EP0962282A1 - Procédé et dispositif pour chamfreiner une plaquette semiconductrice - Google Patents

Procédé et dispositif pour chamfreiner une plaquette semiconductrice Download PDF

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Publication number
EP0962282A1
EP0962282A1 EP98304467A EP98304467A EP0962282A1 EP 0962282 A1 EP0962282 A1 EP 0962282A1 EP 98304467 A EP98304467 A EP 98304467A EP 98304467 A EP98304467 A EP 98304467A EP 0962282 A1 EP0962282 A1 EP 0962282A1
Authority
EP
European Patent Office
Prior art keywords
wafer
notch
axis direction
chamfering
periphery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP98304467A
Other languages
German (de)
English (en)
Other versions
EP0962282B1 (fr
Inventor
Etsuo Noguchi
Kazumi Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to DE69817771T priority Critical patent/DE69817771T2/de
Priority to EP19980304467 priority patent/EP0962282B1/fr
Publication of EP0962282A1 publication Critical patent/EP0962282A1/fr
Application granted granted Critical
Publication of EP0962282B1 publication Critical patent/EP0962282B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece

Definitions

  • the present invention relates generally to a wafer chamfering method and apparatus, and more particularly to a wafer chamfering method and apparatus for chamfering a wafer made of, for example, silicon or similar material used for semiconductor elements, in which an orientation flat or a notch is formed at the periphery thereof.
  • a conventional wafer chamfering apparatus is constructed in such a way that a wafer table, on which a wafer to be chamfered is mounted, is supported in a manner to move along the Y-axis, and that a periphery grinding wheel is placed on the Y-axis.
  • the circular part of the wafer is pressed against the rotating periphery grinding wheel.
  • an orientation flat part of the wafer the orientation flat part of the wafer is pressed against the rotating periphery grinding wheel, and the wafer is slightly rotated and is slightly fed along the Y-axis, so that the orientation flat part can be chamfered.
  • a notch part of a wafer with the notch is chamfered in the same manner.
  • the notch part of the wafer is pressed against a rotating notch grinding tool, and the wafer is slightly rotated and is slightly fed along the Y-axis, so that the notch part can be chamfered.
  • the present invention has been developed in view of the above-described circumstances, and, at least in its preferred embodiments, provides a wafer chamfering method and apparatus for accurately chamfering a wafer which has an orientation flat or a notch at the periphery thereof.
  • the present invention provides a wafer chamfering method for chamfering a periphery of a wafer which has a circular part, an orientation flat part and orientation flat corner parts, wherein the wafer is supported in such a manner as to rotate and to move in an X-axis direction and a Y-axis direction which are perpendicular to one another, and a periphery grinding wheel is rotatably placed on the Y-axis, wherein said method comprises the steps of: chamfering the circular pan of the wafer by bringing the circular part into contact with the periphery grinding wheel, which is rotating, and by rotating the wafer; chamfering the orientation flat part of the wafer by bringing the orientation flat part into contact with the periphery grinding wheel, which is rotating, and by feeding the wafer in the X-axis direction; and chamfering one of the orientation flat corner parts of the wafer by bringing the one of the orientation flat corner parts into contact with the periphery grinding
  • the wafer is supported in such a manner as to rotate and to move in the X-axis direction and the Y-axis direction which are perpendicular to one another, and the periphery grinding wheel is rotatably placed on the Y-axis.
  • the circular part of the wafer the circular part is pressed against the rotating periphery grinding wheel, and then the wafer is rotated.
  • the orientation flat part of the wafer the orientation flat is pressed against the rotating periphery grinding wheel, and then the wafer is fed in the X-axis direction.
  • the orientation flat corner part is pressed against the rotating periphery grinding wheel, and then, the wafer is rotated and is fed in the X-axis direction and the Y-axis direction so that the orientation flat corner part can always be in contact with the periphery grinding wheel.
  • the present invention provides a wafer chamfering method for chamfering a periphery of a wafer which has a circular part, a notch part and notch corner parts, wherein the wafer is supported in such a manner as to rotate and to move in an X-axis direction and a Y-axis direction which are perpendicular to one another, and a periphery grinding wheel and a notch grinding tool are rotatably placed on the Y-axis, wherein said method comprises the steps of: chamfering the circular part of the wafer by bringing the circular part into contact with the periphery grinding wheel, which is rotating, and by rotating the wafer; chamfering the notch part of the wafer by bringing the notch part into contact with the notch grinding tool, which is rotating, and by feeding the wafer in the X-axis direction and the Y-axis direction so that the notch part can always be in contact with the notch grinding tool; and chamfering one of
