EP0955394B1 - Verfahren zur Erzeugung einer Schutzschicht auf der inneren Oberfläche eines Kupferrohrs - Google Patents

Verfahren zur Erzeugung einer Schutzschicht auf der inneren Oberfläche eines Kupferrohrs Download PDF

Info

Publication number
EP0955394B1
EP0955394B1 EP99107792A EP99107792A EP0955394B1 EP 0955394 B1 EP0955394 B1 EP 0955394B1 EP 99107792 A EP99107792 A EP 99107792A EP 99107792 A EP99107792 A EP 99107792A EP 0955394 B1 EP0955394 B1 EP 0955394B1
Authority
EP
European Patent Office
Prior art keywords
copper
copper pipe
carbonate
pipe
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP99107792A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0955394A3 (de
EP0955394A2 (de
Inventor
Christian Dipl.-Ing. Triquet
Stefan Dr. Priggemeyer
Sonja Dr. Priggemeyer
Franz-Josef Bartke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cunova GmbH
Original Assignee
KM Europa Metal AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KM Europa Metal AG filed Critical KM Europa Metal AG
Publication of EP0955394A2 publication Critical patent/EP0955394A2/de
Publication of EP0955394A3 publication Critical patent/EP0955394A3/de
Application granted granted Critical
Publication of EP0955394B1 publication Critical patent/EP0955394B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C8/40—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using liquids, e.g. salt baths, liquid suspensions
    • C23C8/42—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using liquids, e.g. salt baths, liquid suspensions only one element being applied

Definitions

  • DE 195 33 410 A1 further includes a method for producing a protective layer of malachite (CuCO 3 Cu ⁇ OH ⁇ 2 ) or atakamite (CuCl 2 3Cu ⁇ HO ⁇ 2 ) which delimits the copper solubility in water.
  • a protective layer of malachite CuCO 3 Cu ⁇ OH ⁇ 2
  • atakamite CuCl 2 3Cu ⁇ HO ⁇ 2
  • modified synthetic drawing agent used to the halogen-organic or other chlorine / halogen compounds are added.
  • the method has proven itself in principle and limits the copper solubility a very low safe level of about 1 mg / l after 12 hours of stagnation.
  • the inclusion of protective layer production in the drawing process of Copper pipe not always possible.
  • JP-A-60200973 discloses the oxidative Treatment of a copper pipe with an oxidation treatment solution. This should be a heavy metal-soluble layer of copper oxide are formed.
  • a method belongs to the state of the art, in which first roughened the inner surface of an intermediate tube and then at a Temperature of 350 ° C to 650 ° C and introduced into the tube interior oxygen annealed protective gas is annealed. Thereafter, the intermediate tube is a hardness train subjected to a thermal treatment at a temperature of 175 ° C to 275 ° C, in turn, an oxygen-containing gas mixture in the pipe interior is initiated.
  • the inner surface of the copper tube expediently cleaned. This is used in particular for degreasing.
  • the degreasing can be treated chemically by treatment with commercial degreasing agents or by Pickling, e.g. with sulfuric or nitric acid.
  • the tube can after treatment be blown out with compressed air.
  • an oxidation solution is used Oxidants in the form of hydrogen peroxide.
  • Oxidants in the form of hydrogen peroxide.
  • the protective layer produced according to the invention reduces the copper ion emission especially in carbonated and / or acidic drinking waters.
  • the factory production is mainly a copper ion release in the first years after commissioning a new copper installation.
  • the protective layer produced according to the invention reduces the copper ion emission, especially in carbonated and / or acid drinking waters.
  • the Factory production is mainly a copper ion delivery in the first Years after commissioning a new copper pipe installation.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Protection Of Pipes Against Damage, Friction, And Corrosion (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
EP99107792A 1998-05-05 1999-04-20 Verfahren zur Erzeugung einer Schutzschicht auf der inneren Oberfläche eines Kupferrohrs Expired - Lifetime EP0955394B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19819925A DE19819925A1 (de) 1998-05-05 1998-05-05 Verfahren zur Erzeugung einer Schutzschicht auf der inneren Oberfläche eines Kupferrohrs
DE19819925 1998-05-05

