAKE CONTROL SYSTEMS OR PARTS THEREOF; BRAKE CONTROL SYSTEMS OR PARTS THEREOF, IN GENERAL; ARRANGEMENT OF BRAKING ELEMENTS ON VEHICLES IN GENERAL; PORTABLE DEVICES FOR PREVENTING UNWANTED MOVEMENT OF VEHICLES; VEHICLE MODIFICATIONS TO FACILITATE COOLING OF BRAKES
    • B60T2201/00—Particular use of vehicle brake systems; Special systems using also the brakes; Special software modules within the brake system controller
    • B60T2201/08—Lane monitoring; Lane Keeping Systems
    • B60T2201/081—Lane monitoring; Lane Keeping Systems using distance control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60T—VEHICLE BRAKE CONTROL SYSTEMS OR PARTS THEREOF; BRAKE CONTROL SYSTEMS OR PARTS THEREOF, IN GENERAL; ARRANGEMENT OF BRAKING ELEMENTS ON VEHICLES IN GENERAL; PORTABLE DEVICES FOR PREVENTING UNWANTED MOVEMENT OF VEHICLES; VEHICLE MODIFICATIONS TO FACILITATE COOLING OF BRAKES
    • B60T2201/00—Particular use of vehicle brake systems; Special systems using also the brakes; Special software modules within the brake system controller
    • B60T2201/08—Lane monitoring; Lane Keeping Systems
    • B60T2201/088—Lane monitoring; Lane Keeping Systems using transmission control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60W—CONJOINT CONTROL OF VEHICLE SUB-UNITS OF DIFFERENT TYPE OR DIFFERENT FUNCTION; CONTROL SYSTEMS SPECIALLY ADAPTED FOR HYBRID VEHICLES; ROAD VEHICLE DRIVE CONTROL SYSTEMS FOR PURPOSES NOT RELATED TO THE CONTROL OF A PARTICULAR SUB-UNIT
    • B60W2530/00—Input parameters relating to vehicle conditions or values, not covered by groups B60W2510/00 or B60W2520/00
    • B60W2530/10—Weight
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60W—CONJOINT CONTROL OF VEHICLE SUB-UNITS OF DIFFERENT TYPE OR DIFFERENT FUNCTION; CONTROL SYSTEMS SPECIALLY ADAPTED FOR HYBRID VEHICLES; ROAD VEHICLE DRIVE CONTROL SYSTEMS FOR PURPOSES NOT RELATED TO THE CONTROL OF A PARTICULAR SUB-UNIT
    • B60W2554/00—Input parameters relating to objects
    • B60W2554/40—Dynamic objects, e.g. animals, windblown objects
    • B60W2554/404—Characteristics
    • B60W2554/4043—Lateral speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60W—CONJOINT CONTROL OF VEHICLE SUB-UNITS OF DIFFERENT TYPE OR DIFFERENT FUNCTION; CONTROL SYSTEMS SPECIALLY ADAPTED FOR HYBRID VEHICLES; ROAD VEHICLE DRIVE CONTROL SYSTEMS FOR PURPOSES NOT RELATED TO THE CONTROL OF A PARTICULAR SUB-UNIT
    • B60W2554/00—Input parameters relating to objects
    • B60W2554/80—Spatial relation or speed relative to objects
    • B60W2554/803—Relative lateral speed
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/66—Radar-tracking systems; Analogous systems
    • G01S13/72—Radar-tracking systems; Analogous systems for two-dimensional tracking, e.g. combination of angle and range tracking, track-while-scan radar
    • G01S13/723—Radar-tracking systems; Analogous systems for two-dimensional tracking, e.g. combination of angle and range tracking, track-while-scan radar by using numerical data
    • G01S13/726—Multiple target tracking
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/02—Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems
    • G01S2013/0236—Special technical features
    • G01S2013/0245—Radar with phased array antenna
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/88—Radar or analogous systems specially adapted for specific applications
    • G01S13/93—Radar or analogous systems specially adapted for specific applications for anti-collision purposes
    • G01S13/931—Radar or analogous systems specially adapted for specific applications for anti-collision purposes of land vehicles
    • G01S2013/9315—Monitoring blind spots
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/88—Radar or analogous systems specially adapted for specific applications
    • G01S13/93—Radar or analogous systems specially adapted for specific applications for anti-collision purposes
    • G01S13/931—Radar or analogous systems specially adapted for specific applications for anti-collision purposes of land vehicles
    • G01S2013/9321—Velocity regulation, e.g. cruise control
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/88—Radar or analogous systems specially adapted for specific applications
    • G01S13/93—Radar or analogous systems specially adapted for specific applications for anti-collision purposes
    • G01S13/931—Radar or analogous systems specially adapted for specific applications for anti-collision purposes of land vehicles
    • G01S2013/9327—Sensor installation details
    • G01S2013/93271—Sensor installation details in the front of the vehicles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/88—Radar or analogous systems specially adapted for specific applications
    • G01S13/93—Radar or analogous systems specially adapted for specific applications for anti-collision purposes
    • G01S13/931—Radar or analogous systems specially adapted for specific applications for anti-collision purposes of land vehicles
    • G01S2013/9327—Sensor installation details
