ATE266500T1 - Bearbeitung von inhomogenen materialien - Google Patents
Bearbeitung von inhomogenen materialienInfo
- Publication number
- ATE266500T1 ATE266500T1 AT02023996T AT02023996T ATE266500T1 AT E266500 T1 ATE266500 T1 AT E266500T1 AT 02023996 T AT02023996 T AT 02023996T AT 02023996 T AT02023996 T AT 02023996T AT E266500 T1 ATE266500 T1 AT E266500T1
- Authority
- AT
- Austria
- Prior art keywords
- processing
- glass
- ceramic
- inhomogeneous materials
- phase
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/015—Temperature control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Surface Treatment Of Glass (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Glass Compositions (AREA)
- Coating By Spraying Or Casting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10154050A DE10154050A1 (de) | 2001-11-02 | 2001-11-02 | Bearbeitung von inhomogenen Materialien |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE266500T1 true ATE266500T1 (de) | 2004-05-15 |
Family
ID=7704521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT02023996T ATE266500T1 (de) | 2001-11-02 | 2002-10-26 | Bearbeitung von inhomogenen materialien |
Country Status (5)
Country | Link |
---|---|
US (1) | US6875079B2 (de) |
EP (1) | EP1308242B1 (de) |
JP (1) | JP4406531B2 (de) |
AT (1) | ATE266500T1 (de) |
DE (2) | DE10154050A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8602845B2 (en) * | 2011-09-23 | 2013-12-10 | United Technologies Corporation | Strengthening by machining |
US10183376B1 (en) * | 2015-10-20 | 2019-01-22 | Seagate Technology Llc | Carrier for mounting a bar of sliders or a stack of such bars to be lapped |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0592363A (ja) * | 1991-02-20 | 1993-04-16 | Hitachi Ltd | 基板の両面同時研磨加工方法と加工装置及びそれを用いた磁気デイスク基板の研磨加工方法と磁気デイスクの製造方法並びに磁気デイスク |
US5658183A (en) * | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
US5508235A (en) * | 1994-07-06 | 1996-04-16 | Schott Glass Technologies, Inc. | Cladding glass ceramic for use in high powered lasers |
JP2736869B2 (ja) * | 1994-11-16 | 1998-04-02 | 株式会社オハラ | 磁気ディスク基板の製造方法 |
US5742026A (en) * | 1995-06-26 | 1998-04-21 | Corning Incorporated | Processes for polishing glass and glass-ceramic surfaces using excimer laser radiation |
DE69521911T2 (de) * | 1995-11-03 | 2001-11-15 | Seagate Technology Llc | Unter zyklisch veränderten temperaturen kathodenzerstäubte strukturierungsschichten aus materialien mit hohem schmelzpunkt |
US5691256A (en) * | 1995-12-28 | 1997-11-25 | Yamamura Glass Co., Ltd. | Glass composition for magnetic disk substrates and magnetic disk substrate |
US5873769A (en) * | 1997-05-30 | 1999-02-23 | Industrial Technology Research Institute | Temperature compensated chemical mechanical polishing to achieve uniform removal rates |
DE19737849A1 (de) * | 1997-08-29 | 1999-03-11 | Siemens Ag | Vorrichtung und Verfahren zum Beheizen eines flüssigen oder zähflüssigen Poliermittels sowie Vorrichtung zum Polieren von Wafern |
JP3467184B2 (ja) * | 1998-02-05 | 2003-11-17 | 信越半導体株式会社 | ワークの研磨方法 |
US6315635B1 (en) * | 1999-03-31 | 2001-11-13 | Taiwan Semiconductor Manufacturing Company, Ltd | Method and apparatus for slurry temperature control in a polishing process |
US6458018B1 (en) * | 1999-04-23 | 2002-10-01 | 3M Innovative Properties Company | Abrasive article suitable for abrading glass and glass ceramic workpieces |
US6077151A (en) * | 1999-05-17 | 2000-06-20 | Vlsi Technology, Inc. | Temperature control carrier head for chemical mechanical polishing process |
-
2001
- 2001-11-02 DE DE10154050A patent/DE10154050A1/de not_active Withdrawn
-
2002
- 2002-10-26 AT AT02023996T patent/ATE266500T1/de not_active IP Right Cessation
- 2002-10-26 EP EP02023996A patent/EP1308242B1/de not_active Expired - Lifetime
- 2002-10-26 DE DE50200433T patent/DE50200433D1/de not_active Expired - Lifetime
- 2002-10-30 US US10/283,955 patent/US6875079B2/en not_active Expired - Lifetime
- 2002-10-30 JP JP2002315193A patent/JP4406531B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1308242B1 (de) | 2004-05-12 |
DE50200433D1 (de) | 2004-06-17 |
JP2003176155A (ja) | 2003-06-24 |
DE10154050A1 (de) | 2003-05-15 |
EP1308242A1 (de) | 2003-05-07 |
US6875079B2 (en) | 2005-04-05 |
JP4406531B2 (ja) | 2010-01-27 |
US20030087591A1 (en) | 2003-05-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
REN | Ceased due to non-payment of the annual fee |