EP1252365A1 - Verfahren zur erzeugung von funktionsschichten mit einer plasmastrahlquelle - Google Patents

Verfahren zur erzeugung von funktionsschichten mit einer plasmastrahlquelle

Info

Publication number
EP1252365A1
EP1252365A1 EP00993268A EP00993268A EP1252365A1 EP 1252365 A1 EP1252365 A1 EP 1252365A1 EP 00993268 A EP00993268 A EP 00993268A EP 00993268 A EP00993268 A EP 00993268A EP 1252365 A1 EP1252365 A1 EP 1252365A1
Authority
EP
European Patent Office
Prior art keywords
plasma
precursor material
plasma jet
substrate
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00993268A
Other languages
German (de)
English (en)
French (fr)
Inventor
Stefan Grosse
Johannes Voigt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP1252365A1 publication Critical patent/EP1252365A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/513Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C23C4/123Spraying molten metal
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C23C4/134Plasma spraying

Definitions

  • the invention relates to a method and a device for producing functional layers with a plasma beam source according to the preamble of the main claim.
  • Typical known layers consist of one or more layers with different compositions, quality features and functionalities.
  • layers from the gas phase are deposited in a high vacuum using PACVD processes ("physically aided chemical vapor deposition") or PVD processes (“physical vapor deposition”) in a high-quality, dense, homogeneous and flat manner.
  • Both methods are characterized by atomic growth of the layers during the deposition, ie individual atoms or small clusters are deposited on the substrate, the plasmas used being generated using electrical or electromagnetic fields of the entire frequency spectrum.
  • the deposition process is determined by diffusion processes and suffers from low coating rates and a batch operation typical of the type of these processes. Both points are disadvantageous for use in series production.
  • plasma spraying processes powdery microscale particles are introduced into a plasma jet source or a plasma jet in a rough vacuum up to the near-atmospheric pressure range, melted there and partially vaporized, and then directed at high speed onto a substrate.
  • This enables porous layers with different functionalities to be deposited with relatively high deposition rates, but these do not achieve the homogeneity and compactness of typical PACVD layers.
  • the advantages of plasma spraying are the highly localized coating and the high deposition rates.
  • the plasma beam continues to be generated usually with direct voltage, but newly developed plasma sources with inductive high-frequency coupling are also already known. The latter have the advantage that the powder particles introduced have a longer residence time in the plasma jet and are therefore melted more strongly.
  • a metallic powder can also be added to the gas supplied to the plasma jet, so that, analogously to the known plasma spraying with microscale powders, these particles are melted on the surface in the plasma jet and are then deposited on a substrate outside the plasma source.
  • the disadvantage of this method is first of all the high roughness and low mechanical strength of the deposited layers, which is essentially due to the fact that the powder particles supplied in the plasma jet are only exposed to the high plasma temperatures of sometimes more than 9000 K for a short time due to the very high flow rate. so that they are not completely melted, but only melted on the surface. In particular, there is no melting and breaking apart of the supplied particles at the atomic or molecular level. Such layers are therefore often unsuitable as thin wear protection layers or hard material layers with layer thicknesses of a few micrometers. Furthermore, the composition of the layers deposited in this way has hitherto essentially been limited to metals or metal alloys and metal oxides.
  • the method according to the invention with the characterizing features of the main claim has the advantage over the prior art that it eliminates the gap between known PACVD processes and plasma spraying processes is closed.
  • a deposition process is carried out with a plasma jet source in a modified process control in a fine vacuum up to the pressure range close to the atmosphere, which enables a directed, local PACVD coating as a functional coating on a substrate.
  • No particles from several micrometers to submillimetres are plated on the substrate, i.e. superficially melted and / or only partially evaporated, but precursor materials, possibly mixed with an inert gas, carrier gas or reactive gas, are used and broken up or fragmented within the generated plasma at the atomic or molecular level and at the same time at least partially chemically excited and / or ionized.
  • new compounds are formed in the plasma jet from the supplied precursor materials, which then ultimately hit a substrate in a directed manner at a relatively high speed and are deposited there as a functional layer.