    • G01S2013/93272—Sensor installation details in the back of the vehicles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/88—Radar or analogous systems specially adapted for specific applications
    • G01S13/93—Radar or analogous systems specially adapted for specific applications for anti-collision purposes
    • G01S13/931—Radar or analogous systems specially adapted for specific applications for anti-collision purposes of land vehicles
    • G01S2013/9327—Sensor installation details
    • G01S2013/93274—Sensor installation details on the side of the vehicles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/88—Radar or analogous systems specially adapted for specific applications
    • G01S13/93—Radar or analogous systems specially adapted for specific applications for anti-collision purposes
    • G01S13/931—Radar or analogous systems specially adapted for specific applications for anti-collision purposes of land vehicles
    • G01S2013/9327—Sensor installation details
    • G01S2013/93275—Sensor installation details in the bumper area
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
    • G01S7/038—Feedthrough nulling circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/28—Details of pulse systems
    • G01S7/285—Receivers
    • G01S7/288—Coherent receivers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/35—Details of non-pulse systems
    • G01S7/352—Receivers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/35—Details of non-pulse systems
    • G01S7/352—Receivers
    • G01S7/356—Receivers involving particularities of FFT processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/40—Means for monitoring or calibrating
    • G01S7/4004—Means for monitoring or calibrating of parts of a radar system
    • G01S7/4008—Means for monitoring or calibrating of parts of a radar system of transmitters

Definitions

  • This invention relates to a radar sensor of the kind defined by the preamble to claim 1 hereinafter.
  • EP 0 978 729 A describes a radar sensor of the kind defined by the preamble to claim 1 hereinafter.
  • a metal pattern on a first dielectric substrate forms an antenna.
  • the first substrate is mounted on metal base plate and has a dielectric cover through which the antenna radiates.
  • transceiver components including a MMIC, are mounted on or in a second dielectric substrate also mounted on the base plate.
  • a metal cover seals the space containing the second substrate and the transceiver components to the base plate.
  • Signal processing components coupled to the transceiver are mounted on a third substrate, and a further metal cover encloses these components and the sealed transceiver within a compartment formed by the further metal cover and the base plate.
  • a radar sensor of the kind defined by the preamble to claim 1 is characterised in that components of the said RF circuits are disposed on a said surface of the first substrate; a second dielectric substrate is disposed in the recess region above the first substrate and has a pair of opposing surfaces; the or each of the said IF components is disposed on one of the said surfaces of the second substrate; and the EMI shield is disposed over the first and second substrates to reduce EM radiation from the sensor.
  • a preferred embodiment of the present invention takes the form of a millimeter wave (MMW) radar system on a single low temperature ceramic substrate provided from a plurality of Low Temperature Co-fired Ceramic (LTCC) circuit layers.
  • the single LTCC substrate has a top antenna cover or radome layer disposed over an antenna element or radiator layer.
  • the cover or radome layer is used to tune the radiating elements on subsequent radiator layers.
  • MMW transmitter and receiver circuit components are disposed on a second or bottom surface of the single LTCC substrate.
  • Transmitter and receiver circuitry is integrated within the layers of the LTCC substrate to couple the antenna to the transmitter and receiver components.
  • the antenna is provided from an array of radiating antenna elements embedded in the LTCC substrate with array feed and beamforming circuitry embedded and integrated throughout the different layers of the LTCC substrate.
  • Transmitter circuit components including but not limited to a voltage controlled oscillator (VCO) and a power amplifier as well as receiver circuit components including but not limited to a low noise amplifier (LNA), a mixer and a video amplifier are disposed on the bottom surface of the LTCC substrate.
  • the transmitter and receiver circuit components are coupled to transmit and receive antennas as well as other transmit and receive circuitry through via connections provided in the LTCC substrate. In this manner, a highly integrated, single substrate MMW radar system is provided.
  • DSP Digital signal processing
  • PWB printed wiring board
  • the LTCC substrate comprising the antenna and MMW transmit and receive circuits is disposed in a housing.
