EP1269506B1 - Systeme de microactionneurs - Google Patents

Systeme de microactionneurs Download PDF

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Publication number
EP1269506B1
EP1269506B1 EP01919213A EP01919213A EP1269506B1 EP 1269506 B1 EP1269506 B1 EP 1269506B1 EP 01919213 A EP01919213 A EP 01919213A EP 01919213 A EP01919213 A EP 01919213A EP 1269506 B1 EP1269506 B1 EP 1269506B1
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EP
European Patent Office
Prior art keywords
micro actuator
thermomechanical
micro
actuator
arrangement according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP01919213A
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German (de)
English (en)
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EP1269506A1 (fr
Inventor
Hans Joachim Quenzer
Bernd Wagner
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Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
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Publication of EP1269506A1 publication Critical patent/EP1269506A1/fr
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Publication of EP1269506B1 publication Critical patent/EP1269506B1/fr
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H61/00—Electrothermal relays
    • H01H61/02—Electrothermal relays wherein the thermally-sensitive member is heated indirectly, e.g. resistively, inductively
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0042—Bistable switches, i.e. having two stable positions requiring only actuating energy for switching between them, e.g. with snap membrane or by permanent magnet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H61/00—Electrothermal relays
    • H01H2061/006—Micromechanical thermal relay

Definitions

  • the present invention relates to a microactuator arrangement with a substrate having a first thermo-mechanical microactuator and a second thermo-mechanical microactuator, wherein the first thermo-mechanical microactuator is deflected in a thermal excitation substantially parallel to the surface of the substrate.
  • the Mikroaktoran angel is particularly suitable for use as a micro-relay.
  • Micro-relays are increasingly replacing conventional electromechanical relays because they can be manufactured at a lower cost and with less space required, and because of their size also achieve shorter switching times.
  • these micro-relays are usually realized on the basis of microactuators, which operate on the electrostatic action principle.
  • these electrostatic micro-relays are characterized by relatively small travel ranges and small actuating forces of the microactuators, which on the one hand leads to problems with regard to the dielectric strength of the microrelay and, on the other hand, to problems due to increased contact wear.
  • thermomechanical microactuators which are used in other areas of microsystems technology, are distinguished above all by the generation of comparatively large actuating forces and travel ranges with at the same time moderate power consumption. In microsystem technology, they are used primarily for the construction of micro-actuators that require the greatest possible actuating forces and travel ranges. An example of this is the use in microvalves. Since for the operation of thermal microactuators usually electrical power in the range of a few 100 mW are required, thermal drives are mainly primarily for the construction of individual control elements in question. However, a particular disadvantage of thermo-mechanical microactuators proves that a thermomechanical microactuator for holding its deflected state induced by thermal excitation (ON state) must be heated continuously by supplying energy. For this reason, thermo-mechanical micro-sensors in micro-relays as well as for a variety of other applications are not used or only in exceptional cases.
  • thermo-mechanical microactuators according to the preamble of claim 1.
  • a microactuator here is a single or a plurality of juxtaposed bar-shaped elements used parallel to a substrate surface at both ends clamped to the substrate and in a Preferred direction are biased parallel to the substrate surface. By heating the beam-shaped elements they expand in the clamped state, so that a deflection in the preferred direction results parallel to the substrate surface. This deflection movement can be used, for example, to open or close a valve opening in the substrate.
  • the thermo-mechanical microactuators of this document can not be used without the above disadvantages in a micro-relay, in which individual switching states must be kept for a long time.
  • thermomechanical microrelay disclosed in J.-Y. Lee et al., "A characterization of thermal parameters of thermally driven polysilicon microbridge actuators using electrical impedance analysis", Sensors and Actuators A75 (1999), 86-92.