  • the periphery grinding wheel and the notch grinding tool are rotatably placed on the Y-axis.
  • the circular part is pressed against the rotating periphery grinding wheel, and then the wafer is rotated.
  • the notch part of the wafer is pressed against the rotating notch grinding tool, and then the wafer is fed in the X-axis direction and the Y-axis direction so that the notch part can always be in contact with the notch grinding tool.
  • the notch corner part is pressed against the rotating notch grinding tool, and then, the wafer is fed in the X-axis direction and the Y-axis direction so that the notch corner part can always be in contact with the notch grinding tool.
  • the chamfering operation causes a substantially 45° cut to be formed in both the top and bottom faces of the wafer adjacent the peripheral edge.
  • the present invention provides an apparatus for chamfering the periphery of a wafer said apparatus comprising:
  • Fig. 1 is a side view illustrating an embodiment of a wafer chamfering apparatus according to the present invention.
  • the wafer chamfering apparatus 10 comprises a wafer feeding apparatus 12 and a grinding tool apparatus 14.
  • a pair of guide rails 18 is provided on a horizontally-arranged base 16.
  • a Y-axis table 22 is slidably supported on the guide rails 18 via sliders 20.
  • the Y-axis table 22 is driven by a feed screw mechanism, which is constructed as described below.
  • a ball screw 24 is provided in parallel with the guide rails 18 on the base 16.
  • the ball screw 24 is engaged with a nut member 26, which is secured to the Y-axis table 22.
  • One end of the ball screw 24 connects to a motor 28, which is rotatable forward and backward and is driven to rotate the ball screw 24.
  • the nut member 26 moves along the ball screw 24, and thereby, the Y-axis table 22, which is connected to the nut member 26, slides along the guide rails 18.
  • a direction in which the Y-axis table 22 slides will hereafter be referred to as a Y-axis direction, and a straight line which is parallel with the Y-direction and goes through the center of the Y-axis table 22 will be referred to as the Y-axis.
  • a pair of guide rails 30 is provided on the Y-axis table 22 in a direction perpendicular to the Y-axis direction.
  • An X-axis table 34 is slidably supported on the guide rails 30 via sliders 32.
  • the X-axis table 34 is driven by a feed screw mechanism in the same manner as the Y-axis table 22, and the feed screw mechanism is constructed as described below.
  • a ball screw 36 is provided in parallel with the guide rails 30 on the Y-axis table 22.
  • the ball screw 36 is engaged with a nut member 38, which is secured to the X-axis table 34.
  • One end of the ball screw 36 connects to a motor 40, which is rotatable forward and backward and is driven to rotate the ball screw 36.
  • the nut member 38 moves along the ball screw 36, and thereby, the X-axis table 34, which is connected to the nut member 34, slides along the guide rails 30.
  • a direction in which the X-axis table 34 slides will hereafter be referred to as an X-axis direction, and a straight line which is parallel with the X-axis direction and goes through the center of the X-axis table 34 will be referred to as the X-axis.
  • a wafer table support 42 is centered on the X-axis table 34.
  • a wafer table 44 is rotatably supported on the wafer table support 42, and the wafer table 44 is rotated by a motor (not shown), which is built in the wafer table support 42.
  • a wafer W to be chamfered is held on the wafer table 44 with vacuum.
  • a straight line which is perpendicular to the wafer table 44 and goes through the rotational center of the wafer table 44 will be referred to as the ⁇ -axis.
  • the wafer W held on the wafer table 44 can be rotated about the ⁇ -axis and can be fed in the X-axis direction and the Y-axis direction.
  • the grinding tool apparatus 14 has a grinding tool support 46.
  • the grinding tool support 46 is slidably supported on a column (not shown), which vertically stands on the base 16, and a drive (not shown) drives the grinding tool support 46 so that the grinding tool support 46 moves up and down along the column.
  • a periphery grinding wheel 48 and a notch grinding tool 50 are provided at the bottom of the grinding tool support 46.
  • the periphery grinding wheel 48 and the notch grinding tool 50 are respectively rotated by motors (not shown), which are built in the grinding tool support 46.
  • the periphery grinding wheel 48 and the notch grinding tool 50 are located on the Y-axis as shown in Fig. 2, and the notch grinding tool 50 is located at a predetermined height above the periphery grinding wheel 48 as shown in Fig. 1.
  • the grinding tool apparatus 14 is constructed as described above, and the periphery of the wafer W is chamfered in such a way that the periphery of the wafer W is pressed against the rotating periphery grinding wheel 48 or the rotating notch grinding tool 50 of the grinding tool apparatus 14.