Publications (3)

Publication Number Publication Date
EP0955394A2 EP0955394A2 (de) 1999-11-10
EP0955394A3 EP0955394A3 (de) 2000-04-12
EP0955394B1 true EP0955394B1 (de) 2005-01-19

Family

ID=7866663

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99107792A Expired - Lifetime EP0955394B1 (de) 1998-05-05 1999-04-20 Verfahren zur Erzeugung einer Schutzschicht auf der inneren Oberfläche eines Kupferrohrs

Country Status (6)

Country Link
EP (1) EP0955394B1 (da)
AT (1) ATE287460T1 (da)
DE (2) DE19819925A1 (da)
DK (1) DK0955394T3 (da)
ES (1) ES2236985T3 (da)
PT (1) PT955394E (da)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007055446A1 (de) * 2007-11-12 2009-05-14 Hansgrohe Ag Bereitstellung von wasserführenden Bauteilen aus Messinglegierungen mit verringerter Metallionenfreisetzung

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4121217B2 (ja) * 1999-06-30 2008-07-23 株式会社スーパーブラストシステムズ 人工緑青発生法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB599971A (en) * 1944-11-04 1948-03-25 Jacob Finley Buckman Improvements in and relating to the colouring of copper and copper-alloy surfaces
US3497401A (en) * 1967-09-20 1970-02-24 Intern Copper Research Ass Inc Patination of copper
US3544389A (en) * 1967-12-18 1970-12-01 Bell Telephone Labor Inc Process for surface treatment of copper and its alloys
FR2064465A5 (en) * 1969-09-12 1971-07-23 Trefimetaux Artificial patina prodn on copper (alloy)objects
JPS53122641A (en) * 1977-04-01 1978-10-26 Mitsubishi Metal Corp Method of electrolytically generating verdigris on surface of copper or copper alloy
JPS53142935A (en) * 1977-05-20 1978-12-13 Mitsubishi Metal Corp Formation of patina on copper or copper alloy surface by electrolysis
JPS5638477A (en) * 1979-09-04 1981-04-13 Nippon Peroxide Co Ltd Formation of cupric oxide coating
JPS56139680A (en) * 1980-03-31 1981-10-31 Matsushita Electric Works Ltd Composition for oxidizing solution
LU83165A1 (fr) * 1981-02-25 1982-09-10 Liege Usines Cuivre Zinc Tubes pour condenseurs ou echangeurs de chaleur en alliages de cuivre resistant a la corrosion et procede pour leur fabrication
JPS60200973A (ja) * 1984-03-23 1985-10-11 Hitachi Cable Ltd 耐食性表面処理銅管
JPS61221378A (ja) * 1985-03-27 1986-10-01 Toho Gas Kk 銅溶解防止方法
DE3827353A1 (de) * 1988-08-12 1990-02-22 Kabelmetal Ag Innenoxidierte rohre
DE4334536A1 (de) * 1993-10-09 1995-04-13 Kabelmetal Ag Verfahren zur Herstellung von nahtlos gezogenen halbharten/harten Installationsrohren
GB9407778D0 (en) * 1994-04-20 1994-06-15 Sandoz Ltd Improvements in or relating to organic compounds
DE19533410B4 (de) * 1995-09-09 2005-11-24 Km Europa Metal Ag Verfahren zur Erzeugung einer Schutzschicht an der inneren Oberfläche eines Kupferrohrs sowie Verwendung von Ziehmitteln

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007055446A1 (de) * 2007-11-12 2009-05-14 Hansgrohe Ag Bereitstellung von wasserführenden Bauteilen aus Messinglegierungen mit verringerter Metallionenfreisetzung

Also Published As

Publication number Publication date
DE59911465D1 (de) 2005-02-24
EP0955394A3 (de) 2000-04-12
DE19819925A1 (de) 1999-11-11
EP0955394A2 (de) 1999-11-10
DK0955394T3 (da) 2005-05-23
ES2236985T3 (es) 2005-07-16
ATE287460T1 (de) 2005-02-15
PT955394E (pt) 2005-03-31

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