EP1245690A1 - Kupfer sowie Kupferlegierung und Verfahren zur Herstellung - Google Patents
Kupfer sowie Kupferlegierung und Verfahren zur Herstellung Download PDFInfo
- Publication number
- EP1245690A1 EP1245690A1 EP02006886A EP02006886A EP1245690A1 EP 1245690 A1 EP1245690 A1 EP 1245690A1 EP 02006886 A EP02006886 A EP 02006886A EP 02006886 A EP02006886 A EP 02006886A EP 1245690 A1 EP1245690 A1 EP 1245690A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper
- alloy
- cold rolling
- rolling
- copper alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 32
- 239000010949 copper Substances 0.000 title claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 238000005097 cold rolling Methods 0.000 claims abstract description 35
- 239000013078 crystal Substances 0.000 claims abstract description 26
- 238000005096 rolling process Methods 0.000 claims abstract description 20
- 230000009467 reduction Effects 0.000 claims abstract description 15
- 238000009864 tensile test Methods 0.000 claims abstract description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 20
- 239000000956 alloy Substances 0.000 claims description 20
- 238000000137 annealing Methods 0.000 claims description 20
- 238000001953 recrystallisation Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 229910017526 Cu-Cr-Zr Inorganic materials 0.000 claims description 5
- 229910017810 Cu—Cr—Zr Inorganic materials 0.000 claims description 5
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 claims description 5
- 239000000463 material Substances 0.000 description 17
- 238000005452 bending Methods 0.000 description 16
- 230000035882 stress Effects 0.000 description 10
- 239000002245 particle Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000001965 increasing effect Effects 0.000 description 5
- 238000005336 cracking Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000005272 metallurgy Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910005487 Ni2Si Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000008207 working material Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
- B21B2003/005—Copper or its alloys
Definitions
- the present invention relates to copper and to copper alloys having fine crystal grains, and relates to a manufacturing method therefor, and more particularly, the resent invention relates to a technology for enhancing the characteristics in bending or other working when used for electronic devices such as terminals, connectors, and lead frames for semiconductor integrated circuits.
- Copper alloy Electrical conductivity of copper alloy is inversely related to strength, and when an alloying element is added to enhance the strength, the electrical conductivity is lowered, and therefore alloys which compromise strength and electrical conductivity or price have been used, depending on the application. So far, alloys for enhancing the strength and electrical conductivity have been intensively developed, and generally, copper alloys of precipitation reinforced type containing second phase particles such as Cu-Ni-Si alloy or Cu-Cr-Zr alloy have come to be used as high functional materials which is superior in balance between both.
- the inventors have accumulated extensive research to solve these problems, and they have discovered that fine crystal grains at a level not known thus far can be obtained by controlling the conditions of the rolling process instead of the conditions of the annealing. That is, in the structure of a material cold rolled with an ordinary cold rolling reduction, when recrystallized by subsequent annealing, the decrease in dislocation density occurs discontinuously when the recrystallized grain boundaries pass a cell, and large crystal grains of uneven size are produced intermittently. This is called static recrystallization.
- the present invention is made on the basis of these findings, and provides copper and copper alloy comprising: a structure having fine crystal grains with grain size of 1 ⁇ m or less composed of crystal grain boundaries mainly formed of curved portions after a final cold rolling, the structure obtained by dynamic continuous recrystallization caused by the final cold rolling, and an elongation of 2% or more in a tensile test.
- the present invention also provides a manufacturing method for copper and copper alloy, the method comprising: a final cold rolling with a reduction (true stress) ⁇ , wherein ⁇ is expressed in the following formula and satisfying ⁇ ⁇ 3, thereby obtaining a structure having fine crystal grains with grain size of 1 ⁇ m or less after the final cold rolling, and an elongation of 2% or more in a tensile test.
- ⁇ In (T 0 /T 1 )
- T 0 plate thickness before rolling
- T 1 plate thickness after rolling.
- a high ductility is essential.
- a fracture elongation in a tensile test is required to be 2% or more at a gauge length of 50 mm.
- the grain size after final cold rolling must be 1 ⁇ m or less.
- the grain size and elongation after final cold rolling vary depending on the cold rolling reduction.
- the value of ⁇ when the value of ⁇ is small, a rolled structure remains, and clear fine crystal grains are not obtained, or if they are obtained, the grain size is large, and the grain boundary sliding does not take place, and favorable ductility is not obtained.
- the value of ⁇ should be 3 or more in order to obtain a fine grain size of 1 ⁇ m or less.
- the structure of a material cold rolled by a conventional ordinary cold rolling reduction sometimes had a cell structure due to mutual entangling of dislocations introduced in the crystal grains. In this case, however, since the misorientation among neighboring cells is small, that is, 15° or less, properties as crystal grain boundary are not realized. Accordingly, as shown in Fig. 1, when recrystallized by annealing after cold rolling, as mentioned above, static crystallization takes place, that is, large crystal grains of uneven size are formed intermittently.
- the crystal grain boundary is largely different from the case of the static recrystallization, and there is no linearity in the grain boundary, and it is a feature that a crystal grain boundary mainly composed of curved portions is formed.
