EP1240653A1 - Procede pour produire une structure multicouche reguliere notamment pour des condensateurs electriques a double couche, et dispositif correspondant - Google Patents

Procede pour produire une structure multicouche reguliere notamment pour des condensateurs electriques a double couche, et dispositif correspondant

Info

Publication number
EP1240653A1
EP1240653A1 EP00993554A EP00993554A EP1240653A1 EP 1240653 A1 EP1240653 A1 EP 1240653A1 EP 00993554 A EP00993554 A EP 00993554A EP 00993554 A EP00993554 A EP 00993554A EP 1240653 A1 EP1240653 A1 EP 1240653A1
Authority
EP
European Patent Office
Prior art keywords
sections
multilayer
layer
carrier material
individual
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00993554A
Other languages
German (de)
English (en)
Inventor
Klaus Schoch
Werner Erhardt
Hartmut Michel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP1240653A1 publication Critical patent/EP1240653A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/10—Multiple hybrid or EDL capacitors, e.g. arrays or modules
    • H01G11/12—Stacked hybrid or EDL capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/22—Electrodes
    • H01G11/26—Electrodes characterised by their structure, e.g. multi-layered, porosity or surface features
    • H01G11/28—Electrodes characterised by their structure, e.g. multi-layered, porosity or surface features arranged or disposed on a current collector; Layers or phases between electrodes and current collectors, e.g. adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/84—Processes for the manufacture of hybrid or EDL capacitors, or components thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/02—Machines for winding capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Definitions

