EP1274964A1 - Structure de puits thermique a ailettes a encoches - Google Patents

Structure de puits thermique a ailettes a encoches

Info

Publication number
EP1274964A1
EP1274964A1 EP01927068A EP01927068A EP1274964A1 EP 1274964 A1 EP1274964 A1 EP 1274964A1 EP 01927068 A EP01927068 A EP 01927068A EP 01927068 A EP01927068 A EP 01927068A EP 1274964 A1 EP1274964 A1 EP 1274964A1
Authority
EP
European Patent Office
Prior art keywords
pipe
heat sink
sink structure
fins
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01927068A
Other languages
German (de)
English (en)
Inventor
Marvin F. Moore
David W. Gailus
Che M. Cheung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermalloy LLC
Original Assignee
Aavid Thermalloy LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aavid Thermalloy LLC filed Critical Aavid Thermalloy LLC
Publication of EP1274964A1 publication Critical patent/EP1274964A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/12—Fins with U-shaped slots for laterally inserting conduits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives

Definitions

  • This invention relates to heat sinks and methods of making the same.
  • Known finned heat sink structures include a plurality of closely disposed heat dissipating fins that are joined to a heat pipe or fluid transfer tube by use of a thermally conductive adhesive or solder. Each of the fins has a cavity about its center region dimensioned to accommodate the heat pipe or fluid transfer tube. Because of the close proximity of the fins to each other
  • an improved heat sink structure which allows solder to be easily applied to a heat pipe mated with a plurality of fins .
  • the present invention is directed to a heat sink structure having a heat conduit such as a pipe, connected to a plurality of fins.
  • the fins dissipate heat into an environment containing the heat sink structure.
  • Each fin in the plurality is constructed of a thermally conductive material having two opposing faces and an edge.
  • the opposing faces define a cavity therein which is dimensioned for seating about the pipe exterior surface.
  • the edge defines an opening having a sidewall extending from the edge to the cavity.
  • Means are provided for attaching the plurality of fins to the exterior surface of the pipe. For example, solder or adhesive is applied to the pipe via access through the opening .
  • the present invention is also directed to a method of making a heat sink structure.
  • the inventive method includes providing a plurality of fins, with each fin being constructed of a thermally conductive material having two opposing faces and an edge.
  • the opposing faces define a cavity therein which is partially bounded by a flange.
  • the edge defines an opening extending from the edge to the cavity.
  • a pipe is then disposed within the cavity of each fin so that the pipe outer surface rests on a portion of each said flange.
  • An adhesive material is disposed on the pipe outer surface by accessing the pipe outer surface through the openings in the fins .
  • Fig. 1 depicts a plurality of fins attached to a heat pipe in accordance with the present invention
  • Fig. 2 depicts a detail of one of the fins of the device in Fig. 1.
  • a heat sink structure 10 in accordance with a preferred embodiment of the present invention is depicted in Fig. 1.
  • the heat sink structure includes a pipe 12 connected at one end to a plurality of fins 14, with the other * end of the pipe connected to a heat source 16 such as an evaporator block containing or supporting an integrated circuit, etc.
  • the pipe 12 provides a conduit for heat exchange between the source 16 and the fins 14 to allow for heat carried by the pipe 12 to the fins to be dissipated to the environment, in a manner well known to those having ordinary skill in the art.
  • the pipe 12 may be a solid heat pipe or a fluid transfer tube containing fluid for providing the desired heat exchange between the source 16 and the fins 14.
