EP1079250B1 - Light coupled device - Google Patents

Light coupled device Download PDF

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Publication number
EP1079250B1
EP1079250B1 EP00118000A EP00118000A EP1079250B1 EP 1079250 B1 EP1079250 B1 EP 1079250B1 EP 00118000 A EP00118000 A EP 00118000A EP 00118000 A EP00118000 A EP 00118000A EP 1079250 B1 EP1079250 B1 EP 1079250B1
Authority
EP
European Patent Office
Prior art keywords
light
couplings
coupled device
insulating
light shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP00118000A
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German (de)
English (en)
French (fr)
Other versions
EP1079250A3 (en
EP1079250A2 (en
Inventor
Katsunori Makiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
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Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of EP1079250A2 publication Critical patent/EP1079250A2/en
Publication of EP1079250A3 publication Critical patent/EP1079250A3/en
Application granted granted Critical
Publication of EP1079250B1 publication Critical patent/EP1079250B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
    • H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers

Definitions

  • the present invention relates to a light coupled device such as a 2-channel photocoupler having a plurality of light couplings.
  • a signal transmitting interface in factory automation equipment or the like requires electrical insulation from external devices, and besides is used in an environment filled with influence of external noise, and accordingly a photocoupler is used as the signal transmitting interface.
  • the photocoupler used in the interface must have a high-speed performance (high-speed signal transmission), and a plurality of photocouplers are required since the interface has a plurality of inputs and outputs.
  • multi-channel type light coupled devices are used, each of which includes a plurality of light couplings in one package.
  • Figs. 4A through 4C show an outward appearance of a conventional multi-channel type light coupled device, in which Fig. 4A is a front view, Fig. 4B a side view and Fig. 4C a plan view.
  • Fig. 5 is a view showing an interconnection in the light coupled device shown in Figs. 4A through 4C.
  • Fig. 6 shows a layout of a lead frame on the light receiving side as shown in Fig. 5.
  • the 2-channel type light coupled device shown in Figs. 4A through 4C, 5 and 6 employs light receiving elements each having a photodiode and a light signal processing circuit integrated into a single chip by bipolar IC process.
  • Each light receiving element acting as an element on the output (or secondary) side, has three external connectors, i.e. a source voltage terminal Vcc, a GND terminal and an output terminal Vo.
  • two light receiving elements 2A and 2B are provided. Since the two light receiving elements can share the source voltage terminal Vcc and GND terminal, a connecting method may be employed therefor, as shown in Fig.
  • each of the light receiving elements 2A and 2B has three terminals to make a total of six terminals on the secondary side (output side)
  • the result will be a 12-pin package.
  • the number of terminals on the secondary side will be four, which provides a simplified package having only eight pins as shown in Fig. 4.
  • a light coupled device with a plurality of light couplings generally, has some of the terminals shared by the light receiving elements in order to achieve compactness and low cost of the product.
  • each light emitting element and an associated light receiving element have a transparent silicone resin filled therebetween to form a light coupling which is sealed with an epoxy resin.
  • a transparent silicone resin filled therebetween to form a light coupling which is sealed with an epoxy resin.
  • Fig. 7 is a sectional view schematically showing light coupled sections of a conventional multi-channel type light coupled device.
  • adjacent light couplings 24 are formed of a transparent silicone resin.
  • Light emitted from each light emitting element 1 passes through a light coupling 24 formed of the transparent silicone resin, and directly reaches the opposite light receiving element 2.
  • Part of the light from the light emitting element 1 is reflected from the boundary between the silicone resin and an adjoining epoxy resin 25 to reach the light receiving element 2.
  • the epoxy resin 25 filled between the two light couplings 24 formed of the transparent silicone resin plays a role of blocking light transmission between the channels so that light emitted from the light emitting element 1 of one channel is prevented from reaching the light receiving element 2 of the other, adjacent channel, in order to avoid an interference of light signals (hereinafter referred to as "crosstalk") between the two light couplings 24.
  • the two-channel type light coupled device shown in Fig. 5 requires a construction in which signals inputted to input terminals T1 and T2 result in a signal outputted from an output terminal T7, while signals inputted to input terminals T3 and T4 result in a signal outputted from an output terminal T6.
  • each light coupling 24 shown in Fig. 7 must be formed of the transparent silicone resin, and the two adjacent light couplings 24 must be spaced apart to be out of contact with each other. This requirement has been a limitational factor in an area saving designing of lead frame size and downsizing (volume saving) of packages.
  • Patent Abstracts of Japan, vol. 1998, no. 03, February 27, 1998 (1998-02-27) and JP 09 307135 disclose an optical composite element in which two photocouplers, one for control signal transmission use and one for feedback signal transmission use, are integrated with each other, disposed in the center of the optical composite element, and separated by a light intercepting shield needed on both sides of the central frame in order to prevent light from leaking from the contacting part of the two photocouplers.
  • the light intercepting shield is a plate traversing the whole device, or package, which is, therefore, formed in three layers, and is, in the light transmission sections of the device, coated on both sides with light shielding material.
  • document US-A-4 291 943 discloses a connector for optical fiber cables for connecting fiber cables with plural optical fibers in parallel to each other.
  • the connector is a mechanical element which receives on two sides the optical fibers of the fiber cables and connects them internally, separated from each other by connector housing material such as injection molded plastic, bunt not by filling a gap between a light emitting element and a light receiving element with a transparent silicone resin.
  • document US-A-4 712 862 also relates to an optical fiber connector in which a supporting means and a sleeve are typically formed of metal, ceramic, or plastic.