  • the LTCC substrate is disposed in the housing over a first support structure which spaces the antenna aperture a predetermined distance from a first or internal surface of the housing.
  • the PWB is also disposed in the housing over a second support structure.
  • the second structure spaces a surface of the PWB a predetermined distance from the second surface of the LTCC substrate.
  • the LTCC substrate and the PWB are disposed in a single common housing.
  • a flex circuit couples the circuit components disposed on the LTCC substrate to the circuit components disposed on the PWB.
  • the radar is provided as an integrated structure having a relatively connector-less interface.
  • the housing is provided having a single connector through which RF, DC and logic signals are provided. Furthermore, an EMI shield is disposed in the housing to reduce the amount of radiation emitted through the housing from locations other than the antenna aperture. While the integrated single substrate MMW radar of the present invention is particularly well-suited for automotive radar systems, especially active electronically scanned antenna automotive radar systems, it is understood that the radar may also be used in other radar system applications.
  • first and second radar systems 10 are mounted behind portions of vehicle body 12.
  • the vehicle body 12 corresponds to an automobile bumper 16 portion of a vehicle.
  • radar system 10 can be mounted behind any portion of a vehicle provided that an appropriate amount of space exists or can be made to accommodate the radar system 10.
  • Radar system 10 can be provided as a highly integrated millimeter wave (MMW) multibeam sensor and thus can be mounted at various locations on a vehicle and is not limited to mounting in association with the bumper 12, as will be described below. Specific techniques for mounting a highly integrated millimeter wave (MMW) multibeam sensor behind a vehicle bumper, fascia, or other vehicle portion are described in U.S. Patent Application entitled System and Technique for Mounting a Radar System on a Vehicle, filed on August 16, 2001, and assigned Application No. 09/930,868, assigned to the assignee of the present invention.
  • MMW millimeter wave
  • the radar systems 10 may be provided, for example, as the types described in U.S. Patent Application entitled Radar Transmitter Circuitry and Techniques, filed on August 36, 2001, and assigned Application No. 09/931,636, and U.S. Patent Application entitled Switched Beam Antenna Architecture, filed on August 16,2001, and assigned Application No. 09/932,574, each of which are assigned to the assignee of the present invention. It should be appreciated of course that other radar systems can be used in accordance with the present invention.
  • the radar systems 10 are each mounted behind a vehicle section 12 provided from a material which allows radar signal energy to pass therethrough with relatively little, or ideally no, attenuation.
  • the radar system 10 can be coupled to the vehicle body 12 via a mounting bracket 14 or can be coupled directly to the body of the vehicle.
  • a protective barrier section 16 is disposed between an inner wall 18 of the vehicle section 12 and a surface 10a of the sensor 10. The protective barrier section 16 provides additional protection for the sensor 10.
  • the sensor 10 includes a housing 20 having a portion thereof removed to reveal a single Low Temperature Co-fired Ceramic (LTCC) substrate 40 having a first or top surface 40a on which a plurality of antenna elements 42 are disposed.
  • LTCC Low Temperature Co-fired Ceramic
  • a preferred antenna array and antenna element for use in automotive radar applications is described in co-pending U.S. Patent Application entitled “Slot Antenna Element for an Array Antenna" filed August 16, 2001 and assigned Application No. 09/931,633, assigned to the assignee of the present invention and the aforementioned co-pending U.S. Patent Application entitled “Switched Beam Antenna Architecture".
  • the substrate 40 is provided from Ferro's A6-M LTCC tape.
  • the tape is provided having a thickness of about 0.010 inch pre-fired and about 0.0074 inch post-fired and a relative dielectric constant of about 5.9.
  • the LTCC tape has a loss characteristic at 24 GHz of 1.1 dB per inch for a 0.0148 inch ground plane spacing.
  • the tape layers can be provided from Ferro's A6-S tape.
  • the single substrate 40 is provided from LTCC for a variety of reasons including but not limited to its potential for low cost in high volume production. Furthermore, LTCC allows compact circuit design and is compatible technology at this frequency for multi-layer circuits with large quantities of reliable, embedded vias (approximately 1200 vias in one particular embodiment). Surface-mount devices can also be integrated with LTCC as will be described below in conjunction with Figs. 4, 5 and 7 below.
  • an array antenna 50 having a length L and a width W includes a transmit array 52 and a receive array 54.
  • Each of the arrays 52, 54 includes eight rows 56a - 56g and six columns 58a - 58f.
  • each of the transmit and receive arrays 52, 54 have forty-eight radiating elements (or more simply “radiators” or “elements"), generally denoted 60, with eight elements in azimuth and six elements in elevation.
