EP1308242B1 - Bearbeitung von inhomogenen Materialien - Google Patents
Bearbeitung von inhomogenen Materialien Download PDFInfo
- Publication number
- EP1308242B1 EP1308242B1 EP02023996A EP02023996A EP1308242B1 EP 1308242 B1 EP1308242 B1 EP 1308242B1 EP 02023996 A EP02023996 A EP 02023996A EP 02023996 A EP02023996 A EP 02023996A EP 1308242 B1 EP1308242 B1 EP 1308242B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- temperature
- components
- different
- processing
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/015—Temperature control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
Definitions
- the invention relates to a method for processing, in particular for Polishing the surface of at least two components Material.
- a typical example of a two-component material represents the glass ceramic Zerodur®, which is a crystal phase with a negative Coefficient of thermal expansion and a glass phase with a positive Has coefficient of thermal expansion. Both phases also point different removal properties.
- the Surface during the polishing process at a defined Machining temperature polished to a minimum polishing roughness.
- the Polishing roughness results largely from the different Removal properties of the two components.
- Application temperature of the material from the processing temperature deviates, it can be in addition to the polishing roughness due to the different coefficients of thermal expansion still lead to an increase the roughness due to different expansion of the two Components come, so the quality of the surface of the material is not more meets the requirements.
- the task is solved with a processing method, in particular for polishing the surface of at least two components material with at least one polishing pad and one Suspension at a predefinable processing temperature at which the Components due to different coefficients of thermal expansion a different state of expansion and due to different Removal properties have different removal rates, the Processing temperature is chosen so that the different removal of the Components because of their different expansion each other is compensated for that the roughness of the surface of the machined Material at the application temperature is minimal.
- the at least two components In the case of another material, it is also possible for the at least two components to have different coefficients of thermal expansion with the same removal properties.
- the object is achieved with a method at a predeterminable processing temperature and a known application temperature, the processing temperature being selected to be the same as the application temperature.
- the temperature of the polishing disc conveniently also measured the suspension.
- the processing temperature which in an advantageous embodiment of the suspension and / or Polishing wheel can be adjusted, checked and if necessary be adjusted.
- the figure shows schematically the surface 3 to be machined during processing at a processing temperature and after processing at the previously known application temperature.
- the processing temperature became lower than the application temperature selected.
- the glass phase 2 has one compared to the ceramic phase 1 greater removal and a positive coefficient of thermal expansion.
- the Ceramic phase has a negative coefficient of thermal expansion.
- the temperature rises to the final one Application temperature so that the glass phase 2 with a positive Thermal expansion coefficient corresponding to the expansion path 8 expands and the ceramic phase 1, which is a negative Has coefficient of thermal expansion, corresponding to the shrink path 6 contracts up to surface 7 of the ceramic phase.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Surface Treatment Of Glass (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Glass Compositions (AREA)
- Coating By Spraying Or Casting (AREA)
Description
Hierbei wird die Aufgabe mit einem Verfahren bei einer vorgebbaren Bearbeitungstemperatur und einer bekannten Anwendungstemperatur gelöst, wobei die Bearbeitungstemperatur gleich der Anwendungstemperatur gewählt wird.
- 1
- Keramikphase
- 2
- Glasphase
- 3
- Oberfläche bei Bearbeitungstemperatur
- 4
- Vertiefung Glasphase bei Bearbeitungstemperatur
- 5
- Erhöhung Keramikphase bei Bearbeitungstemperatur
- 6
- Schrumpfweg Keramikphase nach Bearbeitungstemperatur bei Anwendungstemperatur
- 7
- Oberfläche Keramikphase bei Anwendungstemperatur
- 8
- Ausdehnungsweg Glasphase nach Bearbeitungstemperatur bei Anwendungstemperatur
- 9
- Oberfläche Glasphase bei Anwendungstemperatur
Claims (6)
- Verfahren zum Polieren der Oberfläche eines mindestens zwei Komponenten aufweisenden Materials, wobei jede Komponente in Verbindung mit der zu bearbeitenden Oberfläche steht, mit mindestens einer Polierscheibe und einer Suspension bei einer vorgebbaren Bearbeitungstemperatur, bei der die Komponenten aufgrund unterschiedlicher Wärmeausdehnungskoeffizienten einen unterschiedlichen Ausdehnungszustand und aufgrund unterschiedlicher Abtragseigenschaften unterschiedliche Abtragsraten aufweisen, wobei die Bearbeitungstemperatur so gewählt wird, daß der Abtrag der Komponenten aufgrund deren unterschiedlicher Ausdehnung einander so kompensiert wird, daß die Rauhigkeit der Oberfläche des bearbeiteten Materials bei der Anwendungstemperatur minimal ist.
- Verfahren zum Polieren, der Oberfläche eines mindestens zwei Komponenten aufweisenden Materials, wobei jede Komponente in Verbindung mit der zu bearbeitenden Oberfläche steht, mit mindestens einer Polierscheibe und einer Suspension bei einer vorgebbaren Bearbeitungstemperatur, bei der die Komponenten aufgrund unterschiedlicher Wärmeausdehnungskoeffizienten einen unterschiedlichen Ausdehnungszustand und aufgrund identischer Abtragseigenschaften identische Abtragsraten aufweisen, und einer bekannten Anwendungstemperatur, wobei die Bearbeitungstemperatur gleich der Anwendungstemperatur gewählt wird.