  • a bridge-shaped polysilicon membrane is deflected by heating perpendicular to the substrate surface to connect electrical contacts.
  • keeping this connection requires constant power input.
  • thermo-mechanical actuators From WO 99/16096 a micro-relay of a plurality of identically constructed thermo-mechanical actuators is known, which are clamped on bar-shaped elements at both ends of the substrate. By heating the bar-shaped elements, a deflection of the two actuators is caused parallel to the substrate surface. About a mechanical locking mechanism, a lateral hooking with the second actuator, one of the actuators can be held without current in a certain position. The lock can be released again by actuating the second actuator.
  • the object of the present invention is to provide a further Mikroaktoran angel that allows switching between at least two switching states with great force and large travel, the respective switching states can be held without power.
  • the present microactuator arrangement consists of a substrate with at least two thermomechanical microactuators.
  • a first thermomechanical microactuator is arranged in a manner known from the prior art on the substrate, wherein it is deflected in a thermal excitation substantially parallel to the surface of the substrate, that carries out its actuating movement substantially parallel to the surface.
  • the second thermomechanical microactuator on the one hand is designed such that it is deflected at a thermal excitation substantially perpendicular to the surface of the substrate, ie performs its adjusting movement substantially perpendicular to the substrate surface.
  • the second thermo-mechanical microactuator is arranged relative to the first thermomechanical microactuator such that a portion of the first thermo-mechanical microactuator at a thermal excitation to below a portion of the second thermo-mechanical microactuator - in the deflected state - extends.
  • the second thermomechanical microactuator performs an actuator motion substantially perpendicular to the substrate surface, a portion of the first thermo-mechanical microactuator is in a deflected state between a portion of the second thermo-mechanical microactuator and the substrate surface, such that that portion of the first thermo-mechanical microactuator will shut off the second thermo-mechanical microactuator thermomechanical microactuator is clamped by this.
  • thermo-mechanical microactuators thus makes it possible to keep the switching state (ON state) of the first thermo-mechanical microactuator powerless.
  • first both thermo-mechanical microactuators are switched on, ie thermally excited, so that a first section of the first thermo-mechanical microactuator moves below a second section of the second thermo-mechanical microactuator.
  • the second thermo-mechanical microactuator is turned off, thereby clamping the first portion of the first thermo-mechanical microactuator. If this is then also switched off by interrupting the supply of heat, it remains in the deflected position, since it is held in this position by the clamping action of the switched-off second thermo-mechanical microactuator.
  • thermo-mechanical microactuator This holding position is on the one hand by the friction between the two microactuators and on the other hand by the high restoring force, with the second thermal Mikroaktor takes his rest position allows. In this way, the deflected state of the first thermo-mechanical microactuator is held without further energy supply, that is, without power. To release this holding position, it is only necessary to briefly turn on the second thermo-mechanical microactuator, whereby the holding position is released and the first thermo-mechanical microactuator returns to its rest position (OFF state), in which he also remains without energy.
  • thermomechanical microactuators in order to be able to use two switching states with the aid of thermomechanical microactuators, it is possible to use the large actuating forces and actuating strokes of thermomechanical microactuators even in areas for which they were hitherto unsuitable.
  • the present Mikroaktoranssen is particularly suitable for use in micro-relays, but can of course be used for other applications such as micro valves.
  • the use of the present microactuator arrangement makes it possible, especially when used in micro-relays, to combine comparatively large travel ranges with a relatively large contact pressure on the contacts to be bridged.
  • the first thermomechanical actuator also referred to below as a lateral actuator
