EP1191559A2 - Microcommutateur et son procédé de fabrication - Google Patents

Microcommutateur et son procédé de fabrication Download PDF

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Publication number
EP1191559A2
EP1191559A2 EP01120498A EP01120498A EP1191559A2 EP 1191559 A2 EP1191559 A2 EP 1191559A2 EP 01120498 A EP01120498 A EP 01120498A EP 01120498 A EP01120498 A EP 01120498A EP 1191559 A2 EP1191559 A2 EP 1191559A2
Authority
EP
European Patent Office
Prior art keywords
contact elements
microswitch
carrier substrate
contact
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01120498A
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German (de)
English (en)
Other versions
EP1191559A3 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Little Things Factory GmbH
Original Assignee
Little Things Factory GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Little Things Factory GmbH filed Critical Little Things Factory GmbH
Publication of EP1191559A2 publication Critical patent/EP1191559A2/fr
Publication of EP1191559A3 publication Critical patent/EP1191559A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/64—Protective enclosures, baffle plates, or screens for contacts
    • H01H1/66—Contacts sealed in an evacuated or gas-filled envelope, e.g. magnetic dry-reed contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0078—Switches making use of microelectromechanical systems [MEMS] with parallel movement of the movable contact relative to the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H36/00—Switches actuated by change of magnetic field or of electric field, e.g. by change of relative position of magnet and switch, by shielding
    • H01H2036/0093—Micromechanical switches actuated by a change of the magnetic field
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H36/00—Switches actuated by change of magnetic field or of electric field, e.g. by change of relative position of magnet and switch, by shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/005—Details of electromagnetic relays using micromechanics