  • each fin 14 is preferably constructed of a thermally conductive sheet or plate material having a front face 16 and a rear face 18 and defining a cavity 20 formed therein.
  • the cavity 20 is preferably dimensioned for seating about a diameter of the pipe 12 as discussed more fully below.
  • the cavity 20 is dimensioned slightly larger than the pipe diameter.
  • the cavity 20 is bounded by a sidewall or edge 22 at which a flange 24 is preferably attached for providing an interface between the pipe and the fins 14.
  • the flange 24 collars or substantially surrounds a circumference of the pipe, as shown in Fig. 1.
  • the flange 24 also provides an offset or space between adjacent fins in the plurality as shown in Fig. 1. Although the flange 24 is depicted in Fig. 2 as depending from one face of the fin (e.g., face 16) it will be readily recognized that the flange may extend from either or both faces without departing from the scope of the invention.
  • edge or sidewall 22 may provide adequate contact with the pipe surface, in which event the flange 24 may not be required.
  • each fin 14 has an edge 26 defining and opening 28 extending from the edge 26 to the cavity 20.
  • the opening has a pair of walls or edges 30 which are preferably tapered inwardly toward each other (as shown) so that the opening 28 resembles a 'V-shaped notch.
  • the opening may be configured as a 'U' -shape or semicircular shape so long as it provides its intended purpose of facilitating application of solder material to the pipe and fins in a manner described below.
  • openings 28 provide access to an exposed region of the pipe surface area for disposing the solder 32 either directly thereon, or by applying solder to the opening sides 30 and heating the heat sink structure to cause the solder to flow downward along the sides 30 to the pipe 10.
  • the opening 28 in the fin allows for ease of application of the solder to the fin and pipe interface area, i.e. to the area where the flange 24 meets the heat pipe 10.
  • solder or bonding material 32 flows and adheres between the flange 24 and all or substantially all of the contact area between the pipe and the flange or wall 22 so that air bubbles that may be present in the contact area are removed. This is facilitated by providing an additional opening or notch 36 located at the cavity and flange interface which allows the attachment solder or epoxy to wick or flow along the surface of the pipe and along the flange so that, when cured, the solder will bond and provide thermal coupling between the pipe and fins .
  • the application of the solder 32 can be in a preform or paste that is applied to the sidewalls 30, either before or after the pipe is disposed in the cavities 20, or may be disposed directly in the opening 28 once the pipe is in place.
  • the fins 14 can be placed on the pipe 12 in any known manner. For example, they can be placed over a free end of the pipe one at a time by simply aligning and mating the pipe with the cavity of each fin. Alternatively, the fins can be pre-stacked or aligned in a support structure (not shown) whereupon the end of the pipe can be fed through the fin cavities simultaneously. In a further alternate embodiment, rather than feeding the end of the pipe through the cavities, a length of the pipe may be laid within the opening 28 and forced downward into the cavities 20 by applying a downward force in a direction of arrow X.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un puits thermique (10) constitué d'un tube (12) solidaire d'une pluralité d'ailettes (14).
EP01927068A 2000-04-14 2001-04-16 Structure de puits thermique a ailettes a encoches Withdrawn EP1274964A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US19741100P 2000-04-14 2000-04-14
US197411P 2000-04-14
PCT/US2001/012362 WO2001079776A1 (fr) 2000-04-14 2001-04-16 Structure de puits thermique a ailettes a encoches

