Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
  • B32B21/10—Next to a fibrous or filamentary layer
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
  • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
  • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
  • B27N3/06—Making particle boards or fibreboards, with preformed covering layers, the particles or fibres being compressed with the layers to a board in one single pressing operation
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
  • B32B9/02—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising animal or vegetable substances, e.g. cork, bamboo, starch

Definitions

• the invention relates to a chipboard with high flexural strength and high modulus of elasticity, consisting of several layers of glued with condensation resins, pressed under pressure and elevated temperature with different chip size.
• the quality of these chipboards is determined, among other things, by the bending strength and the elastic modulus of elasticity, which are a measure of the inherent deflection and the load-bearing capacity of the board. These measured values therefore provide technical information about the possible further use of the chipboard, that is, whether it can be used in the construction or furniture sector, for example.
• the following process parameters are available, namely increasing the gluing factor for the wood chips or increasing the density in the finished chipboard.
• the increase in the gluing factor leads to an increase in the proportion of condensation resins and thus to a complex process due to high energy and raw material costs; the increase in density is associated with a drastic increase in the weight of the chipboard and thus with unfavorable production and transport conditions.
• the invention is based on the object, the known problems in increasing the bending strength and the flexural modulus of a particle board can occur to avoid and additionally increase the bending strength and the flexural modulus.
• a particle board of the type mentioned is therefore proposed, which is characterized in that a fabric, scrim or fleece consisting of natural fibers is provided within or between the individual layers of glued wood chips.
• the wood chipboard according to the invention also has the advantage that the fabric, scrim or fleece consisting of natural fibers is pre-consolidated by mechanical and / or chemical treatment.
• a further advantage of the wood chipboard according to the invention is that the woven fabric, scrim or fleece consisting of natural fibers contains bast fibers, in particular hemp, flax or jute fibers and mixtures thereof.
• the chipboard is further characterized according to the invention in that the chipboard has a three-layer structure consisting of a middle layer and two cover layers and that the fabric, scrim or fleece made of natural fibers is arranged on both sides of the middle layer or on both sides within the cover layers.
• the chipboard 1 according to the invention is given in the form of a three-layer structure.
• This consists of the middle layer 2, which has relatively large, glued wood chips and the top layers 3 and 3 ', which, in contrast to the middle layer, have finer, glued wood chips.
• the preferably pre-consolidated natural fiber fabrics 4 and 4 ' are arranged on both sides of the middle layer 2.
• FIG. 1 also shows a chipboard 1 'with a three-layer structure according to FIG. 1, the preferably pre-consolidated natural fiber fabrics 4, 4' being present within the cover layers 5, 5 'and 6, 6'.
• wood chipboards shown in the description of the figures are produced, for example, as follows:
• the wood used is processed in a chipper and in mills into chips of different sizes, dried and stored separately according to chip size. This is followed by gluing with nitrogen-containing condensation resins, for example urea-formaldehyde resins, which are present in aqueous solution. The proportion of synthetic resin in the solution is adjusted such that the gluing factor is between 6 and 10%. After gluing, the chips for the top or middle layers of the board are stored in two spreading machines, if necessary.
• nitrogen-containing condensation resins for example urea-formaldehyde resins
• the natural fiber fabrics 4, 4 ' are pretreated, for example, in such a way that they are impregnated with a synthetic resin solution such as an isocyanate solution and then dried. This results in the partial pre-consolidation of the natural fibers in the tissue, the fibers being glued together.
• a synthetic resin solution such as an isocyanate solution
• a layer structure according to FIGS. 1 and 2 is produced using these partially pre-consolidated fabrics 4, 4 '.
• This layer structure can now be fed to a chipboard press, in which it is pressed at temperatures of around 240 ° C and at pressures of 40 kp / cm2.
• the condensation reaction of those used as binders now takes place Synthetic resins.
• the wood chips are bonded in the cover and middle layers, and the fiber fabrics 4 and 4 'are bonded to the respectively adjacent wood chip layers.
• the application of temperature and pressure to the fiber fabric also causes its further pre-consolidation.
• the gluing with the adjoining wood chip layers ensures that the pre-consolidation of the natural fiber fabrics is maintained.
• the chipboard according to the invention now has increased values for bending strength and flexural modulus of elasticity due to the measure of the pre-consolidated natural fiber fabrics and therefore withstands particularly high weight loads.
• the wood chipboard according to the invention can be easily processed like known wood chipboards, for example by veneering and coating with foils, decorative papers and laminate boards, so that the decorative requirements, for example for furniture construction, are also met.
• the raw panel can also be used due to its excellent weight-bearing capacity, especially for load-bearing structures.

Landscapes

• Life Sciences & Earth Sciences (AREA)
• Engineering & Computer Science (AREA)
• Wood Science & Technology (AREA)
• Manufacturing & Machinery (AREA)
• Forests & Forestry (AREA)
• Dry Formation Of Fiberboard And The Like (AREA)
• Laminated Bodies (AREA)

Applications Claiming Priority (3)

Publications (1)

Family

ID=3528636

Family Applications (1)

Country Status (7)

Families Citing this family (8)

Family Cites Families (16)

• 1997
  • 1997-12-18 AT AT0214097A patent/AT407507B/de not_active IP Right Cessation
• 1998
  • 1998-12-15 EP EP98960848A patent/EP0963289A1/de not_active Withdrawn
  • 1998-12-15 PL PL98335191A patent/PL335191A1/xx unknown
  • 1998-12-15 SK SK1094-99A patent/SK109499A3/sk unknown
  • 1998-12-15 WO PCT/AT1998/000305 patent/WO1999032285A1/de not_active Application Discontinuation
  • 1998-12-15 CZ CZ992728A patent/CZ272899A3/cs unknown
  • 1998-12-15 HU HU0000820A patent/HUP0000820A3/hu unknown

Non-Patent Citations (1)

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