  • the wafer chamfering apparatus 10 of the present invention is constructed as described above, and a controller (not shown) controls the wafer chamfering apparatus 10.
  • the wafer W is set on the wafer chamfering apparatus 10. Specifically, the wafer W is positioned on the wafer table 44, and the wafer W is held on the wafer table 44 with vacuum.
  • the wafer W is placed so that the center thereof can be positioned on the ⁇ -axis of the wafer table 44, and that an orientation flat OF thereof can be parallel to the Y-axis (see Fig. 4(a)).
  • This state will be referred to as an initial state, where the center of the wafer W is positioned on the Y-axis and at a predetermined distance away from the axis of the periphery grinding wheel 48.
  • the grinding tool support 46 moves up or down so as to position the periphery grinding wheel 48 at a predetermined machining position.
  • the wafer chamfering apparatus 10 starts chamfering the wafer W.
  • the periphery grinding wheel 48 is rotated, and the wafer W is fed in the Y-axis direction to the periphery grinding wheel 48 at the same time.
  • the wafer W moves by a predetermined distance, a circular part C of the wafer W meets the rotating periphery grinding wheel 48, and the wafer W stops moving.
  • the wafer W When the point of contact reaches the orientation flat corner OR of the wafer W as represented with a broken line in Fig. 4(c), the wafer W is rotated about the ⁇ -axis and is fed in the X-axis direction and the Y-axis direction. The wafer W moves so that the orientation flat corner OR can always be in contact with the periphery grinding wheel 48. Thus, the orientation flat corner OR of the wafer W is chamfered by the periphery grinding wheel 48.
  • the orientation flat OF of the wafer W of which movement is controlled as stated above, finally becomes parallel to the X-axis as represented with a solid line in Fig. 4(c), and the chamfering of the orientation flat corner OR is completed.
  • the periphery grinding wheel 48 is in contact with the orientation flat OF of the wafer W.
  • the orientation flat OF is chamfered subsequently.
  • the orientation flat OF is chamfered by feeding the wafer W in the X-axis direction. That is, the wafer W moves in parallel with the orientation flat OF while the orientation flat OF being in contact with the periphery grinding wheel 48. Thereby, the orientation flat OF is chamfered by the periphery grinding wheel 48.
  • the wafer W is fed in the X-axis direction until the point of contact between the wafer W and the periphery grinding wheel 48 reaches the other end of the orientation flat OF, or the other orientation flat corner OR as shown in Fig. 4(e).
  • the orientation flat corner OR is chamfered subsequently.
  • the wafer W is rotated about the ⁇ -axis and is fed in the X-axis direction and the Y-axis direction.
  • the wafer W moves so that the orientation flat corner OR can always be in contact with the periphery grinding wheel 48.
  • the orientation flat corner OR of the wafer W is chamfered by the periphery grinding wheel 48.
  • the center of the wafer W is finally positioned on the Y-axis as represented with a broken line in Fig. 4(f), and the chamfering of the orientation flat corner OR is completed.
  • the periphery grinding wheel 48 is in contact with the circular part C of the wafer W.
  • the wafer W is rotated about the ⁇ -axis to chamfer the circular part C subsequently, and then, the wafer W returns to the state where the chamfering is started, that is, the state shown in Fig. 4(a).
  • the chamfering of the whole periphery of the wafer W is completed by repeating the above-mentioned series of processes a plurality of times.
  • the wafer W stops in the state where the chamfering started, that is, the state shown in Fig. 4(a). Then, the wafer W moves in the Y-axis direction so that it becomes farther away from the periphery grinding wheel 48, and the wafer W returns to the initial state. The wafer W is picked from the wafer table 44, and the machining is completed.
  • the wafer W when the orientation flat OF of the wafer W is chamfered, the wafer W is fed straight in parallel with the orientation flat OF. Thus, it is possible to easily chamfer the orientation flat OF with high straightness.
  • the wafer W is moved so that the orientation flat corner OR can always be in contact with the periphery grinding wheel 48. Thus, it is possible to easily chamfer the orientation flat corners OR with high accuracy.
  • the whole periphery of the wafer W is sequentially chamfered, but each part of the periphery of the wafer W may be chamfered separately. Specifically, only the circular part C of the wafer W may be chamfered first, then the orientation flat F may be chamfered, and finally the orientation flat corners OR may be chamfered.
  • orientation flat OF may be chamfered first, then the orientation flat corners OR may be chamfered, and finally the circular part C may be chamfered.
  • the wafer W is set on the wafer chamfering apparatus 10. Specifically, the wafer W is positioned on the wafer table 44, and the wafer W is held on the wafer table 44 with vacuum.
