EP1130125A2 - Gut wärmeleitende Aluminium-Legierung zum Druckgiessen und hergestelltes Gussstück - Google Patents

Gut wärmeleitende Aluminium-Legierung zum Druckgiessen und hergestelltes Gussstück Download PDF

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Publication number
EP1130125A2
EP1130125A2 EP01301441A EP01301441A EP1130125A2 EP 1130125 A2 EP1130125 A2 EP 1130125A2 EP 01301441 A EP01301441 A EP 01301441A EP 01301441 A EP01301441 A EP 01301441A EP 1130125 A2 EP1130125 A2 EP 1130125A2
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EP
European Patent Office
Prior art keywords
amount
alloy
less
heat conductivity
heat
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP01301441A
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English (en)
French (fr)
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EP1130125A3 (de
Inventor
Takao c/o K. K. Daiki Aluminium Kogyosho Suzuki
Kiyofumi K. K. Daiki Aluminium Kogyosho Kawai
Naoto c/o K. K. Daiki Aluminium Kogyosho Oshiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daiki Aluminium Industry Co Ltd
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Daiki Aluminium Industry Co Ltd
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Publication date
Application filed by Daiki Aluminium Industry Co Ltd filed Critical Daiki Aluminium Industry Co Ltd
Publication of EP1130125A2 publication Critical patent/EP1130125A2/de
Publication of EP1130125A3 publication Critical patent/EP1130125A3/de
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/02—Alloys based on aluminium with silicon as the next major constituent

Definitions

  • the present invention relates to an aluminum alloy and a casting alloy thereof which are best-suited for materials of members required to have heat-dissipating characteristics, such as cabinets for accommodating electronic components, a heat-receiving block and a heat sink, for use in computers, electronic apparatus and the like.
  • Conventional heat-dissipating members of this type for example, a heat-dissipating member having a multiplicity of fins on one side or opposite sides thereof, generally comprise an extruded product of highly heat-conductive pure aluminum or a malleable aluminum alloy, which, however, exhibit very poor castability. Users cut such an extruded product to a desired size and machine a portion of the extruded product on which an electronic component is to be mounted. Such machining becomes costly when massive amounts of extruded products are machined, thus resulting in a problem of increased costs as a whole.
  • a second object of the present invention is to provide a cast aluminum alloy obtained from the above alloy.
  • a highly heat-conductive alloy for pressure casting comprising Cu in an amount of 0.10% or less, Si in an amount of 5% to 16%, Mg in an amount of 0.20% or less, Zn in an amount of 0.10% or less, Fe in an amount of 0.20% to 1.0%, Mn in an amount of 0.20% or less, Ni in an amount of 0.05% or less, Ti in an amount of 0.05% or less, Pb in an amount of 0.06% or less, Sn in an amount of 0.05% or less, Cr in an amount of 0.10%, and Al forming the balance.
  • the aluminum alloy for pressure casting according to the present invention is excellent in heat conductivity as well as in castability and seizure proofness and hence is useful as a material for heat-dissipating members.
  • Al, Si and Fe are principal components, while other components are impurities. Since the heat conductivity of the alloy lowers as the amounts of impurities increase, lower contents of impurities are more desirable. However, the contents of impurities are determined taking the balance with costs into consideration.
  • the alloy having the principal components in respective amounts as specified above meets the requirements as to castability, seizure proofness and heat conductivity.
  • Table 2 shows the chemical composition and the heat conductivity of each of examples 1 to 6 (samples Nos. 12 to 15, 25 and diecast product) within the scope of the present invention and each of comparative examples 1 to 14 (samples Nos. 1 to 8 and 16 to 21).