  • the array antenna 50 may be provided, for example, on the surface 40a (Fig. 2) in the LTCC substrate 40 (Fig. 2).
  • each radiating element 60 is a stripline-fed open-ended cavity in LTCC.
  • the cavity is formed in the LTCC 40 (Fig. 2) using embedded vias, generally denoted 62, that create the "cavity walls.”
  • Each of the arrays 52, 54 have a rectangular lattice spacing: 0.223" (azimuth) x 0.295" (elevation).
  • the azimuth spacing is selected to be compatible with a Butler matrix feed circuit selected to yield desired beam locations which provided desired detection zones.
  • the elevation spacing is selected to achieve a desired elevation beamwidth and the maximum spacing needed to avoid a cover induced scan blindness.
  • the antenna 50 is enclosed in the housing 20 (Fig. 2) and radiates through the housing cover 20a (Fig. 2).
  • the cover 20a is incorporated into the radiator design while in other embodiments the cover is spaced from the antenna aperture by a distance corresponding to one-half wavelength.
  • a highly integrated MMW multi-beam sensor system 70 includes a housing 72 having a pair of mounting ears 74a, 74b and a connector 76 projecting therefrom. RF, DC and logic signals are provided to and from the sensor 70 via the connector 76.
  • the housing 72 is provided having a length L typically of about 120 mm, a width W typically of about 66mm, and a height H typically of about 32 mm and all signals provided to and from the sensor 70 are provided through the connector 76 to a car area network (CAN) controller as will be described below in conjunction with Fig. 6.
  • CAN car area network
  • the housing 72 includes a base portion 72a and a cover portion 72b.
  • the base portion 72a is provided having integral sides to thus provide a recess region 73 within the base 72a.
  • the base 72a may be provided using injection molding techniques of any other technique well known to those of ordinary skill in the art of providing structurally sound, compact and lightweight structures.
  • the base 72a side walls have a support structure 84 projecting therefrom.
  • the support structure 84 corresponds to a shoulder region 84 of the base 72a.
  • a second support structure here provided from a plurality of posts 90.
  • the posts 90 project from a bottom surface of the base 72a.
  • An LTCC substrate 80 having first and second opposing surfaces 80a, 80b (80b not visible in Fig. 4) is disposed in the recess region 73 of the base 72a.
  • An antenna which may be provided for example as the type described above in conjunction with Fig. 3 is disposed on surface 80b.
  • the antenna on the substrate 80 is thus disposed to transmit and receive signals through the bottom surface of base 72a.
  • the LTCC substrate 80 is disposed is the recess region 73 and supported on the shoulder portion 84 provided in the base 72a.
  • the shoulder region 84 is provided to support the substrate 80 and space the aperture of the antenna provided on the LTCC substrate 80 a predetermined distance from a surface of the housing portion 72a as will be described in more detail below in conjunction with Fig. 5.
  • a printed circuit board (PCB) 86 having first and second opposing surfaces 86a, 86b is also disposed in the recess region 73 of the housing 72.
  • PCB 86 is adapted to have circuit components 88 including but not limited to surface mounting circuit components disposed on the opposing surfaces 86a, 86b.
  • the circuit components 88 may be provided as inductors, power supplies and digital circuit components and subsystems.
  • the PWB 86 is also disposed in the recess region 73 and is supported by spacers 90.
  • the spacers 90 are selected to space a first surface of the PWB 86 a predetermined distance from the surface 80a of the LTCC substrate 80.
  • the particular distance by which PWB 86 is spaced from LTCC substrate 80 is selected such that the circuit components disposed on the surface 80a of substrate 80 do not interfere with either circuit components 88 disposed on the surface 86b of PWB 86 or with the surface 86b itself.
  • An EMI shield 92 is disposed over the PWB 86 and provides a barrier which prevents leakage of substantially all radiation from the LTCC substrate 80 and the circuits provided therewith as well as PWB 86 and the circuits provided therewith.
  • the shield 92 also provides a level of immunity from radiated emissions coming from outside the sensor 70.
  • the cover 72a is provided having a thickness selected to allow attachment to the base 72 via a vibrational technique.
  • the FMCW radar transmits a signal 102 having a frequency which changes in a predetermined manner over time.
  • the transmit signal 102 is generally provided by feeding a VCO control or ramp signal 104 to a voltage controlled oscillator (VCO) 106.
  • VCO voltage controlled oscillator
  • the VCO 106 In response to the ramp signal 104, the VCO 106 generates a chirp signal 108.
  • a measure of transmit time of the RF signal can be determined by comparing the frequency of a received or return signal 110 with the frequency of a sample 112 of the transmit signal.