  • the essence of the method according to the invention is therefore the combination of a plasma beam source with the use of precursor materials and the choice of process parameters which lie between those of the classic PACVD and the plasma beam process to form a process which is referred to as a high-rate PACVD process or can be used.
  • the main advantages of the method according to the invention lie in the cost-effective deposition of dense, high-quality, sometimes hard to superhard layers with a plasma beam source with high deposition rates.
  • the method according to the invention is a method with less or, in special cases, no expense for vacuum technology than known PECVD methods, since a fine or coarse vacuum or even the near-atmospheric pressure range is often sufficient or suitable for implementation.
  • the typical high gas or particle exit velocities of plasma beam sources are advantageously used to bring an effective flow of precursor material onto the surface to be coated, which enables significantly higher layer growth rates than with a purely diffusive material transport, as is the case with known CVD or PECVD. Procedure is common.
  • Gaseous organic and organosilicon or organometallic compounds are particularly suitable as precursor material. A mixture of these gases can also be used.
  • the method according to the invention is not restricted to gaseous precursor materials, but these can also be in liquid form, as submicro or nanoscale particles, in particular powder particles made of hard materials or ceramics such as nitrides, in particular boron nitrides, silicon nitrides or metal nitrides such as TiN, oxides such as aluminum oxide, Titanium dioxide or a silicon dioxide, suicides or silicon compounds, and also as liquid suspensions, in particular with nanoscale particles from the above material classes suspended therein, the plasma or the plasma beam source.
  • mixtures of the above materials are also suitable for the process according to the invention.
  • Inert gases such as argon or nitrogen are suitable as the gas for the plasma jet source for generating the plasma and / or as the carrier gas for the precursor material.
  • Oxygen, nitrogen, ammonia, methane, acetylene, silane and hydrogen are preferably used as reactive gases for a chemical reaction with the precursor material.
  • the torch body can additionally advantageously be supplied with a cylindrical gas surrounding the generated plasma, such as hydrogen or argon.
  • a precursor material supplied to the plasma can also be supplied to the plasma jet via a shower which is arranged outside the plasma jet source and in particular concentrically surrounds the plasma jet.
  • a nozzle which is preferably arranged in the vicinity of the outlet opening of the plasma jet source and with which the precursor material is injected into the plasma jet, is also suitable for this purpose.
  • this nozzle can also be used to supply a quench gas for cooling.
  • plasma beam sources are suitable which operate at a pressure of 10 "4 inbar up to 1.5 bar in the process space, the plasma in various ways, for example via direct current excitation, high-frequency alternating current excitation, microwave excitation or excitation with unipolar ones or bipolar voltage pulses, can be ignited or maintained.
  • a particularly important advantage of the method according to the invention is its versatility in terms of presentation different layer systems. This applies in particular to the combination of different precursor materials, each known as a material, and the range of variations in the process conditions, which in turn affect the layer properties that can be achieved.
  • the method according to the invention can thus also be used to produce a wide variety of layer systems which result from the variation of the layer composition as a function of time.
  • the method according to the invention also allows the composition of the precursor materials in the plasma or the process control during the deposition to be changed over time, and thus the production of a sequence of partial layers which have a continuous transition in the material composition.
  • layers or layer systems can be deposited in the manner explained, which consist of metal silicides, carbides, oxides, nitrides, borides, sulfides, amorphous to crystalline carbon, hydrocarbonaceous materials, silicon dioxide or even a mixture of these materials.
  • FIG. 1 shows a plasma jet source known from the prior art for carrying out the method according to the invention
  • FIG. 2 shows a modified plasma jet source with modified gas guidance.
  • an injector gas 15 is fed axially to this plasma jet source 5 with a cylindrical burner body 11 via a feed 13 and a cylindrical sleeve 14.
  • a precursor material 16 are supplied to the ⁇ 11 Brennerkorper.