  • a lateral actuator can in this case be designed so that it enables strokes or travel ranges of 50-80 ⁇ m. Through these large travel paths, the electrical contacts in the relay can have a greater mutual distance, so that on the one hand increases the dielectric strength of the relay and on the other hand, a crosstalk between each Lines is reduced.
  • the second thermo-mechanical actuator hereinafter also referred to as a z-actuator, which holds the lateral actuator in a deflected position develops pressure forces in the rest position in the range of 10 mN-50 mN and more.
  • the lateral actuator thus provides for the large stroke while the z-actuator for closing the relay contacts provides the large pressure force, since he presses the lateral actuator with this pressure force against the substrate surface on which the micro-relay to be closed contacts are arranged.
  • the electrical power of about 200 - 300 mW for switching the micro-relay is required only during the short switching phases, while the individual switching states can be held without power.
  • the space required for the two microactuators on the substrate is usually about 2 mm x 1 mm and is therefore comparable to the areas required for microrelays according to the electrostatic action principle.
  • the present microactuator arrangement is thus clearly superior to any hitherto known micro-relay concept with regard to the achievable switching forces and the achievable switching strokes.
  • microactuator arrangement according to the invention is also suitable for other applications in which, on the one hand, at least two switching states must be held without power and, on the other hand, large actuating forces and travel paths are required.
  • microactuator arrangement with this arrangement not only two but also further switching states can be realized and kept without power.
  • This only requires that the lateral actuator at different deflections, which are generated by different degrees of thermal excitation, each with a portion extends below the z-actuator. This can be achieved for example by a correspondingly long boom on the lateral actuator, which extends in the deflection direction. In this way, the lateral actuator can be held by the z-actuator in any deflection position.
  • This embodiment enables a multiplicity of switching connections in a microrelay equipped with the microactuator arrangement according to the invention.
  • a further preferred embodiment of the present microactuator arrangement is characterized in that the two microactuators interlock when the holding position is taken.
  • This hooking can be realized in that the two overlapping in the holding position portions of the lateral actuator and the z-actuator engage, for example by one of the two sections has a recess into which engages a survey of the other of the two sections.
  • other geometrical configurations are conceivable, which lead to a corresponding entanglement or to a corresponding interlocking. The person skilled in the art knows such embodiments from many areas of the technique. In the case of a plurality of shift positions to be held, different holding positions can be predetermined by corresponding geometric design of the sections, with the two sections meshing with one another.
  • thermomechanical microactuators are known to the person skilled in the art.
  • a bar-shaped element is used as a basic element of the single microactuator, as is known for example from US 5,909,078.
  • This bar-shaped element is preferably etched out of the substrate such that it remains clamped on both sides of the substrate.
  • the second thermo-mechanical actuator that is, the z-actuator, consists of such an element which is connected in the form of a bridge to the substrate.
  • the thermal excitation of the two elements can be done in a variety of ways.
  • thermal excitations such as irradiation, arranging a heating element on the substrate, direct heating by current flow through the actuator element or attaching a Schumachers harsh on the actuator element are known in the art.
  • the last option in the present microactuator arrangement is used by applying to the beam-shaped elements a corresponding heating conductor layer, for example of polysilicon.
  • the microactuator arrangement is not limited to a lateral and a z-actuator. Thus, several such actuators in a corresponding arrangement be used for the substrate. Likewise, a mechanical coupling of different lateral actuators is possible, as is known from the mentioned in the introductory part US-Script.
  • contact bridges are provided from a highly conductive material on the underside of the lateral actuator.
  • the actuator itself or the bar-shaped elements of the actuator can in this case consist of other materials.