  • the diecast product was obtained by diecasting an aluminum alloy having a chemical composition within the scope of the invention, and the data of the diecast product in Table 2 was obtained by analyzing the chemical composition of the diecast product thus obtained.
  • the aluminum alloy of the present invention even when diecast, exhibited a heat conductivity higher than the target heat conductivity (150 W/(m ⁇ °C)).
  • sample Nos. 1 to 8 correspond to comparative examples 1 to 8, respectively, samples Nos. 12 to 15 correspond to examples 1 to 4, respectively, samples Nos. 16 to 21 correspond to comparative examples 9 to 14, respectively, and sample No. 25 and diecast product correspond to examples 5 and 6, respectively.
  • the alloy for pressure casting according to the present invention is required to have superior castability, seizure proofness and heat conductivity.
  • Pure aluminum (comparative example 1) exhibits a heat conductivity of 252 W/(m ⁇ °C), which is the highest. This value decreases when an additional element is incorporated in aluminum.
  • Fig. 1 is a graph showing the relationship between the content of Si and the heat conductivity. As shown, the heat conductivity steeply drops until the Si content reaches about 1%, and then gradually lowers until the Si content reaches about 7%. When the Si content is between 5% and 16%, substantially the same level of heat conductivity, or 170 W/(m ⁇ °C) or higher, is maintained. Therefore, this range of Si content satisfies the requirement as to heat conductivity.
  • Si is an additive that contributes to an improvement in the castability of an alloy, and an alloy for pressure casting, in general, is required to contain Si in an amount of 5% or more so as to exhibit an improved castability. It is known that the fluidity of an alloy becomes maximum when the Si content is about 15%, and therefore, the castability of the alloy lowers when the Si content is 16% or more. Accordingly, an optimum Si content is between 5% and 16% when the castability and the heat conductivity are taken into consideration.
  • Si content is between 11% and 14%.
  • the alloy for pressure casting according to the present invention is also required to have a seizure proofness, which prevents a casting from seizing the mold to allow smooth release of the casting therefrom.
  • Fe or Mn is known to be effective in imparting an alloy with such a seizure proofness. Since Fe impairs the heat conductivity less than Mn as seen from comparative examples 5 and 6, Fe is more preferable than Mn. According to examples 1 to 6, an adequate Fe content that satisfies the requirements of both the heat conductivity and the seizure proofness is 0.2 to 1.0%.
  • the heat conductivity lowers to 146 W/(m ⁇ °C), which is lower than the target level, when the content of Mn reaches 0.22%.
  • the Mn content in the alloy of the invention is required to be not more than 0.20%.
  • the heat conductivity lowers to 146 W/(m ⁇ °C), which is lower than the target level as described above, when the content of Mg reaches 0.24%.
  • the Mg content in the alloy of the invention is required to be not more than 0.20%.
  • the alloy of the invention needs to permit inclusion of impurities to such an extent as not to impair the target heat conductivity.
  • the alloy of the invention permits inclusion of Cu in an amount of not more than 0.1%, Zn in an amount of not more than 0.1%, Ti in an amount of not more than 0.05%, Pb in an amount of not more than 0.06%, Sn in an amount of not more than 0.05%, Cr in an amount of not more than 0.10%, and Ni in an amount of not more than 0.05%.
  • the alloy of the invention containing Al, Si and Fe and other impurities in respective amounts specified above satisfied the requirement of heat conductivity without impairment of the castability and seizure proofness that are required in diecasting.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Conductive Materials (AREA)
EP01301441A 2000-03-02 2001-02-19 Gut wärmeleitende Aluminium-Legierung zum Druckgiessen und hergestelltes Gussstück Ceased EP1130125A3 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000057233 2000-03-02
JP2000057233 2000-03-02
JP2000190655A JP4191370B2 (ja) 2000-03-02 2000-06-26 高熱伝導加圧鋳造用合金と該合金鋳物
JP2000190655 2000-06-26