  • the wafer W is placed so that the center thereof can be positioned on the ⁇ -axis of the wafer table 44, and that a notch NO thereof can be positioned on the X-axis (see Fig. 5(a)).
  • This state will be referred to as an initial state, where the center of the wafer W is positioned on the Y-axis and at a predetermined distance away from the axis of the periphery grinding wheel 48.
  • the grinding tool support 46 moves up or down so as to position the periphery grinding wheel 48 at a predetermined machining position.
  • the wafer chamfering apparatus 10 starts chamfering the wafer W.
  • the periphery grinding wheel 48 is rotated, and the wafer W is fed in the Y-axis direction to the periphery grinding wheel 48 at the same time.
  • the wafer W moves by a predetermined distance, a circular part C of the wafer W meets the rotating periphery grinding wheel 48, and the wafer W stops moving.
  • the wafer W rotates a predetermined number of times, the chamfering of the circular part C of the wafer W is completed. Then, the wafer W stops rotating, and returns to the initial state. Thereafter, the wafer chamfering apparatus 10 starts chamfering the notch NO of the wafer W.
  • the wafer W moves in the X-axis direction by a predetermined distance from the initial state until it reaches a predetermined machining position (see Fig. 5(c)).
  • the grinding tool support 46 moves down by a predetermined distance so that the notch grinding tool 50 can be positioned at a predetermined machining position.
  • the notch grinding tool 50 is rotated, and the wafer W is fed in the Y-axis direction at the same time.
  • a notch corner NR of the wafer W meets the rotating notch grinding tool 50, and the wafer W stops moving.
  • the wafer W is fed in the X-axis direction and the Y-axis direction so that the notch corner NR can be chamfered.
  • the wafer W moves according to the shape of the notch corner NR so that the notch corner NR can always be in contact with the notch grinding tool 50.
  • the notch corner NR of the wafer W is chamfered by the notch grinding tool 50.
  • the wafer W is subsequently fed in the X-axis direction and the Y-axis direction so that the notch NO can be chamfered.
  • the wafer W is fed so that the notch NO can always be in contact with the notch grinding tool 50.
  • the notch NO is V-shaped for example, and the wafer W moves in a manner to describe V according to the shape of the notch NO. Thereby, the notch NO of the wafer W is chamfered by the notch grinding tool 50.
  • the notch corner NR is subsequently chamfered as shown in Fig. 5(e).
  • the wafer W is fed in the X-axis direction and the Y-axis direction so that the notch corner NR can always be in contact with the notch grinding tool 50.
  • the notch corner NR of the wafer W is chamfered by the notch grinding tool 50.
  • the wafer W stops moving. Then, the notch NO and the notch corners NR are chamfered in the reverse direction in the same manner as described above. Specifically, the notch grinding tool 50 moves relatively to the wafer W from the notch corner NR at the other side to the notch NO, and it returns to the state where the chamfering of the notch NO started, that is, the state shown in Fig. 5(c).
  • the chamfering of the notch NO and the notch corners NR is completed by repeating the above-mentioned series of processes a required number of times.
  • the wafer W stops in the state where the chamfering of the notch NO started, that is, the state shown in Fig. 5(c). Then, the wafer W moves in the Y-axis direction so that it becomes farther away from the notch grinding tool 50, and the wafer W returns to the initial state. The wafer W is picked from the table 44, and the machining is completed.
  • the wafer W when the notch NO of the wafer W is chamfered, the wafer W is fed so that the notch grinding tool 50 can always be in contact with the notch NO. Thus, it is possible to easily chamfer the notch NO with high accuracy.
  • the wafer W is fed so that the notch grinding tool 50 can always be in contact with the notch corner NR. Thus, it is possible to easily chamfer the notch corners NR with high accuracy.
  • the circular part C of the wafer W is chamfered first, and then the notch NO and the notch corners NR are chamfered.
  • the machining order should not be restricted to this: for example, the notch NO and the notch corners NR may be chamfered first, and then the circular part C may be chamfered.
  • the movement of the wafer is controlled by rotating the wafer on the rotational axis and feeding the wafer along the two axes which are perpendicular to the rotational axis and are perpendicular to one another.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
EP19980304467 1998-06-05 1998-06-05 Procédé et dispositif pour chamfreiner une plaquette semiconductrice Expired - Lifetime EP0962282B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE69817771T DE69817771T2 (de) 1998-06-05 1998-06-05 Verfahren und Vorrichtung zum Abfasen von Halbleiterscheiben
EP19980304467 EP0962282B1 (fr) 1998-06-05 1998-06-05 Procédé et dispositif pour chamfreiner une plaquette semiconductrice