- This dynamic continuous recrystallization is mostly formed in cold rolling. It is also known that a clearer high angle grain boundary is grown by annealing at intentional low temperatures and bringing it into an ordinary recovery regime. In this case, it is found that the ductility is further enhanced as described below.
- cold rolling may be performed by plural rolling machines by exchanging rolling machines depending on the range of plate thickness, or pickling or polishing may be performed in order to control the surface properties.
- the ductility is enhanced, and a further preferable bending properties are obtained.
- annealing conditions it is necessary to set adequate annealing conditions to such an extent that the product value will not be lost due to extreme decline of strength.
- the annealing condition differs with the alloy system, but by selecting an appropriate annealing condition in a temperature range of 80 to 500°C and in a range of 5 to 60 minutes, an elongation of 6% or more may be easily obtained, and it is applicable to a severe bend forming.
- copper alloy of the invention include Cu-Ni-Si alloys having precipitates of intermetallic compounds of Ni and Si such as Ni 2 Si, and the copper alloys comprise Ni: 1.0 to 4.8 mass %, Si: 0.2 to 1.4 mass %, and the balance of Cu.
- the invention also includes Cu-Cr-Zr alloys having precipitates of pure Cr grains and intermetallic compounds of Cu and Zr, and the copper alloys comprise Cr: 0.02 to 0.4 mass %, Zr: 0.1 to 0.25 mass %, and balance of Cu.
- These copper alloy may be added with subsidiary components such as one or more of Sn, Fe, Ti, P, Mn, Zn, In, Mg and Ag in a total amount of 0.005 to 2 mass %.
- copper alloys having second phase particles such as other kinds of precipitates and dispersed particles may be used.
- Test pieces were sampled from the obtained plates, and the materials were tested to evaluate "grain size", “strength”, “elongation”, “bending”, and “electrical conductivity”.
- the bright fields were observed by a transmission electron microscope, and it was determined by the cut-off method of JIS H 0501 on the obtained photograph.
- the tensile strength and rupture elongation were measured.
- "bending” by bend forming using a W-bend testing machine, the bent part was observed by an optical microscope at a magnification of 50 times, and presence or absence of cracking was observed. The mark “o” indicates that cracking is absent, and the mark “x” indicates that cracking is present.
- the "electrical conductivity” was determined by measuring the electrical conductivity according to a four-point method.
- Fig. 2 is a transmission electron microscope photograph of sample No. 12 of the invention, in which the mean grain size of the formed continuous recrystallization is 1 ⁇ m or less, and its crystal grain boundary is mainly composed of curved portions and is round.
- a transmission electron microscope photograph of comparative example No. 6 is shown in Fig. 3, in which the grain size is nearly linear.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001091179 | 2001-03-27 | ||
JP2001091179 | 2001-03-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1245690A1 true EP1245690A1 (de) | 2002-10-02 |
EP1245690B1 EP1245690B1 (de) | 2006-10-11 |
Family
ID=18945850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP02006886A Expired - Lifetime EP1245690B1 (de) | 2001-03-27 | 2002-03-26 | Kupfer sowie Kupferlegierung und Verfahren zur Herstellung |
Country Status (5)
Country | Link |
---|---|
US (2) | US20020189729A1 (de) |
EP (1) | EP1245690B1 (de) |
KR (1) | KR100513943B1 (de) |
CN (1) | CN1223690C (de) |
DE (1) | DE60215240T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112005001197B4 (de) * | 2004-05-27 | 2016-11-03 | The Furukawa Electric Co., Ltd. | Verfahren zum Herstellen eines Werkstückes aus einer Kupferlegierung |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4087307B2 (ja) * | 2003-07-09 | 2008-05-21 | 日鉱金属株式会社 | 延性に優れた高力高導電性銅合金 |
JP5306591B2 (ja) * | 2005-12-07 | 2013-10-02 | 古河電気工業株式会社 | 配線用電線導体、配線用電線、及びそれらの製造方法 |
JP5355865B2 (ja) * | 2006-06-01 | 2013-11-27 | 古河電気工業株式会社 | 銅合金線材の製造方法および銅合金線材 |
CN100587091C (zh) * | 2008-09-12 | 2010-02-03 | 邢台鑫晖铜业特种线材有限公司 | 接触线用Cu-Cr-Zr合金制备工艺 |