Publications (2)

Publication Number Publication Date
EP1130125A2 true EP1130125A2 (de) 2001-09-05
EP1130125A3 EP1130125A3 (de) 2001-09-19

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP01301441A Ceased EP1130125A3 (de) 2000-03-02 2001-02-19 Gut wärmeleitende Aluminium-Legierung zum Druckgiessen und hergestelltes Gussstück

Country Status (3)

Country Link
US (1) US20010031218A1 (de)
EP (1) EP1130125A3 (de)
JP (1) JP4191370B2 (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016145644A1 (en) * 2015-03-19 2016-09-22 GM Global Technology Operations LLC Alloy composition
CN109332631A (zh) * 2018-11-02 2019-02-15 广东鸿图科技股份有限公司 一种通讯箱体低温压铸工艺
CN110735071A (zh) * 2019-11-21 2020-01-31 白福林 一种高导热铝合金及其制备方法
US10927436B2 (en) 2017-03-09 2021-02-23 GM Global Technology Operations LLC Aluminum alloys
CN113005335A (zh) * 2021-02-22 2021-06-22 李秋明 新型铝合金材料、薄壁件和金属手模

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003089838A (ja) * 2001-09-18 2003-03-28 Toyota Industries Corp アルミダイカスト製吸放熱部品
EP2275584B1 (de) 2004-04-05 2013-03-20 Nippon Light Metal Company Ltd. Herstellungsverfahren für gegossene Aluminium-Wärmesenken
US9353429B2 (en) 2007-02-27 2016-05-31 Nippon Light Metal Company, Ltd. Aluminum alloy material for use in thermal conduction application
JP5304808B2 (ja) * 2011-01-31 2013-10-02 株式会社デンソー アルミニウム合金鋳物およびその製造方法
JP5699774B2 (ja) * 2011-04-20 2015-04-15 トヨタ自動車株式会社 アルミニウム合金材及びその製造方法
CN104662186B (zh) 2012-09-25 2017-07-04 学校法人常翔学园 过共晶铝硅合金压铸部件及其制造方法
MY179378A (en) * 2014-10-23 2020-11-05 Daiki Aluminium Ind Co Ltd Aluminum alloy for die casting, and aluminum alloy die-cast product using same
KR101601551B1 (ko) 2014-12-02 2016-03-09 현대자동차주식회사 알루미늄 합금
CN106255770A (zh) * 2015-04-15 2016-12-21 株式会社大纪铝工业所 压铸用铝合金以及使用该铝合金的铝合金压铸件
KR101795260B1 (ko) * 2016-05-24 2017-11-07 현대자동차주식회사 열전도도 및 주조성이 향상된 다이캐스팅용 알루미늄 합금을 이용한 배터리용 히트싱크 및 이의 제조방법
CN110804708A (zh) * 2019-12-09 2020-02-18 宁波市佳利来机械制造有限公司 一种高强度压铸铝合金、发动机壳体及其制造方法
KR20210152776A (ko) * 2020-06-09 2021-12-16 ㈜에스엘엠글로벌 열전도율이 우수한 주조용 알루미늄 합금
CN121087327A (zh) 2024-06-06 2025-12-09 通用汽车环球科技运作有限责任公司 耐腐蚀铝合金
DE102024129876A1 (de) * 2024-10-15 2026-04-16 Audi Aktiengesellschaft Aluminiumlegierung für Strukturgussanwendungen, Verwendung der Aluminiumlegierung zum Druckgießen von Strukturbauteilen, Strukturbauteil für ein Kraftfahrzeug und Kraftfahrzeug mit dem Strukturbauteil
DE102024129878A1 (de) * 2024-10-15 2026-04-16 Audi Aktiengesellschaft Aluminiumlegierung für Strukturgussanwendungen, Verwendung der Aluminiumlegierung zum Druckgießen von Strukturbauteilen, Strukturbauteil für ein Kraftfahrzeug und Kraftfahrzeug mit dem Strukturbauteil

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3726672A (en) * 1970-10-30 1973-04-10 Reduction Co Aluminum base alloy diecasting composition
FR2354171A1 (fr) * 1976-06-09 1978-01-06 Reynolds Metals Co Composition de brasure pour le brasage de l'aluminium
US4489140A (en) * 1982-06-24 1984-12-18 Atlantic Richfield Company Multi-layer aluminum alloy brazing sheet
JPS60206597A (ja) * 1984-03-30 1985-10-18 Sumitomo Precision Prod Co Ltd アルミニウム合金ろう
KR0184019B1 (ko) * 1993-08-03 1999-05-01 도모마쯔 겐고 알루미늄 합금 브레이징 재료, 열교환기용 알루미늄 합금 브레이징 박판 및 알루미늄 합금 열교환기 제조방법
US5837388A (en) * 1995-08-07 1998-11-17 The Furukawa Electric Co., Ltd. Aluminum alloy solder material, its manufacturing method, brazing sheet using this material, and method of manufacturing aluminum alloy heat exchanger using this sheet
JP3332885B2 (ja) * 1999-04-20 2002-10-07 古河電気工業株式会社 セミソリッド加工用アルミニウム基合金及びその加工部材の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016145644A1 (en) * 2015-03-19 2016-09-22 GM Global Technology Operations LLC Alloy composition
US10927436B2 (en) 2017-03-09 2021-02-23 GM Global Technology Operations LLC Aluminum alloys
CN109332631A (zh) * 2018-11-02 2019-02-15 广东鸿图科技股份有限公司 一种通讯箱体低温压铸工艺
CN110735071A (zh) * 2019-11-21 2020-01-31 白福林 一种高导热铝合金及其制备方法
CN113005335A (zh) * 2021-02-22 2021-06-22 李秋明 新型铝合金材料、薄壁件和金属手模

Also Published As

Publication number Publication date
JP4191370B2 (ja) 2008-12-03
JP2001316748A (ja) 2001-11-16
US20010031218A1 (en) 2001-10-18
EP1130125A3 (de) 2001-09-19

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