  • Multi-layer structures are known in particular in the case of electrical components, in order to generally increase the performance of electrical single-layer components by arranging them one on top of the other.
  • capacitors with a multilayer structure which consist, for example, of a multiplicity of electrode layers, between each of which a dielectric is arranged.
  • the capacitor with a multilayer structure has a multiple of the capacitance that a single capacitor element, consisting of two electrode layers with a dielectric arranged in between, has.
  • the performance or the capacitance of the capacitor with a multilayer structure results from the product of the capacitance of an individual capacitor element with the number of capacitor elements.
  • JP 11-260673 A discloses a double-layer capacitor, for the manufacture of which positive and negative electrodes are alternately embedded in a band-shaped separator, which is then folded in a meandering shape, so that a stack with all ternierend arrangement of positive and negative electrodes is obtained.
  • Another advantage of a multilayer construction is that the field strength between two electrode layers increases with decreasing electrode spacing. This increased field strength is also of interest for other components, for example for a piezo actuator in a multilayer construction, in which the individual piezo actuator elements are arranged one above the other.
  • a piezo actuator with a multilayer structure can be operated with a much lower operating voltage than a correspondingly single-layer piezo actuator with the same layer thickness of piezo material or with the same maximum piezoelectrically induced deflection.
  • components with a multilayer structure can be designed or manufactured as more or less loose stacking of individual layers.
  • a firmer bond of the individual layers in the multilayer structure is required in order to give the whole thing sufficient mechanical stability.
  • a monolithic bond is sought for components with a ceramic multilayer structure.
  • the electrode layers are arranged one above the other alternately with electrically non-conductive intermediate layers.
  • a meander-shaped folded separator is used in particular, in whose “pockets” the electrode layers are inserted.
  • the electrode layers can also have a multilayer structure, in the multilayer capacitor mentioned, for example, a three-layer structure made of two porous carbon layers intermediate metallic electrode layer, for example made of aluminum.
  • the different electrode layers are stacked one on top of the other for manufacture. A separate work step is required for each layer or each layer.
  • the invention is based on the basic idea of designing the production as a continuous process, since the repetitive layer sequences in the multilayer structure also necessitate repetitive process steps.
  • the starting point is the mechanically most stable layer, which serves as a carrier material and is available in a band-shaped modification, in particular as an "endless belt".
  • the band-shaped carrier material is separated into individual sections of the desired size and shape in at least two stages. In a first partial separation, the carrier material is divided into the individual carrier sections, a load-bearing connection remaining between two individual adjacent sections, for example, which is designed in the form of a web. This enables continuous further processing of the carrier material in one piece. In the next step, at least one further material layer is applied continuously on one of the surfaces of the band-shaped carrier material. Only then are the individual sections of the desired size completely separated from one another along a predetermined dividing line, the dividing line lying above the partial separation that has already taken place.
  • the similar multilayer sections obtained in this way are then joined together by regular stacking to form a multilayer structure. If necessary, an intermediate layer can be inserted between two multilayer sections, which can also comprise a multilayer structure.
  • the method has the advantage that it can be carried out continuously and that the smallest sections to be processed are already multilayer sections which do not have to be stacked one on top of the other.
  • the multilayer sections have the advantage that they have a uniform and exact structure due to the integrated process management. This solves the problem of precise positioning within a single multilayer section.
  • Another advantage of the separation in two stages is that the base areas of the individual layers, ie the base area of the carrier sections and the at least one further material layer can be selected differently. It is thus possible to embed a material layer, in particular the carrier material, almost completely between the other material layers. In the finished component, the cut edge of the carrier material then remains visible from the outside only in the area of the webs last separated. This is particularly advantageous in the case of metallic carrier materials, which can form sharp cutting edges, which in turn can interfere with further processing or also with the handling of the component.
  • the method makes it possible not only to apply a layer of material to the carrier substrate, but also to apply additional layers simultaneously or subsequently to the same or the opposite surface. It is also possible, by means of further additional cuts, to set a different size of the sections for each individual material layer, in order to embed layers lying on the inside in the multilayer section almost completely without a cutting edge which is visible from the outside. In the multi-layer structure, only the part of the edge of the carrier material or another inner layer that is severed in the last separation step as part of the load-bearing connection is visible.
  • the separation in three steps, the load-bearing connection remaining in the first partial separation being severed after application of a further material layer in a second partial separation, although a part of the second material layer as a permanent connection between two neighboring sections should remain.
  • the three dividing lines can be placed in such a way that no cut edge of the carrier material layer is visible on the outside in the multilayer section.
  • the cutting edge of a material layer which is visible from the outside, is laid inwards with a smaller section area than other layers and is therefore not very troublesome.
  • the dividing line in the area of the load-bearing connection forms a receptacle facing the middle of the section.
  • the web is preferably cut through by punching out a circular cut-out, for example. This is of particular interest for the multilayer structure, in which the cut edge mentioned is then located in a recess that recedes from the boundary surface of the multilayer structure.
  • Figure 1 shows a schematic representation of ribbon-shaped carrier material during various work stages