  • nickel is used as the material for the beam-shaped elements, since this has good thermo-mechanical properties and is suitable for building the elements in the required dimensions by known means of microstructure technology.
  • the electrically conductive contact bridges and the heating conductor layer are additionally insulated from the nickel via an intermediate layer.
  • thermomechanical microactuators on a substrate can be taken from the specialist literature at any time. This is usually a combination of photolithography, galvanic deposition and etching.
  • FIG. 1 shows a three-dimensional view of a microactuator arrangement according to a first exemplary embodiment.
  • the microactuator arrangement consists of the substrate 1, a semiconductor substrate on which a lateral microactuator 3 and a z-actuator 4 are arranged.
  • the lateral actuator 3 is composed of four bar-shaped elements 7, which are each anchored to the substrate 1 on one side. At these beam-shaped elements, a plate-shaped arm 9 is mounted, which extends in the direction of the deflection, that is, in the direction of the z-actuator 4.
  • the lateral actuator 3 can be seen in the figure in the deflected state. In the resting state, it is located above the indicated depression 11 in the substrate surface, which is produced during the production process during the undercutting of the bar-shaped elements 7.
  • the bar-shaped elements 7 are provided with Bankrupts harshen (not visible in the figure), which are supplied via corresponding pads 12 with power.
  • the bar-shaped elements hereby have dimensions of typically about 1 mm in length, 5-10 ⁇ m in width and 15-20 ⁇ m in height.
  • the z-actuator 4 is also composed of a bar-shaped element 8, which is clamped on both sides of the substrate 1.
  • This z-actuator 4 is designed in the form of a Brückenaktors.
  • the bar-shaped element 8 is also provided in this case with a corresponding, not shown, heating layer, which is supplied via connection pads 12 with power.
  • a plate-shaped arm 10 is provided, which extends in the direction of the lateral actuator 3. Both arms 9 and 10 can be hooked together by a corresponding configuration, as shown in the enlarged portion of Figure 2.
  • both actuators are first put into operation.
  • the lateral actuator 3 pushes its plate-shaped arm 9 under the z-actuator 4.
  • the z-actuator is first turned off and lowers with its arm 10 on the boom 9.
  • a suitable hook-like structure prevents after switching off the lateral actuator. 3 a release of this contact.
  • both actuators are also first switched on. The lateral actuator 3 is switched off but this time before the z-actuator 4.
  • the figure 1 shows the microactuator arrangement in the ON state.
  • the bar-shaped elements 7, 8 and the arms 9, 10 of the two actuators 3, 4 are made of nickel in this example.
  • the heating conductor extending below the bar-shaped elements is separated from this metallic structure by insulating layers.
  • Figure 2 shows another example of a microactuator assembly according to the present invention when used as a micro-relay.
  • the substrate 1 and the two microactuators 3, 4 with the respective bar-shaped elements 7, 8 and the arms 9, 10 can be seen.
  • four printed conductors 13 are arranged on the substrate 1, of which - can be seen in the enlarged view - all are interrupted by a gap.
  • contact bridges 14 At the bottom of the boom 9 of the lateral actuator 3 are contact bridges 14 for closing the open contacts.
  • These contact bridges 14 may be formed of a good conductive material such as gold, which is isolated from the material of the actuator. As a result, smaller lead resistances can be achieved in the relay.
  • several contacts or lines 13 can also be closed simultaneously.
  • the ON state of the micro-relay is shown, in which the contacts of the four lines are closed in different ways, as can be seen in the enlarged view.
  • the high pressure force is generated by the return movement of the z-actuator 4, which presses on the lateral actuator 3.
  • the enlarged view is also a geometric arrangement of a possible entanglement between the boom 10 of the z-actuator 4 and the boom 9 of the lateral actuator 3 can be seen.
  • a suitable metal such as nickel is recommended.
  • a suitable metal such as nickel is recommended.
  • the switching times of the relay are approximately between 10 ms and 100 ms. Due to the very good electrical conductivity of the bar-shaped elements, however, prohibits direct use as a heating element in this case.
  • a heat conductor layer is preferably attached to the actual actuator element, which of course must be isolated from the actual thermoactor.