  • document GB-A-1 309 938 discloses a housing for optical-electronic semiconductor devices which is formed by a cylinder of darkened insulating material and which is sealed, using recesses, at each end by a respective metallic end plate by means of a binding material.
  • the present invention has been made having regard to the state as noted above, and its object is to provide a multichannel type light coupled device with a construction for enabling an area saving designing of lead frame size and downsizing of packages.
  • this object is accomplished by a light coupled device as defined in claim 1.
  • the light coupled device prevents crosstalk since the insulating and light shielding element blocks light transmission between the adjacent light couplings.
  • This construction compared with the conventional construction (Fig. 7), realizes a reduced distance between the adjacent light couplings.
  • the insulating and light shielding element used in the light coupled device according to the invention may comprise a polyimide film or silica glass sheet with a light shielding color applied thereto.
  • a light shield may be effected between the adjacent light couplings by using an insulating and light shielding polyimide film or silica glass sheet. Even though the light couplings are arranged close together, no crosstalk will occur therebetween.
  • projections or recesses are formed on/in a lead frame on which the light couplings are mounted, for fixing the insulating and light shielding element to a predetermined position between the light couplings.
  • the light shielding element does not become displaced when a transparent silicone resin is injected to form the light couplings. Consequently, the light shielding element may be fixed to an optimal position in the middle between the adjacent light couplings.
  • the insulating and light shielding element is fixed by an adhesive to the lead frame on which the light couplings are mounted.
  • the insulating and light shielding element may be fixed to the lead frame by using an adhesive such as an epoxy resin, instead of the projections or recesses. With this measure also, the insulating and light shielding element may be fixed to the optimal position in the middle between the adjacent light couplings.
  • Fig. 1 is a sectional view schematically showing light couplings of a light coupled device in Embodiment 1 of the invention.
  • the light coupled device shown in Fig. 1 is a 2-channel type photocoupler similar to that shown in Fig. 7.
  • This device includes two pairs of light emitting elements 1 consisting of light emitting diodes and light receiving elements 2 consisting of light receiving diodes mounted on lead frames 3 to be opposed to each other.
  • a transparent silicone resin is filled between each pair of light emitting element 1 and light receiving element 2 to act as a light coupling 4.
  • the light coupled device in this example is characterized by an insulating and light shielding film 5 disposed between the two adjacent light couplings 4, i.e. in a middle position of the light couplings 4 seen as a whole.
  • This film 5 is formed by applying a light shielding color to a polyimide film.
  • the insulating and light shielding film 5 isolates the two light couplings 4 from each other so that no light is transmitted from one to the other. Thus, even though the two light couplings 4 are arranged close together, no crosstalk will occur therebetween.
  • Embodiment 1 employs, as an insulating and light shielding element, the insulating and light shielding film 5 formed by applying a light shielding color to a polyimide film.
  • the film 5 a silica glass sheet with a light shielding color applied thereto may be disposed between the two light couplings 4 to produce a similar effect.
  • Fig. 2 is a sectional view schematically showing light couplings of a light coupled device in Embodiment 2 of the invention.
  • Embodiment 2 shown in Fig. 2 is characterized by an addition to the construction shown in Fig. 1 of projections 31 formed on the lead frame 3 associated with the light receiving elements 2, for positioning and fixing the insulating and light shielding film 5 between the two adjacent light couplings 4, i.e. in the middle position of the light couplings 4 seen as a whole.
  • projections 31 are effective to prevent the light shielding film 5 becoming displaced when the transparent silicone resin is injected to form the light couplings 4. Consequently, the light shielding film 5 may be fixed to an optimal position in the middle between the light couplings 4.
  • the projections 31 may be replaced with positioning and fixing recesses formed in the lead frame 3. Instead of forming the projections or recesses, the light shielding film 5 may be fixed to the lead frame 3 by means of an epoxy resin.
  • the construction for fixing the insulating film 5 with the projections, recesses or epoxy resin described above is applicable where a silica glass sheet or the like with a light shielding color applied thereto is used.
  • Fig. 3 is a sectional view schematically showing light couplings of a light coupled device not forming part of the invention.
  • the light coupled device shown in Fig. 3 is a 2-channel type photocoupler having two pairs of light emitting elements 1 (light emitting diodes) and light receiving elements 2 (light receiving diodes) mounted on lead frames 3 to be opposed to each other.
  • a primary light coupling section 6 and a secondary light coupling section 7 are formed of a transparent silicone resin around each light emitting element 1 on the primary side and each light receiving element 2 on the secondary side.
  • the primary light coupling section 6 and secondary light coupling section 7 are optically interconnected through a cylindrical silica glass element 8 (insulating and light transmitting element).
  • the primary light coupling section 6, secondary light coupling section 7 and silica glass element 8 constitute a light coupling 14.
  • each light coupling were formed only of the silicone resin, without the interposition of an insulating and light transmitting element, variations in viscosity of the silicone resin would destabilize the formation.
  • a relatively large margin is required in the distance between the light couplings to accommodate possible dimensional inaccuracies of the light couplings formed of the silicone resin.
  • the silica glass elements used in the device shown in Fig. 3 may be spherical, cubic or otherwise, apart from being cylindrical.
  • a light coupled device has an insulating and light shielding element disposed between adjacent light couplings.
  • the light shielding element allows the light couplings to be arranged close to each other while preventing crosstalk occurring therebetween. This construction achieves a reduction in package size and a reduced area for mounting.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
EP00118000A 1999-08-23 2000-08-22 Light coupled device Expired - Lifetime EP1079250B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP23564499 1999-08-23
JP23564499A JP3676136B2 (ja) 1999-08-23 1999-08-23 光結合素子