  • Figure 2 shows a single multilayer section in plan view
  • FIG. 3 shows a single multilayer section in a schematic cross section
  • FIG. 4 shows a capacitor with a multilayer structure in schematic cross section
  • FIG. 5 shows a device for producing a multilayer section in a schematic cross section.
  • FIG. 1 shows a section of the carrier material 1 with different sections in different processing stages.
  • the imaginary boundaries between different sections a to h are identified by the dashed lines 2.
  • a partial separation of the carrier material 1 into individual carrier material sections for example b and c
  • various recesses 3 are separated out of the carrier material 1 with the aid of a suitable cutting or punching device.
  • a stable connection in the form of a web 4 remains between the two partially separated sections c and d, which ensures the further processing of the film 1 as an “endless material”.
  • a continuous connection between the sections a to f is obtained above the punched-out areas 3, in which no separation into sections has taken place.
  • a further layer of material is applied to the carrier material, in the present case a carbon cloth 5 for the capacitor application mentioned.
  • This further layer of material can be applied over the entire surface, but for the capacitor application in such a way that the upper edge strip in the figure remains uncovered.
  • the carbon cloth is also applied in such a way that it projects beyond the edge of the carrier material 1 shown in FIG. 1 below with a narrow strip.
  • another can likewise be placed on the underside of the carrier material 1 in a corresponding manner
  • Material layer are applied, here a further carbon cloth for the capacitor, which is not shown in the figure for the sake of clarity.
  • a single multilayer section 8 is obtained, which is shown for example in FIG. 2.
  • the carbon cloth 5 overlaps the section of the carrier material 1 on all sides and, seen from above, only has the cutting edge in the area of the circular punch 10 in common with it. Only the tab 9, which is used for contacting in the later use of the multilayer section as an electrode unit in a capacitor with a multilayer structure, still protrudes as part of the carrier material 1 from the multilayer section 8 covered with carbon cloth 5.
  • the multilayer section 8 has only a loose connection between the individual layers.
  • the connection between the carbon cloth 5 and the aluminum foil 1 serving as the carrier material is produced only by the contact pressure of transport rollers.
  • the separated multilayer sections 8 are therefore preferably processed further immediately.
  • the multilayer sections 8 are stacked one above the other, an electrically non-conductive material being arranged as a separator between each two multilayer sections 8.
  • a separator Preferably, a likewise band-shaped, electrically insulating, but permeable to ions foil is used as the separator material, which is folded in a meandering shape.
  • FIG. 4 shows how the prepared multilayer sections 8 are introduced into the pockets of this meander-shaped separator film 12, a regular multilayer structure 13 being produced. Up to 100 multilayer sections with separator 12 in between can be arranged for a capacitor.
  • the individual multilayer sections are preferably rotated alternately by 180 °, so that the tabs 9 made of aluminum foil protrude from the multilayer structure 13 on different sides.
  • the multilayer structure 13 is introduced into a housing, the tabs are welded to one another and to the housing, and the housing is then filled with a solvent and with conductive salt.
  • Possible dimensions for such a capacitor with a multilayer structure range from approx. 16x30x55 mm for a capacitor with approx. 100 F to dimensions of 60x60x160 mm for a capacitor with approx. 2700 F.
  • FIG. 5 shows a device in a schematic representation as it is suitable for producing multilayer sections 8.
  • This comprises a first feed device for a band-shaped carrier material 1, for example consisting of a supply roll 15 and at least one deflection and transport roller 19. With this the band-shaped carrier material 1 is transported in the processing direction x.
  • the device 18 is a partial separation of the band-shaped carrier material 1 into individual sections, for example according to the punchings 3 in FIG. 1.
  • FIG. 5 shows a possible further feed device for a band-shaped third material layer 14, which here comprises a supply roll 16 and at least two further transport and deflection rolls.
  • this second punching device 22 is designed for the complete separation of the material strip, which here consists of three layers and was previously connected.
  • this second punching device 22 is schematically designed as a cutting knife. This results in isolated multilayer sections 8, which can now be used to produce a multilayer structure 13 by stacking one on top of the other.
  • the production of a multilayer structure which is described only by way of example using an exemplary embodiment, can also be varied in a simple manner for other applications, in particular the materials, the number of further layers and the shape of the sections or the cut for the partial and complete separation of the sections can be varied. Overall, the method is ideally suited for a fully automatic process, with which a secure positioning of the individual layers relative to one another is ensured, at least in the multilayer section. On cumbersome handling of individual layer sections is no longer necessary.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention vise à produire une structure multicouche comportant des suites de couches récurrentes. A cet effet, un matériau support en forme de bande (1) est tout d'abord divisé partiellement en sections individuelles de dimensions identiques, entre lesquelles demeurent des jonctions stables (4). Après application en continu d'au moins une autre couche de matériau (6) sur la surface du matériau support, les sections individuelles sont entièrement séparées par découpage ou estampage. La structure multicouche s'obtient par superposition des sections multicouches ainsi formées, des couches intermédiaires pouvant éventuellement être intercalées entre deux sections multicouches.
EP00993554A 1999-12-21 2000-12-04 Procede pour produire une structure multicouche reguliere notamment pour des condensateurs electriques a double couche, et dispositif correspondant Withdrawn EP1240653A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19961840 1999-12-21
DE19961840A DE19961840C1 (de) 1999-12-21 1999-12-21 Verfahren zur Herstellung eines regelmäßigen Mehrschichtsaufbaus für insbesondere elektrische Doppelschichtkondensatoren und Vorrichtung dafür
PCT/DE2000/004315 WO2001046973A1 (fr) 1999-12-21 2000-12-04 Procede pour produire une structure multicouche reguliere notamment pour des condensateurs electriques a double couche, et dispositif correspondant