Definitions

  • the present invention relates to a microswitch at least two electrically conductive, with external circuit units connectable contact elements, their relative Position relative to each other can be changed by an impressed magnetic force is, wherein at least one magnetizable contact element is movably mounted, so that at least two switching states are adjustable.
  • the invention also relates to a method for manufacturing of such a microswitch.
  • EP 0 874 379 A1 describes a magnetically operated Microswitch and a manufacturing process therefor described.
  • the microswitch shown has two contact elements, which are arranged parallel to a substrate surface are. However, these contact elements are different Levels formed, so that relatively many manufacturing steps must be executed. When the magnetic force acts the movable contact element perpendicular to the substrate surface be moved.
  • microswitches that are as small as possible are constantly increasing, because new fields of application are constantly being developed.
  • microswitch are used, for example, to monitor the status of housing flaps, keyboard covers, etc. used.
  • microswitches can be used for level indicators Monitoring the end position of moving elements in automation technology and as sensors in security technology are used, but here are only a few possible fields of application were called.
  • the magnetic force acting on the contact elements is at a given magnetic field approximately square depending on the thickness of the respective contact elements. If you consider the contact element as a leaf spring at the same time, this increases from the deformation of the leaf spring resulting restoring force approximately cubic with the thickness of the Spring on and falls approximately cubically with the length of the leaf spring.
  • the magnetic force F M and the restoring force F R are directed in opposite directions.
  • the difference between the magnetic force and the restoring force results in the contact force F K , which must not fall below a predetermined value in order to produce a correspondingly low electrical contact resistance between the contact elements. If the contact elements are to be shortened, the thickness of the contact elements must be reduced accordingly so that the restoring force does not become too great. However, this also reduces the magnetic force and thus the resulting contact force. It is generally assumed that the contact force F K should not be less than 1 mN. The size of the air gap remaining between the contact elements cannot be reduced to a certain extent if a given dielectric strength is to be maintained.
  • a microswitch solved in which at least the magnetizable contact element is designed as a thin plate that is substantially parallel is movable to a carrier substrate, and that both Contact elements in a plane parallel to the carrier substrate are arranged, each having a side surface of the contact elements serves as a button.
  • This structure of the microswitch enables another Reduction of the external dimensions as it is due to the special Construction of the contact elements succeeds, sufficiently high Provide contact forces, although the magnetic force is relative is small.
  • the proposed structure enables Manufacture of the microswitch using in the Semiconductor technology or microsystem technology usual process technologies saving procedural steps, since the Contact elements are arranged in one plane and thereby in same cycle can be produced. Deviating from known solutions, the contact elements are not vertical but moved parallel to the substrate surface.
  • a particularly preferred embodiment of the microswitch is characterized in that both contact elements designed as magnetizable plates with movable bearings are in a plane parallel to the carrier substrate lie and over spacers with the through contacts are connected.
  • the two contact elements are preferably largely identical, which also makes the production of the microswitch is simplified. In these embodiments will have the benefits of providing a sufficiently high contact force is particularly effective because of both contact elements the magnetic force acts and in both Contact elements only a relatively low restoring force (based on the size of the contact elements) compensated must become.
  • the contact elements are preferably made made of thin metallic layers with soft magnetic Characteristics.
  • the spring elements can be meandering be formed, each with one or more meanders be provided depending on the desired spring action. In this context it should be noted that the restoring force must not be too small to adhere to prevent the buttons.
  • the spring elements can also be designed as parallel springs or with one Joint can be combined if the contact elements to Carry out an angular or rotary movement should.
  • the method steps mentioned are under Application of technologies known from semiconductor technology carried out.
  • microswitch For permanent use of the microswitch and It is protection of the buttons against erosion and corrosion expedient to encapsulate the microswitch in a housing, which is filled with protective gas. It can also be useful be the formwork surfaces with a special contact material (e.g. gold, palladium-nickel).
  • a special contact material e.g. gold, palladium-nickel
  • Fig. 1 shows a simplified perspective view a carrier substrate 1, which is the base plate of a microswitch forms.
  • the carrier substrate 1 consists of electrical non-conductive material, such as silicon dioxide, if the microswitch on a section of a conventional one Wafer is manufactured.
  • the Microswitch has only two contact elements. There are however, embodiments are also possible in which several Contact elements are used.
  • the carrier substrate 1 has that shown in FIG. 1 Example two through holes, one in each Through contact 2 is positioned, which is made of electrical conductive material, mostly a special metal alloy, consists. Are on the underside of the carrier substrate 1 Connection points 3 are provided, which are electrically connected to the through contacts 2 are connected.
  • the connection points 3 serve the subsequent contacting of the microswitch with external ones Components or circuit units.
  • the connection points 3 be designed as soldering points when the Microswitch used as an SMD component on printed circuit boards becomes.
  • the through holes can be used in the manufacture of the microswitch by etching or by laser processing in the Carrier substrate 1 are introduced.
  • the through contacts 2 in a further process step in the through holes arranged.
  • spacers 5 are formed over the through contacts, which consist of electrically conductive material and are electrically connected to the through contacts 2.