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19980304467 EP0962282B1 (fr) 1998-06-05 1998-06-05 Procédé et dispositif pour chamfreiner une plaquette semiconductrice

Publications (2)

Publication Number Publication Date
EP0962282A1 true EP0962282A1 (fr) 1999-12-08
EP0962282B1 EP0962282B1 (fr) 2003-09-03

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EP19980304467 Expired - Lifetime EP0962282B1 (fr) 1998-06-05 1998-06-05 Procédé et dispositif pour chamfreiner une plaquette semiconductrice

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EP (1) EP0962282B1 (fr)
DE (1) DE69817771T2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017081782A (ja) * 2015-10-28 2017-05-18 日本電気硝子株式会社 板ガラスの製造方法及び製造装置
JP2019198899A (ja) * 2018-05-14 2019-11-21 中村留精密工業株式会社 面取り研削装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0354586A2 (fr) * 1988-08-12 1990-02-14 Shin-Etsu Handotai Company Limited Procédé et dispositif pour chamfreiner automatiquement une plaquette semi-conductrice
EP0552989A1 (fr) * 1992-01-24 1993-07-28 Shin-Etsu Handotai Company Limited Méthode d'appareillage pour polir les chanfreins de plaquettes semiconductrices
DE4331727A1 (de) * 1992-09-19 1994-03-24 Daito Shoji Co Ltd Verfahren und Vorrichtung zum Anfasen der Peripherie eines gekerbten scheibenförmigen Werkstücks

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0354586A2 (fr) * 1988-08-12 1990-02-14 Shin-Etsu Handotai Company Limited Procédé et dispositif pour chamfreiner automatiquement une plaquette semi-conductrice
EP0552989A1 (fr) * 1992-01-24 1993-07-28 Shin-Etsu Handotai Company Limited Méthode d'appareillage pour polir les chanfreins de plaquettes semiconductrices
DE4331727A1 (de) * 1992-09-19 1994-03-24 Daito Shoji Co Ltd Verfahren und Vorrichtung zum Anfasen der Peripherie eines gekerbten scheibenförmigen Werkstücks

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017081782A (ja) * 2015-10-28 2017-05-18 日本電気硝子株式会社 板ガラスの製造方法及び製造装置
JP2019198899A (ja) * 2018-05-14 2019-11-21 中村留精密工業株式会社 面取り研削装置

Also Published As

Publication number Publication date
DE69817771T2 (de) 2004-03-11
DE69817771D1 (de) 2003-10-09
EP0962282B1 (fr) 2003-09-03

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