CN102271483B - 散热组合结构 - Google Patents

散热组合结构 Download PDF

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CN102271483B
CN102271483B CN201010193423.1A CN201010193423A CN102271483B CN 102271483 B CN102271483 B CN 102271483B CN 201010193423 A CN201010193423 A CN 201010193423A CN 102271483 B CN102271483 B CN 102271483B
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heat pipe
heat
heat radiator
fixed orifice
combined structure
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CN102271483A (zh
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谢宜莳
孙瑞文
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Furui Precise Component Kunshan Co Ltd
Hon Hai Precision Industry Co Ltd
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Furui Precise Component Kunshan Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to US12/832,948 priority patent/US8453716B2/en
Publication of CN102271483A publication Critical patent/CN102271483A/zh
Priority to US13/875,295 priority patent/US20130233522A1/en
Priority to US13/886,229 priority patent/US9279622B2/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/12—Fastening; Joining by methods involving deformation of the elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

一种散热组合结构，包括若干散热片及一热管，所述散热片上开设有一固定孔，所述热管穿设于所述固定孔中，所述散热片上于固定孔的两侧各设置有一弱化结构，所述弱化结构受力后可压缩变形，使所述固定孔紧缩而使散热片与所述热管紧密贴合。本发明通过在固定孔的相对两侧的散热片上设有弱化结构，并于散热片上施压使散热片与所述热管无间隙贴合，达到最佳的热传效果。

Description

散热组合结构
技术领域
本发明涉及一种散热组合结构，尤其涉及一种带有热管的散热组合结构。
背景技术
随着科技的日新月异，电子产业和信息技术的不断发展，电子装置信息处理的能力越来越强，电子元件集成化程度越来越高，其产生的热量也越来越多，因此，业界通常于中央处理器或重要的电子元件表面上装设有高效能的散热结构，以对这些电子元件散热。
目前通常的散热结构主要包括若干散热片及穿设或卡设于这些散热片的一热管。
此种散热结构在制造时，先在散热片上穿孔，然后将热管穿设或卡设在相应的穿孔中。各散热片的穿孔与热管为间隙配合，亦即散热片的穿孔尺寸通常稍大于热管的截面。如此，热管与散热片之间存在较大热阻，不能快速的散发电子元件的热量。
发明内容
有鉴于此，有必要提供一种热阻较小的散热组合结构。
一种散热组合结构，包括若干散热片及一热管，所述散热片上开设有一固定孔，所述热管穿设于所述固定孔中，所述散热片上于固定孔的两侧各设置有一弱化结构，所述弱化结构受力后可压缩变形，使所述固定孔紧缩而使散热片与所述热管紧密贴合。
本发明通过在固定孔的相对两侧的散热片上设有弱化结构，并于鳍片上施压使鳍片与热导管无间隙贴合，达到最佳的热传效果。
附图说明
图1为本发明第一实施例中的散热组合结构的立体组合图。
图2为图1中的散热组合结构的立体分解图。
图3为图1中两片散热片的立体放大图。
图4为本发明第二实施例中两片散热片的立体放大图。
图5为本发明第三实施例中两片散热片的立体放大图。
主要元件符号说明
散热组合结构    100
散热片组        20
散热片          10/10a/10b
本体            12
折板            14
固定孔          16
环缘            18
热管            30
收容通道        22
扣合件          142
收容孔          144
挡止部          146
缺口            182
弱化结构        122/122a/122b
第一侧边        11
第二侧边        13
具体实施方式
请参阅图1和图2，其所示为本发明第一实施例中的散热组合结构100。该散热组合结构100包括由若干散热片10通过扣合的方式堆叠结合而形成的散热片组20和一热管30，所述热管30将从发热电子元件(图未示)上所吸收的热量传导至所述散热片组20上，进而散发到周围的空气中。
所述散热片10由导热性良好的材料制成，如铜、铝等制成。请同时参阅图3，每一散热片10包括一本体12和自该本体12的相对两侧沿同一方向垂直延伸出的两个折板14。
所述本体12为一长方形板体，其包括二相对的第一侧边11和二相对的第二侧边13。所述本体12中部形成有一椭圆形的固定孔16，其形状与所述热管30的横截面大致相同，且尺寸略大于所述热管30的尺寸，从而使热管30能够穿过该固定孔16。所述本体12的相对两侧、自二第二侧边13的中部朝向固定孔16形成有二弱化结构122。于本实施例中，所述每一弱化结构122为由若干平行于所述第一侧边11的长条状片体相互链接而形成的一波浪片，且弱化结构122的厚度较所述本体12薄，受力后可压缩变形即可。所述固定孔16的一侧边向外延伸有一垂直于所述本体12的、椭圆形的一环缘18。所述环缘10的宽度与高度与固定孔16的宽度与高度相等。所述环缘18靠近所述弱化结构122的两侧各开设有一贯穿的缺口182。
所述折板14是从所述本体12的相对第一侧边11沿所述环缘18延伸的一侧延伸出来的一长方形板体，所述折板14延伸的长度与所述环缘18延伸的长度相当。每一折板14的相对两侧同向间隔的凸伸有二扣合件142。每一扣合件142内侧、于折板14与第一侧边11的连接处设置有一收容孔144。所述收容孔144用于收容相邻散热片对应的的扣合件142。在本实施例中，所述扣合件142与所述收容孔144均呈“凸”字形的结构，且所述收容孔144与所述扣合件142相适应。所述本体12的第一侧边11上在所述收容孔144的位置向上凸起一挡止部146，所述挡止部146为一方形片体且其顶端与折板14共面。可以理解的，在其他实施例中，收容孔144及扣合件142可以呈其他任意的形状，只要相应的扣合件142能够收容于对应的收容孔144中，从而使相邻的散热片10能够稳定组合即可。
所述热管30由导热性好的材料如铜等制成。于本实施例中，所述热管30为一纵长的扁平管状体，其横截面与所述固定孔的形状相匹配，即也为椭圆形。可以理解地，在其它的实施例中，所述热管30可根据实际的使用需要为其它形状。
对散热组合结构100进行组装时，先将一片散热片10的扣合件142对准相邻的另一散热片10对应的收容孔144，并使扣合件142收容于收容孔144内，所述散热片10的挡止部146也收容于其相邻的散热片10对应的收容孔144里，阻挡所述散热片10从前一散热片10上脱出。如此可完成所述散热片10和与其相邻的前一散热片10的扣合。后面依此进行组装，散热片10的数目不做限定，可根据具体的实际情况来安排。此时，所述散热片10上的环缘18的自由前端抵顶于前一散热片10的固定孔16的边缘，这些环缘18形成一尺寸较热管30大的收容通道22供所述热管30穿设。
所述热管30的外表面涂上锡膏(图未示)，然后将涂满锡膏的热管30穿设于所述散热片组20的收容通道22中，直至其一端露出于所述收容通道22外。由于所述热管30的尺寸稍微小于收容通道22的尺寸，所述热管30与收容通道22之间存在间隙，所述热管30能很方便地穿设于所述散热片组20的收容通道22中，且不会把涂在热管30外表面上的锡膏刮擦掉。此时于所述散热片组20上施加与所述弱化结构122的朝向相垂直的力，于本实施例中，即在所述散热片组20上施加一平行于所述第二侧边13的力，使所述弱化结构122紧缩，相应地，所述缺口182的高度也慢慢减小，散热片组20受力而高度变小，并使固定孔16及环缘18的高度因为被挤压而缩小，使所述热管30上下两侧与被挤压的环缘18相互贴合。此时所述热管30被卡设于所述散热片组20的收容通道22中，其上下表面与所述散热片组20的环缘18的内表面紧密贴合。再将锡膏烘烤，使热管30与环缘18之间均匀紧密结合。
如此，通过在所述散热片10的固定孔16的两侧的本体12上设置弱化结构122，并于散热片组20上施压使散热片组20与所述热管30无间隙贴合，不会造成部分锡膏在穿设于收容通道22的过程中被刮擦掉，达到最佳的热传效果。
请同时参阅图4，为本发明提供的第二实施例的一散热片10a的立体图。本实施例中的散热片10a与第一实施例中的散热片10相似，其区别在于：其弱化结构122a与第一实施例中的弱化结构122不同。第一实施例中本体12一侧的一弱化结构122于本实施例中被一自环缘18一侧的本体12中部、沿所述第一侧边11的方向上、自环缘18的缺口182一直延伸到相应一第二侧边13的一纵长的开口123取代，第一实施例中本体12另一侧的一弱化结构122于本实施例中被一自环缘18另一侧的本体12中部、沿所述第一侧边11的方向上、自环缘18的缺口182朝向第二侧边13延伸的一纵长的开槽124取代，该开槽124通过一连接片125与第二侧边13连接，从而该开槽124不贯穿第二侧边13。
请同时参阅图5，为本发明提供的第三实施例的一散热片10b的立体图。本实施例中的散热片10b与第一实施例中的散热片10相似，且其弱化结构122b与第一实施例中的弱化结构122基本相同，区别在于，在第三实施例中，每一个弱化结构122b在其中部、沿所述第一侧边11的方向上开设有一与环缘18的缺口182连通的开槽126，且此开槽126不贯穿第二侧边13。