Publications (3)

Publication Number Publication Date
EP1079250A2 EP1079250A2 (en) 2001-02-28
EP1079250A3 EP1079250A3 (en) 2004-02-11
EP1079250B1 true EP1079250B1 (en) 2007-10-17

Family

ID=16989079

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00118000A Expired - Lifetime EP1079250B1 (en) 1999-08-23 2000-08-22 Light coupled device

Country Status (5)

Country Link
US (1) US6507048B1 (ja)
EP (1) EP1079250B1 (ja)
JP (1) JP3676136B2 (ja)
DE (1) DE60036762T2 (ja)
TW (1) TWI223458B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006753A (ja) * 2002-04-05 2004-01-08 Canon Inc 光半導体用パッケージ
JP2006038572A (ja) * 2004-07-26 2006-02-09 Sharp Corp 反射型エンコーダおよびこの反射型エンコーダを用いた電子機器
JP5019799B2 (ja) * 2006-06-15 2012-09-05 シャープ株式会社 光結合素子、電子機器および光結合素子の製造方法
US9472536B2 (en) 2011-10-11 2016-10-18 Kabushiki Kaisha Toshiba Semiconductor device and method for manufacturing the same
JP5649547B2 (ja) 2011-10-11 2015-01-07 株式会社東芝 半導体装置の製造方法
JP2013197302A (ja) * 2012-03-19 2013-09-30 Toshiba Corp 半導体装置およびその製造方法
KR101833672B1 (ko) 2016-04-12 2018-03-02 주식회사 엘지화학 화합물 및 이를 포함하는 유기 전자 소자
CN116093095B (zh) * 2022-12-14 2024-06-14 莱弗利科技(苏州)有限公司 光耦隔离器及其封装工艺

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1948843A1 (de) * 1969-09-26 1971-04-01 Siemens Ag Optoelektronische Anordnung
US4291943A (en) * 1977-08-05 1981-09-29 Minnesota Mining And Manufacturing Company Connector for optical fiber cables
JPS59177978A (ja) * 1983-03-26 1984-10-08 Nec Corp マルチチヤンネル型半導体光結合装置
US4612670A (en) * 1984-05-16 1986-09-16 General Dynamics Corporation Electro-optical connection between electronic modules
US5148243A (en) * 1985-06-25 1992-09-15 Hewlett-Packard Company Optical isolator with encapsulation
US4712862A (en) * 1986-08-27 1987-12-15 Rca Corporation Optical fiber connector and method of assembling same
JPH0479380A (ja) * 1990-07-23 1992-03-12 Nec Corp 多チャンネルホトカプラ
JPH05251731A (ja) 1992-03-09 1993-09-28 Sharp Corp 光結合装置およびこれに使用する１次モールド金型
JP2600616B2 (ja) * 1994-09-08 1997-04-16 日本電気株式会社 光結合装置
JP3401128B2 (ja) 1995-09-25 2003-04-28 シャープ株式会社 多チャンネル型光結合装置の製造方法
JPH09205223A (ja) 1995-11-24 1997-08-05 Denso Corp 半導体装置
JPH09307135A (ja) * 1996-05-17 1997-11-28 Toshiba Corp 光複合素子

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Also Published As

Publication number Publication date
US6507048B1 (en) 2003-01-14
EP1079250A3 (en) 2004-02-11
JP3676136B2 (ja) 2005-07-27
DE60036762D1 (de) 2007-11-29
EP1079250A2 (en) 2001-02-28
TWI223458B (en) 2004-11-01
JP2001060714A (ja) 2001-03-06
DE60036762T2 (de) 2008-07-24

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