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  • Micromachines (AREA)
  • Thermally Actuated Switches (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)

Claims (11)

  1. Structure à micro-acteurs, en particulier micro relais, comprenant un substrat (1), sur lequel un premier micro-acteur thermomécanique (3) et un deuxième micro-acteur thermomécanique (4) sont disposés, audit premier micro-acteur thermomécanique (3), en réponse à une stimulation thermique, étant dévié en une direction essentiellement en parallèle à la surface (2) dudit substrat (1),
    caractérisée en ce
    que ledit deuxième micro-acteur thermomécanique (4) est configuré et disposé, relativement audit premier micro-acteur thermomécanique (3), d'une telle manière, qu'il soit dévié, après une stimulation thermique, essentiellement en une direction orthogonale sur la surface (2) dudit substrat (1), et en ce qu'en un état de déviation, un premier segment (5) dudit premier micro-acteur thermomécanique (3) s'étend jusqu'à un point au-dessous d'un deuxième segment (6) dudit deuxième micro-acteur thermomécanique (4).
  2. Structure à micro-acteurs selon la revendication 1,
    caractérisée en ce
    que ledit premier et/ou ledit deuxième micro-acteur thermomécanique (3, 4) est/sont composé(s) d'un ou plusieurs éléments en barre, qui sont serrés des deux côtés sur ledit substrat (1).
  3. Structure à micro-acteurs selon la revendication 2,
    caractérisée en ce
    que ledit un ou lesdits plusieurs éléments en barre sont pourvus d'une couche à conduction thermique.
  4. Structure à micro-acteurs selon la revendication 2 ou 3,
    caractérisée en ce
    que ledit un ou lesdits plusieurs éléments en barre consistent en un matériau à conduction électrique.
  5. Structure à micro-acteurs selon une quelconque des revendications 1 à 4,
    caractérisée en ce
    que ledit premier segment (5) dudit premier micro-acteur thermomécanique (3) est conçu sous forme d'une console en lame, qui s'étend le long de la direction d'extension dudit premier micro-acteur thermomécanique (3).
  6. Structure à micro-acteurs selon la revendication 5,
    caractérisée en ce
    que ladite console en lame présente une telle longueur en sens d'extension dudit premier micro-acteur thermomécanique (3), qu'en réponse aux extensions différentes dudit premier micro-acteur thermomécanique (3), il s'étend jusqu'à un point au-dessous dudit deuxième segment (6) dudit deuxième micro-acteur thermomécanique (4).
  7. Structure à micro-acteurs selon une quelconque des revendications 1 à 6,
    caractérisée en ce
    que ledit deuxième segment (6) dudit deuxième micro-acteur thermomécanique (4) est conçu sous forme d'une console en lame, qui s'étend en un sens opposé à la direction d'extension dudit premier micro-acteur thermomécanique (3).
  8. Structure à micro-acteurs selon une quelconque des revendications 1 à 7,
    caractérisée en ce
    que ledit premier segment (5) et ledit deuxième segments (6) sont conçus d'une telle manière, qu'ils se trouvent en prise l'un dans l'autre, quand la stimulation thermique dudit deuxième micro-acteur thermomécanique (4) est terminée, pendant que ledit premier micro-acteur thermomécanique (3) se trouve en l'état de déviation.
  9. Structure à micro-acteurs selon la revendication 8,
    caractérisée en ce
    que ledit premier segment (5) présente un évidement, dans lequel une saillie sur le deuxième segment (6) est prise ou vice versa.
  10. Structure à micro-acteurs selon une quelconque des revendications 1 à 9,
    caractérisée en ce
    qu'un ou plusieurs pistes conductives (13) et/ou aires de contact à une ou plusieurs discontinuité(s) sont formées sur ledit substrat (1), qu'on peut ponter par l'extension dudit premier micro-acteur thermomécanique (3).
  11. Structure à micro-acteurs selon la revendication 10,
    caractérisée en ce
    que ledit premier micro-acteur thermomécanique (3) présente un ou plusieurs ponts de contact à conduction électrique (14) pour le pontage desdits discontinuités.
EP01919213A 2000-03-29 2001-03-16 Systeme de microactionneurs Expired - Lifetime EP1269506B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10015598A DE10015598C2 (de) 2000-03-29 2000-03-29 Mikroaktoranordnung
DE10015598 2000-03-29
PCT/DE2001/001040 WO2001073805A1 (fr) 2000-03-29 2001-03-16 Systeme de microactionneurs

Publications (2)

Publication Number Publication Date
EP1269506A1 EP1269506A1 (fr) 2003-01-02
EP1269506B1 true EP1269506B1 (fr) 2007-03-07