  • the range determination is thus provided by measuring the beat frequency between the frequencies of the sample 112 of the transmit signal and the return signal 110, with the beat frequency being equal to the slope of the ramp signal 104 multiplied by the time delay of the return signal 110.
  • the measured frequency further contains the Doppler frequency due to the relative velocity between the target and the radar system.
  • a CW tone is generated after the chirp so that the return signal from it differs solely by the Doppler frequency.
  • the VCO control signal 104 is generated with digital circuitry and techniques.
  • the ramp signal 104 is generated by a DSP 114 and a digital-to-analog converter (DAC) 116.
  • DAC digital-to-analog converter
  • Use of the DSP 114 and DAC 116 to generate the ramp signal 104 is possible in the SOD system of Fig. 6 since, it has been determined that by proper selection of the detection zone characteristics including but not limited to detection zone size, shape and resolution, precise linearity of the chirp signal 108 is not necessary. With this arrangement, the frequency of the transmit signal 102 is accurately and easily controllable which facilitates implementation of several features.
  • one or more characteristics of successive ramps in the ramp signal 104 are randomly varied in order to reduce interference between similar, proximate radar systems.
  • temperature compensation is implemented by appropriately adjusting the ramp signal 104.
  • compensation for non-linearity in the VCO operation is another example.
  • changes to the SOD system which would otherwise require hardware changes or adjustments can be made easily, simply by downloading software to the DSP 114.
  • the frequency band of operation of the SOD system can be readily varied, as may be desirable when the SOD is used in different countries with different operating frequency requirements.
  • An electronics portion 120 of the SOD system includes the DSP 114, a power supply 122 and a connector 124 through which signal buses are coupled between the SOD system and a vehicle on which the SOD system is disposed.
  • a digital interface unit is provided in the form of a controller area network (CAN) transceiver (XCVR) 126 which is coupled to the DSP 114 via a CAN microcontroller 128.
  • the CAN controller 128 has a system clock 130 coupled thereto to provide frequency stability. In one embodiment, the system clock is provided as a crystal controlled oscillator.
  • An analog-to-digital (A/D) converter 132 receives the output of a video amplifier 134 and converts the signal to digital form for coupling to the DSP 114 for detection processing.
  • the A/D converter 132 is provided as a twelve bit A/D converter. Those of ordinary skill in the art will appreciate, however, that any A/D converter having sufficient resolution for the particular application may be used.
  • a signal bus 136 is coupled to antenna switch circuits 140, 142 in order to provide control signals to drive the switches which comprise the switch circuits.
  • Also provided in the electronics portion 120 of the SOD system is a memory in which software instructions, or code and data are stored. In the illustrative embodiment of Fig. 6, the memory is provided as a flash memory.
  • the DSP provides output signals, or words to the DAC which converts the DSP output words into respective analog signals.
  • An analog smoothing circuit 144 is coupled to the output of the DAC in order to smooth the stepped DAC output to provide the ramp control signal to the VCO.
  • the DSP includes a memory device 146 in which is stored a look-up table containing a set of DSP output signals, or words in association with the frequency of the transmit signal generated by the respective DSP output signal.
  • the VCO 106 receives ramp signal 104 from the analog smoothing circuit 144.
  • the VCO operates in the transmit frequency range of between 24.01 to 24.24 GHz and provides an output signal to bandpass filter 148, as shown.
  • the output of the VCO 106 is filtered by the bandpass filter 148 and amplified by an amplifier 150.
  • a portion of the output signal from amplifier 150 is coupled via coupler 152 to provide the transmit signal 102 to a transmit antenna 154.
  • Another portion of the output signal from the amplifier 150 corresponds to a local oscillator (LO) signal fed to an LO input port of a mixer 156 in the receive signal path.
  • LO local oscillator
  • the switch circuits 140, 142 are coupled to the receive and transmit antennas 154, 158 through a Butler matrix (not shown in Fig. 6).
  • the antennas 154, 158 and switch circuits 140, 142, and Butler matrix can be of the type described in the above-referenced patent applications entitled Slot Antenna Element for an Array Antenna and Switched Beam Antenna Architecture. Suffice it here to say that the switch circuits and Butler matrix operate to provide the antenna having a switched antenna beam with antenna beam characteristics which enhance the ability of the SOD system to detect targets.
  • the received signal 110 is processed by an RF low noise amplifier (LNA) 160, a bandpass filter 162, and another LNA 164, as shown.
  • LNA low noise amplifier
  • the output signal of the RF amplifier 164 is down-converted by mixer 156 which receives the local oscillator signal coupled from the transmitter, as shown.