Claims (3)

1.一种散热组合结构，包括若干散热片及一热管，所述散热片上开设有一固定孔，所述热管穿设于所述固定孔中，其特征在于：所述散热片上于固定孔的两侧各设置有一弱化结构，所述弱化结构受力后可压缩变形，使所述固定孔紧缩而使散热片与所述热管紧密贴合，所述固定孔及弱化结构形成于所述散热片的一本体上，所述弱化结构为由若干长条状片体堆叠而成的波浪片，所述波浪片的厚度较所述本体薄。
2.如权利要求1所述的散热组合结构，其特征在于：所述波浪片上开设有一开槽。
3.如权利要求1至2任意一项所述的散热组合结构，其特征在于：所述固定孔的一侧向外延伸有一环缘，所述环缘的相对两侧各设有一缺口与对应的弱化结构连接。
CN201010193423.1A 2010-06-07 2010-06-07 散热组合结构 Expired - Fee Related CN102271483B (zh)

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CN201010193423.1A CN102271483B (zh) 2010-06-07 2010-06-07 散热组合结构
US12/832,948 US8453716B2 (en) 2010-06-07 2010-07-08 Heat dissipation device
US13/875,295 US20130233522A1 (en) 2010-06-07 2013-05-02 Heat dissipation device
US13/886,229 US9279622B2 (en) 2010-06-07 2013-05-02 Heat dissipation device

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US20130233522A1 (en) 2013-09-12
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