  • the Spacers 5 rise after the completion of the Microswitch over the carrier substrate 1 to an air gap between the contact elements and the carrier substrate 1 provide. This air gap primarily serves the unhindered Movement of the contact elements.
  • the generation of the Spacers and the contact elements on the carrier substrate is described in more detail below.
  • Fig. 2 shows the completed in a perspective view Microswitch, one conveniently to be provided Housing is not shown.
  • two contact elements 6 are arranged, which consist of electrically conductive material exist, which additionally should have good magnetic properties since the microswitch actuated by an external magnetic force becomes.
  • a soft magnetic material i.e. height Permeability ⁇ , low remanence and low coercivity.
  • Each contact element 6 consists of a plate 7, an air gap 8 in the non-actuated state exists between the two plates 7, which should be large enough must to prevent voltage flashovers. The end faces the plates 7 thus form the buttons of the contact elements.
  • Each plate 7 is connected to a spring element 10 Bearing 11 attached.
  • the spring element 10 a double-sided meandering spring, the a movement of the adjoining plate 7 in the longitudinal direction allows.
  • the camp 11 is attached to the spacer, creating a good electrical Connection is ensured.
  • the excess material areas can be etched or cut out by laser processing become. With other methods, the required Material areas or structures through application processes generated.
  • a magnetic field with a the plates move in a suitable field orientation 7 towards each other, as shown by the center Arrow is shown.
  • the movement takes place in parallel to the surface of the carrier substrate.
  • the air gap 8 will closed and the two buttons on the End faces of the plates 7 make electrical contact ago. If the magnetic force no longer acts, they cause restoring forces provided by the spring elements 10 a backward movement so that the buttons the plates 7 are separated from each other.
  • the special one Design of the spring elements 10 enables relatively small Restoring forces so that the induced in the plates 7 Magnetic force is sufficiently large to the required contact force to provide at the buttons.
  • Fig. 3 shows a simplified view from above modified embodiment of the contact elements, the Carrier substrate 1 is not shown.
  • the contact elements each consist of plates 7, on the end face the buttons are formed, each a spring element 10, which is designed as a double meander spring, and assigned bearings 11.
  • the special feature is this Embodiment in that the spring element 10 only on one Side is positioned and on the other side of the contact element a film joint 15 is provided in each case.
  • the Buttons of the plates 7 are again opposite one another, however, they run obliquely to the longitudinal extent of the contact elements.
  • the air gap 8 is thus also arranged obliquely.
  • FIG. 4 shows the two contact elements from FIG. 3 in one State in which the buttons make electrical contact have produced, i.e. a magnetic force on the contact elements acts.
  • a magnetic force on the contact elements acts.
  • the two spring elements 10 deformed so that a rotational movement around the film joints 15. Move the two buttons towards each other until they have the desired contact force be pressed together.
  • FIG. 5 Another modified embodiment of the contact elements 5 is a simplified top view of FIG. 5 shown.
  • the contact elements formed here correspond largely the embodiment of FIG. 2, however the spring elements 10 designed as double meander springs. By these changed spring elements changes the resulting one Spring constant for the force-displacement characteristic of the spring element is characteristic.
  • FIG. 6 shows the contact elements from FIG. 5 in a position, in which the front buttons of the panels 7 are electrically contacted, i.e. the magnetic force acts the contact elements.
  • the front buttons of the panels 7 are electrically contacted, i.e. the magnetic force acts the contact elements.
  • Fig. 7 shows a simplified view from above fourth embodiment of the contact elements.
  • spring elements 10 two parallel springs are used here, the on the outside of the plates 7, the connection to the bearings 11 manufacture. Since the two contact elements at least would be arranged in sections next to each other same size of housing of the microswitch a reduction the magnetically effective surface of the plates 7, so that the effective magnetic force is also reduced.
  • About the downsizing to compensate for the area at least partially extends between each of the parallel springs 10 tongue-shaped extension 18 of the plates 7. On the restoring force the tongue-shaped extension 18 has none Influence, since it is not part of the parallel springs 10. However, it increases the resulting magnetic force, which results in ultimately a higher contact force on the buttons results.
  • the embodiment shown in Fig. 7 forms a section of the side faces of the plates 7 the button so that the air gap 8 parallel to the longitudinal extent the contact elements runs.
  • Fig. 8 the contact elements from Fig. 7 are in one position shown in which the buttons of the plates 7 touch each other and make the electrical contact.
  • the magnetic force field act in a different direction must, as is the case with the aforementioned embodiments was.
  • the contact elements There are other design forms of the contact elements possible. It should always be noted that the spring elements are designed so that a sufficiently high contact force results.
  • FIG. 9 shows several sectional views of different ones Stages in a manufacturing process to form several Microswitches on the carrier substrate. Based on this Sectional views become a preferred variant of the method described for the manufacture of the microswitch.
  • the electrical non-conductive carrier substrate 1 through holes introduced, in which the through contacts 2 are arranged.
  • a sacrificial layer 22 fully applied in the areas of through contacts 2 is selectively removed. Serves as the sacrificial layer 22 for example aluminum.
  • photo etching techniques can be used.
  • a third method section 23 no further increase structuring start layer 24 applied.
  • the starting layer 24 in turn consists of electrically conductive material, so that an electrical connection to the through contacts 2 is maintained.
  • a photoresist layer 26 on the starting layer 24 applied according to the desired structures of the Contact elements exposed and by developing the photoresist layer 26 structured.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacture Of Switches (AREA)
EP01120498A 2000-09-01 2001-08-28 Microcommutateur et son procédé de fabrication Withdrawn EP1191559A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2000143549 DE10043549C1 (de) 2000-09-01 2000-09-01 Mikroschalter und Verfahren zu dessen Herstellung
DE10043549 2000-09-01