  • Illustrative frequencies for the RF signals from the amplifier 164 and the local oscillator signal are on the order of 24 GHz.
  • the illustrated receiver is a direct conversion, homodyne receiver, other receiver topologies may be used in the SOD radar system.
  • the video amplifier 134 amplifies and filters the down-converted signals which, in the illustrative embodiment have a frequency between 1 KHz and 40 KHz.
  • the video amplifier may incorporate features, including temperature compensation, filtering of leakage signals, and sensitivity control based on frequency.
  • the A/D converter 132 converts the analog output of the video amplifier 134 into digital signal samples for further processing.
  • the digital signal samples are processed by a fast Fourier transform (FFT) within the DSP in order to determine the content of the return signal within various frequency ranges (i.e., frequency bins).
  • FFT fast Fourier transform
  • the FFT outputs serve as data for the rest of the signal processor 262 in which one or more algorithms are implemented to detect objects within the field of view.
  • the radar system includes a temperature compensation feature with which temperature induced variations in the frequency of the transmit signal are compensated by adjusting the ramp signal accordingly.
  • the transmitter 100 includes a DRO 166 coupled to a microwave signal detector 168.
  • the output of the microwave detector is coupled to an analog-to-digital converter of the CAN controller 128 for processing by the DSP 114.
  • the apertures of the transmit and receive antenna array 154, 158 form surface 80b of the LTCC substrate 80.
  • the RF circuit components which provide the RF transmitter and receiver components denoted 170 are all included either within or on the LTCC substrate 80.
  • filter 148, coupler 152 and various printed circuit transmission lines provided within the layers of the substrate 80 as will be described below in conjunction with Fig. 7.
  • VCO 106 is provided as a surface mount component disposed on a surface of the substrate 80.
  • amplifiers 150, 160, 164 and mixer 156 may all be provided as monolithic microwave integrated circuits (MMICs) and disposed on a surface of the substrate 80.
  • MMICs monolithic microwave integrated circuits
  • those components which comprise electronics portion 120 are disposed on the PWB 86.
  • DSP 114, DAC 116, power supply 122, LAN XCVR and controller 126, 128 and AD 132 are all disposed on first or second surfaces 86a, 86b of the PWB 86. In this manner, the sensor 70 is provided as an entire radar system in a compact package.
  • a radiating element 200 and associated feed circuits are provided from twelve 0.0074" tape LTCC layers 202 - 222 with a (stripline) ground plane spacing of 0.0148.”
  • the radiating element 200 itself is provided from layers 210 - 222 as shown. It should be noted that cover layers 218-222 are integral to the element 200. Layer 216 has a ground plane 224 disposed thereon. Portions of the ground plane are removed to form an aperture 226.
  • a power divider circuit 228 is coupled through conductive vias 230a, 230b to a conductive trace 232 and a strip line feed circuit 234, respectively.
  • an elevation feed circuit is interlaced with the element 200.
  • Capacitive windows 240 are formed on layers 214, 216 via by disposing ground planes material on the layers 214, 216 and providing openings in the ground planes.
  • Layers 202, 204 and 208 are also provided having ground planes 242 disposed thereon.
  • Layers 202 - 208 are dedicated to a Butler Matrix circuit while layers 210 - 216 are dedicated to the radiator and feed circuit.
  • a plurality of embedded vias 235 in the LTCC are used for forming the waveguide structure of the radiator in the LTCC while vias 230a, 230b are used for transitioning between the circuits on the different layers.
  • the embedded vias 235 form a waveguide structure and share the same layers as the power divider circuit 228 and the radiator feed circuit 234.
  • the LTCC manufacturing flow comprises eight generic operations which are defined as: tape blanking, via formation, via filling, conductor deposition, lamination, wafer firing, continuity test, and dicing. The following is a brief description of each of the eight core work centers.
  • Raw LTCC is supplied in tape form on spools having a standard width of either 7" or 10". Typical tape area per roll ranges from 4200 to 6000 sq. in. and is also predetermined at time of order.
  • the blanking of LTCC tape is performed manually with the use of an arbor blanking die. Tape is blanked to either a 5" or a 7" manufacturing format size.
  • An orientation hole is also introduced during the blanking operation which references the LTCC tape's as-cast machine and transverse directions. This orientation hole will ultimately allow for layers to be identified and cross-plied in order to optimize total product shrinkage at firing.
  • the creation of Z-axis via holes is performed through the use of a high speed rapid punch system.
  • the system is driven by punch CAD/CAM data which is electronically down loaded via Ethernet directly to the manufacturing work cell.
  • the supplied punch files contain X- Y-coordinate locations for via formation.