  • a further gas can be added to the injector gas 15 at least temporarily as the central gas 22.
  • a plasma 10 is then ignited and continuously operated via electromagnetic coupling by components, which are not shown and are known per se, which plasma 11 emerges from the plasma beam source 5 in the form of a plasma beam 17.
  • a gas supply 21 in the form of a gas shower is provided for the optional concentric introduction of a hollow gas 19 into the burner body 11.
  • the hull gas 19 is introduced outside the sleeve 14 in such a way that it suppresses an undesirably strong heating or coating of the inner walls of the burner body 11.
  • 19 precursor materials can also be added to the Hullgas.
  • the plasma 10 thus emerges in the form of a plasma beam 17 from the burner body 11, which has a typical height of approx. 10 cm, and strikes a substrate 12 at a distance of typically approx. 10 cm to 100 cm in order to have one Deposit functional coating 18.
  • FIG. 2 shows a modification of the design of the plasma beam source 5, the introduction of a Hull gas 19 and the use of the sleeve 14 being dispensed with.
  • a further precursor material 16 is supplied to the plasma 10, which emerges from the burner body 11 as a plasma beam 17, but outside the plasma beam source 5.
  • an additional shower 20 concentrically surrounding the plasma jet 17 is provided. This shower 20 can optionally be placed in a nozzle at the outlet of the plasma jet source 5, i.e. in the area where the plasma beam 17 emerges from the plasma beam source 5, is adapted.
  • an axial injection of the first precursor material 16 ⁇ into the burner body 11 can also be dispensed with, for example by introducing a reactive gas such as oxygen or hydrogen into the burner body 11 as the injector gas 15. which then first generates the plasma 10 and to which the precursor material 16 is then fed outside the plasma beam source 5 via the concentric shower 20.
  • the plasma 10 reacts outside the plasma beam source 5 with the precursor material 16, for example by inducing a chemical reaction of the precursor material 16 (thermal activation or supply of a reaction component) or by breaking the precursor material 16 at the atomic or molecular level and simultaneously at least partially chemically activated or ionized.
  • the injector gas 15 supplied can also be just an inert gas such as argon or a carrier gas such as nitrogen, which is fed to the plasma jet source 5 according to FIG. 1 or 2 simultaneously with the precursor material 16.
  • the essential process parameters during operation of the plasma jet source 5 are the power coupled into the plasma 10, the type of plasma excitation in the burner body 11, the distance between the outlet opening of the burner body 11 and the substrate 12, the type and amount of the supplied precursor materials 16, 16, the gas flow of the injector gas 15, the hollow gas 19 and the central gas 22 and the pressure at which the plasma jet source 5 is operated.
  • the plasma jet can be the residence time of the charged particles or precursor materials 16, 16 in the plasma jet 17 ⁇ 17 being affected, which in turn absorb during this flight time of energy from the plasma beam 17 over the length. Only when the duration of stay and thus the absorbed energy is sufficiently long is it possible, for example, to completely break open one Precursor material 16, 16 ⁇ guaranteed down to the atomic or molecular level.
  • a first exemplary embodiment of the invention provides that a plasma 10 is generated in the plasma beam source 5 by inductively coupled high frequency and by supplying a reactive gas such as oxygen or hydrogen as injector gas 15 in the burner body 11 according to FIG.
  • the coupled power is approx. 20 kW, the pressure approx. 200 mbar, the gas flow of the central gas 22 approx. 20 SLpM (standard liter per minute), the gas flow of the hollow gas 19 approx. 70 SLpM, the gas flow of the supplied reactive gas approx. 10 SLpM and the distance between the outlet opening of the burner body 11 and the substrate 12 about 20 cm.
  • the central gas 22 and the hull gas 19 are each argon.
  • a gaseous precursor material 16 ⁇ with a gas flow of 5 SLpM is fed via the feed (injector) 13.
  • This precursor material 16 ⁇ is, for example, an organosilicon compound such as hexamethylsilane (HMDS) or tetramethylsilane (TMS), an organotitanium compound or, in particular for the deposition of amorphous carbon layers or materials containing hydrocarbons, a purely organic compound such as acetylene or methane.
  • HMDS hexamethylsilane
  • TMS tetramethylsilane
  • a chemical reaction and conversion then takes place in the plasma with the precursor material 16 ⁇ , so that the precursor material 16 is deposited on the substrate 12 in an atomic or molecular form as a functional coating 18.
  • a nozzle, a gas nozzle or injector may ⁇ , the precursor material 16 in the other alternatively or additionally, also as shown in FIG 2 via the Gaszubowung 20 in the form of the plasma jet are fed to seventeenth Hydrogen is also suitable as the hull gas 19 supplied according to FIG. 1.