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EP01919213A Expired - Lifetime EP1269506B1 (fr) 2000-03-29 2001-03-16 Systeme de microactionneurs

Country Status (6)

Country Link
US (1) US6684638B2 (fr)
EP (1) EP1269506B1 (fr)
JP (1) JP4880167B2 (fr)
AT (1) ATE356420T1 (fr)
DE (2) DE10015598C2 (fr)
WO (1) WO2001073805A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008005815A1 (de) 2007-09-10 2009-03-26 Vogel, Albrecht, Dipl.-Ing.Dr-Ing. Elektrisches Schaltgerät mit einer Mikrorelais-Anordnung
EP2126942A1 (fr) * 2007-03-16 2009-12-02 Simpler Networks Inc. Actionneurs et commutateurs à microsystèmes électromécaniques

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004066326A2 (fr) * 2003-01-17 2004-08-05 The Regents Of The University Of California Microrelais a contact lateral actionne par voie electrothermique et procede de fabrication associe
US7312678B2 (en) * 2005-01-05 2007-12-25 Norcada Inc. Micro-electromechanical relay
DE102006002753B4 (de) * 2006-01-20 2010-09-30 X-Fab Semiconductor Foundries Ag Verfahren und Anordnung zur Bewertung der Unterätzung von tiefen Grabenstrukturen in SOI-Scheiben
US7480432B2 (en) 2006-02-28 2009-01-20 Corning Incorporated Glass-based micropositioning systems and methods
FR2984013B1 (fr) * 2011-12-09 2014-01-10 St Microelectronics Rousset Dispositif mecanique de commutation electrique integre possedant un etat bloque
DE102015120430A1 (de) 2015-11-25 2017-06-01 Technische Universität Darmstadt Aktoranordnung

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4511974A (en) * 1981-02-04 1985-04-16 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Load condition indicating method and apparatus for forklift truck
US5619177A (en) * 1995-01-27 1997-04-08 Mjb Company Shape memory alloy microactuator having an electrostatic force and heating means
US5909078A (en) * 1996-12-16 1999-06-01 Mcnc Thermal arched beam microelectromechanical actuators
US5994816A (en) * 1996-12-16 1999-11-30 Mcnc Thermal arched beam microelectromechanical devices and associated fabrication methods
US5796152A (en) 1997-01-24 1998-08-18 Roxburgh Ltd. Cantilevered microstructure
AUPO794697A0 (en) * 1997-07-15 1997-08-07 Silverbrook Research Pty Ltd A device (MEMS10)
US6070851A (en) * 1998-06-08 2000-06-06 Industrial Technology Research Institute Thermally buckling linear micro structure
JP3536202B2 (ja) * 2000-03-16 2004-06-07 日本航空電子工業株式会社 光スイッチ
US6360539B1 (en) * 2000-04-05 2002-03-26 Jds Uniphase Corporation Microelectromechanical actuators including driven arched beams for mechanical advantage

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2126942A1 (fr) * 2007-03-16 2009-12-02 Simpler Networks Inc. Actionneurs et commutateurs à microsystèmes électromécaniques
EP2126942B1 (fr) * 2007-03-16 2014-05-21 Réseaux MEMS, Société en Commandite Actionneurs et commutateurs à microsystèmes électromécaniques
DE102008005815A1 (de) 2007-09-10 2009-03-26 Vogel, Albrecht, Dipl.-Ing.Dr-Ing. Elektrisches Schaltgerät mit einer Mikrorelais-Anordnung

Also Published As

Publication number Publication date
JP4880167B2 (ja) 2012-02-22
DE50112158D1 (de) 2007-04-19
US20030051473A1 (en) 2003-03-20
DE10015598C2 (de) 2002-05-02
EP1269506A1 (fr) 2003-01-02
JP2003528744A (ja) 2003-09-30
ATE356420T1 (de) 2007-03-15
DE10015598A1 (de) 2001-10-18
WO2001073805A1 (fr) 2001-10-04
US6684638B2 (en) 2004-02-03

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