Publications (1)

Publication Number Publication Date
EP1274964A1 true EP1274964A1 (fr) 2003-01-15

Family

ID=22729313

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01927068A Withdrawn EP1274964A1 (fr) 2000-04-14 2001-04-16 Structure de puits thermique a ailettes a encoches

Country Status (7)

Country Link
US (2) US20010042615A1 (fr)
EP (1) EP1274964A1 (fr)
JP (1) JP2003531480A (fr)
CN (1) CN1451091A (fr)
HK (1) HK1053864A1 (fr)
TW (1) TW502105B (fr)
WO (1) WO2001079776A1 (fr)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1440759B8 (fr) * 2003-01-27 2007-11-07 SPX-Cooling Technologies GmbH Méthode pour fabriquer un échangeur de chaleur
TW560836U (en) * 2003-03-05 2003-11-01 Hon Hai Prec Ind Co Ltd Combined fin
CN1304809C (zh) * 2004-02-10 2007-03-14 珍通科技股份有限公司 热管与散热鳍片的连接方法
JP4160026B2 (ja) * 2004-07-30 2008-10-01 稔之 新井 電気部品用の放熱体
CN1327184C (zh) * 2004-08-13 2007-07-18 钟义 散热装置
TWM268111U (en) * 2004-09-08 2005-06-21 Shiau Fu Yuan Structure for punch rivet set of radiator and heat tube
DE102004046821A1 (de) * 2004-09-27 2006-04-06 Siemens Ag Kühleinrichtung einer elektrischen Maschine
US20060108104A1 (en) * 2004-11-24 2006-05-25 Jia-Hao Li Heat-dissipating fin set in combination with thermal pipe
CN100394587C (zh) * 2005-01-25 2008-06-11 讯凯国际股份有限公司 散热器结构及其制造方法
CN100369244C (zh) * 2005-02-21 2008-02-13 奇鋐科技股份有限公司 具导流功能的散热片
TWI286919B (en) * 2005-08-04 2007-09-11 Delta Electronics Inc Heat dissipation module and assembling method thereof
CN1960615A (zh) * 2005-11-03 2007-05-09 富准精密工业(深圳)有限公司 散热器
US7500513B2 (en) * 2006-11-03 2009-03-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat-pipe type heat sink
US20090056928A1 (en) * 2007-09-01 2009-03-05 Shih-Jie Jiang Heat dissipation assembly
JP4357569B2 (ja) 2008-01-31 2009-11-04 株式会社東芝 電子機器
US20100212868A1 (en) * 2008-02-15 2010-08-26 Yang Chien-Lung Assembled configuration of cooling fins and heat pipes
US8286693B2 (en) * 2008-04-17 2012-10-16 Aavid Thermalloy, Llc Heat sink base plate with heat pipe
CN101959389B (zh) * 2009-07-13 2014-07-16 富瑞精密组件（昆山）有限公司 散热装置及其制造方法
CN102271483B (zh) * 2010-06-07 2015-07-08 富瑞精密组件（昆山）有限公司 散热组合结构
US20120085519A1 (en) * 2010-10-12 2012-04-12 Chou Chu-Hsien Heat-dissipating structure for motor stator
CN102921829B (zh) * 2012-11-22 2015-04-15 秦大庆 散热鳍片与热管的连接方法
JP6276539B2 (ja) * 2013-08-26 2018-02-07 三菱重工業株式会社 熱交換器及び熱交換器の製造方法
US20150211807A1 (en) * 2014-01-29 2015-07-30 Trane International Inc. Heat Exchanger with Fluted Fin
TWI544201B (zh) 2014-12-22 2016-08-01 中強光電股份有限公司 散熱模組及具有散熱模組的投影裝置
CN108303837B (zh) 2017-01-12 2020-12-18 中强光电股份有限公司 投影装置、散热模块及散热鳍片组
US20230171928A1 (en) * 2020-04-10 2023-06-01 Hewlett-Packard Development Company, L.P. Thermal modules with solder-free thermal bonds

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3643312A (en) * 1969-03-24 1972-02-22 Orbit Mfg Co Method of making finned tubing
US3780797A (en) * 1972-02-28 1973-12-25 Gebelius Sven Runo Vilhelm Convectors
DE3432073A1 (de) * 1984-08-31 1986-03-06 Dirk Dipl.-Wirtsch.-Ing. 3500 Kassel Pietzcker Waermetauscher, insbesondere fuer kraftfahrzeuge, und vorrichtung und verfahren zum verbinden von dessen rohren und lamellen
US5423121A (en) * 1994-01-18 1995-06-13 Mcelroy Manufacturing, Inc. Automated fin tube process

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0179776A1 *

Also Published As

Publication number Publication date
US20010042615A1 (en) 2001-11-22
TW502105B (en) 2002-09-11
CN1451091A (zh) 2003-10-22
HK1053864A1 (zh) 2003-11-07
WO2001079776A1 (fr) 2001-10-25
US20030079862A1 (en) 2003-05-01
JP2003531480A (ja) 2003-10-21

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