Publications (2)

Publication Number Publication Date
EP1191559A2 true EP1191559A2 (fr) 2002-03-27
EP1191559A3 EP1191559A3 (fr) 2005-03-02

Family

ID=7654940

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01120498A Withdrawn EP1191559A3 (fr) 2000-09-01 2001-08-28 Microcommutateur et son procédé de fabrication

Country Status (2)

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EP (1) EP1191559A3 (fr)
DE (1) DE10043549C1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1441375A1 (fr) * 2002-07-31 2004-07-28 Matsushita Electric Works, Ltd. Micro-relais
EP1856708A2 (fr) * 2005-03-04 2007-11-21 HT Microanalytical, Inc. Dispositif de commutation miniature
WO2008155296A2 (fr) * 2007-06-20 2008-12-24 Epcos Ag Composant fixé avec un niveau de contrainte réduit
US9284183B2 (en) 2005-03-04 2016-03-15 Ht Microanalytical, Inc. Method for forming normally closed micromechanical device comprising a laterally movable element

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10048880C2 (de) * 2000-09-29 2003-04-24 Little Things Factory Gmbh Mikroschalter und Verfahren zu dessen Herstellung

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5430421A (en) * 1992-12-15 1995-07-04 Asulab S.A. Reed contactor and process of fabricating suspended tridimensional metallic microstructure
EP0688033A1 (fr) * 1994-06-17 1995-12-20 Asulab S.A. Microcontacteur magnétique et son procédé de fabrication
US5644177A (en) * 1995-02-23 1997-07-01 Wisconsin Alumni Research Foundation Micromechanical magnetically actuated devices
DE19646667A1 (de) * 1996-11-12 1998-05-14 Fraunhofer Ges Forschung Verfahren zum Herstellen eines mikromechanischen Relais
EP0874379A1 (fr) * 1997-04-23 1998-10-28 Asulab S.A. Micro-contacteur magnétique et son procédé de fabrication
DE19800189A1 (de) * 1998-01-05 1999-07-22 Fraunhofer Ges Forschung Mikromechanischer Schalter und Verfahren zur Herstellung desselben
EP1119012A2 (fr) * 2000-01-20 2001-07-25 Cronos Integrated Microsystems, Inc. Interrupteur micromécanique actionné magnétiquement et matrice de commutation associée

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3243387A1 (de) * 1982-11-24 1984-05-24 Elektro-Apparate-Fabrik J. Hüngerle GmbH & Co KG, 7705 Steißlingen U-foermige kontaktfeder fuer hochspannungs-anschlussstecker, insbesondere fuer fernsehbildroehren

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5430421A (en) * 1992-12-15 1995-07-04 Asulab S.A. Reed contactor and process of fabricating suspended tridimensional metallic microstructure
EP0688033A1 (fr) * 1994-06-17 1995-12-20 Asulab S.A. Microcontacteur magnétique et son procédé de fabrication
US5644177A (en) * 1995-02-23 1997-07-01 Wisconsin Alumni Research Foundation Micromechanical magnetically actuated devices
DE19646667A1 (de) * 1996-11-12 1998-05-14 Fraunhofer Ges Forschung Verfahren zum Herstellen eines mikromechanischen Relais
EP0874379A1 (fr) * 1997-04-23 1998-10-28 Asulab S.A. Micro-contacteur magnétique et son procédé de fabrication
DE19800189A1 (de) * 1998-01-05 1999-07-22 Fraunhofer Ges Forschung Mikromechanischer Schalter und Verfahren zur Herstellung desselben
EP1119012A2 (fr) * 2000-01-20 2001-07-25 Cronos Integrated Microsystems, Inc. Interrupteur micromécanique actionné magnétiquement et matrice de commutation associée

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1441375A1 (fr) * 2002-07-31 2004-07-28 Matsushita Electric Works, Ltd. Micro-relais
EP1441375A4 (fr) * 2002-07-31 2007-03-28 Matsushita Electric Works Ltd Micro-relais
EP1856708A2 (fr) * 2005-03-04 2007-11-21 HT Microanalytical, Inc. Dispositif de commutation miniature
EP1856708A4 (fr) * 2005-03-04 2011-05-04 Ht Microanalytical Inc Dispositif de commutation miniature
US8258900B2 (en) 2005-03-04 2012-09-04 Ht Microanalytical, Inc. Miniaturized switch device
US9284183B2 (en) 2005-03-04 2016-03-15 Ht Microanalytical, Inc. Method for forming normally closed micromechanical device comprising a laterally movable element
WO2008155296A2 (fr) * 2007-06-20 2008-12-24 Epcos Ag Composant fixé avec un niveau de contrainte réduit
WO2008155296A3 (fr) * 2007-06-20 2009-03-26 Epcos Ag Composant fixé avec un niveau de contrainte réduit
US20100176899A1 (en) * 2007-06-20 2010-07-15 Epcos Ag Component having stress-reduced mounting
US8624466B2 (en) * 2007-06-20 2014-01-07 Epcos Ag Component having stress-reduced mounting
DE102007028292B4 (de) 2007-06-20 2019-06-19 Snaptrack, Inc. Bauelement mit spannungsreduzierter Befestigung

Also Published As

Publication number Publication date
DE10043549C1 (de) 2002-06-20
EP1191559A3 (fr) 2005-03-02

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