- Verfahren nach Anspruch 1 oder 2, bei dem die Temperatur der Polierscheibe kontrolliert wird.
- Verfahren nach einem der Ansprüche 1 bis 3, bei dem die Temperatur der Suspension kontrolliert wird.
- Verfahren nach einem der Ansprüche 1 bis 4, bei dem die Bearbeitungstemperatur über die Suspension eingestellt wird.
- Verfahren nach einem der Ansprüche 1 bis 5, bei dem die Bearbeitungstemperatur über die Polierscheibe eingestellt wird.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10154050 | 2001-11-02 | ||
DE10154050A DE10154050A1 (de) | 2001-11-02 | 2001-11-02 | Bearbeitung von inhomogenen Materialien |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1308242A1 EP1308242A1 (de) | 2003-05-07 |
EP1308242B1 true EP1308242B1 (de) | 2004-05-12 |
Family
ID=7704521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP02023996A Expired - Lifetime EP1308242B1 (de) | 2001-11-02 | 2002-10-26 | Bearbeitung von inhomogenen Materialien |
Country Status (5)
Country | Link |
---|---|
US (1) | US6875079B2 (de) |
EP (1) | EP1308242B1 (de) |
JP (1) | JP4406531B2 (de) |
AT (1) | ATE266500T1 (de) |
DE (2) | DE10154050A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8602845B2 (en) * | 2011-09-23 | 2013-12-10 | United Technologies Corporation | Strengthening by machining |
US10183376B1 (en) * | 2015-10-20 | 2019-01-22 | Seagate Technology Llc | Carrier for mounting a bar of sliders or a stack of such bars to be lapped |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0592363A (ja) * | 1991-02-20 | 1993-04-16 | Hitachi Ltd | 基板の両面同時研磨加工方法と加工装置及びそれを用いた磁気デイスク基板の研磨加工方法と磁気デイスクの製造方法並びに磁気デイスク |
US5658183A (en) * | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
US5508235A (en) * | 1994-07-06 | 1996-04-16 | Schott Glass Technologies, Inc. | Cladding glass ceramic for use in high powered lasers |
JP2736869B2 (ja) * | 1994-11-16 | 1998-04-02 | 株式会社オハラ | 磁気ディスク基板の製造方法 |
US5742026A (en) * | 1995-06-26 | 1998-04-21 | Corning Incorporated | Processes for polishing glass and glass-ceramic surfaces using excimer laser radiation |
JPH10512386A (ja) * | 1995-11-03 | 1998-11-24 | シーゲート テクノロジー,インコーポレイテッド | 高融点材料から作られた、スパッタリングされた熱サイクル処理済み組織層 |
US5691256A (en) * | 1995-12-28 | 1997-11-25 | Yamamura Glass Co., Ltd. | Glass composition for magnetic disk substrates and magnetic disk substrate |
US5873769A (en) * | 1997-05-30 | 1999-02-23 | Industrial Technology Research Institute | Temperature compensated chemical mechanical polishing to achieve uniform removal rates |
DE19737849A1 (de) * | 1997-08-29 | 1999-03-11 | Siemens Ag | Vorrichtung und Verfahren zum Beheizen eines flüssigen oder zähflüssigen Poliermittels sowie Vorrichtung zum Polieren von Wafern |
JP3467184B2 (ja) * | 1998-02-05 | 2003-11-17 | 信越半導体株式会社 | ワークの研磨方法 |
US6315635B1 (en) * | 1999-03-31 | 2001-11-13 | Taiwan Semiconductor Manufacturing Company, Ltd | Method and apparatus for slurry temperature control in a polishing process |
US6458018B1 (en) * | 1999-04-23 | 2002-10-01 | 3M Innovative Properties Company | Abrasive article suitable for abrading glass and glass ceramic workpieces |
US6077151A (en) * | 1999-05-17 | 2000-06-20 | Vlsi Technology, Inc. | Temperature control carrier head for chemical mechanical polishing process |
-
2001
- 2001-11-02 DE DE10154050A patent/DE10154050A1/de not_active Withdrawn
-
2002
- 2002-10-26 AT AT02023996T patent/ATE266500T1/de not_active IP Right Cessation
- 2002-10-26 EP EP02023996A patent/EP1308242B1/de not_active Expired - Lifetime
- 2002-10-26 DE DE50200433T patent/DE50200433D1/de not_active Expired - Lifetime
- 2002-10-30 JP JP2002315193A patent/JP4406531B2/ja not_active Expired - Fee Related
- 2002-10-30 US US10/283,955 patent/US6875079B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6875079B2 (en) | 2005-04-05 |
ATE266500T1 (de) | 2004-05-15 |
JP2003176155A (ja) | 2003-06-24 |
DE10154050A1 (de) | 2003-05-15 |
EP1308242A1 (de) | 2003-05-07 |
US20030087591A1 (en) | 2003-05-08 |
DE50200433D1 (de) | 2004-06-17 |
JP4406531B2 (ja) | 2010-01-27 |
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