  • the injector gas 15 supplied can also be merely a carrier gas such as nitrogen or an inert gas such as argon, which supplies the burner body, for example, with nanoscale powder 16 ⁇ as the precursor material.
  • the composition of the functional coating 18 can be on the choice of the injector gas 15 selectively influenced become.
  • the exemplary embodiment explained is furthermore not restricted with regard to the specific shape of the precursor material 16 or 16.
  • This can be gaseous, liquid or powder, and can also consist of a mixture of different precursor materials.
  • the precursor material 16, 16 ⁇ can be supplied in liquid form, for example in the form of isopropanol or acetone with a flow rate of preferably 1 to 10 ml per minute, and react chemically in the plasma jet 17 or the plasma 10 or react with the injector gas 15.
  • a supply of a suspension, a powder or a powder mixture as a precursor material 16, 16 ⁇ about the shower 20 or the Zubowung 13 into the plasma jet 17 or the plasma 10 is possible in the context of this exemplary embodiment.
  • the particles in the suspension or the powder particles are expediently in the form of nanoscale particles, since depending on the process and material, it can be achieved in this way that they are within the plasma jet 17 completely, ie down to the atomic level. Due to the at least very extensive opening, in particular melting or Evaporation, the supplied solids in the plasma jet 17 is also achieved that the individual atoms or molecules are directed and hit the substrate 12 at high speed.
  • injector gases 15 can also be combined with different precursor materials 16, 16 in the exemplary embodiment explained. It thus allows, in particular, amorphous carbon layers and layers and layer systems made of metal silicides, carbides, oxides, nitrides, sulfides or borides and corresponding silicon compounds to be deposited on the substrate 12, with an additional parameter also being a change in the type and amount over time of the supplied precursor material 16, 16 is available in order to generate a sequence of differently composed and / or differently structured layers.
  • the plasma jet source 5 can be fed via the feed 13, for example, a nanoscale powder such as TiC together with oxygen as the injector gas 15, so that with appropriate setting of the process parameters in the plasma 10 or in the plasma jet 17, carbon is sputtered from the TiC particles via high-energy gas components , which then reacts with the supplied oxygen to CO : and is pumped out, so that an amorphous TiO 2 layer is finally deposited on the substrate 12.
  • a nanoscale powder such as TiC together with oxygen as the injector gas 15
  • carbon is sputtered from the TiC particles via high-energy gas components , which then reacts with the supplied oxygen to CO : and is pumped out, so that an amorphous TiO 2 layer is finally deposited on the substrate 12.
  • a second exemplary embodiment provides that an additional, separately controllable PVD (physical vapor deposition) or CVD (chemical vapor deposition) device is provided which, in a manner known per se, has an, for example, amorphous layer as a matrix layer on the Deposits substrate 12.
  • This CVD or PVD device is preferably at least temporarily at a deposition of precursor materials 16, 16 ⁇ with the plasma beam source 5 combined according to the above exemplary embodiment.
  • the CVD process is operated continuously via a corresponding CVD device and this CVD process is only temporarily connected to the plasma beam source 5 for depositing the functional coating, or that the plasma beam source 5 is operated continuously and the CVD device is only switched on temporarily.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Vapour Deposition (AREA)
EP00993268A 1999-12-04 2000-11-25 Verfahren zur erzeugung von funktionsschichten mit einer plasmastrahlquelle Withdrawn EP1252365A1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19958474 1999-12-04
DE19958474A DE19958474A1 (de) 1999-12-04 1999-12-04 Verfahren zur Erzeugung von Funktionsschichten mit einer Plasmastrahlquelle
PCT/DE2000/004207 WO2001040543A1 (de) 1999-12-04 2000-11-25 Verfahren zur erzeugung von funktionsschichten mit einer plasmastrahlquelle

Publications (1)

Publication Number Publication Date
EP1252365A1 true EP1252365A1 (de) 2002-10-30

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EP00993268A Withdrawn EP1252365A1 (de) 1999-12-04 2000-11-25 Verfahren zur erzeugung von funktionsschichten mit einer plasmastrahlquelle

Country Status (4)

Country Link
EP (1) EP1252365A1 (ja)
JP (1) JP2003515676A (ja)
DE (1) DE19958474A1 (ja)
WO (1) WO2001040543A1 (ja)

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Publication number Publication date
DE19958474A1 (de) 2001-06-21
JP2003515676A (ja) 2003-05-07
WO2001040543A1 (de) 2001-06-07

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