EP1221174A1 - Verfahren und gerät zum ätzen und beschichten mittels mikroplasmen - Google Patents

Verfahren und gerät zum ätzen und beschichten mittels mikroplasmen

Info

Publication number
EP1221174A1
EP1221174A1 EP00973456A EP00973456A EP1221174A1 EP 1221174 A1 EP1221174 A1 EP 1221174A1 EP 00973456 A EP00973456 A EP 00973456A EP 00973456 A EP00973456 A EP 00973456A EP 1221174 A1 EP1221174 A1 EP 1221174A1
Authority
EP
European Patent Office
Prior art keywords
electrode
substrate
plasma
dielectric layer
voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00973456A
Other languages
English (en)
French (fr)
Inventor
Yogesh B. Gianchandani
Chester G. Wilson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wisconsin Alumni Research Foundation
Original Assignee
Wisconsin Alumni Research Foundation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wisconsin Alumni Research Foundation filed Critical Wisconsin Alumni Research Foundation
Publication of EP1221174A1 publication Critical patent/EP1221174A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32366—Localised processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
EP00973456A 1999-10-12 2000-10-11 Verfahren und gerät zum ätzen und beschichten mittels mikroplasmen Withdrawn EP1221174A1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15881799P 1999-10-12 1999-10-12
US158817P 1999-10-12
PCT/US2000/028083 WO2001027969A1 (en) 1999-10-12 2000-10-11 Method and apparatus for etching and deposition using micro-plasmas

Publications (1)

Publication Number Publication Date
EP1221174A1 true EP1221174A1 (de) 2002-07-10

Family

ID=22569839

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00973456A Withdrawn EP1221174A1 (de) 1999-10-12 2000-10-11 Verfahren und gerät zum ätzen und beschichten mittels mikroplasmen

Country Status (4)

Country Link
EP (1) EP1221174A1 (de)
AU (1) AU1196001A (de)
CA (1) CA2387432C (de)
WO (1) WO2001027969A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE245310T1 (de) * 2000-03-14 2003-08-15 Fraunhofer Ges Forschung Verfahren und vorrichtung zur plasmagestützten oberflächenbehandlung und verwendung des verfahrens
DE10129313C1 (de) * 2001-06-19 2002-11-21 Fraunhofer Ges Forschung Sputterverfahren und Vorrichtung zur Beschichtung und/oder Oberflächenbehandlung von Substraten
WO2004070819A1 (ja) * 2003-02-05 2004-08-19 Semiconductor Energy Laboratory Co., Ltd. 表示装置の製造方法
US7824520B2 (en) * 2003-03-26 2010-11-02 Semiconductor Energy Laboratory Co., Ltd. Plasma treatment apparatus
DE102005042754B4 (de) * 2005-09-08 2008-09-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur selektiven Plasmabehandlung von Substraten zur Vorbehandlung vor einem Beschichtungs- oder Bondprozess
WO2009148305A1 (en) * 2008-06-06 2009-12-10 Fujifilm Manufacturing Europe B.V. Method and apparatus for plasma surface treatment of moving substrate
KR101594464B1 (ko) * 2013-10-02 2016-02-18 아주대학교산학협력단 마이크로 플라즈마 분사 소자, 적층형 마이크로 플라즈마 분사 모듈 및 마이크로 플라즈마 분사 소자의 제작 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5302237A (en) * 1992-02-13 1994-04-12 The United States Of America As Represented By The Secretary Of Commerce Localized plasma processing
US5688415A (en) * 1995-05-30 1997-11-18 Ipec Precision, Inc. Localized plasma assisted chemical etching through a mask
DE19826418C2 (de) * 1998-06-16 2003-07-31 Horst Schmidt-Boecking Vorrichtung zur Erzeugung eines Plasma sowie ein Herstellungsverfahren für die Vorrichtung sowie Verwendung der Vorrichtung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0127969A1 *

Also Published As

Publication number Publication date
CA2387432A1 (en) 2001-04-19
AU1196001A (en) 2001-04-23
CA2387432C (en) 2010-02-09
WO2001027969A1 (en) 2001-04-19

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