  • Individual tape layers, in either a 5" or 7" format, are mounted into single layer tape holders/frames. These framed layers are subsequently loaded into a handling cassette which can house a maximum of 25 LTCC tape layers.
  • the cassette is loaded and is handled automatically at the work center when respective punch programs are activated.
  • the high speed punch processes via holes in tape layers individually and ultimately indexes through the entire cassette. Via holes are formed at typical rates of 8 to 10 holes per second.
  • the cassette is unloaded from the work center, processed tape layers removed, and the cassette is reloaded for continued processing.
  • LTCC tape layers which have completed respective via formation operations require the insertion of Z-axis conductors in order to ultimately establish electrical interface with upper and lower product layers.
  • the via filling operation requires the use of positive pressure displacement techniques to force conductive pastes into via formed holes in the dielectric tape.
  • Mirror image stencils are manufactured for respective tape layers which feature all punched via hole locations; these stencils are fixtured on a screen printing work cell.
  • LTCC tape layers are soft fixtured onto a porous vacuum stone. The stone is indexed under the stencil where a preset pressure head travels over the stencil forcing deposited conductor paste through the stencil and into the dielectric tape.
  • Each tape layer is processed in a similar fashion; all layers are dried, driving off solvents, prior to follow on operations.
  • Via filled dielectric tape layers require further processing to establish X- and Y-axis conductor paths.
  • the deposition of these conductor mediums provides "from-to" paths on any one LTCC layer surface and originate from and terminate at filled via locations.
  • the conductor deposition operation employs the same work center as described in the via filling operation with the exception that wire mesh, emulsion patterned screens are substituted for through hole stencils.
  • the technique for fixturing both the screen and the tape product is also the same. All product layers are serially processed in this fashion until deposition is complete; again, all layers are dried prior to follow on operations.
  • the lamination operation requires the collation and marriage of parallel processed layers into series of independent wafers. Individual layers, (layers 1,2,3,...n), are sequentially placed upon a lamination caul plate; registration is maintained through common tooling which resides in all product layers.
  • the collated wafer stack is vacuum packaged and placed in an isostatic work cell which provides time, temperature, and pressure to yield a leathery wafer structure.
  • Laminated wafers are placed on firing setters and are loaded onto a belt furnace for product densification. Firing is performed in a single work cell which performs two independent tasks. The primary operation calls for the burning off of solvents and binders which had allowed the tape to remain pliable during the via formation, filling, conductor deposition, and lamination operations. This binder burnout occurs in the 350 - 450C range. The wafer continues to travel down the belt furnace and enters the peak firing zone where crystallization, and product densification occurs; temperatures ranging to 850-860C are typical. Upon cool down the wafers exit the furnace as a homogenous structure exhibiting as-fired conditions. All product firing occurs in an air environment. Post firing operations would not require wafers to be processed through an additional binder burnout steps but would only require exposure to the 850C densification temperatures.
  • Net list data files are Ethernet down loaded to the net probe work center and are exercised against respective wafer designs. Opens and shorts testing of embedded nets, and capacitance and resistive load material measurements defines the bulk work center output. Failures are root caused to specific net paths.
  • Net list tested wafers typically exhibit individual circuit step/repeat patterns which can range from one to fifty or more on any one particular wafer.
  • Conventional diamond saw dicing techniques are employed to singulate and dice circuits out of the net list tested wafers. Common fixturing is in place to handle both 5" and 7" fired wafer formats.
  • a vehicle 250 here shown as an automobile, has a pair of radar displays 252, 254 , for example lights or LEDs, mounted to a surface of a rear window 256 of the automobile 250.
  • the displays 252, 254 are disposed on an inner surface of the rear window 256.
  • the radar displays are coupled to portable radar sensors 258, 260.
  • the radar displays 252, 254 are coupled to sensors 258, 260 via respective ones of wires 262, 264. In other embodiments, however, a wireless connection can be used between the displays 252, 254 and sensors 258, 260.
  • the radar sensors 258, 260 may be provided, for example, as the types described above in conjunction with Figs. 1-7 and/or as described in co-pending U.S. Patent Application No. 09/931,636, filed August 16,2001, and entitled Portable Object Detection System.
  • the radar sensors 258, 260 are each portably mounted to the interior surface of the side windows 266, 268.
  • the radar sensors 258, 260 can be mounted to window brackets or can be mounted directly on the windows 266, 268.
  • Wires 270, 272 couple respective ones of the radar sensors 258, 260 to a power source (not shown) such as a car battery or other power source provided as part of the vehicle 250.
  • a power source such as a car battery or other power source provided as part of the vehicle 250.