US8876990B2 (en) * | 2009-08-20 | 2014-11-04 | Massachusetts Institute Of Technology | Thermo-mechanical process to enhance the quality of grain boundary networks |
CN104087768B (zh) * | 2014-06-25 | 2017-02-15 | 盐城市鑫洋电热材料有限公司 | 一种改善镍铬铁电热合金性能的方法 |
CN105291891A (zh) * | 2015-11-25 | 2016-02-03 | 北京力鑫科技有限公司 | 一种强化型吊弦的制作方法及电气化铁路接触网 |
JP6617313B2 (ja) * | 2017-08-03 | 2019-12-11 | Jx金属株式会社 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
CN109338314A (zh) * | 2018-12-04 | 2019-02-15 | 有研亿金新材料有限公司 | 一种超细晶铜锰合金靶材的加工方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0390374A1 (de) * | 1989-03-15 | 1990-10-03 | Ngk Insulators, Ltd. | Verfahren zur Warmverformung von Kupfer-Beryllium-Legierung und hergestelltes Erzeugnis |
JPH09256084A (ja) * | 1996-03-19 | 1997-09-30 | Hitachi Cable Ltd | 耐屈曲性銅合金線 |
JPH11222641A (ja) * | 1998-01-30 | 1999-08-17 | Furukawa Electric Co Ltd:The | 導電性ばね用銅合金及及びその製造方法 |
JP2000038628A (ja) * | 1998-07-22 | 2000-02-08 | Furukawa Electric Co Ltd:The | 半導体リードフレーム用銅合金 |
DE19954375A1 (de) * | 1998-11-17 | 2000-05-18 | Nippon Mining Co | Gewalzte Kupferfolie für eine flexible gedruckte Schaltung und Herstellungsverfahren dafür |
JP2000256766A (ja) * | 1999-03-05 | 2000-09-19 | Sanyo Special Steel Co Ltd | CuNiFe合金の熱間加工方法 |
JP2000273560A (ja) * | 1999-03-26 | 2000-10-03 | Dowa Mining Co Ltd | ワイアーボンディング性およびダイボンディング性に優れた銅及び銅基合金とその製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6251199B1 (en) * | 1999-05-04 | 2001-06-26 | Olin Corporation | Copper alloy having improved resistance to cracking due to localized stress |
-
2002
- 2002-03-25 KR KR10-2002-0016015A patent/KR100513943B1/ko not_active IP Right Cessation
- 2002-03-26 EP EP02006886A patent/EP1245690B1/de not_active Expired - Lifetime
- 2002-03-26 DE DE60215240T patent/DE60215240T2/de not_active Expired - Lifetime
- 2002-03-26 US US10/105,454 patent/US20020189729A1/en not_active Abandoned
- 2002-03-27 CN CNB021192707A patent/CN1223690C/zh not_active Expired - Fee Related
-
2008
- 2008-06-05 US US12/134,043 patent/US20080277032A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0390374A1 (de) * | 1989-03-15 | 1990-10-03 | Ngk Insulators, Ltd. | Verfahren zur Warmverformung von Kupfer-Beryllium-Legierung und hergestelltes Erzeugnis |
JPH09256084A (ja) * | 1996-03-19 | 1997-09-30 | Hitachi Cable Ltd | 耐屈曲性銅合金線 |
JPH11222641A (ja) * | 1998-01-30 | 1999-08-17 | Furukawa Electric Co Ltd:The | 導電性ばね用銅合金及及びその製造方法 |
JP2000038628A (ja) * | 1998-07-22 | 2000-02-08 | Furukawa Electric Co Ltd:The | 半導体リードフレーム用銅合金 |
DE19954375A1 (de) * | 1998-11-17 | 2000-05-18 | Nippon Mining Co | Gewalzte Kupferfolie für eine flexible gedruckte Schaltung und Herstellungsverfahren dafür |
JP2000256766A (ja) * | 1999-03-05 | 2000-09-19 | Sanyo Special Steel Co Ltd | CuNiFe合金の熱間加工方法 |
JP2000273560A (ja) * | 1999-03-26 | 2000-10-03 | Dowa Mining Co Ltd | ワイアーボンディング性およびダイボンディング性に優れた銅及び銅基合金とその製造方法 |
Non-Patent Citations (6)
Title |
---|
FERRASSE S ET AL: "MICROSTRUCTURE AND PROPERTIES OF COPPER AND ALUMINUM ALLOY 3003 HEAVILY WORKED BY EQUAL CHANNEL ANGULAR EXTRUSION", METALLURGICAL AND MATERIALS TRANSACTIONS A: PHYSICAL METALLURGY &MATERIALS SCIENCE, THE MINERALS, METALS AND MATERIALS SOCIETY, US, vol. 28A, no. 4, April 1997 (1997-04-01), pages 1047 - 1057, XP001002966, ISSN: 1073-5623 * |
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 01 30 January 1998 (1998-01-30) * |
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 13 30 November 1999 (1999-11-30) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 05 14 September 2000 (2000-09-14) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 12 3 January 2001 (2001-01-03) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 13 5 February 2001 (2001-02-05) * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112005001197B4 (de) * | 2004-05-27 | 2016-11-03 | The Furukawa Electric Co., Ltd. | Verfahren zum Herstellen eines Werkstückes aus einer Kupferlegierung |
Also Published As
Publication number | Publication date |
---|---|
DE60215240T2 (de) | 2007-05-03 |
KR100513943B1 (ko) | 2005-09-09 |
US20080277032A1 (en) | 2008-11-13 |
EP1245690B1 (de) | 2006-10-11 |
KR20020076139A (ko) | 2002-10-09 |
CN1223690C (zh) | 2005-10-19 |
US20020189729A1 (en) | 2002-12-19 |
DE60215240D1 (de) | 2006-11-23 |
CN1386873A (zh) | 2002-12-25 |
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