Publications (1)

Publication Number Publication Date
EP1240653A1 true EP1240653A1 (fr) 2002-09-18

Family

ID=7933688

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00993554A Withdrawn EP1240653A1 (fr) 1999-12-21 2000-12-04 Procede pour produire une structure multicouche reguliere notamment pour des condensateurs electriques a double couche, et dispositif correspondant

Country Status (11)

Country Link
US (1) US6740351B2 (fr)
EP (1) EP1240653A1 (fr)
JP (1) JP2003529918A (fr)
KR (1) KR20020065589A (fr)
CN (1) CN1413352A (fr)
BR (1) BR0016556A (fr)
CA (1) CA2395261A1 (fr)
DE (1) DE19961840C1 (fr)
HU (1) HUP0203508A2 (fr)
RU (1) RU2002119403A (fr)
WO (1) WO2001046973A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10203143A1 (de) * 2002-01-28 2003-08-07 Epcos Ag Elektroden, deren Herstellung und Kondensatoren mit den Elektroden
DK1528972T3 (da) * 2002-08-16 2008-01-21 Fraunhofer Ges Forschung Folier forsynet med et udstansningsmönster og foliekompositter, navnlig til fremstillingen af elektrokemiske komponenter
DE10261920A1 (de) * 2002-12-13 2004-07-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mit einem Stanzmuster versehene Folien und Folienverbünde, insbesondere für die Fertigung von elektrochemischen Bauelementen auf Folienbasis
DE10302119A1 (de) * 2003-01-21 2004-07-29 Epcos Ag Elektrode für eine elektrochemische Zelle, Elektrodenwickel und elektrochemische Zelle
JP4311144B2 (ja) * 2003-09-19 2009-08-12 株式会社村田製作所 カット装置およびカット方法
KR101079497B1 (ko) * 2010-02-16 2011-11-03 삼성전기주식회사 전기 이중층 커패시터 셀과 전기 이중층 커패시터의 제조방법 및 전기 이중층 커패시터 셀의 제조장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3616039A (en) * 1968-12-06 1971-10-26 Union Carbide Corp Method of making a laminated capacitor
US4531281A (en) * 1983-04-18 1985-07-30 Industrial Electronic Rubber Company Method useful in the manufacture of electrolytic capacitors
US4603467A (en) * 1984-05-25 1986-08-05 Marcon Electronics Co., Ltd. Method of manufacturing chip-type aluminum electrolytic capacitor
CH680823A5 (fr) * 1990-08-17 1992-11-13 Kobe Properties Ltd
US5621607A (en) 1994-10-07 1997-04-15 Maxwell Laboratories, Inc. High performance double layer capacitors including aluminum carbon composite electrodes
US5922168A (en) * 1995-09-28 1999-07-13 Pacific Trinetics Corporation Apparatus for making laminated electrical and electronic devices
DE19704584C2 (de) * 1997-02-07 1999-02-25 Dornier Gmbh Doppelschichtkondensator aus mehreren Doppelschichtkondensatoreinzelzellen, verwendbar als Energiespeicher, Stromquelle oder elekronisches Bauteil
US5922215A (en) * 1996-10-15 1999-07-13 Pacesetter, Inc. Method for making anode foil for layered electrolytic capacitor and capacitor made therewith
US6134760A (en) 1997-09-22 2000-10-24 Mushiake; Naofumi Process for manufacturing electric double layer capacitor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0146973A1 *

Also Published As

Publication number Publication date
RU2002119403A (ru) 2004-02-20
CA2395261A1 (fr) 2001-06-28
DE19961840C1 (de) 2001-07-05
US20030003685A1 (en) 2003-01-02
JP2003529918A (ja) 2003-10-07
US6740351B2 (en) 2004-05-25
HUP0203508A2 (en) 2003-03-28
BR0016556A (pt) 2002-09-10
KR20020065589A (ko) 2002-08-13
WO2001046973A1 (fr) 2001-06-28
CN1413352A (zh) 2003-04-23

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