  • alternative power sources such as rechargeable or non-rechargeable batteries, can also be used to provide power to the sensor.
  • the senor In operation, if one of sensors 258, 260 detects an object within its detection zone, the sensor causes the corresponding display 252, 254 to provide an indication that a sensor has detected an object in its detection zone.
  • An operator of the vehicle 250 receives the indication, via a conventional rear view mirror 274 in which the operator can see radar displays 252, 254. In this manner, the detection system alerts the operator of the vehicle to the presence of the object within the detection zone associated with each radar sensor 258, 260.
  • the sensors 258, 260 can provide an audible indication of a detected object with an audible alert device.
  • the audible indication can be provided by an audible alert device within the radar displays 252, 254, or the radar sensors 258, 260 or with a separate audible alert device.
  • radar systems and two displays are here shown and described, it should be appreciated that fewer or more than two radar systems and displays can also be used.
  • the particular number of radar systems and displays to use in any particular application is selected in accordance with a variety of factors including but not limited to the size and shape of the vehicle, the number of blind spots on the vehicle and the location of vehicle blind spots.
  • two or more radar systems may be mutually coupled to one radar display.
  • one, two, or more displays can be coupled to a single radar sensor.
  • the illustrative embodiment shows the radar system disposed internal to the vehicle 250, on the interior surface or the side windows, the radar system could also be disposed external to the vehicle, for example on the exterior surface of the side windows.
  • the portable sensor 258 is shown to include a housing 270 having first and second opposing surfaces 270a, 270b.
  • An antenna system (not visible in Fig. 9) radiates RF energy through the first surface 270a of the housing 270.
  • Disposed in the housing 270 are one or more radiating sensor elements provided as part of a highly integrated millimeter wave (MMW) substrate.
  • MMW millimeter wave
  • the LED 252 is coupled to the sensor 258 via an electrical connection 262.
  • the RF energy 282 radiates through the face 270a to detect objects.
  • the sensor 258 can be mounted to a vehicle via a variety of techniques. As explained above in conjunction with Figs. 1 and 1A, for example, the sensor can be mounted internally to or behind to a portion of the vehicle (e.g. including but not limited to under the vehicle body or skin or shell or cover or behind a vehicle bumper, side panel and vehicle fascia). Also, the sensor can be mounted externally to the vehicle. As shown in Fig. 9, for example, a clip 284 couples the sensor 258 to an inner surface 286a of an vehicle window 286. In alternate embodiment, the sensor 258 may be coupled to outer window surface 286b.
  • the sensor 258 may be, for example, coupled with a hook and loop fastener system generally denoted 288.
  • the illustrative clip 284 is placed over a top edge of the window 286 of the vehicle and the radar sensor 258 is attached to the clip 284 with hook and loop fasteners 288. In this manner, sensor 258 is removably coupled and thus portably mounted to the vehicle.
  • An illustrative sensor 258 is provided having a length L of 12.7 cm, a width W of 7.6 cm and a thickness T of 3.8 cm where the thickness corresponds to the distance between the two surfaces 272a, 272b. It will be recognized by one of ordinary skill in the art that sensor systems with other dimensions can also be used. It will be further recognized that other external mounting structures and techniques in addition to the clip 284 are possible.
  • the senor 258 can be mounted to any window or to any interior or exterior surface of the vehicle, so long as the radiating face 272a is not placed behind a surface through which radar energy cannot propagate effectively. Furthermore, it should be understood that it is necessary to orient the sensor 258 in a particular direction to provide a preferred detection zone about the vehicle.

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  • Engineering & Computer Science (AREA)
  • Remote Sensing (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • Combustion & Propulsion (AREA)
  • Transportation (AREA)
  • Computer Security & Cryptography (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
EP01964092A 2000-08-16 2001-08-16 Highly integrated single substrate mmw multi-beam sensor Expired - Lifetime EP1310012B1 (en)

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US22616000P 2000-08-16 2000-08-16
US226160P 2000-08-16
PCT/US2001/025677 WO2002015323A2 (en) 2000-08-16 2001-08-16 Highly integrated single substrate mmw multi-beam sensor

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DE60119335T2 (de) 2007-04-12
WO2002015323A2 (en) 2002-02-21
DE60119335D1 (de) 2006-06-08
KR100831507B1 (ko) 2008-05-22
WO2002015323A3 (en) 2002-06-13
JP2004506912A (ja) 2004-03-04
KR20030036704A (ko) 2003-05-09
AU2001284984A1 (en) 2002-02-25
EP1310012A2 (en) 2003-05-14
US6501415B1 (en) 2002-12-31
WO2002015323A9 (en) 2003-03-27

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